Patents Examined by Dean O Takaoka
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Patent number: 10854941Abstract: A broadband waveguide comprising at least one filament configured to transmit a signal therethrough. The broadband waveguide may include one or more reflection suppression techniques including a damping material coupled to at least a portion of the at least one filament and/or at least one reflection point configured thereon. The waveguide may further including a cladding material coupled to the at least one filament. The at least one filament may be coupled to a securing element configured to couple to a surface. The at least one filament may be coupled to a sensor configured to sense the transmitted signal.Type: GrantFiled: December 31, 2018Date of Patent: December 1, 2020Assignee: ETEGENT TECHNOLOGIES, LTD.Inventors: Christopher G. Larsen, Oleg Lobkis, Richard A. Roth, Stuart J. Shelley, Conor Coyan, Jason Feldman, Ann El Demery, Mackenzie Shelley
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Patent number: 10856402Abstract: A superconducting radio frequency cell includes a body defining a hollow cavity having a first iris and second iris at opposite ends of the body, an axis that extends between the first and second irises, and an equator around the axis between the first and second irises. The body includes at least a first weld seam around the axis at a location on the body spaced from the equator. Each weld seam extends through the body and has opposite sides terminating proximate an interior and an exterior of the body, and each weld seam includes a first, conduction weld formed on one side of the weld seam and a second weld formed on the opposite side of the weld seam. The second weld can be a conduction weld, a keyhole weld, or a transition weld.Type: GrantFiled: June 26, 2018Date of Patent: December 1, 2020Assignee: II-VI Delaware, Inc.Inventors: Alan Hedges, Kyle Branigan
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Patent number: 10847860Abstract: A superconducting radio frequency (SRF) cell includes a body defining a hollow cavity having a first iris at a first end of the body, a second iris at a second end of the body, an axis that extends between the first and second irises and an equator around the axis between the first and second irises. The body includes a first weld seam around the axis at a location on the body spaced from the equator. A method for producing the SRF cavity includes: (a) providing a first-partial cell including a first cell welding edge; (b) providing a second-partial cell including a second cell welding edge; (c) positioning the first- and second-partial cells with the first and second cell welding edges facing toward each other; and (d) welding the first- and second-partial cells together at a position other than the equator of the body.Type: GrantFiled: May 18, 2018Date of Patent: November 24, 2020Assignee: II-VI Delaware, Inc.Inventor: Kyle Branigan
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Patent number: 10832989Abstract: The disclosure is directed to semiconductor structures and, more particularly, to a three dimensional microstrip branchline coupler and methods of manufacture. The structure includes a plurality of through silicon vias and conductive lines electrically connected to a first end and a second end of respective ones of the plurality of through silicon vias. A first through silicon via of the plurality of through silicon vias forms a first port of a three dimensional (3D) branchline coupler. A second through silicon via of the plurality of through silicon vias forms a second port of the 3D branchline coupler. A third through silicon via of the plurality of through silicon vias forms a third port of the 3D branchline coupler. A fourth through silicon via of the plurality of through silicon vias forms a fourth port of the 3D branchline coupler.Type: GrantFiled: September 26, 2019Date of Patent: November 10, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Barbara S. DeWitt, Essam Mina, B M Farid Rahman, Guoan Wang
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Patent number: 10833457Abstract: An in-line suspended power sensor coupling configuration situated within a high frequency transmission line housing that allows forward, reverse, and sampling voltage elements to all be produced simultaneously on one double sided printed circuit board (PCB). The power sensor coupling allows for calibrated coupling responses across a much wider frequency range with a single PCB assembly, as opposed to the need to cover equivalently sized frequency ranges with multiple individually fabricated coupling element assemblies.Type: GrantFiled: July 1, 2019Date of Patent: November 10, 2020Inventor: Jefferson Lexa
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Patent number: 10833388Abstract: The present disclosure relates to couplers suitable for use in communications systems. The coupler comprises: a main conductive line comprising a first main section and a second main section; a first auxiliary conductive line comprising a first auxiliary section and a first end portion, wherein the first auxiliary section is configured to couple with the main conductive line to generate a first coupled signal; a second auxiliary conductive line comprising a second auxiliary section and a second end portion, wherein the second auxiliary section is configured to couple with the main conductive line to generate a second coupled signal; a transmission module that is configured to combine the first coupled signal and the second coupled signal into an output signal of the microstrip coupler and to pass the output signal to an outlet; and a coupled port coupled to the outlet and used for outputting the output signal.Type: GrantFiled: June 27, 2019Date of Patent: November 10, 2020Assignee: CommScope Technologies LLCInventors: Honghui Chen, Yuemin Li, Haifeng Li
