Abstract: Epoxy resin composition for molding comprising epoxy resin (A), acid anhydride (B), curing accelerator (C), coupling agent (D) and filler (E), process for preparing molded product used for apparatus for high voltage made of the epoxy resin composition for molding and molded product produced by the process for preparing the molded product. The epoxy resin composition has excellent mechanical properties such as high mechanical strength and high toughness and excellent thermal resistance, the process for preparing the molded product can provide molded product made of the epoxy resin composition, and the produced molded product has excellent crack resistance and high reliability.

Abstract: A method for encapsulating segments of signal transmission devices such as splices, pressure blocks and end blocks with a room-temperature curable composition comprising:(1) a hydroxy-functional compound having a molecular weight of greater than 500 and a hydroxy functionality of 2 or more;(2) an epoxy-functional compound having an epoxy functionality of 2 or more; and(3) a curative catalyst, in an amount effective to crosslink the epoxy and hydroxy components of the respective epoxy-functional and hydroxy-functional compounds.

Abstract: A thermal latent acid catalyst which comprises (i) a compound having an epoxy group, (ii) a compound having a sulfur atom of the following formula: R.sup.5 --S--R.sup.6, wherein R.sup.5 and R.sup.6 are the same or different from each other and are a hydrogen atom or an organic group of 1 to 40 carbon atoms, R.sup.5 and R.sup.6 optionally are bonded with each other to form a cyclic structure; and (iii) a Lewis acid of the following formula: (X.sup.1).sub.n1 --M.sup.1 --(R.sup.7).sub.n2, wherein M.sup.1 is a boron atom, an aluminium atom, a tin atom, a lead atom or a transition element, X.sup.1 is one or more halogen atoms, R.sup.7 is one or more organic groups of 1 to 40 carbon atoms, R.sup.7 optionally forms a chelate ring by coordinating to the M.sup.1 atom, n1 and n2 are each an integer of 0 through 6, and n1 plus n2 equals an integer of 1 to 6. The ratio of the epoxy group of the epoxy compound (i) to the M.sup.1 atom of the Lewis acid is 0.

Abstract: A 4-methyl-1-pentene polymer composition having excellent heat resistance, releasability, gas permeability, impact resistance and other mechanical properties as well as heat sealability, prepared by melt mixing 40 to 97.5 parts by weight of a 4-methyl-1-pentene polymer (A), 2.5 to 60 parts by weight of a 1-butene polymer (B), and 1 to 100 parts by weight, based on 100 parts by weight of the total of (A) and (B), of a propylene polymer (C).

Abstract: A method for making multilayer resist structures for microlithographic processing using a thermosetting anti-reflective coating is disclosed for a broad range of exposure wavelengths, said coating containing an active curing catalyst, ether or ester linkages derived from epoxy functionality greater than 3.0, a dye-grafted hydroxyl-functional oligomer, and an alkylated aminoplast crosslinking agent, all present in a low-to-medium alcohol-containing solvent.

Abstract: Linear low density copolymer of ethylene/1-hexene is made processible into heat shrinkable film by a continuous process starting with the extrusion of the copolymer as a film. The production rate of heat shrinkable film made from linear low density copolymer of ethylene/1-octene-can be increased by the step of blending a minor proportion of highly branched low density polyethylene with either copolymer prior to extrusion.

Abstract: Disclosed is a syndiotactic, polystyrenic resin composition comprising (A) 100 parts by weight of a component composed of (a) from 10 to 98% by weight of a styrene-based polymer having a syndiotactic configuration and (b) from 2 to 90% by weight of a polyolefin, (B) from 0.5 to 50 parts by weight of a block or graft styrene-olefin copolymer having a styrene content of from 40 to 85% by weight; the composition can be formed into articles having good heat resistance, a high modulus of elasticity and good toughness. In addition, the articles are advantageous in that their surface layers are hardly peeled.

