Patents Examined by Derris H. Banks
  • Patent number: 8347473
    Abstract: A stud installation tool comprising a slide shaft including a pair of arms angled towards each other, a slide bar with a triangular head at an end engaged within the pair of arms to enable the slide bar to move along the slide shaft without disengaging, a receiving brace attached to the slide shaft at an opposing end from the slide bar, where said receiving brace includes a threaded hole, a bolt threaded through the slide bar and extending down and through the threaded hole, a bolt head fastened to the bolt and positioned above the slide bar, and a stud holder connected to the slide bar at an end opposite from the triangular head wherein the stud holder includes an opening to accept a stud after the stud is slid through a hole in an axle plate and positioned between the receiving brace and the stud holder.
    Type: Grant
    Filed: September 24, 2010
    Date of Patent: January 8, 2013
    Inventor: Alton Wayne Hux
  • Patent number: 8316531
    Abstract: A clamping apparatus capable of clamping various semiconductor substrates is provided. The clamping apparatus includes includes a main body, and a support plate partially coupled to the main body. The support plate is movable vertically. In addition, the clamping apparatus further includes a fixed gripper coupled and fixed onto the main body and a movable gripper disposed on the main body. The movable gripper is movable horizontally.
    Type: Grant
    Filed: November 9, 2009
    Date of Patent: November 27, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ho-Soo Jang, Dong-Soo Lee, Dong-Chul Han
  • Patent number: 8225471
    Abstract: Embodiments of an injection molded energy harvesting device are described. In one embodiment, a piezoelectric cantilever is produced via an injection molding method to harvest vibration energy from an environment being sensed. The cantilever device consists of a piezoelectric material member, a proof mass of high density material coupled to the piezoelectric member, and a leadframe for electrical connection. The piezoelectric member is electrically attached to the leadframe with a standard connecting material. The entire assembly is then injection molded with plastic. The plastic encased piezoelectric member forms a cantilever that generates electricity in response to vibration exerted on the proof mass.
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: July 24, 2012
    Assignee: Robert Bosch GmbH
    Inventor: Brian Stark
  • Patent number: 8176625
    Abstract: An electrical connector tool assembly is disclosed. The tool assembly includes a conductor tool and a connector tool connected to and cooperable with the conductor tool. The tool assembly can be used in connecting a first conductor to a second conductor with an electrical connector. The tool assembly is adjustably arranged and disposed to receive and removably retain a first conductive member of an electrical connector in the connector tool and is further arranged and disposed to both to hold the second conductor in place relative to a second conductive member of the electrical connector and to prevent rotation of the second conductive member with respect to the first conductive member.
    Type: Grant
    Filed: July 15, 2008
    Date of Patent: May 15, 2012
    Assignees: Tyco Electronics Corporation, Tyco Electronics Canada ULC
    Inventors: Charles D. Copper, Barry James Johnson, Dmitry Ladin
  • Patent number: 8087161
    Abstract: An assembling device for assembling an electronic device which includes a front shell, a rear shell, a lens cover mounted on one of the front and rear shells includes a supporting member and a pressing member. The supporting member includes a base and a positioning block according to the lens cover to be assembled. The base defines a well for receiving the electronic device to be assembled. The positioning block is positioned in the well and has an adjustable height relative to the bottom surface of the well. The pressing member includes a pressing portion which is configured for pressing one of the front and rear shells of the electronic device. Thereby when assembling the electronic device, the height of the positioning block can be adjusted to press or not press the lens cover depending on which of the front and rear shells is assembled.
    Type: Grant
    Filed: March 10, 2009
    Date of Patent: January 3, 2012
    Assignee: Chi Mei Communication Systems, Inc.
    Inventor: Kun-Hung Ho
  • Patent number: 8061012
    Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.
    Type: Grant
    Filed: December 7, 2007
    Date of Patent: November 22, 2011
    Assignee: RF Micro Devices, Inc.
    Inventors: Dan Carey, Jeffrey Scott Walker, Gary D. Messner
  • Patent number: 8056226
    Abstract: A dual interface separable insulated connector comprising a faraday cage molded over a bus bar for use in an electric power system and a method of manufacturing the same are provided. The faraday cage can be disposed within a semi-conductive shell. The configuration of the separable insulated connector can provide for easier bonding between the faraday cage and insulating material. Additionally, the configuration can eliminate or reduce the need to coat the bus bar with an adhesive agent and to smooth the metal bus bar to remove burrs, other irregularities, and sharp corners from the bar. Manufacturing the dual interface separable insulated connector can include molding a semi-conductive rubber faraday cage over a conductive bus bar, inserting the faraday cage into a shell, and injecting insulating material between the faraday cage and shell.
    Type: Grant
    Filed: February 25, 2008
    Date of Patent: November 15, 2011
    Assignee: Cooper Technologies Company
    Inventors: David Charles Hughes, Mark Clifford Kadow, Michael John Gebhard, Sr.
