Patents Examined by Devang R Patel
  • Friction welding drive apparatus for repair of pipes and valves
    Patent number: 9581260
    Abstract: In some implementations, an injection system that injects sealant into a pipe, pressure component or valve while containing the pipe, pressure component or valve repair that significantly reduces or eliminates release of hazardous material from inside the pipe, pressure component valve or injection system and thus significantly reduces emission of the hazardous material from inside the pipe, pressure component or valve into the environment and protecting the repair technicians.
    Type: Grant
    Filed: June 15, 2013
    Date of Patent: February 28, 2017
    Inventors: Michael Lee Miller, Daniel J. Rybicki, Mathew A. Rybicki, Lawrence J. Povse, Kenneth R. Vejr, Andre S. Todd, John M. Griffin
  • Thermocompression bonding structure and thermocompression bonding method
    Patent number: 9579746
    Abstract: A thermocompression bonding structure includes a first member and a second member having a linear expansion coefficient different from that of the first member; and metal fine particles interposed between the first and second members as a bonding material to thermocompression bond the two members. The two members are disposed to apply thermal stress generating between the first member and the second member as pressurizing force on a bonding surface between the two members, and to increase temperature to thermocompression bond the first member and the second member.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: February 28, 2017
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Yoshito Kinoshita, Eiji Mochizuki, Tatsuo Nishizawa, Shinji Tada
  • Method and device for friction stir welding
    Patent number: 9573222
    Abstract: A method for friction stir welding two components, with a rotating tool that comprises a rotating or non-rotating shoulder surface for subjecting the components to a process force in the region of a joining zone, and with a stirring pin for stirring plasticized material or for plasticizing and stirring the components in the region of the joining zone, in which method a stirring pin with a section slidably plunges in a slide on which the components are supported, which slide is guided along the joining zone on a side of the component, which side faces away from the tool, so that during welding an automatic relative movement between the stirring pin and the slide or the shoulder surface of the tool and a support surface of the slide, which support surface supports the components, is made possible, as well as a device for implementing such a method.
    Type: Grant
    Filed: July 15, 2011
    Date of Patent: February 21, 2017
    Assignee: Airbus Operations GmbH
    Inventors: Sergio Tavares, Marco Pacchione, Hartmut Ostersehlte
  • Solder application method and apparatus
    Patent number: 9573214
    Abstract: A method of applying solder includes providing a first roller and a second roller, where at least one of the first and second rollers has an outer surface comprising a solder wicking material. A metallic article is provided, the metallic article having a first side and a second side, and having an opening extending from the first side to the second side. The metallic article is dipped in solder, where the dipping forms an initial coating of solder on the metallic article. After the dipping, the metallic article is fed between the first and second rollers. The wicking material removes solder from the metallic article, such that a solder thickness of the initial coating on the metallic article is reduced after exiting the first and second rollers.
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: February 21, 2017
    Assignee: Merlin Solar Technologies, Inc.
    Inventors: Alejandro de la Fuente Vornbrock, Venkateswaran Subbaraman
  • Impeller brazing method
    Patent number: 9566655
    Abstract: The present invention relates to an impeller manufacturing method in which a thermal cycle is performed on an assembly body with a brazing material formed of a Ni-containing Au alloy being placed at a bond portion of at least two impeller constituent members. The thermal cycle includes a temperature increasing process with a temperature increasing rate of 20° C./hr. to 100° C./hr., the process including a first intermediate retention and a second intermediate retention each keeping the temperature, the first intermediate retention performed in a temperature range of 500° C. to 850° C. and the second intermediate retention performed in a temperature range of 850° C. to 950° C. (but not including 850° C.). In the thermal cycle, the temperature is increased in a temperature range exceeding 950° C. after the second intermediate retention at a rate lower than that before the second intermediate retention.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: February 14, 2017
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Kazutoshi Yokoo, Daisuke Tanaka, Daisuke Kawada, Koshiro Niihara, Hiroki Takagi, Yujiro Watanabe, Hiroshi Nakajima
  • High-strength brass alloy for sliding member, and sliding member
    Patent number: 9568047
    Abstract: High-strength brass alloy having superior wear maintains single-structure ? phase and Fe—Cr—Si-based intermetallic compounds dispersed in the ? phase. A high-strength brass alloy for sliding member comprises Zn from 17% to 28%, Al from 3% to 10%, Fe from 1% to 4%, Cr from 0.1% to 4%, Si from 0.5% to 3%, mass ratio, and the remnant including Cu and inevitable impurities. The high-strength brass alloy has structure in which the matrix shows single-phase structure of ? phase and Fe—Cr—Si-based intermetallic compounds are dispersed in the ? phase. The high-strength brass alloy for sliding member has the structure in which the matrix shows single-structure of ? phase and hard Fe—Cr—Si-based intermetallic compounds are dispersed in the ? phase. Thus the hardness is increased and wear resistance is improved.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: February 14, 2017
    Assignee: OILES CORPORATION
    Inventors: Maki Hirayama, Taku Watakabe, Kentaro Okubo
  • Method for manufacture of a multi-layer plate device
    Patent number: 9556074
    Abstract: A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a continuous layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the time at temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: January 31, 2017
    Inventors: Alfred Grant Elliot, Brent Donald Alfred Elliot, Frank Balma, Richard Erich Schuster, Dennis George Rex, Alexander Veytser
  • Member for semiconductor manufacturing apparatus and method for manufacturing the same
    Patent number: 9548226
    Abstract: A high-frequency power supply includes a shaft bonded to one surface of a plate serving as a gas distributor plate. The plate includes a radio-frequency electrode buried therein. The shaft has a through-hole through which a gas flows. The plate and the shaft are made of a ceramic material. The shaft has a double-tube structure including the inner tube and the outer tube . The interior space of the inner tube forms the through-hole. The plate is hermetically solid-state bonded to the inner tube and the outer tube. The shaft is bonded to the center of the plate.
