Patents Examined by David T Karst
  • Patent number: 11359047
    Abstract: Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including an epoxy resin blend comprising an epoxy resin, a first curing agent selected from the group of a polyarylene alkylphosphonate, a polyarylene arylphosphonate, and combinations thereof, and a second curing agent.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: June 14, 2022
    Assignee: HEXION INC.
    Inventors: Amitabh Bansal, Larry Steven Corley, Diana Sepulveda-Camarena, Jennifer W. Chung, Leeanne Taylor, Alla Hale
  • Patent number: 11352562
    Abstract: An epoxy resin, comprising an epoxy compound having a mesogenic structure, and having a value of ??2/??1 equal to 3 or less, wherein ??1 is an initial dynamic shear viscosity (Pa·s) and ??2 is a maximum value of dynamic shear viscosity (Pa·s), in a measurement of dynamic shear viscosity.
    Type: Grant
    Filed: April 9, 2019
    Date of Patent: June 7, 2022
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Tomoko Higashiuchi, Naoki Maruyama, Kazumasa Fukuda, Yoshitaka Takezawa, Hideyuki Katagi, Yuki Nakamura
  • Patent number: 11339261
    Abstract: A prepreg contains: a reinforcing fiber material; and a resin composition with which the reinforcing fiber material is impregnated. The resin composition contains an epoxy resin, an amine curing agent, and an imidazole curing agent. An amount of the amine curing agent is less than or equal to 3.8 parts by mass, relative to 100 parts by mass of the epoxy resin, and a sum of the amount of the amine curing agent and an amount of the imidazole curing agent is less than or equal to 10 parts by mass, relative to 100 parts by mass of the epoxy resin. The fiber-reinforced composite material is a cured product of the prepreg.
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: May 24, 2022
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Takuya Teranishi, Satoshi Okamoto, Akira Oota, Masahiro Ichino
  • Patent number: 11319405
    Abstract: A curing agent for a water-based epoxy resin, including a reaction composition (A) containing a reaction product of styrene and an amine compound represented by the following formula (1), a water-based epoxy resin composition containing the same, and a cured product thereof. H2N—CH2-A-CH2—NH2??(1) wherein A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: May 3, 2022
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Yuiga Asai, Takuma Hanaoka
  • Patent number: 11306220
    Abstract: A flexible encapsulating material, a method for preparing the flexible encapsulating material, and an encapsulating method using the flexible encapsulating material are provided. The flexible encapsulating material includes an epoxy resin represented by a Formula (1), a curing agent, and a curing accelerator and optionally includes a coupling agent, wherein based on 100 parts by weight of a total usage amount of the epoxy resin (A), the curing agent (B), and the curing accelerator (C), a usage amount of the epoxy resin (A) is 85 parts by weight or more, and based on 100 parts by weight of the usage amount of the epoxy resin (A), a usage amount of the coupling agent (D) is 0 to 5 parts by weight.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: April 19, 2022
    Assignee: eChem Solutions Corp.
    Inventors: Zong-Hao Tang, Hsin-Jen Chen
  • Patent number: 11292871
    Abstract: Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including a liquid epoxy resin component including a liquid epoxy resin and an acrylate monomer, a curing agent component including a compound having an imidazole group and, optionally, a co-curing agent for the compound having an imidazole group comprising a phenolic monomer compound, a branched chain carboxylic acid, and combinations thereof, and a non-aromatic polyol compound. The composition may be used to form composites, such as used in commercial wind turbine blade manufacturing.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: April 5, 2022
    Assignee: HEXION INC.
    Inventors: Larry Steven Corley, Wilbur Paul Ubrich, Jennifer W. Chung, Amitabh Bansal, Terry Loy
  • Patent number: 11292872
    Abstract: Provided is an epoxy resin composition maintaining excellent adhesion and having low dielectric tangent. Specifically, provided is an epoxy resin composition comprising a specific epoxy resin and a phenol-based curing agent.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: April 5, 2022
    Assignee: SUMITOMO SEIKA CHEMICALS CO., LTD.
