Patents Examined by Dion R Ferguson
  • Patent number: 11152161
    Abstract: An improved capacitor is provided. The capacitor comprises a working element wherein the working element comprises an anode comprising a first dielectric on the anode, a cathode and a conductive separator between the first dielectric and cathode. The conductive separator comprises a separator and a first conductive polymer wherein the first conductive polymer at least partially encapsulates the separator. A second conductive polymer at least partially encapsulates the first conductive polymer and wherein the first conductive polymer has a higher conductivity than the second conductive polymer. An anode lead is in electrical contact with the anode and a cathode lead is in electrical contact with the cathode.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: October 19, 2021
    Assignee: KEMET Electronics Corporation
    Inventors: Victor Andoralov, Miguel Evaristo, Rui A. Monteiro, Philip M. Lessner
  • Patent number: 10249467
    Abstract: A device for collimation or focusing of a relativistic electron packet, obtained in particular by laser-plasma acceleration, including a gas cloud and a laser capable of emitting a laser pulse focused in the gas cloud in order to create therein a wave of focusing electric and magnetic fields. The invention also relates to a device for emission of a collimated or focused relativistic electron packet. The invention further relates to a collimation or focusing method for a relativistic electron packet, and to methods for emission of a collimated or focused relativistic electron packet.
    Type: Grant
    Filed: November 4, 2015
    Date of Patent: April 2, 2019
    Assignees: ECOLE POLYTECHNIQUE, ECOLE NATIONALE SUPÉRIEURE DE TECHNIQUES AVANCÉES
    Inventors: Cédric Thaury, Rémi Lehe, Victor Malka, Emilien Guillaume
  • Patent number: 10212831
    Abstract: An electronic control unit having a housing containing a circuit board. The housing includes a base and a cover between which the circuit board is located, and the unit being characterized in that the base and the cover are connected to one another via interference fit interengagement around at least a major part of a peripheral edge of the cover.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: February 19, 2019
    Assignee: VEONEER SWEDEN AB
    Inventors: Norbert Karszt, Sebastian Hetzel
  • Patent number: 10201116
    Abstract: A data center can include at least one computing room, and at least one rack system disposed in the computing room. The rack system includes a rack housing that at least substantially encapsulates an interior space, and a plurality of computing devices mounted to the rack in the interior space. The data center can further include a cooling system. The cooling system includes a conduit that is disposed in the interior space of the rack housing and a fluid that flows through the conduit, wherein heat is transferred from air in the interior space to the fluid to produce cooled air in the rack housing.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: February 5, 2019
    Assignee: Amazon Technologies, Inc.
    Inventors: Peter George Ross, Matthew David Striffler, Alan Donald Gillooly
  • Patent number: 10185376
    Abstract: An electronic device includes a display module that outputs a screen by using supplied power, and a heat sink with an electric shock prevention function prevents an electric shock accident by using a stable insulation structure. An inner housing is disposed under the display module, and the heat sink is disposed between the display module and the inner housing. A surface of the heat sink faces the inner housing is insulated, and an outer housing is disposed under the inner housing.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: January 22, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jung Hwan Jun, Jong Min Choi
  • Patent number: 10178797
    Abstract: Examples are disclosed that relate to cooling multiple heat-generating components in an electronic device. One example provides a cooling module including an airflow channel downstream of a blower to receive a flow of air generated by the blower, a heat sink extending into the airflow channel and configured to direct air toward a first outlet, and an air-diverting structure positioned within a gap between a distal surface of the heat sink and an opposing interior surface of the airflow channel, the air-diverting structure configured to redirect air flowing in the gap toward a second outlet.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: January 8, 2019
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: Michael Lau, Julia Purtell, Jeffrey Mark Reents
  • Patent number: 10178804
    Abstract: A heat spreader includes a main body extending between a front and a rear configured to be mounted to a cage and heat transfer fingers cantilevered forward from the front of the main body. The heat transfer fingers each have a fixed end, a distal end, a top, a bottom and mating edges facing each other across gaps. The heat transfer fingers are configured to be received in corresponding channels between heat transfer fins of a pluggable module as the pluggable module is installed in the cage through the front end with the gaps receiving the heat transfer fins. The mating edges are configured to face and be thermally coupled to corresponding heat transfer fins. The heat transfer fingers transfer heat from the heat transfer fins rearward toward the distal ends and into the main body.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: January 8, 2019
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Alex Michael Sharf, Nathan Lincoln Tracy
  • Patent number: 10176923
    Abstract: A ceramic electronic component includes a body, a first external electrode, and a second external electrode. The body includes a first end surface and a second end surface that face each other, surfaces each extending between the first end surface and the second end surface, an outer edge that is provided along the surfaces and includes recesses, the recesses extending from the first end surface and the second end surface along ridges of the surfaces, and a functional unit that is disposed inward relative to the outer edge. The first external electrode and the second external electrode respectively cover the first end surface and the second end surface and extend to come close to each other from the first end surface and the second end surface along the surfaces and the recesses.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: January 8, 2019
    Assignee: Taiyo Yuden Co., Ltd.
