Abstract: A circuit layout structure and a memory storage device are disclosed. The circuit layout structure includes a plurality of first volatile memory modules, a plurality of second volatile memory modules, a first data line, a second data line, a first clock enable signal line and a second clock enable signal line. The first data line is configured to access the first volatile memory modules in parallel by a first sequential bit group. The second data line is configured to access the second volatile memory modules in parallel by a second sequential bit group. The first clock enable signal line and the second clock enable signal line are configured to control the first volatile memory modules and the second volatile memory modules to enter a self-refresh mode respectively.

Abstract: Methods, systems, and devices for memory die resource management are described. A resource manager can determine, from a set of global resources for multiple memory dies of a memory sub-system, a set of die-specific resources for a memory die of the multiple memory dies of the memory sub-system. In some case, the set of die-specific resources can be allocated for read commands for the memory die. The resource manager can assign a read command to a die-specific resource of the set of die-specific resources based on the die-specific resource being available and refrain from assigning the read command to the die-specific resource based on the die-specific resource being unavailable.

Abstract: Methods, systems, and devices for source line configurations for a memory device are described. In some cases, a memory cell of the memory device may include a first transistor having a floating gate for storing a logic state of the memory cell and a second transistor coupled with the floating gate of the first transistor. The memory cell may be coupled with a word line, a digit line, and a source line. During a write operation, the source line may be clamped to the digit line using one or more memory cells in the memory device. During a read operation, the source line may be grounded using one or more memory cells in the memory device.

Abstract: The present embodiments relate to methods for maintaining steady and high performance programming of non-volatile memory devices such as NAND-type flash devices. According to certain aspects, embodiments provide adaptive control of programming parameters over the lifespan of a NAND flash device so as to maintain write performance and obtain high endurance.

Abstract: A duration of time for a first idle state of a memory sub-system is determined, where the memory sub-system includes an active state and a second idle state. A first command is received to transition from the active state to the second idle state. In response to the first command, the memory sub-system is transitioned to the first idle state. The memory sub-system is transitioned from the first idle state to the second idle state in response to an expiration of the duration of time.

Abstract: A semiconductor memory device includes a block decoder having a sense node, and a control unit. The block decoder includes first and second transistors each connected between a first node and ground, a third transistor connected between a power source voltage and a second node, a fourth transistor connected between the first and second nodes and controlled by the same gate signal as the third transistor, a fifth transistor having a first terminal connected to the sense node and a gate connected to the second node through an inverter, and a latch circuit that switches the first transistor on and off according to its setting. The control unit determines the setting of the latch circuit, according to a logic level based on a voltage of the sense node during an operation in which the second and third transistors are turned off and the fourth transistor is turned on.

Abstract: An apparatus is provided that includes a plurality of NAND strings having a common set of word lines. Each NAND string includes data memory cells for data storage and dummy memory cells connected in series with the data memory cells. A first group of NAND strings includes dummy memory cells with a first pattern of threshold voltages and a second group of NAND strings includes dummy memory cells with a second pattern of threshold voltages for separate isolation of data memory cells of the first and second groups of NAND strings from corresponding bit lines.

Abstract: The present disclosure relates to a memory device. The memory device includes first memory cell strings, second memory cell strings, a peripheral circuit, and a control logic. The peripheral circuit is connected to first drain select transistors of each of the first memory cell strings through first bit lines, and is connected to second drain select transistors of each of the second memory cell strings through second bit lines. The control logic controls the peripheral circuit to increase a potential of a program inhibit bit line among the first bit lines to a first voltage, and float the program inhibit bit line and increase a potential of the second bit line to a second voltage after the potential of the program inhibit bit line increases to the first voltage.

Abstract: A memory device includes a calibration circuit having a pull-up code generator including a pull-up resistor block and generating a pull-up code, and a pull-down code generator including a replica pull-up resistor block and a pull-down resistor block and generating a pull-down code, and an off chip driver/on die termination circuit providing a termination resistance having a resistance value set by the calibration circuit in a data reception operation and outputting data at an output strength set by the calibration circuit in a data output operation. In a calibration operation, a resistance value of the replica pull-up resistor block is adjusted to be less than a resistance value of the pull-up resistor block, and the pull-down code has a code value by which a resistance value of the pull-down resistor block corresponds to the resistance value of the replica pull-up resistor block.

Abstract: A storage device is disclosed herein. The storage device comprises a block including a plurality of memory cells and a circuit coupled to the plurality of memory cells of the block. The circuit is configured to determine data states for a first set of memory cells of a neighboring word line of the set of word lines, determine a bit line voltage bias and a sense time for a memory cell of a second set of memory cells of the selected word line based on a data state determined for a memory cell for each memory cell of the second set of memory cells, and perform a verify operation on the selected word line using the bit line voltage bias and the sense time determined for each memory cell of the second set of memory cells.