    Inventors: Ryota Harisaki, Noriaki Fukuda, Katsumasa Yamamoto
  • Patent number: 11292874
    Abstract: Provided is a thermosetting resin composition (C) of which curing can be started at a relatively low temperature in a short time and a cured product exhibits high heat resistance, the thermosetting resin composition (C) comprising an epoxy resin; an epoxy resin curing agent; and an epoxy resin curing accelerator, wherein the epoxy resin curing agent contains an imidazole-based curing agent 1 which is not encapsulated in a microcapsule and a curing agent 2 which is encapsulated in a microcapsule, and the epoxy resin curing accelerator comprises a urea derivative.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: April 5, 2022
    Assignee: Mitsubishi Chemical Corporation
    Inventors: Takuya Teranishi, Masahiro Ichino, Kazuhisa Ikeda, Akira Oota
  • Patent number: 11286334
    Abstract: A method for preparing a latent hardener includes, in the order recited, introducing a hardener into a dry mixer that is a high-energy-type mixer; injecting carbon dioxide gas or an inert gas into the dry mixer; and mechanochemically deactivating only a surface of the hardener using the dry mixer. The hardener may be an amine-based adduct, an imidazole-based adduct, dicyandiamide, a dihydride-based compound, a dichlorophenyl dimethylurea compound and combinations thereof. The inert gas may be helium, nitrogen, argon, neon, krypton, and combinations thereof.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: March 29, 2022
    Assignee: Korea Institute of Science and Technology
    Inventors: Jong Hyuk Park, Min Park, Tae Ann Kim, Jongwon Kim, Sung Min Jee
  • Patent number: 11286385
    Abstract: The present invention provides an epoxy resin composition that contains an epoxy resin (A) that is a product of reaction between an epihalohydrin and either catechol, optionally with its aromatic ring methyl-substituted, or pyrogallol, optionally with its aromatic ring methyl-substituted, and an aromatic glycidylamine epoxy resin (B). This epoxy resin composition is suitable for use in fiber-reinforced composite materials, fiber-reinforced plastic articles, etc., by virtue of being liquid at room temperature, being superior in quick curing, and high mechanical properties in its cured form.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: March 29, 2022
    Assignee: DIC Corporation
    Inventors: Koji Hayashi, Nana Sugimoto, Kunihiro Morinaga
  • Patent number: 11279796
    Abstract: A heat-curing epoxy resin compositions which can in particular be used as bodyshell adhesives for motor vehicle construction. The heat-curing epoxy resin compositions contain a curing agent which can be activated through elevated temperature and has a first component K1 containing at least one epoxy resin and a second component K2 containing at least one tertiary amine and also a primary amine. These compositions, after short-term heating of 30 to 120 seconds at a temperature of 90° C. to 130° C., exhibit sufficient strength and adhesion to withstand transport-induced mechanical strains.
    Type: Grant
    Filed: May 29, 2018
    Date of Patent: March 22, 2022
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Antonio Voci, Michael Gutgsell, Christian Eyholzer
  • Patent number: 11261358
    Abstract: The present invention provides an epoxy resin-based curable composition which may be used as a structural adhesive for an automobile. Particularly, the present invention provides an epoxy resin-based curable composition having excellent low-temperature curability, while maintaining good storage stability and good adhesion. The present invention relates to a curable composition comprising an epoxy resin, a urea-based curing accelerator (A) and an amine-based curing agent (B) having a pyrazine ring.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: March 1, 2022
    Assignee: Sunstar Engineering Inc.
    Inventors: Kazunobu Takami, Takatomi Nishida
  • Patent number: 11248085
    Abstract: The present invention provides an epoxy resin material, a preparation method therefor and an application thereof. The present method for preparing an epoxy resin material comprises: heating a mixture of an epoxy resin main agent and a curing agent that are placed at room temperature to 40-85° C. for reaction and curing. The curing agent contains an adduct of an olefinic nitrile compound and an amine compound. The present method for preparing an epoxy resin material has the characteristics of low mixing viscosity, long operation time, and low amount of heat released during preparation.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: February 15, 2022
    Inventors: Meng Zhou, Zhaoxing Liu, Xiucai Du, Xiaoli Sun, Changkun Chu, Congying Zhang, Xin Li, Qingmei Jiang
  • Patent number: 11236227
    Abstract: Provided are a heat dissipation material capable of ensuring stable adhesion while reducing cost, an inlay substrate using the same, and a method for manufacturing the same. A heat dissipation material having adhesive is obtained by coating a portion or the whole of the heat dissipation material with a heat dissipation material adhering composition including a resin component containing an epoxy resin, a curing agent, and an inorganic filler, and having a complex viscosity at 80° C. of 1×103 Pa·s to 5×106 Pa·s.
