Patents Examined by Dion R Ferguson
  • Patent number: 12040135
    Abstract: Provided is an improved multilayered ceramic capacitor and an electronic device comprising the multilayered ceramic capacitor. The multilayer ceramic capacitor comprises first conductive plates electrically connected to first external terminations and second conductive plates electrically connected to second external terminations. The first conductive plates and second conductive plates form a capacitive couple. A ceramic portion is between the first conductive plates and said second conductive plates wherein the ceramic portion comprises paraelectric ceramic dielectric. The multilayer ceramic capacitor has a rated DC voltage and a rated AC VPP wherein the rated AC VPP is higher than the rated DC voltage.
    Type: Grant
    Filed: February 8, 2023
    Date of Patent: July 16, 2024
    Assignee: KEMET Electronics Corporation
    Inventors: John Bultitude, Nathan A. Reed, Allen Templeton, James R. Magee, James Davis, Abhijit Gurav, Hunter Hayes, Hanzheng Guo
  • Patent number: 12033800
    Abstract: According to an aspect of the present disclosure, a capacitor component includes a body including a dielectric layer and an internal electrode layer; and an external electrode disposed on the body and connected to the internal electrode layer, wherein the body further includes a withstand voltage layer disposed in a region spaced apart by more than 0 to 30 nm or less in a direction from a boundary of the internal electrode layer toward the dielectric layer, and having ionic mobility, lower than ionic mobility of the dielectric layer.
    Type: Grant
    Filed: April 5, 2022
    Date of Patent: July 9, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Hoon Yoo, Su Been Kim, Kyung Ryul Lee, Jong Suk Jeong, Chun Hee Seo, Dong Geon Yoo, Hyung Jun Kong
  • Patent number: 12027315
    Abstract: A multilayer capacitor includes a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes stacked with respective dielectric layers interposed therebetween, external electrodes disposed on external surfaces of the body and connected to the internal electrodes, and an insulating layer covering a surface of the body. One of the external electrodes includes a metal layer connected to the insulating layer, and the insulating layer includes an oxide of a metal component of the metal layer.
    Type: Grant
    Filed: May 22, 2023
    Date of Patent: July 2, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yun Sung Kang, Min Jung Cho, Yun Hee Kim
  • Patent number: 12009150
    Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes alternately disposed in a first direction, and external electrodes disposed on the body to be connected to the internal electrodes. At least one internal electrode of the internal electrodes includes a plurality of disconnected portions penetrating through a respective internal electrode. A disconnected portion of the plurality of disconnected portions includes at least one of a pore or a dielectric substance disposed to connect adjacent dielectric layers to each other. A dielectric filling ratio, defined as a ratio of an overall length of the dielectric substance to an overall length of the disconnected portion on a cross section in the third and first directions, is more than 20% to 80% or less.
    Type: Grant
    Filed: May 8, 2023
    Date of Patent: June 11, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kyoung Jin Cha, Woo Chul Shin, Seung Heui Lee, Beom Seock Oh
  • Patent number: 12009155
    Abstract: A multilayer ceramic capacitor includes a capacitor main body, and two interposers on both sides in a length direction of a surface of the capacitor main body. When a distance between a side surface of one interposer on one side in the length direction, and a side surface of the capacitor main body is defined as X1, a distance between another side surface of the one interposer, and another side surface of the capacitor main body is defined as X4, a distance between a side surface of another interposer on another side in the length direction, and the side surface of the capacitor main body is defined as X2, and a distance between another side surface of the other interposer on the other side in the length direction, and the other side surface of the capacitor main body is defined as X3; X2>X3 and X1>X4 are satisfied.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: June 11, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Satoshi Yokomizo, Shinobu Chikuma, Yohei Mukobata
  • Patent number: 12009152
    Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of internal electrodes laminated in a first direction, and external electrodes. The body includes an active portion, in which the plurality of internal electrodes are disposed to form capacitance, corresponding to a region between internal electrodes disposed on an outermost side in the first direction, among the plurality of internal electrodes, a cover portion covering the active portion in the first direction, and a side margin portion covering the active portion in a second direction, perpendicular to the first direction, and 1.49<A1/A2<2.50 where A1 is an average grain size of the dielectric layer in a central region of the active portion, and A2 is an average grain size of the dielectric layer in an active-cover boundary portion, adjacent to the cover portion, of the active portion.
    Type: Grant
    Filed: April 17, 2023
    Date of Patent: June 11, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hong Gi Nam, Seung In Baik, Ji Su Hong, Eun Ha Jang, Hee Sun Chun, Jae Sung Park
  • Patent number: 12009156
    Abstract: A method of manufacturing a multilayer ceramic capacitor includes alternately laminating dielectric layers and internal electrode layers to manufacture a multilayer body, forming an external electrode connected with the internal electrode layers on each of two end surfaces of the multilayer body to manufacture a capacitor main body, connecting two interposers via a plate-shaped member, connecting the two interposers and the external electrode, and removing the plate-shape member.
