Abstract: A dual-polarized antenna, an antenna array, and a communications device are disclosed. The dual-polarized antenna includes a base board, a horizontally polarized antenna, and a vertically polarized antenna. The substrate includes a first substrate and a plurality of second substrates stacked on the first substrate. The horizontally polarized antenna includes a first radiating element disposed on the first substrate, and a first feeding unit that feeds the first radiating element. The vertically polarized unit includes a second radiating element and a second feeding unit that feeds the second radiating element. The second radiating element includes a first metal patch disposed on each second substrate. In the foregoing technical solution, the base board formed by the stacked substrates is used as a support part, so that the horizontally polarized antenna and the vertically polarized antenna are disposed on the base board, thereby reducing space occupied by the dual-polarized antenna.

Abstract: Dual-band antenna systems and methods of fabricating and using the same are provided. A tunable dual-polarization (left-hand circular polarized (LHCP) and right-hand circular polarized (RHCP)) antenna can be used both for L-band (1.215 gigahertz (GHz)-1.85 GHz) and Ka-band (32.3 GHz-34.2 GHz) operation. The antenna system can be an embedded antenna system, which can be used for 3U CubeSats, with full polarization diversity able to operate in two widely spaced frequency bands (L-band and Ka-band) of the spectrum. The antenna system can include three layers, including a top substrate, a bottom substrate, and a ground plane disposed between the top substrate and the bottom substrate.

Abstract: An antenna element comprises one or more directors, a resonator, and a three dimensional ground assembly. Parts of the antenna element are arranged on three metal layers. A top layer has an unconnected metal bar which forms a beam director, a resonator and a top part of the ground assembly. The resonator is an integral piece substantially in the form of a loop connected to a feed line and a feed line terminal ending. The feed line terminal ending serves as the ground plane for the feed line as well as providing impedance matching from the external transceiver circuit to the resonator. The ground assembly includes a top layer ground connected to a plurality of metallized half cylindrical hole channels (or metallized via holes) which connect to a ground terminal in a bottom layer.

Abstract: A compact dual-band triple-polarized antenna based on shielded mushroom structures includes a vertically-polarized radiator and a horizontally-polarized radiator. Two parts are fixedly connected in a disc-shaped structure. The vertically-polarized radiator and the horizontally-polarized radiator are both multilayer structures. Each multilayer structure includes a plurality of concentric circles, and the plurality of concentric circles include a plurality of dielectric substrates. The vertically-polarized radiator and horizontally-polarized radiator each include a plurality of shielded mushroom cell structures. Each shielded mushroom cell structure includes at least three metal layers and a metallic shorting pin, and the metallic shorting pin connects at least two of the at least three metal layers.

Abstract: Systems and methods provide an antenna array with separately fed subarrays. The systems and methods provide optimized or improved physical embodiments of each sub-banded subarray in terms of radiating element type and physical implementation, radio frequency integrated circuit (RFIC) technology choice, RFIC packaging and interconnect implementation, and/or intra-subarray feed typology choice and implementation. The antenna array can include first elements within a first distance range from a point in a surface associated with the antenna array and configured for first signals in a first frequency range, and second elements within a second distance range from the point and configured for second signals in a second frequency range. The antenna system also can include an interconnect system comprising a first multichip module and a second multichip module region.

Abstract: A multi-band antenna includes a lower grounding portion, a feed-in portion, a feeding point, an upper grounding portion, a first extending portion, a second extending portion, a third extending portion, a fourth extending portion, a fifth extending portion, a first branch, a second branch, a third branch and a loop portion. The feed-in portion, the first extending portion, the second extending portion, the third extending portion, the fourth extending portion and the first branch form a first radiation portion. The feed-in portion, the first extending portion, the second extending portion, the third extending portion, the fifth extending portion and the second branch form a second radiation portion. The feed-in portion, the first extending portion, the second extending portion and the third branch form a third radiation portion.

Abstract: The present disclosure relates to an antenna device comprising: a first antenna comprising a first reflecting member configured to reflect at least a portion of a signal radiated by the antenna device; a second antenna comprising a second reflecting member configured to reflect at least a portion of the signal radiated by the antenna device, there is a spacing between the first reflecting member and the second reflecting member; and a coupling capacitor comprising a first polar plate and a second polar plate, the first polar plate is disposed on a side, close to the spacing, of a first reflecting surface of the first reflecting member, and the second polar plate is disposed on a side, close to the spacing, of a second reflecting surface of the second reflecting member.

Abstract: An electronic device may be provided with wireless circuitry. The wireless circuitry may include one or more antennas. The antennas may include millimeter wave antenna arrays. Non-millimeter-wave antennas such as cellular telephone antennas may have conductive structures separated by a dielectric gap. In a device with a metal housing, a plastic-filled slot may form the dielectric gap. The conductive structures may be slot antenna structures, inverted-F antenna structures such as an inverted-F antenna resonating element and a ground, or other antenna structures. The plastic-filled slot may serve as a millimeter wave antenna window. A millimeter wave antenna array may be mounted in alignment with the millimeter wave antenna window to transmit and receive signals through the window. Millimeter wave antenna windows may also be formed from air-filled openings in a metal housing such as audio port openings.

Abstract: A radio assembly is provided. The radio assembly includes at least one radio module and a radome. The radio module has a heatsink disposed on one side and a radio module base on the other side thereof. The radio module base is disposed between the heatsink and the radome. The heatsink defines a cable channel for routing at least one power cable and at least one data cable.

