Abstract: A control system for a thermal stir welding system is provided. The control system includes a sensor and a controller. The sensor is coupled to the welding system's containment plate assembly and generates signals indicative of temperature of a region adjacent and parallel to the welding system's stir rod. The controller is coupled to the sensor and generates at least one control signal using the sensor signals indicative of temperature. The controller is also coupled to the welding system such that at least one of rotational speed of the stir rod, heat supplied by the welding system's induction heater, and feed speed of the welding system's weld material feeder are controlled based on the control signal(s).

Abstract: A practical bonding technique is provided for solid-phase room-temperature bonding not requiring a profile irregularity of the order of several nanometers, in which a high-vacuum energy wave treatment and continuous high-vacuum bonding are not required. Since an adhering substance layer is thin immediately after a surface activating treatment using an energy wave, a bonding interface is spread by crushing the adhering substance layer to perform bonding, so that a new surface appears on a bonding surface, and objects to be bonded are bonded together. In order to crush the adhering substance layer more easily, a bonding metal of a bonding portion of the object to be bonded requires a low hardness. According to the results of various experiments conducted by the present inventors, it was found that the hardness of the bonding portion which is a Vickers hardness of 200 Hv or less is particularly effective for room-temperature bonding.

Abstract: An ultrasonic ribbon bonding system is provided. The ultrasonic ribbon bonding system includes a workholder for supporting a workpiece during a ribbon bonding operation. The workholder defines a first plurality of standoffs extending above a surface of the workholder, the first plurality of standoffs configured to contact the workpiece during the ribbon bonding operation. The ultrasonic ribbon bonding system also includes a bond head assembly carrying a ribbon bonding tool, the ribbon bonding tool being configured to bond a ribbon to the workpiece during the ribbon bonding operation.

Abstract: An object of the invention is to provide an electronic component mounting system and an electronic component mounting method which can execute component mounting work on a plurality of boards simultaneously, concurrently and efficiently so that high productivity and responsiveness to production of many items can be achieved consistently.

Abstract: Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a target location of a microfeature workpiece, with the volume of material including at least a first metallic constituent. The method can further include elevating a temperature of the volume of material while the volume of material is applied to the microfeature workpiece to alloy the first metallic constituent and a second metallic constituent so that the second metallic constituent is distributed generally throughout the volume of material. In further particular embodiments, the second metallic constituent can be drawn from an adjacent structure, for example, a bond pad or the wall of a via in which the volume of material is positioned.

Abstract: A method for producing an amorphous alloy foil strip having a large sheet thickness in an industrial scale includes: a pair of cooling rolls; a driving unit configured to rotate the pair of cooling rolls; and a crucible configured to supply a molten alloy sequentially to an outer circumferential surface of the pair of cooling rolls. The crucible is movable along a moving unit. A molten alloy is supplied alternately to the pair of cooling rolls while rotating and water-cooling the pair of cooling rolls.

Abstract: In the method for welding a hollow structure of the present invention, a rib is placed between a first joining member and a second joining member, and friction stir welding and fixing a place where the rib is placed between the first and the second joining member are conducted. Thus, friction stir welding is accomplished without changing the shape of an extrusion part or partly changing the shape of the extrusion part with insertion of a simply shaped rib.

Abstract: A solder drawing member (402) is detachably attached on the outer side of a jet nozzle (303) that jets molten solder pumped from a solder tank (102) storing the molten solder. The solder drawing member (402) is made of a material having higher wettability to the molten solder than the surface material of the jet nozzle (303). Thus a force of separating the solder from a point to be soldered can be increased by a surface tension of the molten solder flowing on the solder drawing member (402), thereby reducing bridge phenomena and icicle phenomena.

Abstract: Copper metal or metal alloy workpieces and/or aluminum metal or metal alloy workpieces are joined in a solid state weld by use of a reactive material placed, in a suitable form, at the joining surfaces. Joining surfaces of the workpieces are pressed against the interposed reactive material and heated. The reactive material alloys or reacts with the workpiece surfaces consuming some of the surface material in forming a liquid-containing reaction product comprising a low melting liquid that removes oxide films and other surface impediments to a welded bond across the interface. Further pressure is applied to expel the reaction product and to join the workpiece surfaces in a solid state weld bond.

Abstract: An assembly is disclosed for exothermic welding comprising a mold which is formed of a material which withstands exothermic welding temperatures and includes a weld cavity therein for positioning at least two members which are to be exothermically welded together, and an ignition cavity communicating with the weld cavity. The mold is capable of accommodating any one of several exothermic welding procedures which may involve either a flint igniter or the use of an electrical igniter which is readily accommodated by the mold in the performance of several of the procedures. The electrical igniter is formed of a pair of flat, longitudinally extending conductor strips with a sheet of insulation laminated therebetween, a filament adjacent one end of the strips, and one or more positioning tabs adjacent one end of the strips. A cartridge is also provided which contains the weld metal and the electrical igniter and which may be positioned in the ignition cavity of the mold.

