Patents Examined by Dieu Hien T. Duong
  • Patent number: 11769950
    Abstract: A wireless communication device includes: a substrate containing a dielectric; a zeroth-order resonance antenna; a high frequency circuit mounted on the substrate and a metal body mounted on the substrate. The zeroth-order resonance antenna includes: a main plate providing a ground potential, a patch portion, a feeder line extending from a feeding point to the patch portion to electrically connect the patch portion and the high frequency circuit, at least a part thereof being arranged on a same surface as the patch portion on the substrate, and a short circuit portion. The metal body has a same potential as the main plate. The metal body has a longer length (greater height) than the patch portion in a Z direction.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: September 26, 2023
    Assignee: DENSO CORPORATION
    Inventors: Sho Matsumoto, Jungaun Lee, Youichi Hayase, Ryu Atsuta
  • Patent number: 11764483
    Abstract: An antenna apparatus includes a ground plane, a patch antenna pattern disposed on an upper surface of the ground plane, a feed via penetrating the ground plane and spaced apart from the patch antenna pattern, and a coiled feed pattern electrically connected to an upper end of the feed via, spaced apart from the patch antenna pattern, and configured to provide a feed path to the patch antenna pattern, wherein at least a portion of the coiled feed pattern is coiled, wherein the patch antenna pattern includes an aperture portion corresponding to the coiled feed pattern.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: September 19, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Won Cheol Lee, Jeong Ki Ryoo, Nam Ki Kim, Jae Min Keum, Dong Ok Ko, Shin Haeng Heo
  • Patent number: 11764484
    Abstract: The present invention provides phased array antenna apparatus (200) for operation in frequencies above six gigahertz.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: September 19, 2023
    Assignee: SOFANT TECHNOLOGIES LTD
    Inventors: Victor Steel, Andrew Christie
  • Patent number: 11749895
    Abstract: A stacked patch antenna comprises two or more patch antennas physically disposed in a stack to provide a multi-frequency or broad band antenna. However, independence of the resonant response frequencies of the lower and upper patches of each stacked patch antenna pair ground requires metallization dimensions for the upper patch's lower surface be contained within the perimeter of the lower patch's resonant metallization. Accordingly, composite stacked patch element dimensions are limited by the desired resonant frequency of the lower patch. The inventors have established an alternate physical structure where the resonant patch geometry of the lower patch element's upper metallization is not limited by the lower surface ground plane metallization of the first upper patch element. The inventors have also established design solutions allowing the lower frequency performance of the first, lower patch within a stacked patch antenna to be lowered without compromising footprint of the resulting antenna.
    Type: Grant
    Filed: July 14, 2022
    Date of Patent: September 5, 2023
    Assignee: Tallysman Wireless Inc.
    Inventors: Julien Yannick Hautcoeur, Gyles Panther
  • Patent number: 11742594
    Abstract: A low-profile circularly polarized isoflux antenna module is provided, which relates to the field of microelectronic antennas, and provides a solution to solve the contradiction between size and gain in conventional technology. The antenna module includes an antenna array, a substrate, a connection plate, and a feeding plate that are stacked in sequence. The feeding network on the feeding plate is electrically connected to the antenna array through probe passing through the connection plate and the substrate. The antenna array includes two or more concentrically distributed antenna elements, and each antenna element forms mutually independent concentric circularly polarized apertures through feed control. The structure is simple to assemble and easy to process, light in weight, small in size, and low in profile.