Abstract: Conventional hot-melt adhesive compositions for the coating of textile sheet structures exhibit problems in respect of resistance to washing and cleaning. The presence of an epoxide in hot-melt adhesive composition enables the production of cleaning-resistant laminated materials having a particularly high level of wash resistance.

Abstract: The invention provides a fluorine-containing resin blend. This resin blend includes 100 parts by weight of a first resin and 1-50 parts by weight of a second resin. The first resin is one of an elastic fluorohydrocarbon resin and a vinylidene fluoride based resin. The second resin is a graft copolymer prepared by graft copolymerization of a rubber-like polymer with a first monomer and an optional second monomer. The first monomer is at least one of an acrylic ester and a methacrylic acid ester. The optional second monomer is at least one copolymerizable monomer other than the first monomer. When the elastic fluorohydrocarbon resin is used as the first resin, the resin blend is improved in extensibility upon molding in a melted condition and lowered in modulus of elasticity under a condition that the resin blend is strained by up to 20%, without impairing the elastic fluorohydrocarbon in its heat resistance, low-temperature characteristics and the like.

Abstract: A resin mixture including a composition containing polypropylene that includes a portion insoluble in xylene, an isotactic pentad fraction of not less than 96.5% and an isotactic average chain length of not less than 90, 45.about.70 parts by weight; a polyolefin resin, 5.about.20 parts by weight; an inorganic filler selected from precipitated calcium carbonate, hydrated silicic acid, and hydrated calcium silicate, 5.about.30 parts by weight; and an inorganic filler selected from talc, mica, and potassium titanate, 5.about.30 parts by weight; is superior in scratch resistance, moldability, and balance of rigidity and impact resistance. In addition, a laminate having a layer of this mixture has superior gloss. This mixture and the laminate are useful in automobile parts, electric and electronic parts, packaging materials, etc.

Abstract: Polyalkenylsuccinic acid derivatives are prepared by reacting oligo- or polyolefins having a number average molecular weight (M.sub.N) of from 500 to 10,000 with maleic acid derivatives I ##STR1## where R and R', independently of one another, are each hydroxyl, lower alkyl or halogen or together are oxygen, at elevated temperatures by a process in which effective amounts of free radical acceptors, such as oxygen, are present in the gas phase and in the liquid phase of the reacting system during the reaction. These polyalkenylsuccinic acid derivatives are suitable, after additional imidation, amidation or esterification, as fuel and lubricant additives.

Abstract: "Molded products for high voltage apparatus comprising an" epoxy resin composition for molding comprising an epoxy resin (A), an acid anhydride (B), a curing accelerator (C), at least one coupling agent (D) and a filler (E). The epoxy resin (A) is a bifunctional brominated bisphenol A or a brominated bisphenol F, "epoxy resin and at least one bisphenol A, bisphenol F or bisphenol epoxy resin". The coupling agent (D) is selected from the group consisting of epoxysilane type coupling agents, phenylaminosilane type coupling agents, mercaptosilane type coupling agents and titanate type coupling agents, which has an average particle diameter of not more than 60 .mu.m and in which the content of particles having a diameter of not more than 5 .mu.m is not less than 5% by weight. The filler (E) comprises at least one of silica fillers or alumina fillers. The ratio of the number of acid anhydride groups of the acid anhydride (B) to the number of epoxy groups of the epoxy resin (A) is 0.5 to 1.

Abstract: The subject invention generally provides a multilayer structure that includes a polymer mixture made from at least two polymer component materials. The invention particularly pertains to a multilayer structure containing an improved sealant layer and a polypropylene layer, wherein the sealant layer is made from a homogeneously branched ethylene polymer having particular molecular weight characteristics and a second ethylene polymer. The sealant layer has balanced properties such low heat seal and hot tack initiation temperature, a high hot tack strength and a broad hot tack seal window. The multilayer structure is particularly useful as a biaxially oriented polypropylene (BOPP) packaging film structure.