    Type: Grant
    Filed: April 12, 2023
    Date of Patent: June 11, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Satoshi Yokomizo, Shinobu Chikuma, Yohei Mukobata
  • Patent number: 11996245
    Abstract: A ceramic electronic component includes: a ceramic body including main surfaces perpendicular to a first axis and end surfaces perpendicular to a second axis; and external electrodes covering the end surfaces and extending from the end surfaces to the main surfaces. The external electrode includes a surface layer portion including a Sn plating layer, and an inner layer portion including a Ni plating layer adjacent to the Sn plating layer and including rounded inner end portions on the main surfaces. In a cross-section perpendicular to a third axis, a ratio t2/t1 is 0.4 or more, where t2 is a thickness in the first axis direction of a portion where an inclination of a tangent line of an outer surface of the inner end portion to each main surface is 45°, and t1 is a maximum thickness in the first axis direction of the inner layer portion on each main surface.
    Type: Grant
    Filed: August 12, 2022
    Date of Patent: May 28, 2024
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Eriko Numata, Daisuke Iwai, Shinichi Sasaki, Fumi Mori
  • Patent number: 11996239
    Abstract: In an embodiment a capacitor includes a dielectric layer including a polyamideimide, the dielectric layer being uniform and a first electrode disposed directly adjacent to the dielectric layer.
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: May 28, 2024
    Assignee: TDK Electronics AG
    Inventors: Birgit Six, Stefan Sax
  • Patent number: 11978594
    Abstract: A multilayer ceramic electronic component includes a ceramic body, and first and second external electrodes disposed on the surface of the ceramic body, respectively. The ceramic body includes a capacitance forming portion including a dielectric layer and internal electrodes, margin portions disposed on both sides of the capacitance forming portion, and cover portions disposed on both sides of the capacitance forming portion. The first and second external electrodes include first and second base electrodes, respectively, first and second conductive layers disposed on edges of the first and second base electrodes, respectively, and first and second terminal electrodes covering the first and second base electrodes, respectively.
    Type: Grant
    Filed: April 17, 2023
    Date of Patent: May 7, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: In Kyung Jung, Dong Hwi Shin
  • Patent number: 11978590
    Abstract: A symmetrical supercapacitor cell is disclosed comprising at least two electrode split sections, at least two electrodes, a plurality of ring isolators, and a spring pin arrangement. The at least two electrodes are placed in between the at least two electrode split sections, wherein a plurality of ring isolators is connected with a plurality of bolts to fasten the at least two electrode split sections. Also disclosed is an integrated thermal management system with a supercapacitor cell including a base support holder, a heating coil casing, a heating coil, and a cavity. The heating coil is installed inside the heating coil casing that is underneath a supercapacitor cell body. Further, a cavity is formed around the supercapacitor cell and contains an oil that is heated via the installed heating coil to achieve a desired temperature.
    Type: Grant
    Filed: March 28, 2023
    Date of Patent: May 7, 2024
    Assignee: UNIVERSITY OF SHARJAH
    Inventors: Abdul Ghani Olabi, Mohammad Ali Abdelkareem, Qaisar Abbas, Ahmed Al Makky
  • Patent number: 11978597
    Abstract: A liquid component for an electrolytic capacitor includes at least one central atom selected from the group consisting of boron, aluminum, and silicon, and a ligand having a plurality of ligand atoms bonded to the central atom. The ligand atoms are at least one selected from the group consisting of oxygen and nitrogen, and are bonded to a carbon atom having no oxo group.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: May 7, 2024
    Assignees: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., SANYO CHEMICAL INDUSTRIES, LTD.
    Inventors: Yuichiro Tsubaki, Tatsuji Aoyama, Kazuyo Saito, Liyi Chen, Kengo Uchihashi
  • Patent number: 11972908
    Abstract: The present invention relates to a capacitor comprising i) an electrode body comprising an electrode material, wherein a dielectric layer comprising a dielectric material at least partially covers a surface of the electrode body; ii) a solid electrolyte layer comprising a solid electrolyte material that at least partially covers a surface of the dielectric layer, wherein the solid electrolyte material comprises a conductive polymer; iii) an anode contact that is in contact with the electrode body and that comprises copper, metal-plated copper or a copper-containing alloy; and iv) a cathode contact that is in contact with the solid electrolyte layer; wherein the capacitor further comprises at least one metal ion migration inhibitor. The present invention also relates to a process for the production of a capacitor, to a capacitor obtainable by such a process, to electronic circuit comprising the capacitor according to present invention and to the use of these capacitors in electronic circuits.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: April 30, 2024
    Assignee: HERAEUS DEUTSCHLAND GMBH & CO. KG
    Inventors: Yayoi Miyazaki, Akio Ishikawa, Udo Merker
  • Patent number: 11967465
    Abstract: A film capacitor for positioning at a direct current (DC) terminal at a front end of an inverter having a plurality of switching elements, can include a first member; and a second member surrounding the first member, in which a second dielectric resistance of the second member is higher than a first dielectric resistance of the first member.