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Patent number: 10833390Abstract: A set of superconducting devices is interconnected in a lattice that is fabricated in a single two-dimensional plane of fabrication such that a superconducting connection can only reach a first superconducting device in the set while remaining in the plane by crossing a component of a second superconducting device that is also located in the plane. A superconducting coupling device having a span and a clearance height is formed in the superconducting connection of the first superconducting device. A section of the superconducting coupling device is separated from the component of the second superconducting device by the clearance in a parallel plane. A potential of a first ground plane on a first side of the component is equalized with a second ground plane on a second side of the component using the superconducting coupling device.Type: GrantFiled: June 28, 2019Date of Patent: November 10, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventor: Salvatore Bernardo Olivadese
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Patent number: 10833380Abstract: The present disclosure provides systems and methods associated with mode conversion for electromagnetic field modification. A mode converting structure (holographic metamaterial) is formed with a distribution of dielectric constants chosen to convert an electromagnetic radiation pattern from a first mode to a second mode to attain a target electromagnetic radiation pattern that is different from the input electromagnetic radiation pattern. A solution to a holographic equation provides a sufficiently accurate approximation of a distribution of dielectric constants that can be used to form a mode converting device for use with one or more transmission lines, such as waveguides. One or more optimization algorithms can be used to improve the efficiency of the mode conversion.Type: GrantFiled: March 5, 2019Date of Patent: November 10, 2020Assignee: Elwha LLCInventors: Tom Driscoll, John Desmond Hunt, Nathan Ingle Landy, David R. Smith, Yaroslav A. Urzhumov
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Patent number: 10833383Abstract: A cascading microwave switch (cascade) includes a set of Josephson devices, each Josephson device in the set having a corresponding operating bandwidth of microwave frequencies, wherein different operating bandwidths have different corresponding center frequencies. A series coupling is formed between first Josephson device from the set and an nth Josephson device from the set, wherein the series coupling causes the first Josephson device in an open state to reflect back to an input port of the first Josephson device a signal of a first frequency from a frequency multiplexed microwave signal (multiplexed signal) and the nth Josephson device in the open state to reflect back to an input port of the nth Josephson device a signal of an nth frequency from the multiplexed signal.Type: GrantFiled: September 10, 2019Date of Patent: November 10, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventor: Baleegh Abdo
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Patent number: 10826152Abstract: An apparatus for processing radio frequency (RF) signals includes a housing with a cavity. In the cavity, a stripline is configured to carry the RF signal. The stripline is on a substrate and suspended in the cavity. One or more coupled lines, which can be forward and reverse directional microstrip couplers, are electromagnetically coupled to the stripline and receive an attenuated version of the RF signal. The couplers can have a stair step design or asymmetric design to enhance directivity.Type: GrantFiled: August 27, 2018Date of Patent: November 3, 2020Assignee: Analog Devices, Inc.Inventor: Anthony P. Messina
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Patent number: 10826151Abstract: A directional coupler circuit includes a signal line disposed between a first terminal and a second terminal; a coupling line comprising a first end terminal and a second end terminal, and disposed to be coupled to the signal line; a switching circuit connecting the first end terminal and a coupling port to each other to extract a first coupling signal in a first coupling mode, and connecting the second end terminal and the coupling port to extract a second coupling signal in a second coupling mode; and a phase compensating circuit configured to compensate for a phase difference between the coupling port and a first isolation port in the first coupling mode, or compensate for a phase difference between the coupling port and a second isolation port in the second coupling mode.Type: GrantFiled: May 24, 2019Date of Patent: November 3, 2020Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jong Mo Lim, Yoo Sam Na, Hyun Hwan Yoo, Hyun Jin Yoo, Hyung Jun Cho, Yoo Hwan Kim
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Patent number: 10818996Abstract: A power sampler may include a sampling circuit interposed in one leg of a differential-signal circuit. An input balun may convert a single-ended signal from a signal source into a differential signal on first and second differential-signal input ports. An output balun may convert an output differential signal to a single-ended output signal to a signal load. The sampling circuit may include an inductance and a coupling circuit. The inductance may be an inductor and have an impedance higher than a source impedance. The coupling circuit, which may be a balun, is connected to the inductance and outputs a single-ended sample signal having a magnitude proportional to the inductance impedance at the design frequency. A second coupling-circuit output conducts an output differential signal and may be connected to the output balun.Type: GrantFiled: October 10, 2019Date of Patent: October 27, 2020Assignee: Werlatone, Inc.Inventors: Allen F. Podell, Philip M. Robertson, Carl G. Schuster, Bernard J. Werlau, Ky-Hien Do
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Patent number: 10818999Abstract: A bi-directional coupler architecture that allows an entire radio frequency coupler to be fully integrated with other circuitry on a single IC substrate. Embodiments of the invention use a lumped component architecture instead of quarter-wave transmission lines to reduce area and limit loss on the primary signal line. In some embodiments, two directional couplers of opposite polarities are implemented at least in part using spiral secondary inductors electromagnetically coupled to a shared primary inductor signal line, thus providing a bi-directional coupler architecture.Type: GrantFiled: February 4, 2020Date of Patent: October 27, 2020Assignee: pSemi CorporationInventor: Norman L. Frederick, Jr.