Abstract: Epoxy resin casting compositions comprising(a) a liquid aromatic glycidyl or .beta.-methylglycidyl ether or a liquid mixture of several aromatic glycidyl or .beta.-methylglycidyl ethers containing on average more than one glycidyl ether group per molecule,(b) one or more than one acid hardener for the glycidyl ether,(c) a curing accelerator,(d) a filler mixture containing calcite and wollastonite in an amount from 40 to 60% by weight, based on components (a), (b) and (d), and as optional components,(e) customary additives for epoxy resin casting compositions are suitable in particular for coating or encapsulating electrical or electronic components and, more particularly, electrical ignition coils.

Abstract: Hollow molded articles prepared from a molding composition comprising:(A) from 95 to 60 percent by weight, based on the weight of (A) and (B), of an ethylene polymer having a density of 0.955 g/cm.sup.3 or higher, a melt index from 0.3 to 10 g/10 min, a melt index ratio I.sub.21 /I.sub.2 of from 40 to 80, and a polydispersity of from 1.8 to 10, the ethylene polymer being selected from the group consisting of i) high density ethylene homopolymers and ii) high density ethylene copolymers prepared by slurry or gas phase polymerization in the presence of a Ziegler or Phillips catalyst or prepared by polymerization in the presence of a transition metal compound catalyst containing a cyclopentadienyl or cyclopentadienyl derivative moiety; and(B) from 5 to 40 percent by weight, based on the weight of (A) and (B), of a homogeneous linear or substantially linear ethylene interpolymer having a density from 0.85 to 0.93 g/cm.sup.3, a melt index from 0.5 to 5 g/10 min, and a polydispersity of from 1.8 to 2.

Abstract: This invention relates to adhesive formulations, which can be snap-cured without loss of adhesive strength (as measured by die shear strength) and flexibility (as measured by radius of curvature), comprising 20-80 parts by weight of a flexible epoxy resin comprising an oligomeric backbone of alkylene or alkyleneoxy repeat units, terminated with an aromatic moiety bearing one or more epoxy functionalities, and 80-20 parts by weight of an aromatic O-glycidyl ether (to a total 100 parts), a curing catalyst, and optionally one or more fillers, and a phenolic hardener.

Abstract: This invention relates to adhesive formulations, which can be snap-cured without loss of adhesive strength (as measured by die shear strength) and flexibility (as measured by radius of curvature), comprising 20-80 parts by weight of a flexible epoxy resin and 80-20 parts by weight of an aromatic O-glycidyl ether (to a total 100 parts), a curing catalyst, and optionally one or more fillers.

Abstract: A non-woven web having antimicrobial properties made from a melt-extrudable thermoplastic composition. The thermoplastic composition includes a thermoplastic polyolefin and an additive. The additive is an antimicrobial siloxane quaternary ammonium salt which can be either of two general classes: (1) a trisiloxane having a pendent quaternary ammonium group and a molecular weight of from about 600 to about 1,700; and (2) an ABA-type siloxane having a polydispersity of up to about 3.0 and a weight-average molecular weight of from about 800 to about 2,000, in which a central siloxane moiety is terminated at each end by a quaternary ammonium salt group. The anion in general can be any anion which does not adversely affect the thermal stability of the salt.

Abstract: The organopolysiloxane particles consist of a single molecule, are crosslinked and have an average diameter of 5 to 200 nm. At least 80% of the particles have a diameter which deviates from the average diameter by not more than 30%. The particles are soluble in a solvent to the extent of at least 5% by weight.

Abstract: Fibers having antimicrobial properties made from a melt-extrudable thermoplastic composition. The thermoplastic composition includes a thermoplastic polyolefin and an additive. The additive is an antimicrobial siloxane quaternary ammonium salt which can be either of two general classes: (1) a trisiloxane having a pendent quaternary ammonium group and a molecular weight of from about 600 to about 1,700; and (2) an ABA-type siloxane having a polydispersity of up to about 3.0 and a weight-average molecular weight of from about 800 to about 2,000, in which a central siloxane moiety is terminated at each end by a quaternary ammonium salt group. The anion in general can be any anion which does not adversely affect the thermal stability of the salt.