    Type: Grant
    Filed: November 29, 2019
    Date of Patent: April 23, 2024
    Assignees: LG MAGNA E-POWERTRAIN CO., LTD., RUBYCON CORPORATION
    Inventors: Sungtae Choi, Takahisa Makino
  • Patent number: 11967464
    Abstract: A selection method includes: obtaining or providing multilayer ceramic capacitors each having a multilayer structure in which each of a plurality of ceramic dielectric layers and each of a plurality of internal electrode layers are alternately stacked; measuring a ratio of (a current value at 10 V/?m when a direct voltage is applied to a plurality of ceramic dielectric layers at 125 degrees C.)/(a current value at 10 V/?m when a direct voltage is applied to the plurality of the ceramic dielectric layers at 85 degrees C.), with respect to each multilayer ceramic capacitor; determining whether the ratio is in a predetermined range; and selecting a multilayer ceramic capacitor or multilayer ceramic capacitors each having a ratio in the predetermined range as a desired multilayer ceramic capacitor.
    Type: Grant
    Filed: August 26, 2022
    Date of Patent: April 23, 2024
    Assignee: TAIYO YUDEN CO., LTD.
    Inventor: Katsuya Taniguchi
  • Patent number: 11961677
    Abstract: A capacitor module includes a capacitor element, a plurality of connection terminals for electrically connecting the capacitor element to a semiconductor module and a power supply that are another equipment, and an exterior coating that includes a resin film having electrical insulating property and wraps the capacitor element except the plurality of connection terminals.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: April 16, 2024
    Assignee: DENSO CORPORATION
    Inventors: Mamoru Kuwahara, Yuta Hashimoto, Kazuya Takeuchi
  • Patent number: 11955282
    Abstract: A capacitor component includes a body including a dielectric layer and internal electrode layers, with the dielectric layer interposed therebetween; and an external electrode disposed on the body and connected to the internal electrode layers. Each of the internal electrode layers has a capacitance formation portion disposed to overlap an adjacent internal electrode layer, and a lead-out portion extending from the capacitance formation portion and connected to the external electrode. A ratio (H2/H1) of a height difference H2 to a height difference H1 is 0.2 or less, where the height difference H2 is a height difference between the capacitance formation portion and the lead-out portion of a lowermost internal electrode layer the height difference H1 is a height difference between the capacitance formation portion and the lead-out portion of an uppermost internal electrode layer. An average thickness of the dielectric layer is 420 nm or less.
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: April 9, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ha Young Song, Jong Hoon Kim, Min Gon Lee
  • Patent number: 11955281
    Abstract: An electronic component includes: a multilayer capacitor including a capacitor body and a pair of external electrodes, respectively disposed on external surfaces of the capacitor body in a first direction; and an interposer disposed below the multilayer capacitor and including an interposer body, a pair of via holes penetrating through the interposer body, and a pair of via electrodes, respectively disposed in the via holes to be connected to the pair of external electrodes, respectively. 0.24T?t?0.3T, where “T” is a maximum height of the multilayer capacitor and “t” is a maximum height of the interposer.
    Type: Grant
    Filed: May 17, 2021
    Date of Patent: April 9, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Hoon Kim, Chang Hee Lee, Jea Hoon Lee, Hye Jin Kim, Yeo Ju Cho
  • Patent number: 11955280
    Abstract: Strong and flexible electrically conductive polymers comprising hydrogen-bondable moieties are described herein. The electrically conductive polymers are formed by polymerizing an electron donating aromatic monomer in the presence of an oxidant, solvent, and/or hydrogen-bondable additive, such as an additive comprising a hydroxyl group.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: April 9, 2024
    Assignee: PolyJoule, Inc.
    Inventors: Eli Paster, Taizoon Canteenwala, Eliza Spear, Zhengguo Zhu, Timothy Manning Swager
  • Patent number: 11945923
    Abstract: Disclosed is a method for producing an electrolytic capacitor, the method including the steps of preparing an anode foil that includes a dielectric layer, a cathode foil, and a fiber structure; preparing a conductive polymer dispersion liquid that contains a conductive polymer component and a dispersion medium; producing a separator by applying the conductive polymer dispersion liquid to the fiber structure and then removing at least a portion of the dispersion medium; and producing a capacitor element by sequentially stacking the anode foil, the separator, and the cathode foil. The dispersion medium contains water. The fiber structure contains a synthetic fiber in an amount of 50 mass % or more. The fiber structure has a density of 0.2 g/cm3 or more and less than 0.45 g/cm3.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: April 2, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Daisuke Kubo, Hiroyuki Arima, Tomoyuki Tashiro, Kazuhiro Takatani, Kenta Chashiro, Shumpei Matsushita