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: February 1, 2022
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Hiroaki Umeda, Kazuhiro Matsuda, Ken Yukawa
  • Patent number: 11225556
    Abstract: A super absorbent polymer produced by the preparation method of the super absorbent polymer according to the present invention has excellent dryness while maintaining excellent absorption performance, and thus is preferably used for hygienic materials such as diapers and can exhibit excellent performance.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: January 18, 2022
    Inventors: Bo Hyun Seong, Dae Woo Nam, Jun Kyu Kim, Su Jin Kim, Seon Jung Jung, Ji Yoon Jeong, Tae Hwan Jang
  • Patent number: 11208525
    Abstract: An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: December 28, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Hideyuki Katagi, Kenji Tanaka, Yoshitaka Takezawa, Haruaki Sue, Shinichi Kosugi
  • Patent number: 11208580
    Abstract: A single-component thermosetting epoxy resin adhesives, including: a) at least one epoxy resin having, on average, more than one epoxy group per molecule; b) at least one latent hardener for epoxy resins; and c) 2-7 wt % aerogel particles, relative to the total weight of the single-component thermosetting epoxy resin adhesive, wherein the epoxy resin adhesive has a viscosity of 1000-4000 Pas, in particular 1000-3500 Pas, at 25° C., wherein the viscosity is oscillographically determined by means of a rheometer having a heatable plate (MCR 301, AntonPaar) (gap 1000 ?m, measurement plate diameter: 25 mm (plate/plate), deformation 0.01 at 5 Hz, temperature: 25° C.). The epoxy resin adhesives are characterized in that they can be easily applied in the temperature range from 40° C. to 70° C. and are scouring-resistant, even at higher temperatures.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: December 28, 2021
    Assignee: SIKA TECHNOLOGY AG
    Inventor: Antonio Voci
  • Patent number: 11208523
    Abstract: A polycarbodiimide compound represented by the following general formula (1): wherein R1 and R3 are defined in the specification; R2 comprises a group represented by formula (i) or (ii) as defined in the specification; the proportion of the groups represented by the formula (i) relative to all the R2 groups in the polycarbodiimide compound is 30 to 70 mol %, and the proportion of the groups represented by the formula (ii) relative to all the R2 groups in the polycarbodiimide compound is 30 to 70 mol %; X1 and X2 each represent a group formed by the reaction of the organic compound and isocyanate, and X1 and X2 may be the same as or different from each other; and n represents an integer of 2 to 50.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: December 28, 2021
    Assignee: NISSHTNBO CHEMICAL INC.
    Inventor: Takahiro Sasaki
  • Patent number: 11203661
    Abstract: The present invention relates to a process for the manufacture of an epoxy-functional polyester, and to solid epoxy-functional polyesters made by such process and to a coating composition, in particular a powder coating composition, comprising such solid epoxy-functional polyester. The polyester made as disclosed herein is particularly useful in powder coatings.
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: December 21, 2021
    Inventors: Matthew George Unthank, Ian Marchant Jackson, Barry Gordon Thompson
  • Patent number: 11198789
    Abstract: This invention relates to a hardener composition for an epoxy resin based two-pack coating formulation wherein the hardener composition comprises moieties having at least one structural element of formula >N-D1-NH2, and moieties having at least one structural element of formula >N-D2-NH—C(O)-Q, wherein D1 is a bivalent group, D2 is a bivalent group, and Q is a univalent group, to epoxy resin based two-pack coating formulations comprising at least one epoxy resin which is a polymer containing, on average, at least two epoxide groups per molecule, and the hardener composition, and at least one of diglycerides which are esters of glycerol with two molecules of fatty acid, monoglycerides which are esters of glycerol with one molecule of fatty acid, or glycerol, or the reaction products of at least one of diglycerides or monoglycerides or glycerol with organic compounds having at least one reactive group selected from the group consisting of acylesters, acylanhydrides, isocyanates, epoxides, cyclocarbonates,
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: December 14, 2021
    Assignee: ALLNEX AUSTRIA GMBH
    Inventors: Roland Feola, Florian Lunzer, Johann Gmoser, Manfred Gogg, Alexander Spöck