    Inventor: Takashi Asai
  • Patent number: 10169624
    Abstract: Tamper-proof electronic packages and fabrication methods are provided including an enclosure enclosing, at least in part, at least one electronic component within a secure volume, a two-phase dielectric fluid within the secure volume, and a tamper-respondent detector. The tamper-respondent detector monitors, at least in part, temperature and pressure of the two-phase dielectric fluid. In operation, the two-phase dielectric fluid deviates from an established saturation line of the two-phase dielectric fluid within the secure volume with an intrusion event into the secure volume, and the tamper-respondent detector detects, from the monitoring of the temperature and pressure of the two-phase dielectric fluid, the deviation from the established saturation line, and thereby occurrence of the intrusion event.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: January 1, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Levi A. Campbell, Milnes P. David, Dustin W. Demetriou, Michael J. Ellsworth, Jr.
  • Patent number: 10172257
    Abstract: A heat dissipation module is provided. The heat dissipation includes a base, a frame, and a positioning member. The frame is disposed on the base and has a passage for containing an electronic component. At least a segment of the edge of the frame that is adjacent to the base is distant from the base so as to form an air path inlet that communicates with the passage therebetween. The positioning member is disposed in the passage and is connected to the frame and configured to position an electronic assembly in the frame.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: January 1, 2019
    Assignee: SYNOLOGY INC.
    Inventor: Cheng-Huang Lee
  • Patent number: 10163583
    Abstract: An energy device including a paper based substrate having a top surface and a bottom surface, and a graphene oxide and carbon nanotube composite deposited onto at least the top surface. The energy device can be used as an electrode in, for example, a supercapacitor.
    Type: Grant
    Filed: November 5, 2013
    Date of Patent: December 25, 2018
    Assignee: The Regents of the University of California
    Inventors: Shirui Guo, Wei Wang, Cengiz S Ozkan, Mihrimah Ozkan
  • Patent number: 10153225
    Abstract: In accordance with embodiments of the present disclosure, an information handling system may include a plurality of information handling resources and a thermal control system comprising a plurality of air movers, wherein the thermal control system is configured to operate in a first cooling mode in which the thermal control system operates at least one first air mover of the plurality of air movers to maintain a first information handling resource of the plurality of information handling resources above a minimum temperature threshold and operates at least one second air mover of the plurality of air movers to maintain a second information handling resource of the plurality of information handling resources below a maximum temperature threshold.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: December 11, 2018
    Assignee: Dell Products L.P.
    Inventors: Dominick A. Lovicott, Mukund P. Khatri, Robert B. Curtis
  • Patent number: 10153095
    Abstract: An ultra-capacitor battery includes multiple cathodes, each including a first substrate having a first surface and a second opposite surface, multiple first combs are arranged perpendicularly to the first surface of the first substrate in the same direction at a first interval, and a graphene layer on the first combs and on the first substrate. The battery also includes multiple anodes, each including a body portion and multiple second combs arranged perpendicularly to the body portion in the same direction at a second interval. The first and second combs are interspersed between each other, and an air gap is between the interspersed first and second combs. An insulting film is disposed at the distal end surface of each of the second combs. The battery also includes a hermetically sealed contained enclosing the cathodes and the anodes, and an electrolyte solution filling the air gap and the container.
    Type: Grant
    Filed: October 3, 2016
    Date of Patent: December 11, 2018
    Assignees: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION, SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
    Inventor: Ming Zhou
  • Patent number: 10147557
    Abstract: The present disclosure is directed to structural supercapacitors and electrodes for structural supercapacitors having high energy storage and high mechanical characteristics and methods of making the structural supercapacitors and electrodes. The structural supercapacitors can include a solid electrolyte and carbon fiber electrodes comprising carbon nanotubes, surface functionalized redox-active moieties, and/or a conducting polymer.
