Abstract: The invention claimed herein and depicted in FIGS. 1 through 4 presents a combined alternate power source and speakerphone device for handheld devices such as cellular telephones. Housing 2 contains battery compartment 28 that accepts batteries such as “AA” or “AAA” cells, which are installed by opening sliding cover 4. Electrical power and speakerphone circuit board 24 are also mounted within housing 2, while on/off switch 8, volume control 10, speaker 12, microphone 14 and cord 16 are mounted onto the housing's outer shell. Cord 16 features socket 18 at its terminal end which accepts a plurality of interchangeable adapter plugs 20 that accommodate the input sockets of a variety of handheld devices. When this invention is installed onto a device such as a cellular telephone, the user can select the mode of operation that provides an auxiliary source of operating power and/or an external speaker and microphone for hands-free use of said device.

Abstract: An improved I/O device, such as an audio/video router, includes at least a motherboard, such as a matrix board, including a plurality of locating slots and a plurality of connectors located on the motherboard such that when the motherboard is mounted in the I/O device, the plurality of connectors are positioned horizontally across the I/O device. The I/O device further includes a plurality of input/output (I/O) cards, such as audio/video cards, each of the I/O cards including a locating slot and two I/O connectors. In an I/O device of the present invention, the locating slot of each of the I/O cards mates with a respective locating slot of the motherboard such that the two I/O connectors of each of the I/O cards vertically straddle a respective connector of the motherboard thus maximizing a number of inputs and outputs able to be provided in the rear of the I/O device.

Abstract: Embodiments of the present technique are directed to a blade system. The blade system may include a first blade module comprising a first conjoining channel, and a second blade module comprising a second conjoining channel aligned with the first conjoining channel, wherein the first blade module and the second blade module are symmetrical and mechanically coupled to form a conjoined blade, wherein electrical components of the first blade module and electrical components of the second blade module are electrically coupled via an electrical coupler routed through the aligned first conjoining channel and second conjoining channel.

Abstract: An arrangement of non-signal through vias suitable for a wiring board is provided. The wiring board has a contact surface, a core layer and pads. The contact pads are disposed on the contact surface, while the arrangement of non-signal through vias includes first non-signal through vias and a second non-signal through via. The first non-signal through vias pass through the core layer and are electrically connected to some of the contact pads. The second non-signal through via which passes through the core layer is disposed between the first non-signal through vias and is not electrically connected to the contact pads. The interval between the second non-signal through via and anyone of the surrounding first non-signal through vias is smaller than or equal to 0.72 times of the minimum interval between any two of the contact pads electrically connected to the corresponding first non-signal through vias.

Abstract: A cabinet includes spaces for a number of electronic enclosures, each of which has a free end from which a pair of levers extend upward and downward to teeth engaging slots within the cabinet, aiding in the insertion and removal of the enclosures from the cabinet. An electronic enclosure that is wider than a standard width includes additional teeth on crank plates turning with the levers. The electronic enclosure may include an electrically-operated interlock mechanism preventing the insertion or removal of the electronic enclosure by preventing movement of a shaft attached to either or both of the levers.

Abstract: Provided circuit modules employ flexible circuitry populated with integrated circuitry (ICs). The flex circuitry is disposed about a rigid substrate. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. A strain relief portion of the flex circuitry has preferably fewer layers than the portion of the flex circuitry along which the integrated circuitry is disposed and may further may exhibit more flexibility than the portion of the flex circuit populated with integrated circuitry. The substrate form is preferably devised from thermally conductive materials.

Abstract: A layout of a printed circuit board adaptive to be bonded to an integrated circuit device is introduced here. The layout includes a first metal layer, disposed in a first insulation layer and a second metal layer, disposed in a second insulation layer over the first insulation layer. The first metal layer and the second metal layer are connected to each other through a plurality of contact hole filled with conductive materials and are arranged to be substantially parallel to each other throughout a pad structure region and a line structure region of the printed circuit. The connected first metal layer and second metal layer are used for a signal path from the printed circuit board to the bonded integrated circuit device to improve driving ability of power supply.

Abstract: The present invention relates to a device comprising a power core wherein said power core comprises: at least one embedded singulated capacitor layer containing at least one embedded singulated capacitor; and at least one planar capacitor laminate; wherein said planar capacitor laminate serves as a low inductance path to supply a charge to said at least one embedded singulated capacitor; and wherein said at least one embedded singulated capacitor is connected in parallel to at least one of the said planar capacitor laminates; and wherein said power core is interconnected to at least one signal layer.

Abstract: A connecting unit for accommodating a wick of a cold cathode fluorescent lamp is disclosed. The connecting unit includes a substrate having a conductive layer disposed thereon, a v-shaped opening, and a c-shaped opening. The width of the front end of the v-shaped opening is greater than the diameter of the wick, and the width of the back end of the v-shaped opening is less than the diameter of the c-shaped opening and less than the diameter of the wick. The conductive layer is disposed on a surface of the c-shaped opening and the v-shaped opening.

Abstract: A stereoscopically connected structure is made up of a first circuit board and a second circuit board which are mounted with other electronic components, and a relay board having a recess which is mounted with an electronic component and is provided with a lead-out wiring extending from the electronic component, and also having a land part to be connected with the lead-out wiring on one of the surfaces of the relay board that face the first circuit board and second circuit board. Thus the relay board can mount the electronic component thereon as well as connect the first circuit board and the second circuit board, thereby achieving high density mounting.