Abstract: A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.

Abstract: A method of removing oxidation from certain metallic contact surfaces utilizing a combination of relatively simple and inexpensive off-the-shelf equipment and specific chemistry. The method being a very rapid dry process which does not require a vacuum or containment chamber, or toxic gasses/chemicals, and does not damage sensitive electronic circuits or components. Additionally, the process creates a passivation layer on the surface of the metallic contact which inhibits further oxidation while allowing rapid and complete bonding, even many hours after surface treatment, without having to remove the passivation layer. The process utilizes a room-ambient plasma applicator with hydrogen, nitrogen, and inert gasses.

Abstract: Forming an embedded electronic component includes attaching an electronic component to a first conductive layer and forming a layer stack with a first partially cured dielectric layer having a first opening and a substrate having a second opening. The partially cured dielectric layer is located over the first conductive layer and the substrate is located over the first partially cured dielectric layer such that the first and second openings surround the electronic component. Heat and pressure are applied to the layer stack such that the first partially cured dielectric layer flows for filling gaps within the first and second openings and becomes fully cured.

Abstract: A mandrel that provides a counter-force to the pressure exerted on the outside of a pipe or other arcuate surface by a friction stir welding tool, wherein the mandrel is expandable through the use of a wedge, and wherein the mandrel enables multiple friction stir welding heads to simultaneously perform welding on the arcuate surface.

Abstract: An apparatus including a bond head, a supplemental support, a reduction module, and a transducer is provided. The bond head holds a first substrate that contains a first set of metal pads. The supplemental support holds a second substrate that contains a second set of metal pads. The aligner forms an aligned set of metal pads by aligning the first substrate to the second substrate. The reduction module contains the aligned substrates and a reduction gas flows into the reduction module. The transducer provides repeated relative motion to the aligned set of metal pads.

Abstract: Copper conductor members or other copper-base workpieces are welded using a suitable copper alloy material that is reactive with the joining surfaces of the copper members. The reactive metal material may be applied as a thin metal strip between assembled facing joining surfaces. The members are pressed together against the reactive material and heated. The combined pressure and heat enable the reactive material to react with facing workpiece material, to liquefy and remove oxides or the like that might inhibit the formation of a welded interface. The liquid, containing original reactive metal and byproducts, is squeezed from the interface of the workpieces to enable the formation of a solid-state weld between them without melting of un-reacted workpiece copper material.

Abstract: A method for spray forming a metal component (11, 17, 21, 27) having an elongated open channel (10, 20, 22, 28) therein comprises firstly spray forming a layer (8, 19, 24) of the desired metal onto a deposition substrate (2), placing then an elongated spray blocking object (9, 18, 26, 29) on the already sprayed layer for forming the channel, and continuing then the spray forming process until the desired total thickness of the component is achieved. According to the present invention, the spray blocking object is a strip (18, 26, 29), the cross-sectional profile of the strip being fully open in the direction of an axis (a) in a cross-sectional plane of the strip, and the strip is placed on the already deposited layer (8, 19, 24) with said axis directed substantially parallel to the direction of the incident metal spray (6).

Abstract: The present invention is a metal paste for sealing comprising a metal powder and an organic solvent characterized in that the metal powder is one or more kinds of metal powders selected from a gold powder, a silver powder, a platinum powder and a palladium powder which has a purity of 99.9% by weight or more and an average particle size of 0.1 ?m to 1.0 ?m and that the metal powder is contained in a ratio of 85 to 93% by weight and the organic solvent is contained in a ratio of 5 to 15% by weight. This metal paste preferably contains an additive such as a surfactant in accordance with the application method. As a sealing method using this metal paste, there is a method of applying and drying a metal paste, sintering it at 80 to 300° C. to form a metal powder sintered body and after that pressurizing the base member and the cap member while heating the metal powder sintered body.

Abstract: A reflow apparatus, where formic acid is used for cleaning a surface of a solder electrode on a processing target, is disclosed. The reflow apparatus includes a processing chamber, a formic acid introduction mechanism for supplying an atmosphere gas containing formic acid to the processing chamber, and a shielding member that is made of a material having corrosion resistance against formic acid. The shielding member is arranged between a reflow processing section of the processing chamber and an inner wall of the processing chamber. In place of or in addition to the shielding member, the reflow apparatus may include a heater for decomposing residual formic acid.

Abstract: A control parameter ramp profile that enables control parameters to be modified in a non-linear manner, such that as a temperature set point of a tool or a weld is approached, the control parameter ramp profile enables the temperature set point to be approached in a manner that prevents temperature overshoot and therefore creating a better weld along the length thereof, wherein the control parameter ramp profile includes but is not limited to proportional, exponential or an S-curve waveform.