Patents Examined by Dean O Takaoka
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Patent number: 10958870Abstract: A cable television (CATV) multi-tap system includes a tap housing. The system also includes a face plate including one or more subscriber ports. The system also includes a circuit board positioned within the tap housing and coupled to the face plate. The system also includes an access cover coupled to the tap housing. The access cover is configured to be removed from the tap housing to allow access to the circuit board without removing the face plate or the circuit board from the tap housing.Type: GrantFiled: July 3, 2019Date of Patent: March 23, 2021Assignee: PPC BROADBAND, INC.Inventors: Douglas Jones, Noah Montena, Andriy Lozhko
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Patent number: 10958246Abstract: An acoustic wave filter includes series arm resonators and parallel arm resonators, which are acoustic wave resonators including IDT electrodes provided on a piezoelectric substrate. The IDT electrodes of the series arm resonators include a first thinned electrode (floating electrode) and the IDT electrodes of the parallel arm resonators include a second thinned electrode (filled electrode).Type: GrantFiled: May 18, 2020Date of Patent: March 23, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Koji Miyamoto
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Patent number: 10958307Abstract: Aspects of the subject disclosure may include, for example, a coupling device including a first antenna that radiates a first RF signal conveying first data; and a second antenna that radiates a second RF signal conveying the first data from the at least one transmitting device. The first RF signal and second RF signal form a combined RF signal that is bound by an outer surface of a transmission medium to propagate as a guided electromagnetic wave substantially in a single longitudinal direction along the transmission medium. Other embodiments are disclosed.Type: GrantFiled: November 6, 2017Date of Patent: March 23, 2021Assignee: AT&T Intellectual Property I, L.P.Inventors: Paul Shala Henry, Robert Bennett, Irwin Gerszberg, Farhad Barzegar, Donald J. Barnickel, Thomas M. Willis, III
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Patent number: 10951195Abstract: An acoustic resonator filter package includes an acoustic resonator including a piezoelectric layer, a first electrode disposed on a first surface of the piezoelectric layer, and a second electrode disposed on a second surface of the piezoelectric layer; a first substrate having an upper surface on which the acoustic resonator is disposed, the first substrate comprising a first coupling member surrounding the acoustic resonator; a filter spaced apart from the acoustic resonator in an upward direction; a second substrate having a lower surface on which the filter is disposed, the second substrate including a second coupling member disposed above the first coupling member; and a connection member connecting the first coupling member and the second coupling member to each other, the connection member being made of a material different from a material of which the first coupling member and the second coupling member are made.Type: GrantFiled: July 24, 2019Date of Patent: March 16, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Seong Jong Cheon, Jeong Hae Kim
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Patent number: 10944382Abstract: A switch module includes a first terminal, first and second filters, and first and second switches. Impedance of the first filter for a signal in a stop band is capacitive. When the first switch is turned OFF, impedance of the first switch is capacitive, and impedance of the first filter seen from an end portion of the first switch connected to the first filter is not in a short state and impedance of the first filter seen from the first terminal is in an open state.Type: GrantFiled: April 15, 2020Date of Patent: March 9, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takayuki Tomita, Daisuke Watanabe
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Patent number: 10944147Abstract: A high frequency coupler is disclosed that is configured for grid array-type surface mounting. The coupler includes a monolithic base substrate having a top surface and a bottom surface. A first thin film microstrip and a second thin film microstrip are each disposed on the top surface of the monolithic base substrate. Each microstrip has an input end and an output end. At least one via extends through the monolithic base substrate from the top surface to the bottom surface of the monolithic base substrate. The via(s) are electrically connected with at least one of the input end or the output end of the first microstrip or the second microstrip. The coupler has a coupling factor that is greater than about ?30 dB at about 28 GHz.Type: GrantFiled: February 27, 2019Date of Patent: March 9, 2021Assignee: AVX CorporationInventors: Arie Leonid Talalaevsky, Michael Marek, Elinor O'Neill
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Patent number: 10944373Abstract: A lumped element directional coupler having an asymmetrical structure. The lumped element directional coupler can be integrated while being compact by using lumped elements, instead of transmission lines, have broadband characteristics through the lumped elements being asymmetrically arranged, and further increase bandwidth by additionally providing a negative capacitor element or, more particularly, a negative capacitor element having loss.Type: GrantFiled: October 30, 2018Date of Patent: March 9, 2021Assignee: UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITYInventor: Sang Woong Yoon
