Patents Examined by David T Karst
  • Patent number: 10882946
    Abstract: Polyester-epoxide polymer (PEEP) compositions are disclosed. The PEEP compositions comprise a reaction product of a polyepoxide compound (eq. wt. 125 to 250 g/eq.) and a polyester polyol composition. The ratio of epoxy equivalents to hydroxyl equivalents is within the range of 0.8 to 3.5. The PEEP composition has a Tg within the range of ?40° C. to 60° C. Elevated temperature-cure and low temperature-cure processes for making the PEEP compositions are also disclosed. In a simple yet innovative approach, a new class of polymers useful for adhesives, coatings, elastomers, and other valuable products is assembled from readily available starting materials without reliance on polyisocyanates or polyamines. The PEEP compositions have increased elongation and lower Tg when compared with traditional epoxy products.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: January 5, 2021
    Assignee: STEPAN COMPANY
    Inventors: Warren A. Kaplan, Jennifer S. Westfall
  • Patent number: 10870725
    Abstract: A heat curable resin composition which allows voids to be removed by heating and vacuum operation after reflow soldering, and a circuit board with an electronic component mounted thereon are provided. The heat curable resin composition of the present embodiment includes a liquid epoxy resin, a hemiacetal ester derived from monocarboxylic acid and polyvinyl ether, a curing agent, and a filler.
    Type: Grant
    Filed: April 5, 2017
    Date of Patent: December 22, 2020
    Assignee: SAN-EI KAGAKU CO., LTD.
    Inventors: Yasuhiro Takase, Kazuki Hanada, Hiroshi Asami
  • Patent number: 10865272
    Abstract: A thermosetting resin composition which produces no free isocyanate even when a carbodiimide compound is used and provides a cured resin having high heat resistance. The thermosetting resin composition makes it possible to reduce the curing temperature, cures in a short time and provides a cured rein having a high glass transition temperature. The thermosetting resin composition includes: (A) an epoxy resin (component A); and (B) a cyclic carbodiimide compound (component B) including a cyclic structure having one carbodiimide group in which first nitrogen and second nitrogen are bonded together by a bond group and having 8 to 50 atoms forming the cyclic structure and/or (b) a polyvalent amine-based curing agent (component b).
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: December 15, 2020
    Assignee: TEIJIN LIMITED
    Inventors: Shinichiro Shoji, Kouhei Endo, Masaya Shibano
  • Patent number: 10829588
    Abstract: A curable composition comprises a) at least one epoxide compound E having at least two epoxide groups; b) at least one amine A having at least two amine hydrogens; and c) at least one acrylic ester U; wherein the epoxide compound E comprises at least one epoxide compound E?, the amine A comprises at least one amine A?, and the acrylic ester U comprises at least one acrylic ester U? whose Hansen solubility parameters for the dipole forces ?p and for the specific interactions ?h satisfy the following conditions: ( ? p ? ( U ? ) - ? p ? ( E ? ) ) 2 + ( ? h ? ( U ? ) - ? h ? ( E ? ) ) 2 ? 1.5 ? ? and ( ? p ? ( U ? ) 2 + ? h ? ( U ? ) 2 ) - ( ? p ? ( A ? ) 2 + ? h ? ( A ? ) 2 ) ? 0 . A suitable choice of the Hansen solubility parameters of the constituents ensures that the acrylic ester is incorporated covalently into the curing material, preventing subsequent evaporation of the diluent.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: November 10, 2020
    Assignee: BASF SE
    Inventors: Friederike Fleischhaker, Andrea Misske, Christoph Fleckenstein, Miran Yu, Martin Kaller, Uwe Meisenburg
  • Patent number: 10793717
    Abstract: Provided are a thermosetting resin composition containing polyester amide acid (A), epoxy compound (B) having a fluorene skeleton, epoxy curing agent (C) and colorant (D), and the thermosetting resin composition capable of forming a cured film having an excellent balance of satisfactory hardness and adhesion to glass under high-temperature conditions, and also an application of the thermosetting resin composition.
