Patents Examined by Daniel McNally
  • Patent number: 11787911
    Abstract: A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm2 to about 300 J/cm2.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: October 17, 2023
    Assignee: Henkel AG & Co. KGaA
    Inventor: Brian Deegan
  • Patent number: 11781047
    Abstract: A method of adhesion provides excellent workability by using a curable resin composition whose viscosity has low temperature dependence. The method of adhesion includes a step of heating a curable resin composition and applying a curable resin composition, a step of spreading the curable resin composition, and a step of curing the curable resin composition. The curable resin composition contains specific amounts of an epoxy resin, fine polymer particles that have a core-shell structure including a core layer and a shell layer, and blocked urethane having a latent NCO % of 0.1% to 2.9%.
    Type: Grant
    Filed: June 3, 2022
    Date of Patent: October 10, 2023
    Assignee: KANEKA CORPORATION
    Inventor: Toshihiko Okamoto
  • Patent number: 11773618
    Abstract: A method for producing a fencing material including the steps of: providing a border material having an interior surface; providing a mesh material having a front and a back; treating the interior surface of the border material to produce a tacky border material surface; placing a portion of the front and/or the back of the mesh material against the tacky border material surface; pressing the tacky border material surface and the mesh material together; and thermally bonding at least some portion of the front and the back of the mesh material with the interior surface of the border material. The border material being a polyvinyl chloride, the mesh being a polyvinyl chloride material and/or a vinyl coated material.
    Type: Grant
    Filed: August 26, 2021
    Date of Patent: October 3, 2023
    Assignee: Cover Care, LLC
    Inventors: Thomas Callahan, Patrick Callahan
  • Patent number: 11773295
    Abstract: Methods of bonding together substrates that do not require use of primers, mixing, fixturing, or autoclaving. These methods can include the steps of disposing an adhesive layer on a bonding surface of either substrate, the adhesive layer comprising a curable composition that is dimensionally stable at ambient conditions; either before or after disposing the adhesive layer on the bonding surface, irradiating the adhesive layer with ultraviolet radiation to initiate curing of the curable composition; placing one substrate so as to be bonded to the other substrate by the adhesive layer; and allowing the adhesive layer to cure.
    Type: Grant
    Filed: June 6, 2022
    Date of Patent: October 3, 2023
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Cyrus A. Anderson, Thomas Q. Chastek, Xiao Gao, Kathleen S. Shafer, Sheng Ye
  • Patent number: 11767450
    Abstract: Embodiments of the present application disclose an adhesive, a die attach film and a preparation method therefor, and relate to the technical field of chip packaging. The adhesive includes epoxy resin, phenoxy resin, an indene oligomer, filler and a curing agent; and 20-60 parts of the epoxy resin, 20-30 parts of the phenoxy resin, 5-10 parts of the indene oligomer, 15-30 parts of the filler and 1-5 parts of the curing agent are provided in parts by mass. The present application further provides the die attach film and the preparation method therefor. In the adhesive provided by the present application, the epoxy resin, the phenoxy resin and the indene oligomer are used as curable substrates to improve a thermal stress obtained after the adhesive is cured, so that the die attach film prepared therefrom is not easy to warp in a temperature change process.
    Type: Grant
    Filed: April 26, 2023
    Date of Patent: September 26, 2023
    Assignee: Wuhan Choice Technology Co, Ltd
    Inventors: De Wu, Shuhang Liao, Ting Li, Yi Wang, Junxing Su
  • Patent number: 11766835
    Abstract: A welding process may be configured to convert a substrate into a welded substrate by applying a process solvent to the substrate, wherein the process solvent interrupts one or more intermolecular force between one or more component in the substrate. The substrate may be configured as a natural fiber, such as cellulose, hemicelluloses, and silk. The process solvent may be configured as an ionic-liquid based solvent and the welded substrate may be a congealed network after the process solvent has been adequately swollen and/or mobilized the substrate. A welding process may be configured such that individual fibers of a substrate are not fully dissolved such that material in the fiber core may be left in the native state by controlling process variables. The welding process fibers may have a tenacity 10% or 20% greater or a diameter 25% less than that of a cellulosic-based yarn substrate.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: September 26, 2023
    Assignee: Natural Fiber Welding, Inc.
    Inventors: Luke Michael Haverhals, Aaron Kenneth Amstutz, Jonglak Choi, Xiling Tang, Michael Molter, Spencer Jacob Null
  • Patent number: 11752701
    Abstract: The invention relates to a method for producing an adhesive bond between at least a first and a second, at least partially transparent planar component, in which the first component is laid onto a support plate, and an adhesive is applied to the first component at specified locations on the side of the first component facing away from the support plate, and the second component is laid onto the first component and is held parallel to the first component at a predefined distance, in such a way that the second component comes into contact with the adhesive on the first component.
