Patents Examined by Devang R Patel
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Patent number: 8813625Abstract: Vascular treatment and methods include a plurality of self-expanding bulbs and a hypotube including interspersed patterns of longitudinally spaced rows of kerfs. Joints between woven structures and hypotubes include solder. Woven structures include patterns of radiopaque filaments measureable under x-ray. Structures are heat treated to include at least shapes at different temperatures. A catheter includes a hypotube including interspersed patterns of longitudinally spaced rows of kerfs. Heat treating systems include a detachable flange. Laser cutting systems include a fluid flow system.Type: GrantFiled: January 29, 2014Date of Patent: August 26, 2014Assignee: Insera Therapeutics, Inc.Inventors: Vallabh Janardhan, Vikram Janardhan
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Patent number: 8814027Abstract: The present invention provides an economic rotation tool for joining a pair of metal members which form an inner corner by abutting the pair of metal members (1) each other, and a joining inner corner method using the same. The rotation tool for joining the pair of metal members which form an inner corner (1) by abutting the pair of metal members each other to perform friction stir welding on an inner corner portion formed by abutting a pair of metal members against each other comprising: a stirring pin (3) to be inserted into the inner corner portion; and a base block (2) supporting the stirring pin (3) and to be brought into contact with one and the other of the pair of metal members respectively, wherein the base block (2) includes: a body portion (4) having a taper shape; and a shoulder portion (5) formed detachably at a tip of the body portion, and the body portion (4) and the shoulder portion (5) are penetrated by the stirring pin (3).Type: GrantFiled: August 12, 2010Date of Patent: August 26, 2014Assignee: Nippon Light Metal Company, Ltd.Inventors: Hisashi Hori, Nobushiro Seo
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Patent number: 8789452Abstract: Vascular treatment and methods include a plurality of self-expanding bulbs and a hypotube including interspersed patterns of longitudinally spaced rows of kerfs. Joints between woven structures and hypotubes include solder. Woven structures include patterns of radiopaque filaments measurable under x-ray. Structures are heat treated to include at least shapes at different temperatures. A catheter includes a hypotube including interspersed patterns of longitudinally spaced rows of kerfs. Heat treating systems include a detachable flange. Laser cutting systems include a fluid flow system.Type: GrantFiled: August 28, 2013Date of Patent: July 29, 2014Assignee: Insera Therapeutics, Inc.Inventors: Vallabh Janardhan, Vikram Janardhan
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Patent number: 8783151Abstract: Vascular treatment and methods include a plurality of self-expanding bulbs and a hypotube including interspersed patterns of longitudinally spaced rows of kerfs. Joints between woven structures and hypotubes include solder. Woven structures include patterns of radiopaque filaments measureable under x-ray. Structures are heat treated to include at least shapes at different temperatures. A catheter includes a hypotube including interspersed patterns of longitudinally spaced rows of kerfs. Heat treating systems include a detachable flange. Laser cutting systems include a fluid flow system.Type: GrantFiled: August 28, 2013Date of Patent: July 22, 2014Assignee: Insera Therapeutics, Inc.Inventors: Vallabh Janardhan, Vikram Janardhan
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Patent number: 8777086Abstract: A bonding tool is adjusted to a desired operational position by viewing the bonding tool with an image-capturing device and displaying an image of the bonding tool as viewed by the image-capturing device onto a display screen. A corresponding image of a reference bonding tool showing the desired operational position of the bonding tool is superimposed onto the display screen and the position of the bonding tool is adjusted with an adjustment mechanism until the bonding tool as viewed by the image-capturing device is aligned with the superimposed image of the reference bonding tool.Type: GrantFiled: April 20, 2012Date of Patent: July 15, 2014Assignee: ASM Technology Singapore Pte. Ltd.Inventors: Jiang Wen Deng, Hei Lam Chang, Tim Wai Mak
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Patent number: 8777087Abstract: The invention concerns a method and an apparatus for the application of solder onto a work piece, wherein the solder is soldered on at a soldering temperature TL and subject to the influence of ultrasound. In order to be able to solder without difficulties the solder onto work pieces that exhibit sensitivity to breakage it is proposed that the solder is heated, is applied to the work piece that is supported in particular in a spring-mounted manner, and is soldered-on subject to the influence of ultrasound.Type: GrantFiled: February 23, 2011Date of Patent: July 15, 2014Assignee: Schott Solar AGInventors: Hilmar Von Campe, Stefan Meyer, Thai Huynh-Minh, Stephan Huber, Silvio Reiff
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Patent number: 8770462Abstract: A solder paste transfer process is provided and includes defining multiple arrangements of solder pad locations on a surface, applying solder paste onto multiple transfer tools coupled to a fixture in a pre-defined configuration reflective of the multiple arrangements, disposing the fixture such that the multiple transfer tools are disposed in an inverted orientation proximate to the surface and reflowing the solder paste to flow from the multiple transfer tools to the solder pad locations.Type: GrantFiled: March 14, 2012Date of Patent: July 8, 2014Assignee: Raytheon CompanyInventors: William D. Beair, Michael R. Williams, Eric Gilley