    Type: Grant
    Filed: January 20, 2016
    Date of Patent: October 6, 2020
    Inventors: Atsushi Murotani, Takayuki Hirota, Katsuyuki Sugihara, Yoshihiro Deyama, Shinta Morokoshi, Setsuo Itami, Toshiyuki Takahashi
  • Patent number: 10793711
    Abstract: The present invention relates to an epoxy resin composition for sealing a semiconductor device, a preparation method therefor, and a semiconductor device sealed by using the same, the epoxy resin composition, which comprises an epoxy resin, a curing agent, an inorganic filler, and one or more additives selected from the group consisting of a curing accelerator, a coupling agent, a release agent, and a colorant, and has a gel content of approximately 1 ppm or less.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: October 6, 2020
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Yoon Man Lee, Jae Hyun Kim, Tae Shin Eom, Eun Jung Lee, Su Mi Im
  • Patent number: 10797013
    Abstract: A sealing acrylic resin composition contains a thermosetting acrylic resin in liquid phase, an organic peroxide, and an inorganic filler in a content proportion ranging from 50% by mass to 95% by mass, inclusive. A silane coupling agent is bonded to the inorganic filler, a total organic carbon content of the inorganic filler in proportion being ranging from 0.1% by mass to 1.0% by mass, inclusive, in a state before the inorganic filler is mixed with at least one of the thermosetting acrylic resin and the organic peroxide. The silane coupling agent has an acrylic group.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: October 6, 2020
    Inventors: Jin Jin, Naoki Kanagawa, Shigeru Yamatsu, Daisuke Sasaki, Kazuki Watanabe
  • Patent number: 10787536
    Abstract: The present invention relates to a catalyst composition for curing resins containing epoxy groups, in particular epoxy/polyurethane hybrid resins, the catalyst composition containing an imidazolium salt, in addition to a base, as well as a method for curing such resins in the presence of the catalyst composition, to the use of the catalyst composition for curing resins containing epoxy groups, to resin systems comprising a resin containing epoxy groups and the catalyst composition, and to a dosing system that comprises the resin and the catalyst composition.
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: September 29, 2020
    Assignee: Henkel AG & Co. KGaA
    Inventors: Christian Holtgrewe, Harald Kuester, Thomas Bachon, Rainer Schoenfeld
  • Patent number: 10787542
    Abstract: The invention relates to inorganic-organic hybrid materials comprising interpenetrated organic and inorganic components, wherein the organic component comprises polymer chains formed at least in part by ring-opening polymerization of a cyclic monomer, and processes for the production thereof.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: September 29, 2020
    Inventors: Francesca Tallia, Julian Raymond Jones, Laura Francesca Cipolla, Laura Russo, Gloria Ruth Young
  • Patent number: 10787590
    Abstract: A polymer is provided, which is formed by reacting a diol having hydrogenated bisphenol group with a bis-epoxy compound. The diol having hydrogenated bisphenol group may have a chemical structure of wherein each of R1 is independently H or methyl, and m and n are independently integers of 1 to 4. The bis-epoxy compound can be or a combination thereof, wherein each of R2 is independently H or methyl, and each of R3 is independently H or methyl.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: September 29, 2020
    Inventors: Kai-Wei Liao, Wei-Cheng Tang, Yi-Tzu Peng, Ya-Tin Yu, Yi-Che Su
  • Patent number: 10774212
    Abstract: The present invention provides a thermally conductive material containing a disk-like compound as a thermally conductive material having high thermal conductivity and high heat resistance. For example, the present invention provides a thermally conductive material containing a cured substance of a resin composition containing a disk-like compound having two or more functional groups, in which the functional groups are selected from the group consisting of a (meth)acryl group, a (meth)acrylamide group, an oxiranyl group, an oxetanyl group, a hydroxyl group, an amino group, a thiol group, an isocyanate group, a carboxyl group, and a carboxylic acid anhydride group. The present invention also provides a device, which includes the aforementioned thermally conductive material, and the aforementioned resin composition.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: September 15, 2020
    Assignee: FUJIFILM Corporation
    Inventor: Keita Takahashi
  • Patent number: 10752773
    Abstract: The purpose of the present invention is to inhibit a decrease in strength attribute to the interface between a simple-shape portion and a complicated-shape portion. This fiber-reinforced resin composite material comprises: a simple-shape portion formed from at least one sheet-shaped prepreg material obtained by impregnating reinforcing fibers with a resin; and a complicated-shape portion obtained by impregnating reinforcing fibers with a resin, the complicated-shape portion having been integrated with the simple-shape portion. The resin used for the prepreg material comprised the same components as the resin used for the complicated-shape portion.