Abstract: According to one embodiment, a memory device includes a memory cell, a word line connected to the memory cell, a word line driver which generates a selection signal for the word line, a first transistor including a gate to which the selection signal generated by the word line driver is input, and a drain which supplies a signal based on the selection signal to the word line, and a detection circuit which detects a value based on a current flowing through the first transistor during a verification period after writing data to the memory cell.

Abstract: An integrated circuit structure includes an SRAM array including a first sub-array having a first plurality of rows and a plurality of columns of SRAM cells, and a second sub-array having a second plurality of rows and the plurality of columns of SRAM cells. A first bit-line and a first complementary bit-line are connected to the first and the second pass-gate MOS devices of SRAM cells in a column in the first sub-array. A second bit-line and a second complementary bit-line are connected to the first and the second pass-gate MOS devices of SRAM cells in the column in the second sub-array. The first bit-line and the first complementary bit-line are disconnected from the second bit-line and the second complementary bit-line. A sense amplifier circuit is electrically coupled to, and configured to sense, the first bit-line, the first complementary bit-line, the second bit-line, and the second complementary bit-line.

Abstract: According to one embodiment, a semiconductor memory device includes: a first bit line; a first memory cell electrically coupled to the first bit line; and a first sense amplifier configured to sense and store data read out to the first bit line. The first sense amplifier includes a first latch circuit and a second latch circuit. In a program operation, each of the first and second latch circuits stores any one bit of program data. In a first verify operation, data is exchanged between the first latch circuit and the second latch circuit when performing the first verify operation for a first data.

Abstract: Systems and methods are provided, which facilitate operations planning, dispatch, regulation control, and autonomous control performance. The disclosure also facilitates systems and methods for utilization of synthetic primary frequency response, synthetic inertia, regulation and load following/ramping reserve capabilities from Demand Response and Distributed Energy Resources for balancing demand and supply and maintaining frequency levels across a power grid.

Abstract: In a channel-stacked memory device which includes a first channel stacked on a second channel, the first channel is programmed in a bottom-to-top direction and the second channel is programmed in a top-to-bottom direction. The electrons in the first channel may be drained by a bit line, while the electrons in the second channel may be drained by a well region.

Abstract: A 3D semiconductor device including: a first level including a first single-crystal layer, a plurality of first transistors, and at least one metal layer, the metal layer overlaying the first single crystal layer with interconnects between the first transistors forming control circuits; a second level overlaying the metal layer, a plurality of second transistors, and a plurality of first memory cells including at least one of the second transistors; a third level overlaying the second level and including a plurality of third transistors, including second memory cells each including at least one third transistor, where at least one of the second memory cells is at least partially atop of the control circuits, where the control circuits are connected so to control second transistors and third transistors, where the second level is bonded to the third level and to the first level, where the bonded includes oxide to oxide bonds; and a fourth level above the third level, including a second single-crystal layer.

Abstract: An electronic memory device and a method of manipulating the electronic memory device. The electronic memory device includes a plurality of basic memory blocks connected together with a modular structure, wherein each of the basic memory blocks includes a plurality lookup tables (LUT) arranged to operate as an memory element for storing a plurality of bits of logic levels; and a plurality of registers each pairing up with a respective lookup table in the basic memory blocks; wherein the plurality of pairs of lookup tables and registers combine to form a pipelining memory structure.

Abstract: A variety of applications can include devices or methods that provide read processing of data in memory cells of a memory de vice without predetermined read levels for the memory cells identified. A read process is provided to vary a selected access line gate voltage over time, creating a time-variate sequence where memory cell turn-on correlates with programmed threshold voltage. Total string current of data lines of a group of strings of memory cells of the memory device can be monitored during a read operation of selected memory cells of the strings to which a ramp voltage with positive slope is applied to an access line coupled to the selected memory cells. Selected values of the change of the total current with respect to time, from the monitoring of the total current, are determined. Read points to capture data are based on the determined selected values. Additional devices, systems, and methods are discussed.

Abstract: A low-power SRAM memory cell includes five word lines and four bit lines. The five word lines are a first word line, a second word line, a third word line, a fourth word line and a fifth word line. The four bit lines are a first bit line, a second bit line, a third bit line, and a fourth bit line. During the operation process of calculating a binary 10×11, the first word line is 1, the second word line is 0, the third word line is 0, the fourth word line is 1, the high bit stored in the bit cell is 1, and the low bit is 1. The voltage value of the fifth word line is 0.73 volt. At this time, the first bit line, the second bit line, and the third bit line do not discharge, while the fourth bit line discharges.

Abstract: A memory device includes first and second memory strings, first and second word lines and a controller. The first memory string includes first and second memory cells, a first select transistor, a second select transistor, and a third select transistor between the first and second memory cells. The second memory string includes third and fourth memory cells, a fourth select transistor above the third memory cell, a fifth select transistor below the fourth memory cell, and a sixth select transistor between the third and fourth memory cells. The first word line is electrically connected to gates of the first and third memory cells. The second word line is electrically connected to gates of the second and fourth memory cells. The controller is configured to execute a read operation on one of the memory cells, the read operation including a first phase and a second phase after the first phase.