Abstract: A water activated tape system includes a tape roller, a water bottle, and a first wipedown mechanism. The tape roller is configured to dispense water activated tape. The water bottle is configured provide liquid to wet the water activated tape. The first wipedown mechanism is configured to press the water activated tape onto a carton. The first wipedown mechanism includes a first hinged arm, a first roller, disposed at a first end of the first hinged arm, a second hinged arm, and a second roller, disposed at a first end of the second hinged arm.

Abstract: A process for making a fully recyclable packaging article comprising (1) a reclosable lid with a living hinge which comprises a copolyester composition that is recyclable in a PET stream, (2) a container which comprises a copolyester composition that is recyclable in a PET stream; and affixed thereto is (3) a crystallizable shrinkable film or label which comprises a copolyester composition that is recyclable in a PET stream.

Abstract: A temporary adhesive having excellent spin coating properties of a circuit side of a wafer and a support, and excellent heat resistance when the circuit side of the wafer or the support is attached to an adhesion layer or a rear surface of the wafer is processed, and is capable of easily separating the circuit side of the wafer from the support after polishing the rear surface of the wafer, and simply removing a adhesive attached to the wafer or the support after the separation. The adhesive contains a component (A) to be cured by a hydrosilylation reaction, and a component (B) containing an epoxy-modified polyorganosiloxane at a ratio in % by mass of the component (A) to the component (B) of 99.995:0.005 to 30:70. The component (B) is an epoxy-modified polyorganosiloxane having an epoxy value of 0.1 to 5.

Abstract: A method for manufacturing a joined body includes subjecting a first electronic component and a second electronic component to thermocompression bonding with a hot-melt adhesive sheet interposed therebetween. The hot-melt adhesive sheet includes a binder and electroconductive particles. The binder includes a crystalline polyamide resin and a crystalline polyester resin. When a melt viscosity of the hot-melt adhesive sheet is measured under a condition of a heating rate of 5° C./min. the hot-melt adhesive sheet has a ratio of a melt viscosity at 20° C. lower than a thermocompression bonding temperature to a melt viscosity at the thermocompression bonding temperature of 10 or higher.

Abstract: A cutting and attaching system for a screen protector having a high hardness is provided, and includes a cutting apparatus, a universal sheet having a hardness of at least 5H, and a film applicator. The cutting apparatus can perform a cutting process to the universal sheet through a cutter thereof according to the film applicator and a mobile apparatus, thereby forming a screen protector that is suitable to be applied to the film applicator and the mobile apparatus.

Abstract: A device for joining together two joining partners includes a first component receptacle for receiving the first joining partner and a second component receptacle for receiving the second joining partner. The first component receptacle and the second component receptacle are rotatable about a first axis of rotation and a second axis of rotation, respectively. The first axis of rotation and the second axis of rotation are perpendicular to each other.

Abstract: A curved and one-sidedly open waveguide for plastic welding, especially for laser transmission welding, includes a first reflecting element having a reflecting surface by means of which laser light can be reflected. The reflecting surface defines a receiving end at which laser light from a laser light source, in particular a light guide or a plurality of light guides, is receivable, and an output end at which laser light is directable into a laser light transmitting work piece. The reflecting surface is defined by a curve between the receiving end and the output end so that the reflecting surface of the first reflecting element has a continuously curved concave shape when viewed in cross-section. Further, the first reflecting element is not opposed by a second reflecting element so that the waveguide is open in the direction normal to the reflecting surface.

Abstract: A method for connecting first and second plastic parts by a laser transmission bonding wherein the first plastic part absorbs laser light and the second plastic part is made of transparent plastic. The method includes the following steps: positioning the first plastic part in a first tool, positioning the second plastic part in a second tool so that the first plastic part and the second plastic part are spaced from each other thereby preventing mutual heat exchange between the parts, directing laser light through the second plastic part onto a connection zone of the first plastic part whereby the first plastic part is heated at least within the connection zone, after heating the first plastic part, moving the second plastic part into contact with the first plastic part, so that the second plastic part is firmly bonded to the first plastic part.

Abstract: An in-line process for forming a panel having a panel body with a top face and a bottom face and at least two side edges therein between, and having one or more additional edge edgings formed from a compressible material on one or both side edges and fixed to the top and bottom faces of the panel body, the process comprising at least the steps of: (i) providing a panel body; (ii) providing of one or more additional edgings formed from a compressible material; (iii) providing a supply of an edge banding material; (iv) locating the one or more additional edgings and the edge banding material to a side edge of the panel body; and (v) fixing the edge banding material to the top and bottom faces of the panel body and encapsulating the at least one of the additional edgings.

Abstract: Disclosed herein are a different material bonding apparatus and an operation method thereof. The different material bonding apparatus in accordance with the present embodiment includes a first layer and a second layer formed of materials having different melting points and each having one surface contacting one surface of the other and a heater configured to apply heat to the other surface of the second layer, the second layer includes a plurality of penetration grooves formed to be recessed in the one surface contacting the first layer, and a melting point of the second layer is higher than a melting point of the first layer.

