Abstract: Methods for improving heat transfer at the interface between the internal reactor wall and mesh media containing microfibrous entrapped catalysts (MFECs) and/or microfibrous entrapped sorbents (MFESs) are described herein. Improved (e.g., more rapid) heat transfer can be achieved using a variety of approaches including increasing the contacting area of the interface between the mesh media and the reactor wall so that more contacting points are formed, enhancing the contacting efficiency at the contacting points between the mesh media and the reactor wall, increasing the number of contact points between the mesh media and the reactor wall using fine fibers, and combinations thereof.

Abstract: A system and method of joining at least two workpieces together using a friction rivet and a friction rivet cap that are friction stirred together after a cutting tip or cutting feature on the friction rivet cuts through workpieces and is then bonded to the friction rivet cap, and wherein the friction rivet cap may be excluded if the friction rivet includes a hollow in the cutting tip, the hollow being flared after the friction rivets cuts through the workpieces to thereby create an integral rivet cap in the end of the friction rivet.

Abstract: A method for manufacturing a clad type electromagnetic shielding material includes step as follows: a first electrically conductive metallic layer, a magnetically conductive metallic layer, a second electrically conductive metallic layer and a shock-absorbing insulation layer, which are stacked in order, are one-time continuously rolled by a clad type rolling process, so as to finish a clad plate applied to an electromagnetic shielding field, wherein the surface of the shock-absorbing insulation layer provided with a binder faces the second electrically conductive metallic layer.

Abstract: Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a bond pad of a microfeature workpiece, with the volume of material including a first metallic constituent and the bond pad including a second constituent. The method can further include elevating a temperature of the volume of material while the volume of material is applied to the bond pad to alloy the first metallic constituent and the second metallic constituent so that the first metallic constituent is alloyed generally throughout the volume of material. A thickness of the bond pad can be reduced from an initial thickness T1 to a reduced thickness T2.

Abstract: A brazing or soldering wire has a pair channels recessed therein. A divider separates the pair of channels. The divider has opposing walls extending outwardly from corresponding base portions of the pair of channels. A first engagement surface is located between the opposing walls. A pair of outer walls is separated by the pair of channels and the divider. A second engagement surface is formed between an outer surface of the elongated wire and a terminal end of one of the outer walls and is substantially coplanar with the first engagement surface. A third engagement surface is formed between the outer surface of the elongated wire and a terminal end of the other of the outer walls and is substantially coplanar with the first engagement surface. A cured flux solution is located within the pair of channels.

Abstract: Provided in one embodiment is a method of forming an interfacial layer or a seal, the method comprising: providing a composition that is at least partially amorphous, the composition having a glass transition temperature Tg and a crystallization temperature Tx; heating the composition to a first temperature that is below Tx; disposing the heated composition to form the interfacial layer or the seal; and cooling the interfacial layer or the seal to a second temperature that is below Tg.

Abstract: Methods of fabricating reduced weight components for apparatuses include providing a plurality of layers from a component core including a relatively lightweight material to an outer layer including a relatively heavyweight material heavier in weight than the relatively lightweight material, the plurality of layers having increasingly higher proportions of the relatively heavyweight material than the relatively lightweight material from the component core to the outer layer; and diffusion bonding the plurality of layers and the outer layer by consolidation of the layers.

Abstract: The invention relates to a friction application device having an application element which is movable by means of a moving device on a surface of a workpiece and in a relative movement with respect to the surface of the workpiece, wherein at least one supporting tool which is in contact with the application element and prevents bead formation on the application element is arranged in the contact region between the application element and the surface of the workpiece.

Abstract: A friction stir welding tool for welding of metallic plates and especially steel plates. The friction stir welding tool is made of cemented carbide comprising WC grains in a binder phase and wherein the welding tool is at least partly coated with a surface coating comprising Al2O3.

Abstract: A method for making a support structure for a probing device includes a step of providing a substrate having first internal conductive lines, a carrier having second internal conductive lines and a thickness less than 2 mm for packaging an integrated circuit chip, solder balls, and photoresist support blocks made by lithography in a way that the solder balls and the photoresist support blocks are disposed between the substrate and the carrier, the photoresist support blocks separately arranged from each other, and at least one of the photoresist support blocks is disposed between two adjacent solder balls. The method further includes a step of electrically connecting the first internal conductive lines with the second internal conductive lines respectively by soldering the carrier and the substrate with the solder balls by reflow soldering.

Abstract: A guide vane has a devised guide configuration for changing a flow direction of molten solder. The guide vane comprises a half-cylindrical plate 11 having a prescribed inner surface shape and a prescribed height, being stood on a prescribed board and changing a flow direction of fluid; and a half-cylindrical plate 12 having a prescribed inner surface shape and a prescribed height, being stood on the board 13 on which the first member 11 is stood and changing the flow direction of the fluid as shown in FIG. 1. The half-cylindrical plate 11 and the half-cylindrical plate 12 are faced so that an inner surface of the half-cylindrical plate 11 is faced to an edge of the half-cylindrical plate 12 and an inner surface of the half-cylindrical plate 12 is faced to an edge of the half-cylindrical plate 11. This structure allows to jet the molten solder to a target place and uniformize a widthwise distribution of the jetting height of the molten solder.

