Abstract: Disclosed is a polycarbonate resin composition containing (a) an aromatic polycarbonate, (b) a polyester, and (c) a polymer having an epoxy group. The following requirements are satisfied. (1) A content of the (a) aromatic polycarbonate is 75% by mass or more based on a mass of the polycarbonate resin composition. (2) A mass ratio of a content of the (c) polymer having an epoxy group with respect to a content of the (b) polyester is 0.8 or more. (3) A content of a sum of the (b) polyester and the (c) polymer having an epoxy group is 25 parts by mass or less with respect to 100 parts by mass of the (a) aromatic polycarbonate.

Abstract: The present invention relates to new compounds based on polyetheramine modified phenalkamine, their use as curing agents, compositions comprising the novel compounds, the manufacture of such compounds and of such compositions, and the use of these compositions, in particular in a potting process in electrical and electronic components and devices.

Abstract: The present invention provides: an epoxy resin composition which has satisfactory handleability during refrigerated transport, is stable and inhibited from increasing in viscosity for a long period even when held at ordinary temperature, well infiltrates into reinforcing fibers, can be sufficiently rapidly cured at a temperature as high as 180° C., and gives molded objects that can be smoothly demolded in a demolding step after the molding since the resin has sufficiently cured and has high heat resistance imparted thereto; and a fiber-reinforced composite material obtained using the epoxy resin composition. The epoxy resin composition for use in producing fiber-reinforced composite materials comprises an epoxy resin and a hardener, and includes tetraglycidyldiaminodiphenylmethane [A], 4,4?-methylenebis(2-isopropyl-6-methylaniline) [B], and a bisphenol F type epoxy resin [C] in a specific proportion, and satisfies 200??30/?80?500 and 50??80?180, where the viscosities of the resin at 30° C. and 80° C.

Abstract: Lignocellulose based hydrogels (LCHs) derived from date palm (DP) waste that can be used to overcome water treatment challenges, as well as a preparation method and application thereof.

Abstract: Polymerization-induced phase separation enables fine control over thermoset network morphologies, yielding heterogeneous structures with domain sizes tunable over 1-100 nm. However, the controlled chain-growth polymerization techniques exclusively employed to regulate morphology at these length scales are unsuitable for most thermoset materials typically formed through step-growth mechanisms. By employing binary mixtures in place of the classic constituents of phase-separating thermosets—resin, curing agent, and secondary polymer—facile tunability over morphology can be achieved through a single compositional parameter. Indeed, this method yields morphologies spanning nano-scale to macro-scale, controlled by the relative reactivities and thermodynamic compatibility of the network components. Due to the connection between chain dynamics and microstructure in these materials, the tunable morphology enables exquisite control over glass transition and other physical and mechanical properties.

Abstract: An object of the present invention is to provide a molding material which can suppress film lifting, gives good peelability of release paper, and can produce therefrom a fiber-reinforced composite article with good demoldability from a metal mold, and a fiber-reinforced composite article. The molding material of the present invention comprises an epoxy resin composition comprising a component (A): an epoxy resin, a component (B): an epoxy resin curing agent, and a component (C): an unsaturated fatty acid ester compound having a melting point or pour point of 25° ° C. or lower; and a reinforcing fiber substrate, wherein the reinforcing fiber substrate is impregnated with the epoxy resin composition.

Abstract: A water-adaptive cement self-healing system, a preparation method and an application thereof are provided. A pH-triggered shell curing agent, an inorganic nano-emulsifier, and a polysaccharide shell material are added into deionized water to obtain an aqueous phase; an active diluent of epoxy is added to an epoxy to obtain a first oil phase; the aqueous phase is mixed with the first oil phase to obtain an oil/water emulsion; a surfactant is added into paraffin oil to obtain a second oil phase; the second oil phase is mixed with the oil/water emulsion to obtain an oil/water/oil emulsion; an acidic liquid is added into the oil/water/oil emulsion dropwise to obtain a solid, followed by centrifuging, washing, and freeze-drying to obtain a self-healing capsule; and then an epoxy curing agent is mixed with the self-healing capsule to obtain the water-adaptive cement self-healing system based on an oil/water/oil double-emulsion template.

Abstract: A resin composition includes 100 parts by weight of an unsaturated C?C double bond-containing polyphenylene ether resin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance, thermal resistance after moisture absorption and rigidity and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.

Abstract: Methods of preparing phthalonitrile coating compositions are provided, including phthalonitrile sprays, phthalonitrile pastes, and phthalonitrile composite films. In embodiments, such a method comprises, heating a phthalonitrile precursor composition comprising a bisphthalonitrile compound to a temperature and for a period of time to form a phthalonitrile prepolymer composition comprising a bisphthalonitrile prepolymer; cooling the phthalonitrile prepolymer composition to ambient temperature and pulverizing the phthalonitrile prepolymer composition to form particles; combining the particles with a liquid medium to form a phthalonitrile solution; optionally, adding an additive to the phthalonitrile solution; and mixing the phthalonitrile solution to form a phthalonitrile coating composition.