Abstract: An antenna includes a first antenna element, a second antenna element, and a first coupler. The first antenna element includes a first radiation conductor and a first feeder line and resonates in a first frequency band. The second antenna element includes a second radiation conductor and a second feeder line and resonates in a second frequency band. The second feeder line is coupled to the first feeder line such that a first component, which is one of a capacitance component and an inductance component, is dominant. The first coupler couples the first and second feeder lines such that a second component different from the first component is dominant. The first and second radiation conductors are arranged at an interval of ½ or less of a resonance wavelength in a first direction. The first and second radiation conductors are arranged to be shifted in a second direction intersecting the first direction.

Abstract: Radiating elements include a first dipole radiator that extends along a first axis, the first dipole radiator including a first pair of dipole arms that are configured to resonate at a first frequency and a second pair of dipole arms that are configured to resonate at a second frequency that is different than the first frequency. Each dipole arm in the first pair of dipole arms comprises a plurality of widened sections that are connected by intervening narrowed sections.

Abstract: An apparatus and method for determining location information using a multi-polarized antenna array is disclosed. The multi-polarized antenna array includes a plurality of metal patches and a multiplexer. Each metal patch has at least two feed-points. The multiplexer is coupled to an RF terminal and to each of the at least two feed-points of each of the plurality of metal patches. The antenna array is configurable to couple each feed-point one at a time to the RF terminal. Location information may be determined by a controller coupled to the RF terminal from RF signals received via each feed-point.

Abstract: A wireless communication device includes: a substrate containing a dielectric; a zeroth-order resonance antenna; a high frequency circuit mounted on the substrate and a metal body mounted on the substrate. The zeroth-order resonance antenna includes: a main plate providing a ground potential, a patch portion, a feeder line extending from a feeding point to the patch portion to electrically connect the patch portion and the high frequency circuit, at least a part thereof being arranged on a same surface as the patch portion on the substrate, and a short circuit portion. The metal body has a same potential as the main plate. The metal body has a longer length (greater height) than the patch portion in a Z direction.

Abstract: A dual-polarized antenna is presented for 5G mobile communications. The antenna includes two discrete elements—a folded dipole and a folded monopole, which generate two orthogonal polarizations. Parasitic elements are used to realize higher-band operation. In one example, the antenna covers both the 28 GHz band and the 39 GHz band. The entire structure is designed on an ultra-thin four-layer laminate and is intended to be incorporated along the edges of smartphones to enable 5G operation.

Abstract: A high-field emission tolerant RFID tag device that may be secured to a product to be cooked, heated, reheated and/or thawed in a heating apparatus such as, but not limited to, a microwave oven and that does not need to be removed from the product before initiating the heating process. The RFID device is microwave safe and does not damage the product or food item to which it is attached during the microwave process, and may contain data to control the microwave process. The microwave safe RFID tag comprises a split ring (or shield) conductor formed on one side of a substrate (or dielectric), a coil antenna conductor formed on an opposite side of the substrate, and a RFID chip. The split ring conductor capacitively couples to the coil antenna conductor via the dielectric and a gap in the split ring conductor prevents arcing.

Abstract: An antenna apparatus includes a ground plane, a patch antenna pattern disposed on an upper surface of the ground plane, a feed via penetrating the ground plane and spaced apart from the patch antenna pattern, and a coiled feed pattern electrically connected to an upper end of the feed via, spaced apart from the patch antenna pattern, and configured to provide a feed path to the patch antenna pattern, wherein at least a portion of the coiled feed pattern is coiled, wherein the patch antenna pattern includes an aperture portion corresponding to the coiled feed pattern.

Abstract: The present invention provides phased array antenna apparatus (200) for operation in frequencies above six gigahertz.

Abstract: A stacked patch antenna comprises two or more patch antennas physically disposed in a stack to provide a multi-frequency or broad band antenna. However, independence of the resonant response frequencies of the lower and upper patches of each stacked patch antenna pair ground requires metallization dimensions for the upper patch's lower surface be contained within the perimeter of the lower patch's resonant metallization. Accordingly, composite stacked patch element dimensions are limited by the desired resonant frequency of the lower patch. The inventors have established an alternate physical structure where the resonant patch geometry of the lower patch element's upper metallization is not limited by the lower surface ground plane metallization of the first upper patch element. The inventors have also established design solutions allowing the lower frequency performance of the first, lower patch within a stacked patch antenna to be lowered without compromising footprint of the resulting antenna.

Abstract: A low-profile circularly polarized isoflux antenna module is provided, which relates to the field of microelectronic antennas, and provides a solution to solve the contradiction between size and gain in conventional technology. The antenna module includes an antenna array, a substrate, a connection plate, and a feeding plate that are stacked in sequence. The feeding network on the feeding plate is electrically connected to the antenna array through probe passing through the connection plate and the substrate. The antenna array includes two or more concentrically distributed antenna elements, and each antenna element forms mutually independent concentric circularly polarized apertures through feed control. The structure is simple to assemble and easy to process, light in weight, small in size, and low in profile.

Abstract: A semiconductor device can comprise a substrate dielectric structure and a substrate conductive structure that traverses the substrate dielectric structure and comprises first and second substrate terminals; an electronic component with a component terminal coupled to the first substrate terminal; and a first antenna element with a first element terminal coupled to the second substrate terminal, a first element head side adjacent a first antenna pattern, a first element base side opposite the first element side, and a first element sidewall. The first element terminal can be exposed from the first element dielectric structure at the first element base side or at the first element sidewall. The first antenna pattern can be coupled to the substrate through the first element terminal. The substrate conductive structure can couple the first antenna element to the electronic component. Other examples and methods are also disclosed.