  • Patent number: 8051547
    Abstract: An assembly system and method for assembling an aircraft wing box or other structure that may define an interior area accessible through at least one access opening are provided. The method includes inserting a robot having an assembly tool mounted thereto into the interior area through the at least one access opening. The assembly tool may be positioned at a fastener location, and may be clamped to the structure. A hole may be made through the structure, and a fastener may be installed in the hole.
    Type: Grant
    Filed: December 29, 2006
    Date of Patent: November 8, 2011
    Assignee: The Boeing Company
    Inventors: Chin H. Toh, Edward Bruce Harman, Branko Sarh
  • Patent number: 8042268
    Abstract: A method for making a gas turbine component (100). A central core (20) is positioned to occupy a space that will define a central channel (42), and an outer channel core (30) is positioned spaced apart from the central core (20). A mold (35) is formed around the central core (20) and the outer channel core (30), so that an exterior wall (32) contacts the mold (35). A substrate material, such as a metal alloy (247) in liquid form, is added to the mold (35) to form an internal volume (41) of the component (100). The central core (20) and the outer channel core (30) are removed, and interconnect channels (44) are formed between the thus-formed central channel (42) and the inner portion (49) of the outer channel (62) thus far formed. A preform (55) is placed into the inner portion (49) and may have a desired outer surface (57) shape. An overlay material is applied to form an outer layer (60), thus defining the remainder of the outer channel (62), which is obtained upon removal of the preform (55).
    Type: Grant
    Filed: March 21, 2008
    Date of Patent: October 25, 2011
    Assignee: Siemens Energy, Inc.
    Inventors: Douglas J. Arrell, Allister W. James, Anand A. Kulkarni
  • Patent number: 8042271
    Abstract: An aspirating roller (1) for transferring labels, comprising at least a pair of pads (20;21) projecting relative to a lateral surface (1a) of the roller (1). The roller (1) is characterised in that at least a portion of the lateral surface (1a) of the roller (1) present between the pads (20;21) is elastically deformable. A method for removing/mounting an elastically deformable plate-like element (6), of the type present between a pair of pads (20;21) and defining a lateral surface (1a) of a roller (1) for transferring labels.
    Type: Grant
    Filed: December 29, 2003
    Date of Patent: October 25, 2011
    Assignee: Sidel Holdings & Technology SA
    Inventors: Alessandro Caprara, James Frederick Robertson Carmichael
  • Patent number: 8042263
    Abstract: According to the present invention, there is provided a process for manufacturing a circuit board wherein a first substrate having a conductor post and a second substrate having a conductor pad for receiving the conductor post are laminated through an interlayer adhesive, and the conductor post and the conductor pad are electrically connected, comprising, as a first step, bonding the conductor pad with the conductor post by thermocompression under predetermined first conditions while the first and the second substrates are arranged such that the conductor pad faces the conductor post through the interlayer adhesive; thermocompressing the first substrate and the second substrate under predetermined second conditions while the conductor pad is bonded with the conductor post; and thermocompressing the first substrate and the second substrate under predetermined third conditions while the conductor pad is bonded with the conductor post, wherein the first, the second and the third conditions are different from eac
    Type: Grant
    Filed: February 8, 2007
    Date of Patent: October 25, 2011
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventors: Masayoshi Kondo, Toshio Komiyatani
  • Patent number: 8037601
    Abstract: The present invention provides a rocker arm manufacturing method capable of stably forming valve stem guide walls. In the method according to the present invention, an intermediate product 13 having both side walls 20 extended in a predetermined direction and arranged in parallel with each other and a one end side connection wall 30 connecting lower ends of both the side walls 20 at a longitudinal one end of the product is obtained. Next, a first pressing punch 70 is pressed against the outer surface portions of both the side walls 20 from the outside thereof to cause downward plastic flows of regions of the outer surface portions of both the side walls positioned below the cutout portions 31 to thereby form raising walls 32 in a downwardly protruded manner at both sides of the one end side connection wall 30. Thereafter, valve stem guide walls 35 are formed by pressing second pressing punches 80 against both the raising walls 32 of the one end side connection wall 30.
    Type: Grant
    Filed: August 1, 2006
    Date of Patent: October 18, 2011
    Assignees: Nakanishi Metal Works Co., Ltd., Otics Corporation
    Inventor: Yoshio Kawatake
  • Patent number: 8037586
    Abstract: A method for fabricating a blind via structure of a substrate is provided. First, a substrate is provided, which includes a conductive layer, a metal layer, and a dielectric layer disposed between the conductive layer and the metal layer. Next, a cover layer is formed on the conductive layer. Finally, the substrate formed with the cover layer is irradiated by a laser beam to form at least one blind via structure extending from the cover layer to the metal layer. The blind via structure includes a first opening, a second opening, and a third opening linking to one another. The first opening passes through the cover layer. The second opening passes through the conductive layer. The third opening passes through the dielectric layer. For example, a size of the first opening is greater than a size of the second opening and a size of the third opening.
    Type: Grant
    Filed: October 28, 2008
    Date of Patent: October 18, 2011
    Assignee: Unimicron Technology Corp.