Abstract: A curable liquid composition containing a particulate filler and an epoxy compound having a non-aromatic cyclic group having 5 or more annular atoms, having a favorable dispersion stability of particulate filler and providing a cured material having high hardness, a filler that is suitably incorporated in the curable liquid composition, and a compound that can be suitably used as a ligand bonded to the filler. In a curable liquid composition comprising an epoxy compound having a non-aromatic cyclic group having 5 or more annular atoms as a curable component, a filler on a surface of which a ligand having an alicyclic epoxy group that may be condensed with an aromatic ring and a thiol group, is bonded, is used.

Abstract: A composite material obtained by impregnating a fibrous filler to which a hydrocarbon-based resin is attached with a polymerizable composition containing a cycloolefin monomer and a metathesis polymerization catalyst is provided. According to the present invention, it is possible to provide a composite material which has no impregnation unevenness and can give a composite material molded article having excellent strength.

Abstract: Provided is a resin composition that has a low viscosity before curing, and is capable of being turned into a cured product having superior dielectric properties (low relative permittivity and low dielectric tangent), a low elastic modulus and also an excellent heat resistance. The resin composition is a heat-curable citraconimide resin composition containing: (A) a citraconimide compound having a saturated or unsaturated divalent hydrocarbon group(s) having 6 to 100 carbon atoms; (B) an epoxy resin having at least two epoxy groups in one molecule; and (C) a reaction promoter, wherein a mass ratio between the components (A) and (B) is (A):(B)=99:1 to 1:99.

Abstract: Provided are an epoxy resin curing agent containing an amine composition or a modified product thereof, wherein the amine composition contains bis(aminomethyl)cyclohexane (A) and a compound (B) represented by the following formula (1), and wherein the content of the component (B) based on 100 parts by mass of the component (A) is from 0.01 to 2.0 parts by mass, an epoxy resin composition, and use of an amine composition for an epoxy resin curing agent, wherein R1 represents an alkyl group having 1 to 6 carbon atoms, and p is a number of 1 to 3.

Abstract: Provided are an epoxy resin curing agent containing an amine composition or a modified product thereof, wherein the amine composition contains bis(aminomethyl)cyclohexane (A), a compound (B) represented by the specific formula (1), and a compound (C) represented by the specific formula (2), and wherein a mass ratio of the component (B) to the component (C) [(B)/(C)] is from 0.01 to 5.0, an epoxy resin composition, and use of an amine composition for an epoxy resin curing agent.

Abstract: The present invention provides a germ-repellent silicone rubber comprising: a silicone rubber substrate and a germ-repellent active ingredient incorporated therein; wherein, the silicone rubber substrate includes polydimethylsiloxane; the germ-repellent active ingredients include poly(ethylene oxide) and silicone oil or their derivatives. The disclosed germ-repellent silicone rubber reduces the bacterial growth by inhibiting their adherence to the surface instead of killing them, does not contribute to super bacteria formation nor cause skin irritation.

Abstract: Polyphosphate compositions are produced by a process that includes the steps of continuously introducing a phosphate compound into a polymerization vessel, polymerizing the phosphate compound at a temperature of 250-450° C. for a time period sufficient to form the polyphosphate composition, and continuously discharging the polyphosphate composition from the polymerization vessel. The phosphate compound can be fed to the polymerization vessel in the form of an aqueous slurry containing 5-50 wt. % of the phosphate compound. Resulting polyphosphate compositions often contain at least 8 wt. % of a polyphosphate and less than 35 wt. % of the phosphate compound.

Abstract: A technical problem to be achieved by the present disclosure is to provide an adhesive resin composition for a conductor, which contains inorganic fillers having different average particle diameters and has enhanced thermal conductivity as a result of controlling the content of the inorganic fillers, and an adhesive film for a semiconductor produced using the same.

Abstract: A prepreg having high processability and laminating performance and a method to produce such a prepreg is described, the prepreg comprising at least the components [A] to [E] shown below, and having a structure incorporating a first layer composed mainly of the component [A] and a first epoxy resin composition that contains the components [B] to [D] but which is substantially free of the component [E], and a second layer composed mainly of a second epoxy resin composition that contains the components [B] to [E], [A] carbon fiber, [B] epoxy resin, [C] curing agent, [D] thermoplastic resin, and [E] particles containing a thermoplastic resin as primary component and having a volume-average particle diameter of 5 to 50 ?m.

Abstract: A high-thermal conductive epoxy compound and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package including the epoxy compound. The epoxy compound has a structure represented by Formula 1. E1-M1p-L1x-M2q-L2y-M3r-L3z-A-L3z-M3r-L2y-M2q-L1x-M1p-E2??Formula 1 In Formula 1, M1, M2, M3, L1, L2, L3, A, E, p, q, r, x, y, and z are the same as defined in the detailed description.

Abstract: A composition comprising (a) a cationically polymerisable epoxy resin, (b) an initiator for the cationic polymerisation, (c) a microparticle filler, and (d) a nanoparticle filler can be used for the production of thermally stable insulating material for electrical and electronic components.