    Type: Grant
    Filed: July 29, 2020
    Date of Patent: September 12, 2023
    Assignee: ASMPT AMICRA GmbH
    Inventors: Rudolf Kaiser, Horst Lapsien
  • Patent number: 11745438
    Abstract: A waveguide for plastic welding has an entry end, an exit end as well as a first and a second inner face arranged between the entry end and the exit end, which are arranged opposite to each other and by means of which laser light can be reflected. A first distance between the entry end and the exit end defines a length of the waveguide and a second distance between the first and the second inner face defines a thickness of the waveguide. The exit end may be arranged opposite to the entry end and a central plane of the waveguide may extend centrally from the entry end to the exit end. The first inner face comprises a continuously curved, concave shape so that a third distance between the first inner face and the central plane varies continuously from the entry end in the direction of the exit end.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: September 5, 2023
    Assignee: BRANSON Ultraschall Niederlassung der Emerson Technologies GmbH & Co. OHG
    Inventors: Marian Blasko, L'udovít {hacek over (S)}ípo{hacek over (s)}
  • Patent number: 11738548
    Abstract: According to a method of manufacturing an image display device of the present invention, a photo-curable resin composition in a liquid state is applied to a surface of a light-transmitting cover member including a light-shielding layer or a surface of the image display member to a thickness greater than that of the light-shielding layer. Then, in this state, the photo-curable resin composition is irradiated with a UV ray to be pre-cured, thereby forming a pre-cured resin layer. Next, the image display member and the light-transmitting cover member are stacked via the pre-cured resin layer and thereafter, the pre-cured resin layer is irradiated with a UV ray to be completely cured, thereby forming a light-transmitting cured resin layer.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: August 29, 2023
    Assignee: DEXERIALS CORPORATION
    Inventors: Kouichi Ogawa, Yoshihisa Shinya, Naoki Hayashi, Tomoyuki Toyoda
  • Patent number: 11739876
    Abstract: A method of creating a weld between a liner of a section of lined pipe and an electrofusion fitting. The fitting comprises at least one heating element, which is suitably disposed on or in an outer surface of the electrofusion fitting and is electrically isolated from an inner surface of the fitting. The method comprises locating an end of the electrofusion fitting within an end of the section of lined pipe, locating an induction coil within a bore of the electrofusion fitting in the vicinity of the at least one heating element, and supplying electrical power to the induction coil to energise the at least one heating element by electromagnetic induction.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: August 29, 2023
    Assignee: Pioneer Lining Technology Limited
    Inventor: Stephen Barnes
  • Patent number: 11738503
    Abstract: Systems and methods for constructing 3-dimensional (3D) parts are disclosed. A printing system may include a deposition system configured to print a plurality of 2-dimensional (2D) layers onto a plurality of carrier sheets. The printing system also includes a transferring system configured to transfer a 2D layer from a carrier sheet of the plurality of carrier sheets, onto the 3D part. The 3D part may be located on a base substrate. The printing system further includes a feed system configured to provide the plurality of carrier sheets from the deposition system to the transfer system in a successive fashion while maintaining the directionality of printing in the deposition and transferring systems.
    Type: Grant
    Filed: November 22, 2021
    Date of Patent: August 29, 2023
    Assignee: Xerox Corporation
    Inventors: Anne Plochowietz, Ashish V. Pattekar, Jengping Lu, Nan-Xing Hu
  • Patent number: 11733444
    Abstract: The present specification relates to a method for manufacturing a polarizing plate, and an adhesive composition for a polarizing plate.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: August 22, 2023
    Inventors: Su Youn Choi, Jin Woo Kim, Yoonkyung Kwon, Dong Uk Kim
  • Patent number: 11732156
    Abstract: A primer is useful for adhering cured silicones to low energy plastic substrates. The primer is prepared from starting materials including a) an organoboron compound capable of forming a free radical generating species, and at least one of b) an organosilicon compound having, per molecule, at least one free radical reactive group and at least one other reactive group, and/or c) an organoborane liberating compound capable of reacting with starting material a) to liberate the free radical generating species. The method for forming the primer may further include use of d) an organic solvent, and e) a free radical polymerizable monomer, oligomer, macromonomer, or polymer.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: August 22, 2023
    Assignee: DOW SILICONES CORPORATION
    Inventor: Bizhong Zhu
  • Patent number: 11730257
    Abstract: The present invention relates to a brush with fusion interlocking bristle strip and a method of manufacturing the same. The brush includes carrier strips and knotted bristle strips bonded together by ultrasonic welding and interlocking.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: August 22, 2023
    Inventor: Fook Yuen Lee
  • Patent number: 11724462
    Abstract: A method for setting up a joining apparatus for joining a light lens to a housing of a motor vehicle lighting arrangement. A first virtual model is created of the joining apparatus with a light lens and a housing received therein, a relative arrangement of the light lens to the housing corresponds to a target arrangement. A plurality of virtual models are created of the joining apparatus with the light lens and the housing received therein. The relative arrangement of the light lens to the housing deviates from the target arrangement in each case by means of virtual displacement of the adjuster. A target displacement is calculated of an adjuster on the basis of a functional relationship calculated and the relative arrangement in the test construction unit measured. A light lens is joined to a housing in the target arrangement by displacing the adjuster by the target displacement.