    Type: Grant
    Filed: October 21, 2013
    Date of Patent: January 17, 2017
    Assignee: NGK Insulators, Ltd.
    Inventors: Yutaka Unno, Tetsuhisa Abe
  • Method of manufacturing coiled tubing using multi-pass friction stir welding
    Patent number: 9541224
    Abstract: A method for manufacturing a long length of coiled metal tubing or the like using friction stir welding. Successive lengths of metal strip are friction stir welded using a three-pass welding technique to eliminate any edge defects in the resulting strip. The method includes one or more three-pass friction stir welding routines, each of which includes a first pass performed using a tool having a first rotational direction and a spiral bit pattern corresponding to the first rotational direction; a second pass using a tool having a second rotational direction and a spiral bit pattern corresponding to the second rotational direction; and a third pass using a tool having said second rotational direction and a spiral bit pattern corresponding to the second rotational direction.
    Type: Grant
    Filed: February 25, 2013
    Date of Patent: January 10, 2017
    Assignee: GLOBAL TUBING, LLC
    Inventors: Raymond Rowland, Mark Wadzeck, Rodney Bond
  • Method for producing an endless belt
    Patent number: 9539669
    Abstract: The invention relates to a method of producing an endless belt (1) from at least two plate-shaped metal plates (2, 3, 4), and the at least two metal plates (2, 3, 4) are introduced into one of two opposing fixtures of at least one removable connection element (5a, 5b), one edge (9, 10, 11, 12) of each leading, and form a composite board (6), whereupon free end edges (7, 8) of the composite board (6) which lie opposite the edges (9, 10, 11, 12) of the metal plates disposed in the at least one connection element (5) are bent towards one another and welded together, whereupon the at least one connection element (5a, 5b) is removed and the edges (9, 10, 11, 12) of the metal plates (2, 3, 4) connected to one another beforehand by the at least one connection element (5) are bent towards one another and welded together.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: January 10, 2017
    Assignee: Berndorf Band GmbH
    Inventors: Thomas Stueckler, Richard Szigethi
  • Warpage control in the packaging of integrated circuits
    Patent number: 9538582
    Abstract: A method includes placing a first package component over a vacuum boat, wherein the vacuum boat comprises a hole, and wherein the first package component covers the hole. A second package component is placed over the first package component, wherein solder regions are disposed between the first and the second package components. The hole is vacuumed, wherein the first package component is pressed by a pressure against the vacuum boat, and wherein the pressure is generated by a vacuum in the hole. When the vacuum in the hole is maintained, the solder regions are reflowed to bond the second package component to the first package component.
    Type: Grant
    Filed: July 26, 2012
    Date of Patent: January 3, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Da Cheng, Hsiu-Jen Lin, Cheng-Ting Chen, Wei-Yu Chen, Chien-Wei Lee, Chung-Shi Liu
  • Bonding material and bonding method in which said bonding material is used
    Patent number: 9533380
    Abstract: The occurrence of uneven drying in the center and end of a surface of a bonding layer during a desolvation process of a pre-drying step is reduced to ensure highly reliable bonding without peeling of a bonding surface even after repeated exposure to heat shock after bonding. The bonding material of the present invention to achieve the object contains silver nanoparticles coated with organic substance having 6 or less carbon atoms and having an average primary particle diameter of 10 to 30 nm as main silver particles, silver nanoparticles coated with an organic substance having 6 or less carbon atoms and having an average primary particle diameter of 100 to 200 nm as secondary silver particles, two kinds of solvents having different boiling points, and a dispersant.
    Type: Grant
    Filed: January 20, 2012
    Date of Patent: January 3, 2017
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Keiichi Endoh, Satoru Kurita, Minami Nagaoka
  • Wave soldering apparatus and nozzle thereof
    Patent number: 9527151
    Abstract: An apparatus used for wave soldering including a nozzle device configured to discharge molten solder to a circuit board near a solder tank, wherein, the nozzle device includes at least one pair of adjacent nozzle openings configured to discharge the molten solder towards the middle between the pair of nozzle openings.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: December 27, 2016
    Assignee: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
    Inventors: Li Ling, Ke Pu, Chun C Wang, Wei Feng Zhang
  • System for friction stir welding including a mobile counter-bearing
    Patent number: 9517529
    Abstract: System for friction stir welding of two parts which includes a welding unit which includes at least one welding head fitted with a rotating pin and a counter-bearing unit which has a support surface to support the parts against a pressure exerted by the welding head, and wherein each welding head can be moved relative to the support surface in a first direction parallel to an axis of rotation of the rotating pin and in a second direction orthogonal to the axis of rotation, and wherein the support surface can be moved in the second direction and is formed of two coaxial clamp rollers which are set apart from each other.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: December 13, 2016
    Assignee: Airbus Operations (S.A.S.)