Abstract: One aspect provides a method of attaching a feedthrough to a titanium housing of an implantable medical device. The method includes providing the housing with a flange forming a recess about an opening through the housing, the opening disposed within the recess. A feedthrough is positioned within the recess so as to form a gap between the flange and an insulator of the feedthrough. A braze preform is then positioned within the recess about the insulator, the braze preform comprising a biocompatible braze material having a melting point less than a ?-transus temperature of the titanium of the housing. The preform is melted at a temperature less than the ?-transus temperature of the titanium of the housing such that the melted braze material fills at least the gap, and then cooled to form a braze joint which bonds the insulator to the housing and hermetically seals the opening.

Abstract: In one aspect of the disclosure, an apparatus for manipulating a plurality of curved sheets is provided. Each of the plurality of curved sheets includes an upper surface and a lower surface. The apparatus includes tooling to be coupled to the upper surface of each of the plurality of curved sheets. The tooling is capable of moving the plurality of curved sheets relative to each other and abutting the plurality of curved sheets so that the upper surface of each of the plurality of curved sheets is coextensive with a virtual arcuate surface. The apparatus also includes a welding apparatus capable of welding the plurality of curved sheets together after abutting the plurality of curved sheets.

Abstract: An apparatus for producing a tailored sheet metal strip, comprising at least one welding station, by means of which at least two sheet metal strips can be welded to one another along their longitudinal edges, and at least two strip feeding devices for respectively feeding one of the sheet metal strips into the at least one welding station, wherein the at least two strip feeding devices and the at least one welding station define a production line. A further-processing station for further processing is integrated in the production line downstream of the at least one welding station in the strip running direction and is equipped with tools for applying reinforcing material, to local points of at least one of the sheet metal strips which are connected to one another, for punching holes and/or for forming at least one of the sheet metal strips which are connected to one another.

Abstract: An electronic component mounting apparatus includes a bonding tool for thermally bonding an electronic component onto a substrate, the bonding tool to be driven in a direction getting close to and from the substrate, a linear scale and a linear scale head detecting the position of the bonding tool in the direction getting close to and from the substrate, and a control unit configured to hold the position of the bonding tool in the direction getting close to and from the substrate when a solder film between an electrode of the electronic component and an electrode of the substrate is thermally fused when the bonding tool gets close to the substrate by a predetermined distance from a reference position while heating the electronic component. The electronic component mounting apparatus for bonding the electronic component and the substrate with thermally fusible bond metal offers an improvement in the bonding quality.

Abstract: The circuit substrate includes at least two lands formed on a substrate, wherein one electrode is to be mounted on the at least two lands, an electronic part having electrodes, one of the electrodes is soldered on the at least two lands with solders whose amounts are adjusted by a metal mask having at least two opening parts, positions of the at least two opening parts corresponding to the at least two lands when the solders are applied and melted, areas of the at least two opening parts being different with each other, wherein a height of one of the solders is different from a height of the other of the solders according to the difference of the areas of the at least two opening parts of the metal mask, whereby the electronic part is mounted on the circuit substrate in an inclined state.

Abstract: A connection method of a terminal includes an inserting-arranging process for inserting and arranging conductors of a plurality of wires into a connection section. The wires have the conductor sections exposed from the sheaths thereof at the end portions. The connection section has cylindrical shape with a bottom portion and an opening section. The method further includes a heating-melting process for heating the connection section in a state that the opening section of the connection section faced upwards in the vertical direction to melt the conductors within the connection section, and a molten-metal raising process for conducting an insertion of the conductors into the connection section and/or a pressurization of the connection section from outside to raise the molten metal within the connection section to a level upper.

Abstract: A draw bead is formed in a plate-shaped material in which a drawn portion is formed, outside the drawn portion, the draw bead being used to adjust an inflow of the plate-shaped material into a drawing die. The drawn portion is drawn in the plate-shaped material by using the draw bead as formed. The draw bead is crushed and flattened after the drawn portion is drawn.

Abstract: In some implementations, an injection system that injects sealant into a pipe, pressure component or valve while containing the pipe, pressure component or valve repair that significantly reduces or eliminates release of hazardous material from inside the pipe, pressure component valve or injection system and thus significantly reduces emission of the hazardous material from inside the pipe, pressure component or valve into the environment and protecting the repair technicians.

Abstract: A welding fixture apparatus has a base and an adjustable head configured for adjustable engagement with one or more workpieces and methods of use.