Abstract: A back grinding adhesive film used to protect a surface of a wafer, the back grinding adhesive film including a base material layer, and an adhesive resin layer which is formed on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material, in which, when a viscoelastic characteristic is measured after curing the ultraviolet curable adhesive resin material by irradiating with an ultraviolet ray, a storage elastic modulus at 5° C. E? (5° C.) is 2.0×106 to 2.0×109 Pa, and a storage elastic modulus 100° C. E? (100° C.) is 1.0×106 to 3.0×107 Pa.

Abstract: A method of manufacturing a curved shaped object formed primarily of plywood, the method comprising: cutting strips from a plywood panel; and arranging and bending the strips in two different directions. The strips can have edges that have a wavy profile. The strips can be arranged in a multi-layer stack where they are staggered or crossed. The object is at least partially ovoid in shape.

Abstract: Provided is a novel electrically conductive adhesive which can yield a sintered body having low resistivity despite containing a thermosetting resin in addition to silver particles. This electrically conductive adhesive contains silver particles and a thermosetting resin. The silver particles are provided with a protective layer that contains a compound represented by general formula (1). [In general formula (1), R1 is an alkyl group having 1-5 carbon atoms, and R2 is a hydrogen atom or an alkyl group having 1-5 carbon atoms.

Abstract: Systems, methods, and devices for providing a joining technique for a metal part and a composite part. The joining technique in which either the metal or the composite part has at least one portion receive a laser etching treatment according at least in part to a laser configuration. Further, the joining technique in which the metal and composite parts are positioned to contact at least one etched surface. Even further, the joining technique in which a joining process is used to join the metal part and composite part to produce a unitary structure.

Abstract: An adhesive member of may include a polymer derived from a resin composition including at least one urethane (meth)acrylate oligomer including two (meth)acryloyl groups per oligomer unit, at least one polyfunctional (meth)acrylate monomer including multiple (meth)acryloyl groups per monomer unit, and at least one photoinitiator. The weight of the urethane (meth)acrylate oligomer may be 1 wt % or more and less than 10 wt %, and the weight of the polyfunctional (meth)acrylate monomer may be 0.2 wt % or more and less than 2 wt %, based on a total weight of the resin composition. The glass transition temperature of the adhesive member may be ?10° C. or more and less than 10° C., and the loss tangent (tan ?) of the adhesive member at ?40° C. may be 0.01 or more and less than 0.3. Accordingly, the adhesive member may undergo easy rework at ?40° C. and show excellent or suitable adhesion reliability during use.

Abstract: Absorbent structures and methods of manufacture are disclosed. In one embodiment, a method of manufacturing may comprise, directing a stream of particles toward a layer, spraying the stream with a first adhesive, the first adhesive contacting the stream at a first contact point, spraying the stream with a second adhesive, the second adhesive contacting the stream at a second contact point, the first contact point being different from the second contact point, depositing the intermixed particles, first adhesive, and second adhesive onto the layer, and covering the mixture of the particles, the first adhesive, and the second adhesive with a second layer.

Abstract: A jig for placement of an insert sheet on a greeting card is disclosed. The jig comprises a support surface configured to support the greeting card. The jig further comprises a guide configured for movement between an open position and a closed position, wherein the guide enables placement of the greeting card at a predetermined location on the support surface when the guide is in the open position, and wherein the guide provides a template for placement of the insert sheet at a designated location on the greeting card when the guide is in the closed position.

Abstract: Provided is a resin profile joining method of joining a pair of resin profiles. The method includes: holding one resin profile and another resin profile of the pair of resin profiles with a first clamp and a second clamp, respectively, such that end surfaces of the pair of resin profiles are faced each other; heating the end surfaces of the pair of resin profiles in no contact with the end surfaces of the pair of resin profiles to melt the pair of resin profiles; making a guide in contact with surfaces of the pair of resin profiles so as to cover between the end surfaces of the pair of resin profiles after the heating; and crimping the end surfaces of the pair of resin profiles to each other while keeping the guide in contact with the surfaces of the pair of resin profiles.

Abstract: Dressings for use in negative pressure therapy and methods of making the dressings are provided herein. The dressings may comprise at least two layers in a stacked configuration. The first layer may comprise a manifold layer and the second layer may comprise a silicone gel layer. The second layer may have perforations to form fluid restrictions that can open and close when used in negative pressure therapy. The perforated second layer may be formed by a first and a second curing step.

Abstract: A glue gun including a housing, an actuator, a carrier, and a stroke adjustment mechanism. The housing extends along an axis and includes a first end and a second end opposite the first end. The first end includes an outlet configured to dispense glue from the housing. The actuator is coupled to the housing. The carrier is supported by the housing and is configured to support a glue stick. The carrier is coupled to the actuator and movable a distance along the axis in response to actuation of the actuator to guide the glue stick toward the first end. The stroke adjustment mechanism is coupled to the carrier to adjust the distance that the carrier is movable along the axis.