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Patent number: 10938376Abstract: An acoustic wave device 1 includes a piezoelectric substrate 2 including a first surface 2A and a second surface 2B, a support substrate 6 bonded to the second surface 2B of the piezoelectric substrate 2, and a first filter 10a and a second filter 10b a passband of which is higher than that of the first filter, both being on the first surface 2A of the piezoelectric substrate 2. The first filter 10a and the second filter 10b each includes an IDT electrode 3. A thickness of the IDT electrode 3 of the first filter 10a and a thickness of the IDT electrode 3 of second filter 10b are different.Type: GrantFiled: October 10, 2017Date of Patent: March 2, 2021Assignee: KYOCERA CorporationInventor: Hiroyuki Tanaka
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Patent number: 10938377Abstract: A surface acoustic wave resonator includes first and second surface acoustic wave resonator connected in series, and a third surface acoustic wave resonator connected in series with the second surface acoustic wave resonator. Each of the first to third surface acoustic wave resonators includes a pair of comb-shaped electrodes in which electrode fingers of one of the comb-shaped electrodes and electrode fingers of the other one of the comb-shaped electrodes are alternately arranged. The second surface acoustic wave resonator has a lower ratio of a width of the electrode fingers to a pitch between the electrode fingers than the first and third surface acoustic wave resonators.Type: GrantFiled: June 10, 2019Date of Patent: March 2, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Toru Eihama
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Patent number: 10938346Abstract: A superconducting input and/or output system employs at least one microwave superconducting resonator. The microwave superconducting resonator(s) may be communicatively coupled to a microwave transmission line. Each microwave superconducting resonator may include a first and a second DC SQUID, in series with one another and with an inductance (e.g., inductor), and a capacitance in parallel with the first and second DC SQUIDs and inductance. Respective inductive interfaces are operable to apply flux bias to control the DC SQUIDs. The second DC SQUID may be coupled to a Quantum Flux Parametron (QFP), for example as a final element in a shift register. A superconducting parallel plate capacitor structure and method of fabricating such are also taught.Type: GrantFiled: May 11, 2016Date of Patent: March 2, 2021Assignee: D-WAVE SYSTEMS INC.Inventors: Andrew J. Berkley, Loren J. Swenson, Mark H. Volkmann, Jed D. Whittaker, Paul I. Bunyk, Peter D. Spear, Christopher B. Rich
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Patent number: 10930995Abstract: Provided is a power divider/combiner capable of improving reflection characteristics and isolation characteristics. The power divider/combiner is formed by a multilayer board, and a strip conductor is arranged in an inner layer of the multilayer board and a chip resistor is arranged on an outer surface of the multilayer board. The power divider/combiner includes vias, which connect the strip conductor and the chip resistor, and includes stubs mounted between input/output terminals and the vias. With this configuration, it is possible to adjust induction mainly during an odd mode of an even/odd mode operation and to consequently improve reflection characteristics of the input/output terminals and isolation characteristics between the input/output terminals.Type: GrantFiled: February 2, 2017Date of Patent: February 23, 2021Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Hideharu Yoshioka, Akimichi Hirota, Naofumi Yoneda, Hidenori Ishibashi
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Patent number: 10931254Abstract: A front end module includes a base filter configured to operate as a bandpass filter passing a pass band of an input radio frequency signal; a switch connected to the base filter, and a first notch filter and a second notch filter selectively connected to the base filter through the switch, wherein a stop band of the first notch filter and a stop band of the second notch filter overlap the pass band of the base filter in a band equal to or higher than a center frequency of the pass band of the base filter.Type: GrantFiled: June 7, 2019Date of Patent: February 23, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Seong Jong Cheon, Hyung Jin Lee, Jeong Hae Kim
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Patent number: 10931259Abstract: An acousto-electric amplifier having insertion gain is provided. The acousto-electric amplifier comprises resistive material coupled to sensors such as conductive fingers. The conductive fingers are disposed on piezoelectric material. The piezoelectric material may be disposed on or above the piezoelectric material. Transducers may be used to couple a surface acoustic wave to and from the acousto-electric amplifier. The acousto-electric amplifier amplifies the surface acoustic wave in one propagation direction and attenuates a surface wave in the opposite propagation direction.Type: GrantFiled: June 11, 2020Date of Patent: February 23, 2021Assignee: Pegasense, LLCInventor: Donald Chester Malocha
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Patent number: 10921654Abstract: A high-frequency device and/or a high-frequency switch including the same may include: a signal electrode; a first ground electrode arranged in parallel with the signal electrode; a first liquid crystal layer disposed between the signal electrode and the first ground electrode; and a first dielectric layer disposed between the first liquid crystal layer and the first ground electrode, and/or between the signal electrode and the first liquid crystal layer. The first dielectric layer may have a dielectric constant that is larger than the dielectric constant of the first liquid crystal layer. The high-frequency device and/or the high-frequency device including the same may be variously implemented.Type: GrantFiled: October 25, 2017Date of Patent: February 16, 2021Assignee: Samsung Electronics Co., Ltd.Inventors: Artem Rudolfovitch Vilenskiy, Elena Aleksandrovna Shepeleva, Gennadiy Aleksandrovich Evtyushkin, Mikhail Nikolaevich Makurin