    Type: Grant
    Filed: January 6, 2022
    Date of Patent: August 29, 2023
    Assignee: SOUTH CHINA UNIVERSITY OF TECHNOLOGY
    Inventors: Quan Xue, Wenquan Che, Siyu Li, Shaowei Liao
  • Patent number: 11742565
    Abstract: A semiconductor device can comprise a substrate dielectric structure and a substrate conductive structure that traverses the substrate dielectric structure and comprises first and second substrate terminals; an electronic component with a component terminal coupled to the first substrate terminal; and a first antenna element with a first element terminal coupled to the second substrate terminal, a first element head side adjacent a first antenna pattern, a first element base side opposite the first element side, and a first element sidewall. The first element terminal can be exposed from the first element dielectric structure at the first element base side or at the first element sidewall. The first antenna pattern can be coupled to the substrate through the first element terminal. The substrate conductive structure can couple the first antenna element to the electronic component. Other examples and methods are also disclosed.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: August 29, 2023
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Kyoung Yeon Lee, Tae Yong Lee, Doo Soub Shin, Seon A Lee, Woo Bin Jung, Ji Yeon Ryu, Jin Young Khim
  • Patent number: 11735820
    Abstract: Disclosed are an antenna module and a method for producing same, the antenna module having an insulating substrate interposed between a base substrate and electrodes so as to keep the base substrate apart from the electrodes and thereby prevent interference by the electrodes in the magnetic permeability of the base substrate. The disclosed antenna module comprises: a base substrate made of a magnetic material; an insulating substrate stacked on the lower surface of the base substrate; a first electrode disposed on the lower surface of the insulating substrate; a second electrode disposed, apart from the first electrode, on the lower surface of the insulating substrate; and a radiation wire which is wound around the base substrate and/or the insulating substrate and has one end thereof connected to the first electrode and the other end thereof connected to the second electrode.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: August 22, 2023
    Assignee: AMOTECH CO., LTD.
    Inventors: Beom Jin Kim, Jong Ho Park
  • Patent number: 11735829
    Abstract: According to an aspect, there is provided a passive antenna module for an active-passive antenna system. The passive antenna module includes a chassis for detachably mounting onto an active antenna module. The chassis includes an opening or a cavity for extending at least partially over the active antenna module when the chassis is mounted onto the active antenna module. The passive antenna module includes a ground plane layer arranged within or over said opening or cavity and fixed to the chassis. The ground plane layer includes a metallic or metallized grid. The passive antenna module includes a first antenna array including one or more first antenna elements arranged, in part, over said chassis and adjacent to said opening or cavity and, in part, over said opening or cavity. The chassis and the ground plane layer are adapted to act as ground planes for the first antenna array.
    Type: Grant
    Filed: November 23, 2022
    Date of Patent: August 22, 2023
    Assignee: Nokia Shanghai Bell Co., Ltd.
    Inventor: Jeanpierre Harel
  • Patent number: 11721903
    Abstract: An antenna module includes a multilayer substrate having a first main surface and a second main surface opposing to each other, a patch antenna formed on a side of the first main surface of the multilayer substrate and configured with a radiation electrode and a ground electrode, an RFIC formed on a side of the second main surface of the multilayer substrate, a first filter, and a second filter different from the first filter, wherein the patch antenna has a first feed point and a second feed point provided at different positions in the radiation electrode, the first feed point is electrically connected to the RFIC via the first filter, the second feed point is electrically connected to the RFIC via the second filter, and the first filter and the second filter are formed in the multilayer substrate.
    Type: Grant
    Filed: January 28, 2022
    Date of Patent: August 8, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kengo Onaka, Yoshiki Yamada, Keiichi Hirose, Hirotsugu Mori
  • Patent number: 11721907
    Abstract: An antenna system includes: a first sub-system comprising at least one first antenna element shaped and disposed to have a first electrical polarization, in a first direction, in response to excitation of the first sub-system; and a second sub-system comprising at least one second antenna element shaped and disposed to have a second electrical polarization, in a second direction, in response to excitation of the second sub-system; where the at least one first antenna element and the at least one second antenna element are complementary antenna elements; and where the first sub-system and the second sub-system are co-located such that first sub-system and the second sub-system in combination provide a slant-polarization for the antenna system.
