Abstract: This invention relates to water-soluble or water-swellable polymers, containing a) 25-35 mol. % of one or more recurrent structural units of formula (1), where R1 and R2 represent hydrogen, methyl or ethyl, A represents a linear or branched C1-C12-alkylene, and Q+ stands for NH4+, Li+, Na+, K+, ½ Ca++, ½ Mg++, ½ Zn++, ? Al+++, or organic ammonium ions of the formula [HNR5R6R7]+, b) 3 to 8 mol. % of one or more recurrent structural units of formula (2), where R1 represents hydrogen, methyl, or ethyl, X+ stands for H+, NH4+, Li+, Na+, K+, ½ Ca++, ½ Mg++, ½ Zn++, ? Al+++, or organic ammonium ions of the formula [HNR5R6R7]+, B is a linear or branched alkylene group with 1 to 6 carbon atoms, and n is a whole number between 0 and 5, and c) 57 to 72 mol. % of a (meth)acrylamide.

Abstract: A tannic acid curing agent and a preparation method thereof are provided. The present invention uses tannic acid as a raw material and the long fatty chain of 10-undecenoyl chloride is introduced into the tannic acid structure to obtain the tannic acid curing agent. The preparation method includes the following steps: mixing tannic acid, 10-undecenoyl chloride, a catalyst and a solvent for a substitution reaction to obtain undecylenyl tannic acid, in which the catalyst includes an acid binding agent and 4-diaminopyridine, and the solvent includes ethyl acetate and N,N-dimethylformamide; mixing the undecylenyl tannic acid, a mercapto compound, a solvent and a photoinitiator for an addition reaction under an ultraviolet irradiation to obtain the tannic acid curing agent, in which the mercapto compound is a mercapto carboxylic acid compound or a mercapto alcohol compound.

Abstract: An epoxy resin, comprising an epoxy compound having at least two mesogenic structures and at least one divalent biphenyl group.

Abstract: The invention provides a powder pre-preg comprising as sole resin a vinyl ester resin having a Tg in the range of ?5 to +30° C. and a melt viscosity @100° C. in the range of 2 to 75 dPa·s, which can be used in making a composite at a temperature as low as 80° C.

Abstract: In an epoxy resin composition, per 100 parts by mass of an epoxy resin component containing from 60 to 85 parts by mass of N,N,N?,N?-tetraglycidyldiaminodiphenylmethane resin (A) having a viscosity at 50° C. of 6000 mPa·s or less and from 15 to 40 parts by mass of a liquid bisphenol A epoxy resin (B) having a viscosity at 25° C. of 20000 mPa·s or less, from 8 to 15 parts by mass of a thermoplastic resin (C), from 2 to 10 parts by mass of elastomer microparticles (D) having an average particle diameter of 1000 nm or less, and from 0.5 to 2.5 parts by mass of silica microparticles (E) having an average particle diameter of 1000 nm or less are blended.

Abstract: Methods and compositions useful in papermaking and tissuemaking applications are provided. Some embodiments of the methods and compositions include a polyaminoamide polymer functionalized with an acrylamidophenyl boronic acid and a crosslinked polyaminoamide functionalized with an acrylamidophenyl boronic acid. The methods and compositions provide useful properties for creping that include good adhesion even under excessively wet conditions, improved film uniformity, and good film durability, while maintaining good film softness and rewettability necessary for efficient runnability of the tissue machine.

Abstract: A highly thermally conductive epoxy compound, and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package, each including the highly thermally conductive epoxy compound. The epoxy compound is represented by Chemical Formula 1 below and has at least one mesogenic naphthalene unit. E1-M1-L1-M2-L2-M3-E2??Chemical Formula 1 In Chemical Formula 1, at least one of M1, M2, or M3, which are mesogenic units, is a naphthalene unit. M1, M2, M3, L1, L2, and E1 and E2 are as defined in the detailed description.

Abstract: The present invention aims to provide a means by which a cured product to be obtained has a low dielectric loss tangent and higher heat resistance. Specifically, provided are an active ester compound represented by chemical formula (1): (where in chemical formula (1), Ar1 is a substituted or unsubstituted first aromatic ring group, and each Ar2 is independently a substituted or unsubstituted second aromatic ring group, in which at least one of Ar1 and Ar2 has an unsaturated bond-containing substituent, and n is an integer of 2 or 3), a curable composition containing the active ester compound, and a cured product thereof.

Abstract: An aqueous dispersion comprising at least one fatty acid-modified epoxy amine adduct wherein the fatty acid has an iodine number of lower than 30 and at least one polymer obtained from the polymerization of one or more ethylenically unsaturated monomers and their use for forming coatings or binder agents, especially for decorative and protective coating applications on various substrates.