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Patent number: 10924084Abstract: An acoustic wave device includes an antenna terminal, a signal terminal, and a plurality of resonators that are provided on a piezoelectric substrate. The plurality of resonators include a plurality of series arm resonators on a series arm, and the duty of an IDT electrode of the series arm resonator closest to the antenna terminal among the plurality of series arm resonators is smaller than the duty of an IDT electrode of at least one series arm resonator among the other series arm resonators.Type: GrantFiled: July 31, 2019Date of Patent: February 16, 2021Assignee: Murata Manufacturing Co., Ltd.Inventor: Junpei Yasuda
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Patent number: 10924070Abstract: A high-frequency module (10) includes a filter unit (20) including a plurality of filters, a switch unit (30) that is connected to the filter unit (20) and that includes a switch configured to switch filters through which a high-frequency signal passes among the plurality of filters, an amplifying unit (50) configured to amplify the high-frequency signal passing through the filter unit (20), a matching unit (40) that is connected between the filter unit (20) and the amplifying unit (50) and that is configured to perform impedance matching of the amplifying unit (50), and a multilayer substrate (100) provided with the filter unit (20), the switch unit (30), the amplifying unit (50), and the matching unit (40).Type: GrantFiled: September 11, 2019Date of Patent: February 16, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Terumichi Kita
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Patent number: 10916821Abstract: Metamaterial waveguides and shielded bridges are employed to improve the scalability and routing of quantum computing circuits. A metamaterial waveguide includes a signal conductor that has a periodic array of lumped element resonators distributed along and electrically coupled to a signal conductor. The periodic array of lumped element resonator pairs defines a bandgap within an operating bandwidth of the waveguide. Qubits can communicate within the operating bandwidth of the waveguide and communications via the waveguide can be controlled by changing a center frequency of the qubits. A shielded bridge is used to cross over high frequency communications and control CPW's in a quantum computing circuit. The shielded bridge includes a signal bridge that is elevated and extends over a separate CPW, and a ground bridge positioned between the signal bridge and the separate CPW.Type: GrantFiled: March 5, 2019Date of Patent: February 9, 2021Assignee: CALIFORNIA INSTITUTE OF TECHNOLOGYInventors: Oskar Painter, Seyed Mohammad Mirhosseini Niri, Eun Jong Kim, Alp Sipahigil, Vinicius Thaddeu dos Santos Ferreira, Andrew J. Keller, Mahmoud Kalaee, Michael T. Fang
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Patent number: 10917139Abstract: According to one embodiment, there is provided a magnetic coupling device including a first coil, a second coil, a third coil, a fourth coil, a first constant-potential node and a second constant-potential node. The second coil is electrically connected with one end of the first coil and wound in a direction opposite to a direction in which the first coil is wound. The third coil faces the first coil. The fourth coil faces the second coil. The first constant-potential node is electrically connected with one end of the third coil. The second constant-potential node is electrically connected with one end of the fourth coil.Type: GrantFiled: February 28, 2019Date of Patent: February 9, 2021Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATIONInventors: Toyoaki Uo, Tsuneo Suzuki, Hiroaki Ishihara
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Patent number: 10911016Abstract: Wideband baluns with enhanced amplitude and phase balance are provided. The wideband balun includes a first transmission line connected between a first port and a third port, and a second transmission line connected between a second port and a fourth port, and a third transmission line connected between the third port and a reference voltage, such as ground. To enhance phase and/or amplitude balance of the wideband balun, the wideband balun further includes a compensation structure operable to provide at least one of capacitive compensation or inductive compensation to balance the wideband balun. For example, in certain implementations, the compensation structure includes at least one of (i) a capacitor connected between the first port and the second port or (ii) a fourth transmission line connected between the first transmission line and the third port.Type: GrantFiled: April 10, 2019Date of Patent: February 2, 2021Assignee: Analog Devices, Inc.Inventors: Song Lin, Mir A. Faiz, Xudong Wang, Donghyun Jin, Bin Hou
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Patent number: 10910690Abstract: A directional coupler that achieves flattening of a coupling characteristic and size reduction or miniaturization is used in a predetermined frequency band and includes a first terminal, a second terminal, a third terminal, a fourth terminal, a main line, and a sub line. The main line is connected between the first terminal and the second terminal. The sub line is connected between the third terminal and the fourth terminal. In the sub line, a low-pass filter is provided.Type: GrantFiled: September 7, 2018Date of Patent: February 2, 2021Assignee: MURATA MANUFACTURING CO., LTD.Inventor: Ikuo Tamaru