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Patent number: 8770464Abstract: A method for manufacturing welded lap joints comprising the following steps: Providing of two components each having at least one base; allocating the components in such a way that the bases face each other and the components overlap in an overlapping area, which extends at least partially over both components; joining the components by welding in the overlapping area such that a weld joint is formed, wherein at the edge of the overlapping area non welded areas are formed; removing of the non welded areas whereby outer cutting areas are formed at the components, which are arranged at obtuse angles to the overlapping area.Type: GrantFiled: May 5, 2011Date of Patent: July 8, 2014Assignee: Airbus Operations GmbHInventors: Marco Pacchione, Juergen Silvanus
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Patent number: 8763881Abstract: A method for applying a wear reducing material to a tool used in a wellbore operation that includes welding a hardfacing alloy to a surface of the tool, wherein the welding comprises friction stirring the alloy into the tool's surface is disclosed. Methods of welding a preformed sleeve or width of wear reducing material using friction stirring are also disclosed.Type: GrantFiled: August 14, 2009Date of Patent: July 1, 2014Assignee: Smith International, Inc.Inventors: Madapusi K. Keshavan, Russell J Steel, Cary A. Roth, Shelton W. Alsup
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Patent number: 8752752Abstract: A composite steel plate includes at least two steel sheets rolled to form a plate. One of the sheets has a composition that varies in a depthwise direction, between nanocrystalline and micron grained. The plate is made by treating a steel sheet to produce a composition in the sheet that varies in a depthwise direction of the sheet between nanocrystalline and micron grained, stacking the treated sheet with at least one other steel sheet, and rolling the stacked sheets to form the plate.Type: GrantFiled: March 9, 2009Date of Patent: June 17, 2014Assignee: Hong Kong Polytechnic UniversityInventors: Jian Lu, Junbao Zhang, Aiying Chen
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Patent number: 8740041Abstract: A brazing ring with integrated fluxing product and methods for production thereof is described. The brazing ring has a c-shaped body with a plurality of channels extending the thickness of the ring and disposed about the circumference thereof. The channels are separated by radially extending flanges with enlarged distal ends that extend into the channels. The enlarged ends at least partially enclose the channels to aid in retention of a fluxing product disposed in therein. The c-shape may enable flexure of the ring for installation on a pipe or fitting and a friction fit to maintain an installed position. The brazing ring is formed by extruding a filler material to form a tube with the desired profile and compressing the fluxing product into the channels of the profile. The tube is subsequently sectioned perpendicularly to its length to produce a plurality of the brazing rings.Type: GrantFiled: July 3, 2012Date of Patent: June 3, 2014Assignee: Flux Brazing Schweiss-Und Lotstoffe USA, LLCInventors: Jasper G. J. Visser, Jacobus C. B. Kotzé
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Patent number: 8740048Abstract: Thermally stable polycrystalline constructions comprise a body having a polycrystalline ultra-hard phase and a plurality of empty voids. A population of the voids can be filled with a reaction product. The body is substantially free of a catalyst material. The construction comprises a first support member attached to the body by a first braze material. A second support member is attached to the body and the first support member by a second braze material. The construction may include a third support member attached to the body that is integral or separate from one of the other support members. The braze materials used to attached the support members can be the same or different, as can be the materials used to form the different support members.Type: GrantFiled: June 29, 2010Date of Patent: June 3, 2014Assignee: Smith International, Inc.Inventors: Georgiy Voronin, J. Daniel Belnap
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Patent number: 8733619Abstract: Nickel-base radiant tube includes straight and curved elbow tube sections. The straight tube section has constant inner and outer radii. The elbow tube section has a constant inner radius and variable outer radius. The inner diameter of the elbow tube section is equal the inner radius of the straight tube section. Mating end portion of the elbow tube section has an outer radius equal to the outer radius of the straight tube section. Method for making the radiant tube comprises the steps of positioning a mating end portion of the straight tube section adjacent to and aligned with the mating end portion of the elbow tube section so that end faces of the straight and elbow tube sections face each other to define a circumferentially extending weld groove, and butt welding the mating end portions of the straight and elbow tube sections together at the weld groove.Type: GrantFiled: June 27, 2011Date of Patent: May 27, 2014Assignee: Arcelormittal Investigacion y Desarrollo, S.L.Inventor: Sree Harsha Lalam