    Type: Grant
    Filed: March 17, 2021
    Date of Patent: August 8, 2023
    Assignee: QUALCOMM Incorporated
    Inventor: Gadi Lahav
  • Patent number: 11721892
    Abstract: The present disclosure relates to a planar antenna structure (100, 200, 800, 900) comprising at least one radiating aperture (101, 201 801, 901), adapted for a certain working frequency band, and an electrically conducting surface structure (102, 202, 802, 902) that is constituted by at least one surface part and is surrounding at least one radiating aperture (101, 201, 801, 901) and having a certain extension (T). The planar antenna structure (100, 200, 800, 900) comprises at least one continuous groove (103, 104; 203, 204; 803, 804; 903, 904) that forms a slot in the surface structure (102, 202, 802, 902), where each groove (103, 104) is defined by an at least virtual electric wall that is electrically connected to the surface structure (102, 202, 802, 902) and forms a continuous electromagnetic wall in the surface structure (102, 202, 802, 902) at the working frequency band. In this manner, that propagation of surface waves via the at least one groove (103, 104; 203, 204; 803, 804; 903, 904) is reduced.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: August 8, 2023
    Assignee: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
    Inventors: Stefan Johansson, Hawai Rashid
  • Patent number: 11715888
    Abstract: A reconfigurable intelligent metasurface with adjustable 3-bit dual-polarization phases may include a plurality of reconfigurable intelligent metasurface units with adjustable 3-bit dual-polarization phases. Each of the plurality of reconfigurable intelligent metasurface units may include: a first layer including four fan-shaped metal patches and four Y-shaped metal patches symmetrical about a center, a second layer being a feeding layer along the x-axis direction, a third layer being a feeding layer along the y-axis direction, and a fourth layer being a metal ground layer. By changing a voltage value at two ends of each of the varactors in an orthogonal polarization direction, the reconfigurable intelligent metasurface unit may be enabled to independently implement dual-polarization 3-bit phase modulation in two orthogonal polarization directions, thereby implementing decoupling in the orthogonal polarization directions.
    Type: Grant
    Filed: November 18, 2022
    Date of Patent: August 1, 2023
    Inventors: Zhixiang Huang, Junjie Han, Guangshang Cheng, Sixian Qian
  • Patent number: 11705619
    Abstract: In an embodiment, an electronic device may include a housing having an inner space and an antenna structure disposed in the inner space of the housing. The antenna structure may include a printed circuit board (PCB) and at least one antenna disposed in the PCB. The PCB may have a plurality of insulating layers and a ground layer. The at least one antenna may include a conductive line disposed on a first insulating layer among the plurality of insulating layers, a conductive via extended from the conductive line in a first direction, and at least one conductive pattern branched at a right angle from the conductive line on the first insulating layer. The wireless communication circuit may be configured to transmit and/or receive a radio signal in a range of about 3 GHz to about 100 GHz through the at least one antenna.
    Type: Grant
    Filed: November 11, 2020
    Date of Patent: July 18, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seongjin Park, Dongyeon Kim, Hosaeng Kim, Sumin Yun, Woomin Jang, Myunghun Jeong, Jaehoon Jo
  • Patent number: 11705636
    Abstract: A composite antenna and array antenna using the same. The antenna has a three-layer structure including a patch antenna, a slot antenna and a transmission line. A first layer includes a patch antenna resonating at half a wavelength, a second layer includes a slot antenna resonating at half the wavelength, and a third layer includes a transmission line and a feed point. The three layers are coupled and the entire composite antenna unit satisfies a resonance condition. A signal is fed through the transmission line and coupled to the slot antenna, and the signal from the slot antenna is further coupled to the patch antenna. This composition antenna has a desirable antenna gain, and an increased antenna bandwidth compared to a single patch antenna or slot antenna.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: July 18, 2023
    Assignee: QUANTUMZ INC.
    Inventors: Kun-Yen Tu, Meng-Hua Tsai, Wei-Ting Lee, Sin-Siang Wang
  • Patent number: 11695210
    Abstract: A terminal device is provided. The terminal device includes a feed, a metal frame, and a radiating patch. At least two grooves are disposed on an outer surface of the metal frame, two through-holes are disposed in each groove, the radiating patch is disposed in each groove, the metal frame is grounded, two antenna feeding points are disposed on each radiating patch, the feed is connected to one feeding point through one through-hole, the antenna feeding points in each groove are in a one-to-one correspondence with the through-holes, and each radiating patch is insulated from the groove by using a non-conducting material.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: July 4, 2023
    Assignee: VIVO MOBILE COMMUNICATION CO., LTD.
    Inventors: Huan-Chu Huang, Yijin Wang, Xianjing Jian
  • Patent number: 11688953
    Abstract: A terminal device includes feed sources, a metal frame, coupling patches, and radiating patches, where at least two grooves are formed in the outer side surface of the metal frame, two first through holes are formed in each groove, a coupling patch and a radiating patch are arranged in each groove; the coupling patch in each groove is arranged between the radiating patch and the bottom of the groove, and two second through holes are formed in the coupling patch; two antenna feed points are arranged on each radiating patch, each feed source is connected to one antenna feed point through one first through hole and one second through hole; and the metal frame, the coupling patch, and the radiating patch are not in contact with one another, and an area of the radiating patch is less than an area of the coupling patch.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: June 27, 2023
    Assignee: VIVO MOBILE COMMUNICATION CO., LTD.