Abstract: A method for preparing a thermoplastic polyoxazolidone, the method including catalytically reacting one or more aromatic diisocyanates and one or more diepoxides, wherein the one or more diepoxides comprise one or more 2-phenylpropane-1,3-diol diglycidyl ether derivatives. The one or more diepoxides further contain one or more diglycidyl ethers of aromatic diols.

Abstract: The present invention has an object to provide a resin composition for fiber-reinforced composite materials that excels in rapid curability without impairing low viscosity and heat resistance. A two-component curable resin for fiber-reinforced composite materials is provided, which is configured of a base material including an epoxy resin (A) and a curing agent including an amine compound (B) selected from either norbornane diamine or triethylenetetramine and a phenol compound (C), and in which a mass ratio of the base material to the curing agent is within the range of from 90:10 to 70:30, and the phenol compound (C) includes a phenol compound including two or more phenolic hydroxyl groups and is contained at 5% by weight to 35% by weight in the curing agent. A fiber-reinforced composite material is obtained by mixing reinforcing fibers in the resin composition for fiber-reinforced composite materials.

Abstract: The present disclosure is generally directed to a method of curing an ionic liquid epoxy mixture using an electromagnetic signal. First, an ionic liquid epoxy resin comprising ionic liquid epoxide monomers and, optionally, diluent epoxy resins and powdered fillers, is combined with a curing agent to form an ionic liquid epoxy mixture. The mixture is then applied as a coating onto a surface of a material. The coating is placed in contact with a second surface of the same material or a surface of another material. An electromagnetic signal, which in some instances is a microwave signal, is applied to the coating. Following application of the signal, the ionic liquid epoxide monomers polymerize and the mixture cures, adhering the surfaces together. Alternately, the epoxy mixture is applied to a surface and cured with microwaves to form a protective coating as in cladding or paint.

Abstract: Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including an epoxy resin blend comprising an epoxy resin, a first curing agent selected from the group of a polyarylene alkylphosphonate, a polyarylene arylphosphonate, and combinations thereof, and a second curing agent.

Abstract: An epoxy resin, comprising an epoxy compound having a mesogenic structure, and having a value of ??2/??1 equal to 3 or less, wherein ??1 is an initial dynamic shear viscosity (Pa·s) and ??2 is a maximum value of dynamic shear viscosity (Pa·s), in a measurement of dynamic shear viscosity.

Abstract: A prepreg contains: a reinforcing fiber material; and a resin composition with which the reinforcing fiber material is impregnated. The resin composition contains an epoxy resin, an amine curing agent, and an imidazole curing agent. An amount of the amine curing agent is less than or equal to 3.8 parts by mass, relative to 100 parts by mass of the epoxy resin, and a sum of the amount of the amine curing agent and an amount of the imidazole curing agent is less than or equal to 10 parts by mass, relative to 100 parts by mass of the epoxy resin. The fiber-reinforced composite material is a cured product of the prepreg.

Abstract: A curing agent for a water-based epoxy resin, including a reaction composition (A) containing a reaction product of styrene and an amine compound represented by the following formula (1), a water-based epoxy resin composition containing the same, and a cured product thereof. H2N—CH2-A-CH2—NH2??(1) wherein A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.

Abstract: A flexible encapsulating material, a method for preparing the flexible encapsulating material, and an encapsulating method using the flexible encapsulating material are provided. The flexible encapsulating material includes an epoxy resin represented by a Formula (1), a curing agent, and a curing accelerator and optionally includes a coupling agent, wherein based on 100 parts by weight of a total usage amount of the epoxy resin (A), the curing agent (B), and the curing accelerator (C), a usage amount of the epoxy resin (A) is 85 parts by weight or more, and based on 100 parts by weight of the usage amount of the epoxy resin (A), a usage amount of the coupling agent (D) is 0 to 5 parts by weight.

Abstract: Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including a liquid epoxy resin component including a liquid epoxy resin and an acrylate monomer, a curing agent component including a compound having an imidazole group and, optionally, a co-curing agent for the compound having an imidazole group comprising a phenolic monomer compound, a branched chain carboxylic acid, and combinations thereof, and a non-aromatic polyol compound. The composition may be used to form composites, such as used in commercial wind turbine blade manufacturing.

Abstract: Provided is an epoxy resin composition maintaining excellent adhesion and having low dielectric tangent. Specifically, provided is an epoxy resin composition comprising a specific epoxy resin and a phenol-based curing agent.

Abstract: Provided is a thermosetting resin composition (C) of which curing can be started at a relatively low temperature in a short time and a cured product exhibits high heat resistance, the thermosetting resin composition (C) comprising an epoxy resin; an epoxy resin curing agent; and an epoxy resin curing accelerator, wherein the epoxy resin curing agent contains an imidazole-based curing agent 1 which is not encapsulated in a microcapsule and a curing agent 2 which is encapsulated in a microcapsule, and the epoxy resin curing accelerator comprises a urea derivative.