Abstract: Embodiments of systems and methods for a poly-phased inductively coupled plasma source are described. In an embodiment, a system may include a metal source configured to supply a metal for ionized physical vapor deposition on a substrate in a process chamber. The system may also include a high-density plasma source configured to generate a dense plasma, the high-density plasma source comprising a plurality of inductively coupled antennas. Additionally, the system may include a substrate bias source configured to provide a potential necessary to thermalize and ionize the plasma. In such embodiments, each antenna is configured to receive power at a phase orientation determined according to a phase arrangement.

Abstract: An electrical storage device includes an electrical storage element and an electrolytic solution. The electrical storage element is formed of an anode body, a cathode body facing the anode body, and a separator interposed between the anode body and the cathode body. The separator includes a separator substrate and a conductive polymer adhering to the separator substrate. The electrical storage element is impregnated with the electrolytic solution. The separator includes a first surface layer having a first surface facing the anode body and a second surface layer having a second surface facing the cathode body. The first surface layer includes a first region that is not provided with the conductive polymer, and the second surface layer includes a second region provided with the conductive polymer.

Abstract: Systems and methods controlling ion energy within a plasma chamber are described. One of the systems includes an upper electrode coupled to a sinusoidal RF generator for receiving a sinusoidal signal and a nonsinusoidal RF generator for generating a nonsinusoidal signal. The system further includes a power amplifier coupled to the nonsinusoidal RF generator. The power amplifier is used for amplifying the nonsinusoidal signal to generate an amplified signal. The system includes a filter coupled to the power amplifier. The filter is used for filtering the amplified signal using a filtering signal to generate a filtered signal. The system includes a chuck coupled to the filter. The chuck faces at least a portion of the upper electrode and includes a lower electrode. The lower electrode is used for receiving the filtered signal to facilitate achieving ion energy at the chuck to be between a lower threshold and an upper threshold.

Abstract: A system uses one or more magnetrons to generate pulsed radio-frequency (RF) power, such as for powering an accelerating cavity. The one or more magnetrons each having a self-excitation threshold voltage and configured to operate with internal modulation using a pulsed RF input signal to produce the pulsed RF power when being powered by a direct-current power supply at a voltage level below the self-excitation threshold voltage.

Abstract: A dummy trace portion is provided in a region between at least a suspension board with circuit on one end side and a support frame of a suspension board assembly sheet with circuits. A base insulating layer is formed on a support substrate in the dummy trace portion. A plurality of conductor traces are formed on the base insulating layer, and a cover insulating layer is formed on the base insulating layer to cover each conductor trace. At least one of the base insulating layer and the cover insulating layer in the dummy trace portion has a groove.

Abstract: Systems and methods to reduce the amplitude of undesirable eddy currents in conducting structures, e.g., induced by the translation of an FRC into a confinement chamber, while leaving beneficial eddy currents unaffected. This is achieved by inducing opposing currents in the same conducting structures prior to plasma translation into the confinement chamber.

Abstract: Capacitors having form factors (e.g., dimensions and functionality) comparable with traditional single layer capacitors, but with considerably higher capacitance and methods of their manufacture are provided. Capacitors and methods that implement capacitors where at least one of the dielectric layers is reduced in thickness post firing to produce a device robust enough for automated handling and provide a stable surface for wire-bonding are also provided. Capacitors and methods that implement an internal electrode between at least two layers of pre-fired ceramic dielectric are also provided. Capacitors and methods that implement the integration of multiple dielectric types in a single device producing high frequency performance characteristics are also provided. Capacitors and dielectrics that implement the combination of a multi-layer capacitor with a thin single layer capacitor to further increase operating frequency and capacitance are also provided.

Abstract: The present disclosure is directed to structural supercapacitors and electrodes for structural supercapacitors having high energy storage and high mechanical characteristics and methods of making the structural supercapacitors and electrodes. The structural supercapacitors can include a solid electrolyte and carbon fiber electrodes comprising carbon nanotubes, surface functionalized redox-active moieties, and/or a conducting polymer.

Abstract: Systems and methods for tuning to reduce reflected power in multiple states are described. The methods include determining values of one or more parameters of an impedance matching circuit so that reflected power is reduced for multiple states. Such a reduction in the reflected power increases a life of a radio frequency generator coupled to the impedance matching circuit while simultaneously processing a substrate using the multiple states.

Abstract: A plasma impedance matching unit for a plasma power supply system includes a first power connector for coupling the matching unit to a RF power source, a second power connector for coupling the matching unit to a plasma load, a data link interface for directly coupling the matching unit to another plasma impedance matching unit via a data link, and a controller configured to control the matching unit to match an impedance from the first power connector to an impedance at the second power connector, to operate as a master for at least one other impedance matching unit and/or at least one RF power source of the plasma power supply system, and to communicate via the data link interface with the at least one other impedance matching unit and/or the at least one RF power source of the plasma power supply system.