    Type: Grant
    Filed: April 12, 2018
    Date of Patent: August 25, 2020
    Inventors: Naoyuki Sekine, Eikatsu Yamaguchi, Yoshihiro Fukuda, Hiroyasu Ihara
  • Patent number: 10752743
    Abstract: The invention provides a powder pre-preg comprising as sole resin a vinyl ester resin having a Tg in the range of ?5 to +30° C. and a melt viscosity @100° C. in the range of 2 to 75 dPa·s, which can be used in making a composite at a temperature as low as 80° C.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: August 25, 2020
    Assignee: Polynt Composites France
    Inventors: Thierry Foussard, Paul Darby, Serge Herman, Christine Dhersin
  • Patent number: 10745513
    Abstract: A renewable chemical composition is disclosed for use in a variety of industrial applications. The renewable chemical composition may be reacted with an isocyanate to produce a polyurethane material. The renewable chemical composition has aromatic groups. The suitability of this material for use in a variety of applications can be adjusted by modifying the acid number, the Hydroxyl number, the viscosity, the glass transition temperature, the % solids, the softening point, and other properties. The chemical reactivity and properties can be modified based on processing conditions and temperature as well as the source of renewable raw material. The lignin used in these formulations may be from pulp and paper processing such as semi-mechanical processing, soda processing, kraft processing, or biomass processing, or a by-product of ethanol production. The novel biobased polyurethane formulations range in firmness from flexible to semi-rigid to rigid and are useful in large volume polyurethane applications.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: August 18, 2020
    Inventor: Karl Vincent Kurple
  • Patent number: 10731063
    Abstract: Methods and compositions useful in papermaking and tissuemaking applications are provided. Some embodiments of the methods and compositions comprise a polyaminoamide (“PAA”) polymer functionalized with an acrylamidophenyl boronic acid and a crosslinked polyaminoamide functionalized with an acrylamidophenyl boronic acid. The methods and compositions provide useful properties for creping that include good adhesion even under excessively wet conditions, improved film uniformity, and good film durability, while maintaining good film softness and rewettability necessary for efficient runnability of the tissue machine.
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: August 4, 2020
    Assignee: ECOLAB USA INC.
    Inventors: Gary Samuel Furman, Jr., David J. Castro, Christopher Kaley, Kevin McDonald, Mingli Wei
  • Patent number: 10731049
    Abstract: A coating composition including an epoxy resin in an amount of about 75 weight percent to about 80 weight percent; an isocyanate compound in an amount of about 10 weight percent to about 15 weight percent; and a melamine compound in an amount of about 5 weight percent to about 10 weight percent, where all weight percents are based on a total weight of the coating composition.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: August 4, 2020
    Inventors: Soohoon Lee, Jaehwan Jeon
  • Patent number: 10717875
    Abstract: Provided herein are compositions useful as ink or coatings which contain novel dispersants that are capable of dispersing pigments which are traditionally difficult to disperse while maintaining acceptable levels of viscosity. Use of dispersants as taught herein enables the preparation of a wide variety of inks and coatings having high pigment loading and existing within a conventionally-useful viscosity range.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: July 21, 2020
    Assignee: HUNTSMAN Petrochemical LLC
    Inventors: Duy T Nguyen, Howard P Klein
  • Patent number: 10717831
    Abstract: A two-component type epoxy resin composition for a fiber reinforced composite material is a two-component type epoxy resin composition for a fiber reinforced composite material that includes the following components [A] to [C], wherein the content of the component [C] is 6 to 25 mass parts relative to 100 mass parts of the component [A]. The fiber reinforced composite material is a fiber reinforced composite material made by combining and curing the two-component type epoxy resin composition for the fiber reinforced composite material and a reinforcing fiber, [A]: an epoxy resin, [B]: an acid anhydride and [C]: a quaternary ammonium salt or a quaternary phosphonium halide or an imidazolium salt.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: July 21, 2020
    Assignee: Toray Indusries, Inc.
    Inventors: Hideki Oka, Nobuyuki Tomioka, Shiro Honda
  • Patent number: 10717806
    Abstract: A packaging material is provided. The packaging material includes (a) epoxy silsesquioxane, (b) epoxy resin, and (c) siloxane-imide-containing benzoxazine compound. (a) Epoxy silsesquioxane and (b) epoxy resin have a weight ratio of 0.3:1 to 10:1. The total weight of (a) epoxy silsesquioxane and (b) epoxy resin and the weight of (c) siloxane-imide-containing benzoxazine compound have a ratio of 100:20 to 100:150.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: July 21, 2020
    Inventors: Wen-Bin Chen, Kai-Chi Chen, Shu-Chen Huang
  • Patent number: 10689547
    Abstract: The present invention concerns a curable adhesive composition, wherein the composition is a two-component composition comprising: (A) an adhesive component comprising: (i) an aliphatic glycidyl ether; (ii) a cycloaliphatic epoxy and/or an aromatic glycidyl ether; and (iii) a silane reducing agent; and (B) a catalyst component comprising: (iv) a Group 9 or Group 10 noble metal catalyst, wherein the adhesive component (A) and/or the catalyst component (B) further comprises an initiator; articles coated by the composition or component compositions thereof; methods of bonding articles using the composition or component compositions thereof; and kits comprising the composition or component compositions thereof.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: June 23, 2020
    Inventors: Stuart Corstorphine, Jana Kolbe