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Patent number: 10812037Abstract: A bulk acoustic wave resonator includes: a substrate; a first electrode disposed on the substrate; a piezoelectric layer at least partially disposed on the first electrode; and a second electrode disposed on the piezoelectric layer; wherein the first electrode includes an aluminum alloy layer containing scandium (Sc), and has a surface roughness of 2.4 nm or less, based on an arithmetic mean roughness.Type: GrantFiled: May 21, 2019Date of Patent: October 20, 2020Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Je Hong Kyoung, Tae Kyung Lee, Sung Sun Kim, Jin Suk Son, Ran Hee Shin, Hwa Sun Lee
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Patent number: 10812047Abstract: An elastic wave filter apparatus includes a transmission-side filter, a reception-side filter, an antenna terminal, and a matching circuit. The matching circuit is connected between a common node of the transmission-side filter and the reception-side filter and the antenna terminal. The transmission-side filter includes a ladder circuit and filter inductors. The matching circuit includes a matching inductor. The ladder circuit includes series arm resonators and parallel arm resonators. The matching inductor is connected between a transmission line connecting the common node and the antenna terminal and a first terminal of the filter inductor on the side of the parallel arm resonator.Type: GrantFiled: December 19, 2018Date of Patent: October 20, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takuma Genji, Akio Kaneda
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Patent number: 10811754Abstract: A power coupler includes an input port, first and second output ports and an antenna element that is electrically coupled between the first output port and the second output port or that is electrically coupled to an isolation port of the power coupler. The power coupler is configured to split a radio frequency signal incident at the input port and/or to combine radio signals incident at the respective first and second output ports.Type: GrantFiled: October 11, 2018Date of Patent: October 20, 2020Assignee: CommScope Technologies LLCInventors: Huan Wang, Michael Brobston
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Patent number: 10804880Abstract: A device structure comprises an acoustic wave transducer comprising a component. The component comprises a piezo-electric material. Component electrodes are disposed on the component and connection posts extend away from the component. Each of the connection posts is electrically connected to one of the component electrodes. The component has a center and a length greater than a width and, for at least one pair of the connection posts, a distance between the connection posts and the center is less than one quarter of the length.Type: GrantFiled: December 3, 2018Date of Patent: October 13, 2020Assignee: X-Celeprint LimitedInventor: Ronald S. Cok
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Patent number: 10804881Abstract: An SAW device includes a piezoelectric substrate, an IDT electrode on a first major surface of the piezoelectric substrate, a capacitance element which is located on the first major surface and is connected to the IDT electrode, and a cover which is superimposed only on the capacitance element between the IDT electrode and the capacitance element.Type: GrantFiled: December 24, 2015Date of Patent: October 13, 2020Assignee: KYOCERA CorporationInventor: Tomonori Urata
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Patent number: 10804963Abstract: A wave guide assembly for a control and diagnostic system for a machine, the wave guide assembly includes a housing defining an exterior surface and an internal cavity extending between distal ends. A wave guide is defined within the internal cavity. At least one open conduit is defined within the internal cavity providing a space for routing conductors through the housing. A fluid passage is defined within the internal cavity separate from the wave guide. A control and diagnostic system for a machine and a gas turbine engine are also disclosed.Type: GrantFiled: July 19, 2019Date of Patent: October 13, 2020Assignee: Raytheon Technologies CorporationInventors: Ryan K. Snyder, Eric J. Heims
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Patent number: 10797679Abstract: An elastic wave device includes a piezoelectric substrate including an IDT electrode provided on one main surface. In the elastic wave device, a center region positioned in a central portion in a direction perpendicular to an elastic wave propagation direction, first and second low acoustic velocity regions positioned outside of the center region, and first and second high acoustic velocity regions positioned outside of the first and the second low acoustic velocity regions in plan view are provided. A groove portion overlaps with one of the first electrode finger and the second electrode finger in plan view in a portion located in the first and second low acoustic velocity regions on the main surface. An acoustic velocity adjusting layer is provided in the groove portion.Type: GrantFiled: July 10, 2019Date of Patent: October 6, 2020Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Harunobu Horikawa