    Type: Grant
    Filed: September 13, 2016
    Date of Patent: December 4, 2018
    Assignee: The MITRE Corporation
    Inventors: Nicholas Hudak, Alexander Schlichting, Kurt Eisenbeiser
  • Patent number: 10141114
    Abstract: A multi-layer ceramic capacitor includes: a body, a first external electrode, and a second external electrode. The body includes a first end surface and a second end surface that face each other, a side surface that extends between the first end surface and the second end surface, a first recess that extends along a first ridge of the first end surface and the side surface, a second recess that extends along a second ridge of the second end surface and the side surface, a first internal electrode that is drawn to the first end surface and the first recess, and a second internal electrode that faces the first internal electrode and is drawn to the second end surface and the second recess. The first external electrode covers the body from the first end surface. The second external electrode covers the body from the second end surface.
    Type: Grant
    Filed: April 14, 2017
    Date of Patent: November 27, 2018
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Ryo Ono, Tetsuhiko Fukuoka
  • Patent number: 10141243
    Abstract: A thyristor assembly radiator for a DC converter valve. A water discharging port of an Nth radiator is communicated with a water discharging port of an (N?2)th radiator. A water feeding port of the Nth radiator is communicated with a water feeding port of an (N+2)th radiator. Or, a water feeding port of the Nth radiator is communicated with a water feeding port of the (N?2)th radiator, and a water discharging port of the Nth radiator is communicated with a water discharging port of the (N+2)th radiator. A water discharging port of an Mth radiator is communicated with a water discharging port of an (M?2)th radiator, and a water feeding port of the Mth radiator is communicated with a water feeding port of an (M+2)th radiator, or a water feeding port of an Mth radiator is communicated with a water feeding port of the (M?2)th radiator, and a water discharging port of the Mth radiator is communicated with a water discharging port of an (M+2)th radiator.
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: November 27, 2018
    Assignees: NR ELECTRIC CO., LTD, NR ENGINEERING CO., LTD, NR ELECTRIC POWER ELECTRONICS CO., LTD.
    Inventors: Xiang Zhang, Taixun Fang, Dongming Cao, Chihan Chen, Guangtai Zhang, Haibin Liu
  • Patent number: 10136511
    Abstract: A circuit assembly includes a circuit board, a heat dissipation member on which the circuit board is placed and that is configured to release heat of the circuit board, an insulating layer that is formed on a surface on the circuit board side of the heat dissipation member, a bonding portion made of a bonding agent that is arranged in a predetermined region between the circuit board and the heat dissipation member, and an adhesive portion that is arranged in a region other than the predetermined region between the circuit board and the heat dissipation member and that is made of an adhesive with which the circuit board and the heat dissipation member are bonded to each other with lower bonding force than with the bonding agent.
    Type: Grant
    Filed: October 2, 2015
    Date of Patent: November 20, 2018
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Takehito Kobayashi, Arinobu Nakamura, Tou Chin, Shigeki Yamane
  • Patent number: 10128051
    Abstract: A variable capacitance component includes a variable capacitance layer made of a dielectric material, a pair of electrodes that face each other via the variable capacitance layer, a pair of insulating portions that support the variable capacitance layer therebetween, and a pair of lead portions is respectively connected to the pair of electrodes, and the pair of lead portions is respectively disposed inside the pair of insulating portions, and the pair of lead portions is on a same axis that is perpendicular or substantially perpendicular to the variable capacitance layer.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: November 13, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Keisuke Kageyama
  • Patent number: 10128046
    Abstract: The invention provides a process for making ceramic film capacitors, the process comprising supplying a flexible substrate, depositing a first electrode on a first region of the flexible substrate, wherein the first electrode defines a first thickness, overlaying the first electrode with a dielectric film; and depositing a second electrode on the ceramic film, wherein the second electrode defines a second thickness. Also provided is a capacitor comprising flexible substrate, a first electrode deposited on said flexible substrate, a dielectric overlaying the first electrode; and a second electrode deposited on said dielectric.
    Type: Grant
    Filed: June 5, 2015
    Date of Patent: November 13, 2018
    Assignee: UCHICAGO ARGONNE, LLC
    Inventors: Beihai Ma, Uthamalingam Balachandran, Stephen E. Dorris, Tae H. Lee
  • Patent number: 10130008
    Abstract: An immersion cooled electronic arrangement includes a sealed housing, a coolant contained within the housing, and an electronic device submerged within the coolant. An agitator is disposed within the housing to control passive heat transfer between the electronic device and the coolant. An immersion cooling system and related method are also described.
    Type: Grant
    Filed: April 4, 2016
    Date of Patent: November 13, 2018
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Charles Shepard, Kris H. Campbell