    Inventors: Wei-Ming Cheng, Shao-Wei Lin, Pao-Chin Chen
  • Patent number: 8033014
    Abstract: The present invention provides a method of making a molded interconnect device. The method includes the steps of: injection molding a plastic body having thereon at least one patterned circuit trench structure; and filling a conductive material into the patterned circuit trench structure thereby forming a circuit trace on the plastic body.
    Type: Grant
    Filed: July 7, 2008
    Date of Patent: October 11, 2011
    Assignee: Unimicron Technology Corp.
    Inventors: Cheng-Hung Yu, Chi-En Li
  • Patent number: 8033015
    Abstract: Disclosed is a printed wiring board having signal layers each interposed between a power supply layer and a ground layer, wherein the signal layer includes at least one of a wiring region for a ground potential and a wiring region for a power supply potential.
    Type: Grant
    Filed: October 13, 2006
    Date of Patent: October 11, 2011
    Assignee: NEC Corporation
    Inventor: Kazuhiro Kashiwakura
  • Patent number: 8032998
    Abstract: A manufacturing apparatus for a foil bearing comprises: a tubular positioning member having a substantially cylindrical wall provided with engagement portions each having a shape corresponding to at least part of a wave-shaped portion of associated one of foil members such that positioning of the foil members can be achieved by engaging the wave-shaped portion of each foil member to the associated engagement portion of the positioning member and inserting the positioning member into an inside of the stationary mount member; and a welding device for welding the foil members to the inner circumferential surface of the stationary mount member, wherein the positioning member is formed with openings in the substantially circumferential wall thereof to allow the welding device to access the foil members from inside the positioning member through the openings.
    Type: Grant
    Filed: February 15, 2008
    Date of Patent: October 11, 2011
    Assignee: Honda Motor Co., Ltd.
    Inventors: Daisuke Kato, Yoshiki Morishita
  • Patent number: 8028401
    Abstract: A method of fabricating a conducting crossover structure for a power inductor comprises stamping a first lead frame to define a first terminal and a second terminal; stamping a second lead frame to define a first terminal and a second terminal; and locating an insulating material between and in contact with the first and second lead frames to form a laminate.
    Type: Grant
    Filed: March 3, 2006
    Date of Patent: October 4, 2011
    Assignee: Marvell World Trade Ltd.
    Inventor: Sehat Sutardja
  • Patent number: 8028406
    Abstract: Methods for fabricating a coplanar waveguide structure. The method may include forming first and second ground conductors and a signal conductor in a coplanar arrangement between the first and second ground conductors, forming a first coplanar array of substantially parallel shield conductors above the signal conductor and the first and second ground conductors, and forming a second coplanar array of substantially parallel shield conductors below the signal conductor and the first and second ground conductors. The method further includes forming a first plurality of conductive bridges located laterally between the signal conductor and the first ground conductor, and forming a second plurality of conductive bridges located laterally between the signal conductor and the second ground conductor. Each of the first plurality of conductive bridges connects one of the shield conductors in the first array with one of the shield conductors in the second array.
    Type: Grant
    Filed: April 3, 2008
    Date of Patent: October 4, 2011
    Assignee: International Business Machines Corporation
    Inventors: Hanyi Ding, Essam F. Mina, Guoan Wang, Wayne H. Woods
  • Patent number: 8028391
    Abstract: A belt lacer uses a power drive carriage for clinching hook or C-shaped belt lacing elements to a belt end. Optionally, the carriage may be driven in a manual mode or a power mode. A detachable power drive such as from an electric drill may be used for the power mode. The power drive of the carriage may be stopped short of an end wall and a return mechanism may return the carriage to the power drive. A moveable belt support in a hand space position allows for working on the lacing elements and may be shifted to a belt supporting position. The belt clamp exerts a forwardly directed force on the belt as it is being clamped. Face plates or combs may be stored on the belt lacer. A latch secures the face plates against lateral sliding during clinching by clinching rollers on the carriage.
    Type: Grant
    Filed: May 26, 2006
    Date of Patent: October 4, 2011
    Assignee: Flexible Steel Lacing Company
    Inventor: James M. Kolodziej
  • Patent number: 8028397
    Abstract: The present invention uses a frame with one or more axial ribs extending from a spine onto which two or more discrete two-terminal electronic components, such as capacitors, resistors, or inductors, can be attached. The function of the frame is to align and space the electronic components in a single device or array that allows the two-terminals of each component to be separately contacted or soldered to a PC board during final assembly into a circuit. The frame may use friction or a bonding agent to hold the components to the frame. Additionally, the base of the frame forms a single surface for the pick and place equipment used in circuit board assembly. The frame and any bonding agent must be capable of sustaining high temperature soldering operations to form electrical contacts in the circuit assembly operation.
    Type: Grant
    Filed: April 22, 2008
    Date of Patent: October 4, 2011
    Assignee: Vishay Sprague, Inc.
    Inventor: John Bultitude