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Patent number: 8727203Abstract: A method of manufacturing an orthopaedic implant device having a porous outer surface is described. In one embodiment, the implant device includes a porous layer, an intermediate layer, and a solid substrate. The porous layer is preferably bonded to the intermediate layer by cold isostatic pressing. The intermediate layer is preferably bonded by vacuum welding to the solid substrate such that the porous layer forms at least a portion of the outer surface of the orthopaedic implant device. Preferably, a diffusion bond is created between the bonded intermediate layer and the solid substrate by hot isostatic pressing. In another embodiment, a porous layer is created on an outer surface of a solid layer by selective melting. Preferably, the solid layer is bonded to the solid substrate such that the porous layer forms at least a portion of the outer surface of the orthopaedic implant device.Type: GrantFiled: September 16, 2010Date of Patent: May 20, 2014Assignee: Howmedica Osteonics Corp.Inventors: Aiguo Wang, Daniel E. Lawrynowicz, Haitong Zeng, Naomi Murray, Balaji Prabhu
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Patent number: 8701973Abstract: A method of forming solder bumps on electrodes of a circuit board without producing bridging using a solder transfer sheet which does not require alignment includes superposing a circuit board and a solder transfer sheet having a solder layer adhered to at least one side of a supporting substrate, performing heating under pressure to a temperature lower than the solidus temperature of the solder to selectively perform solid phase diffusion bonding of the solder layer to electrodes, and peeling the transfer sheet from the circuit board. The solder layer is in the form of a continuous solder coating or in the form of a monoparticle layer of solder particles which are adhered to the supporting substrate by an adhesive layer.Type: GrantFiled: February 15, 2010Date of Patent: April 22, 2014Assignee: Senju Metal Industry Co., Ltd.Inventors: Takeo Kuramoto, Kaichi Tsuruta, Takeo Saitou
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Patent number: 8701971Abstract: A printed board includes a printed board body having a first side, a second side opposing the first side, and a through-hole; a printed conductor disposed on the first side of the printed board body; and a bus bar disposed on the second side of the printed board body, the bus bar including a terminal that extends through the through-hole. The terminal includes a plurality of branched terminal portions at a position corresponding to an interior of the through-hole, and at least one of the branched terminal portions is bent and attached to the printed conductor.Type: GrantFiled: December 7, 2011Date of Patent: April 22, 2014Assignee: Sumitomo Wiring Systems, Ltd.Inventors: Masahiro Tagano, Teruyuki Kitahara
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Patent number: 8684255Abstract: A method of manufacturing an elongate insert configured to be integrated by CIC in a metal container, including coated yarns bonded together, the coated yarns being formed from metal-coated ceramic fibers. The method includes placing the coated yarns side by side in a bundle and pulling the fiber bundle through a shaping element so as to compact the fiber bundle transversely while forming the fiber bundle so as to have a defined cross section. A metal part incorporating a fibrous insert can be manufactured by the CIC technique.Type: GrantFiled: March 30, 2011Date of Patent: April 1, 2014Assignees: SNECMA, Messier-Bugatti-DowtyInventors: Jean-Michel Patrick Maurice Franchet, Gilles Charles Casimir Klein, Richard Masson, Louis Salvat
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Patent number: 8678271Abstract: In one disclosed embodiment, the present method for preventing void formation in a solder joint formed between two metallic surfaces includes forming at least one slit in a layer of solder to form a slit solder layer, positioning the slit solder layer between the two metallic surfaces, and heating the slit solder layer to form the solder joint, wherein the at least one slit forms an outgas alley to prevent void formation in the solder joint. Where solder joint width is a concern, the present method includes applying external pressure concurrently with heating. The outgas alley is formed to provide a ready avenue of escape for flux gasses produced during formation of the solder joint.Type: GrantFiled: June 26, 2007Date of Patent: March 25, 2014Assignee: GLOBALFOUNDRIES Inc.Inventor: Phanit Tameerug
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Patent number: 8668131Abstract: A flux dipping apparatus includes a flux plate having a top surface; and a dipping cavity in the flux plate and recessed from the top surface. A flux leveler is disposed over the flux plate and configured to move parallel to the top surface. A piezoelectric actuator is configured to adjust a distance between the flux leveler and the top surface in response to a controlling voltage applied to electrodes of the first piezoelectric actuator.Type: GrantFiled: February 18, 2011Date of Patent: March 11, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yi-Li Hsiao, Chen-Hua Yu, Chung-Shi Liu, Chien Ling Hwang
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Patent number: 8657183Abstract: A method of bonding poly-crystalline diamonds to a wear surface, using commercially available poly-crystalline diamond cutters having poly-crystalline diamond buttons bonded to a carbide core. The poly-crystalline diamond cutters are cooled with cryogenic liquid. The poly-crystalline diamond cutters are crushed to form poly-crystalline diamond cutter fragments, with each of the fragments having a poly-crystalline diamond button fragment still bonded to a carbide core fragment. The carbide core fragment is then bonded onto the wear surface, such that the wear surface includes poly-crystalline diamond buttons fragments.Type: GrantFiled: January 4, 2011Date of Patent: February 25, 2014Inventors: Gary J. Bakken, Mike Zulak