    Inventors: Huan-chu Huang, Yijin Wang, Xianjing Jian
  • Patent number: 11682827
    Abstract: Disclosed in an electronic device, which includes a housing that includes a first plate and a second plate facing a direction opposite the first plate, a conductive plate that is disposed in a first plane between the first plate and the second plate, and is parallel to the second plate, a wireless communication circuit that is disposed within the housing and is configured to transmit and/or receive a signal having a frequency ranging from 20 GHz to 100 GHz, a first electrical path having a first end electrically connected with the wireless communication circuit and a second end floated, the first electrical path including a first portion between the first end and the second end, a second electrical path having a third end electrically connected with the conductive plate and a fourth end floated, the second electrical path including a second portion between the third end and the fourth end.
    Type: Grant
    Filed: March 14, 2022
    Date of Patent: June 20, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ji Hoon Kim, Ji Yong Kim, Jong In Lee, Yeon Jeong Kim, Yong Jun An, Hyo Seok Na
  • Patent number: 11682846
    Abstract: An antenna device includes a first patch radiator and a second patch radiator arranged over the first patch radiator. The antenna device further includes a central ground pin connected substantially at a center portion of the first patch radiator. The antenna device further includes a plurality of conductive feeding pins connected to the first patch radiator and separated by at least one slot of a plurality of slots provides in the first patch radiator. The antenna device further includes a cell structure having a cavity that includes a polygonal-shaped base and a metallic fence arranged at four or more side walls of the cavity. The first patch radiator and the second patch radiators are arranged in the cavity of the cell structure and are at least partially surrounded by the metallic fence such that a plurality of antenna control parameters are decoupled from each other.
    Type: Grant
    Filed: October 5, 2021
    Date of Patent: June 20, 2023
    Assignee: Movandi Corporation
    Inventors: Nemat Dolatsha, Alfred Grau Besoli, Yifan Wang, Maryam Rofougaran, Ahmadreza Rofougaran
  • Patent number: 11670874
    Abstract: The present disclosure provides a broadband dual-polarized solar cell antenna and an antenna array. The broadband dual-polarized solar cell antenna includes an antenna dipole layer, an isolation layer, a solar cell layer, and a ground that are arranged sequentially from top to bottom, where the antenna dipole layer is connected to the ground and a radio frequency (RF) coaxial connector through a metal feeding probe structure, the solar cell layer is placed on the ground, the isolation layer is located between the antenna dipole layer and the solar cell layer, and the isolation layer is made of a transparent material. The present disclosure is small in sunlight shielding and high in transparency, and has a broadband dual-polarized wide-angle scanning capability, which ensures performance of the antenna and power generation efficiency of the solar cell, and is highly applicable in engineering.
    Type: Grant
    Filed: August 16, 2022
    Date of Patent: June 6, 2023
    Assignee: The 38th Research Institute of China Electronics Technology Group Corporation
    Inventors: Qian Chen, Zichao Li, Jia Fang, Quan Wang, Xiaolin Zhang, Mouping Jin, Yuefei Dai, Yinglu Wan
  • Patent number: 11664595
    Abstract: The disclosure provides an integrated wideband antenna, comprising a first conductor layer, a first conductor patch, a second conductor patch, a feeding conductor structure and a signal source. The first conductor patch has a first coupling edge and a first connecting edge. The first connecting edge electrically connects with the first conductor layer through a first shorting structure. The second conductor patch has a second coupling edge and a second connecting edge. The second connecting edge electrically connects with the first conductor layer through a second shorting structure. The second coupling edge is spaced apart from the first coupling edge at a third interval forming a resonant open slot. The feeding conductor structure is located within the resonant open slot and has a first conductor line, a second conductor line and a third conductor line. The first conductor line is spaced apart from the first coupling edge with a first coupling interval.
    Type: Grant
    Filed: December 15, 2021
    Date of Patent: May 30, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kin-Lu Wong, Wei-Yu Li, Wei Chung