Abstract: A multilayer electronic component includes a body having a stacked structure in which a plurality of internal electrodes and dielectric layers are alternately stacked; and external electrodes disposed on an outer surface of the body and connected to the internal electrodes. The dielectric layer includes a plurality of grains and a plurality of graphene particles, and the plurality of graphene particles are disposed at boundaries of the plurality of grains.

Abstract: To provide a magnetron capable of effectively suppressing a plurality of higher harmonic wave components with a simple configuration. A magnetron 1 is designed so that: a choke part 60 consisting of a first choke 30 and a second choke 32 being a plurality of chokes provided on the inside of a metal sealing body 7 on an output unit 5 are provided to suppress higher harmonic waves; and a plurality of choke grooves 31A, 31B and 31C that correspond to each of higher harmonic wave components larger than the number of the first choke 30 and second choke 32 and different in each frequency are formed by the choke part 60 and the metal sealing body 7.

Abstract: An electrical device includes an electrical component configured to generate heat during operation of the electrical device. A thermal management coating is configured to transfer heat from the electrical component by thermal conduction. The thermal management coating comprises a non-carbon based topological insulator.

Abstract: A plasma chamber is provided to increase conductance within the plasma chamber and to increase uniformity of the conductance. A radio frequency (RF) path for supplying power to the plasma chamber is symmetric with respect to a center axis of the plasma chamber. Moreover, pumps used to remove materials from the plasma chamber are located symmetric with respect to the center axis. The symmetric arrangements of the RF paths and the pumps facilitate an increase in conductance uniformity within the plasma chamber.

Abstract: Circuitry 31 for a solid-state lighting arrangement 20 designed for as a replacement for a gas discharge lamp used in a lighting fixture having a ballast. The circuitry 31 unsafe flow of current through the solid-state lighting arrangement 20, under non-operational conditions and during installation of the lighting arrangement, so as to provide compatibility with safety standards for use with discharge lamps.

Abstract: An electronic component includes a laminated body including first and second end surfaces, first and second side surfaces, and first and second principal surfaces, a first external electrode, and a second external electrode, in which the first external electrode includes a first fired electrode layer and a first resin layer, the second external electrode includes a second fired electrode layer and a second resin layer, each of the first fired electrode layer and the second fired electrode layer is provided on the laminated body and includes a region including voids and glass, each of the first resin layer and the second resin layer includes metal particles, and a surface layer of each of the first resin layer and the second resin layer has a portion of the metal particles exposed in a ratio of about 72.6% or more and about 90.9% or less.

Abstract: An electrolytic capacitor includes an anode body, a dielectric layer formed on the anode body, and a conductive polymer layer covering at least a part of the dielectric layer. The conductive polymer layer includes a conductive polymer and a polymer dopant. The polymer dopant includes a first copolymer including: (A) a first unit derived from a first monomer having a sulfonate group; (B) a second unit derived from a second monomer having a carboxy group; and (C) a third unit derived from a third monomer having a hydroxy group.

Abstract: A multilayer ceramic capacitor includes: a multilayer structure in which each of a plurality of ceramic dielectric layers and each of a plurality of internal electrodes are alternately stacked and are alternately exposed to two edge faces of the multilayer structure; a first external electrode that is coupled to one of the two edge faces; and a second external electrode that is coupled to the other of the two edge faces, wherein: a main component of the plurality of ceramic dielectric layers is BaTiO3; the plurality of ceramic dielectric layers include a rare earth element; and an atomic concentration ratio of a total amount of Mn and V with respect to Ti in the plurality of ceramic dielectric layers is 0.035% or more and 0.120% or less.

Abstract: An arrangement for cooling components of a subsea electric system including a tank filled with a dielectric fluid. The tank includes first and second sections. The arrangement includes one first electric component within the first section, and one second electric component within the second section. The arrangement includes a first heat exchanger located outside the tank and in fluid contact with the tank, and arranged during operation to be in thermal contact with sea water. The arrangement includes a pump arranged to force a flow of dielectric fluid through the first heat exchanger. Flow of dielectric fluid in the tank is by both natural and forced convection generated by the pump. The first electric component generates more heat than the second electric component. Within the first section the share of the flow by natural convection is greater than within the second section.

Abstract: The power conversion device of the invention includes: a cooling unit that is a prism, the interior of which is hollow, and that has a refrigerant inlet portion and a refrigerant outlet portion the cooling unit having in the interior thereof a refrigerant channel through which a refrigerant flows from the refrigerant inlet portion towards the refrigerant outlet portion; electronic devices that are respectively disposed on three or more surfaces on the outside of side surfaces of the cooling unit, excluding a refrigerant inlet surface, in which the refrigerant inlet portion is disposed, and a refrigerant outlet surface, in which the refrigerant outlet portion is disposed, the electronic devices being cooled by boiling of the refrigerant; and a hollow outer case 4 that covers the electronic devices.