    Inventors: Christophe Mialhe, Patrick Lieven, Romain Delahaye
  • Solder bump forming method and apparatus
    Patent number: 9511438
    Abstract: Provided is a solder bump forming method that enables micro-solder bumps to be formed without the possibility of occurrence of a bridge due to excess molten solder. An injection head 11 for supplying molten solder has a nozzle 16 brought into contact with a mask with openings that is disposed over a substrate 8. After completing a supply operation, the injection head 11 is forcedly cooled by heat transfer from a cooling unit 13 through a heater unit 12 whose operation has been stopped. Molten solder 15 in the cooled injection head 11 does not drool from the nozzle 16 when the injection head 11 moves up.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: December 6, 2016
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Issaku Sato, Akira Takaguchi, Isamu Sato, Takashi Nauchi
  • Welding method and system
    Patent number: 9506363
    Abstract: A welding method including the steps of: providing, in a first position, a weld target assembly having a welding region and a weld tab located adjacent the welding region, the weld tab changeable from a first physical configuration to a second physical configuration when subject to a first type of weld operation; performing a first weld process on the welding region and weld tab; moving the assembly from the first to a second position; providing safeguard apparatus for cooperating with the weld tab to: prevent the assembly from moving to the second position when the first weld procedure did not include the first type of weld operation; and permit the assembly be moved to the second position when the first weld procedure included the first type of weld operation. The assembly includes a sub-assembly having a foot member and blade portion welded together, thereby ultimately forming an output guide vane.
    Type: Grant
    Filed: October 8, 2014
    Date of Patent: November 29, 2016
    Assignee: ROLLS-ROYCE plc
    Inventor: Matthew David Curren
  • Method of forming a cermet-containing bushing for an implantable medical device having a connecting layer
    Patent number: 9504840
    Abstract: One aspect relates method of forming an electrical bushing for an implantable medical device, including generating at least one base body green compact for at least one base body from an insulating composition of materials. At least one cermet-containing conducting element green compact is formed for at least one conducting element. At least one conducting element green compact is introduced into the base body green compact. The insulation element green compact is connected to the at least one base body green compact in order to obtain at least one base body having at least one conducting element. A connecting layer is applied onto the at least one conducting element.
    Type: Grant
    Filed: January 9, 2015
    Date of Patent: November 29, 2016
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Goran Pavlovic, Jeremy Glynn
  • System for preventing the formation of martensite in metals joining applications
    Patent number: 9498843
    Abstract: A method for joining materials such as metal alloys that includes a first component, wherein the first component includes a first alloy having a known austenization temperature below which martensite forms when the component is heated and then cooled at a predetermined rate of cooling; a second component, wherein the second component includes a second alloy; and a welding apparatus operative to create a weld between the first and second components without crossing the austenization temperature of the first alloy.
    Type: Grant
    Filed: December 9, 2014
    Date of Patent: November 22, 2016
    Assignee: Edison Welding Institute, Inc.
    Inventor: David P. Workman
  • Carrier with a test surface wettable with liquid solder and method for application thereof
    Patent number: 9498836
    Abstract: A carrier plate has test areas for the assessment of a selective soldering process. The carrier plate has different zones, which are provided with peripheral borders. The zones are not wettable with solder, while the peripheral borders are wettable. If a selective soldering head is brought up to the reference areas, then, as long as there is no deficiency in quality, the respective peripheral border must be just wetted with solder, whereby an assessment of the selective soldering process is possible. The test plate advantageously makes a simple optical evaluation possible, for example by visual inspection.
    Type: Grant
    Filed: June 22, 2012
    Date of Patent: November 22, 2016
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Bernd Müller, Ulrich Wittreich
  • Method for manufacturing a metal part
    Patent number: 9486870
    Abstract: A manufacturing method for a metal part uses a tooling assembly. The tooling assembly includes a counter-form and a deformable core which includes inner and outer skins, a honeycomb structure positioned between the inner and outer skins, and a brazing material interposed between the honeycomb structure and the inner and outer skins. In particular, the core is closed by a lid equipped with ducts through which a gas is introduced. The manufacturing method includes the following steps: positioning the tooling assembly in a vacuum furnace; introducing a pressurized gas directly inside an inner skin of the core of the tooling assembly; purging the pressurized gas from an inner portion of the inner skin of the tooling assembly; and dismounting the tooling assembly so as to extract a metal part manufactured.
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: November 8, 2016
    Assignee: AIRCELLE
    Inventors: Philippe Bienvenu, Jean-Claude Rivoal, Flavien Poulet, Francisco Caneque