Abstract: A circuit board including a capacitor structure formed on a surface of an insulating substrate, wherein the capacitor structure includes paired linear conductive layers arranged on the surface of the insulating substrate, parallel to each other with a predetermined distance between them, and a dielectric material filled in a groove defined by those surfaces of the paired linear conductive layers which face each other and the surface of the insulating substrate.

Abstract: A USB terminal having a conductor layer to be an input/output terminal of a USB connector is formed on a first principle surface of a circuit board. A memory element is mounted on a second principle surface at an opposite side of a terminal forming surface of the circuit board, and the memory element is sealed with a sealing resin. A semiconductor memory device as a USB memory main body is constituted by them. A USB memory is constituted by housing the USB memory main body inside of a USB connector case.

Abstract: An installation device includes connecting modules which, are easy to replace under aggravated conditions of access, while requiring little space. The device is provided with a retaining device for a supporting structure to be coupled thereto and additionally with a housing with integrated module slots for the connecting modules. In order to specifically assign the connecting modules to the module slots, the device is provided with one coding device for each module slot and one mating coding device for each connecting module. The device is also provided with one snap-in device on at least one of the module slots and one mating snap-in device on at least one of the connecting modules to lock and unlock the connecting modules in the corresponding module slots. One contact element each having a long side is provided for each module slot and one connecting module each is provided with one mating contact element, the contact elements being contacted with the mating contact element at an angle to its long side.

Abstract: An electronic module in which an installation base is used, which includes an insulating-material layer (1) and a conductive layer on the surface of the insulating-material layer. The conductive layer also covers the installation cavity of a component (6). The component (6) is set in the installation cavity, in such a way that the contact zones face towards the conductive layer and electrical contacts are formed between the contact zones of the component (6) and the conductive layer. After this, conductive patterns (14) are formed from the conductive layer, to which the component (6) is attached.

Abstract: A semiconductor device including a PCB including conductive patterns formed on at least one surface of the PCB, external connection terminals including at least one ground terminal and coupled to the conductive patterns, at least one semiconductor chip mounted on a surface of the PCB, and an ESD protection pattern being coupled to at least one of the least one ground terminal, the at least one ground terminal not being coupled to the conductive patterns. A semiconductor memory device, including a PCB, a memory chip mounted on a first surface of the PCB, external connection terminals formed on a second surface of the PCB, and a first ESD protection pattern being coupled to at least one ground terminal. A method of mitigating ESD in a semiconductor device, including mounting a chip on a PCB, forming conductive patterns on the PCB, and forming at least one ESD protection pattern on the PCB, the ESD protection pattern being connected to a ground terminal and not being coupled to the conductive patterns.

Abstract: An exemplary Electronic-component housing may be placed onto a carrier rail with two interlocking spars extending longitudinally at a distance from each other and opening toward the longitudinal sides of the rails. An interlocking profile firmly affixed to the housing is positioned on the underside of the housing and across from the interlocking profile. A displaceable securing lock that is spring-loaded toward the interlocking profile. The securing lock may include on its end away from the interlocking profile a shaped drawbar eye for engagement with an actuation tool. The housing side wall above the securing lock and extending upward extends at least with its lower area in a plane perpendicular to the displacement direction of the securing lock and includes in this area a shaped tool-guide channel with its mouth pointed toward the drawbar eye on the securing lock.

Abstract: A hand-held, portable electronic device including a housing, electronic circuitry in the housing and a rocker key. The housing includes a first section and a second section. The second section is longitudinally slideably mounted on the first section along a longitudinal axis. The rocker key is pivotably connected to the second section of the housing. The rocker key includes a one-piece member with a rotational axis generally aligned with the longitudinal axis.

Abstract: A circuit module shunts thermal energy into a chassis component or a part of the box of the computing application in which the module is employed. In one preferred mode, a flex circuit is populated along each of its first and second major sides with two ranks of ICs which are, preferably, array type (CSP) devices. Insertion contacts are disposed in two sets on the first side of the flex circuit typically between the two ranks of ICs along the first side of the IC. A substrate with first and second lateral sides provides a form for the module. That substrate is preferably comprised of metallic material and exhibits an edge about which the flex circuit is wrapped and an extension at the other extremity of the substrate that is thermally connected to a chassis component of the application, either directly or, preferably, through a thermal conduit such as a thermally conductive compliant material.

Abstract: Multiple DIMM circuits or instantiations are presented in a single module. In some embodiments, memory integrated circuits (preferably CSPs) and accompanying AMBs, or accompanying memory registers, are arranged in two ranks in two fields on each side of a flexible circuit. The flexible circuit has expansion contacts disposed along one side. The flexible circuit is disposed about a supporting substrate or board to place one complete DIMM circuit or instantiation on each side of the constructed module. In alternative but also preferred embodiments, the ICs on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are, in a preferred embodiment, windows, pockets, or cutaway areas in the substrate. Other embodiments may only populate one side of the flexible circuit or may only remove enough substrate material to reduce but not eliminate the entire substrate contribution to overall profile.

Abstract: Apparatus and method for communicating high-speed signals between a primary printed circuit board and one or more secondary printed circuit boards. The high-speed signals are communicated between the primary printed circuit boards and the secondary printed circuit boards through multi-layer flexible conductors.