    Type: Grant
    Filed: April 15, 2022
    Date of Patent: August 15, 2023
    Assignee: Hella GmbH & Co. KGaA
    Inventors: Ansgar Hagen, Daria Wilke
  • Patent number: 11718044
    Abstract: An assembly is provided for induction welding. This induction welding assembly includes a fixture. The fixture includes a first support structure and a second support structure. The second support structure includes a frame and a plurality of trunks. Each of the trunks is connected to and repositionable on the frame. The fixture is configured to secure a workpiece vertically between the first support structure and the second support structure using the trunks during induction welding of the workpiece.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: August 8, 2023
    Assignee: Rohr, Inc.
    Inventors: Michael van Tooren, Charles Novak, Fassil Ghebremichael, Dominic J. Elliott, Jonathan S. Huang, Jeffrey Woods
  • Patent number: 11718772
    Abstract: Provided are a curable composition that exhibits favorable adhesiveness without heating at elevated temperatures, and a method for producing a joined structure using the curable composition. As a curable composition for use in forming one or more bonding layers bonding the two or more adherends, in which at least one of the two or more adherends includes a low heat-resistance material, a curable composition that contains an epoxy resin including a structural unit of a specific structure including an epoxy group, and yields a cured product exhibiting a water contact angle of 40° or more and 50° or less by heating at 80° C. or higher and 100° C. or lower and an exposure is used.
    Type: Grant
    Filed: December 14, 2021
    Date of Patent: August 8, 2023
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventor: Tsuyoshi Kurosawa
  • Patent number: 11701839
    Abstract: A method for joining two components of a meltable material comprises the steps of providing a first component having a first border region and a second component having a second border region, placing the second component relative to the first component so as to form an overlap between the first border region and the second border region under a gap between the first border region and the second border region, continuously heating opposed sections of the first border region and the second border region at the same time through at least one energy source arranged in the gap at least partially, continuously providing a relative motion of the at least one energy source along the first border region and the second border region in the gap, and continuously pressing already heated sections of the first border region and the second border region onto each other.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: July 18, 2023
    Assignee: AIRBUS OPERATIONS GMBH
    Inventor: Tassilo Witte
  • Patent number: 11697279
    Abstract: A method and a production device for producing a test element are disclosed. The method comprises providing in a transport step a continuous substrate tape, wherein the tape is transported in a transport direction parallel to a direction of extension of the continuous substrate tape; applying in an adhesive application step at least one continuous adhesive strip, wherein the strip is applied to the continuous substrate tape with a liquid adhesive and a slot coating process, and wherein the continuous adhesive strip is oriented parallel to the transport direction; applying in a cover element application step at least one cover element, wherein the at least one cover element is applied to the continuous adhesive strip, thereby securing the cover element to the continuous substrate tape; and individualizing in an individualization step the continuous substrate tape, wherein the tape is individualized into single test elements.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: July 11, 2023
    Assignee: ROCHE DIAGNOSTICS OPERATIONS, INC.
    Inventors: Kurt Klonig, Marc Moldt, Christine Nortmeyer
  • Patent number: 11697250
    Abstract: An example method of joining a first structure and a second structure is described that includes forming a bond cavity between a first structure and a second structure, placing a semi-permeable breather material at one or more exits of the bond cavity, placing a vacuum bag around the bond cavity and the semi-permeable breather material, evacuating the bond cavity via a vacuum port and forcing adhesive into the bond cavity via an adhesive port while the bond cavity is evacuated, and curing the adhesive via one or more heaters to bond the first structure to the second structure.
    Type: Grant
    Filed: October 15, 2021
    Date of Patent: July 11, 2023
    Assignee: The Boeing Company
    Inventors: Joseph L. Hafenrichter, Gary E. Georgeson