Patents Examined by Doris Lee
  • Patent number: 8835543
    Abstract: A composite material includes a non-polar polymer and alumina hydrate particulate. The composite material has a Heat Distortion Performance of at least about 10% relative to the non-polar polymer absent the alumina hydrate particulate. The composite material may include a coupling agent including a phosphinic acid group, a phosphonic acid group or an ester derivative thereof.
    Type: Grant
    Filed: January 23, 2013
    Date of Patent: September 16, 2014
    Assignee: Saint-Gobain Ceramics & Plastics, Inc.
    Inventors: David J. Bravet, Olivier Guiselin, Gwo S. Swei, Yves Boussant-Roux
  • Patent number: 8822584
    Abstract: Compositions comprising linear polyhydroxyalkanoates and biodegradable aromatic/aliphatic polyesters are disclosed, as well as methods for using same, and articles made therefrom.
    Type: Grant
    Filed: May 6, 2009
    Date of Patent: September 2, 2014
    Assignee: Metabolix, Inc.
    Inventor: Robert S. Whitehouse
  • Patent number: 8822605
    Abstract: Graft copolymer (P) which exhibit pH dependent swelling/dissolution properties comprising a hydrophobic back-bone and graft chains comprising acidic monomer. This Graft copolymer (P) do not swell or dissolve at acidic pH prevalent in the stomach and they swell/dissolve at near neutral pH prevalent in the intestinal region. The graft copolymer (P) is useful for the development of drug delivery formulations particularly for oral drug delivery formulations.
    Type: Grant
    Filed: March 5, 2010
    Date of Patent: September 2, 2014
    Assignee: Council of Scientific & Industrial Research
    Inventors: Ramesh Muthusamy, Mohan Gopalkrishna Kulkarni
  • Patent number: 8815993
    Abstract: A polyester resin composition comprises (A) about 100 parts by weight of polyester resin with a melting point greater than about 200° C. and including repeat units of Formula 1; (B) about 0.1 to about 80 parts by weight of white pigment; and (C) about 0.01 to about 80 parts by weight of filler. The polyester resin composition of the present invention does not exhibit deteriorated reflectance and impact strength and also has good heat resistance, non-yellowing property and humidity resistance and can be used in a light emitting diode (LED) reflector.
    Type: Grant
    Filed: December 21, 2011
    Date of Patent: August 26, 2014
    Assignee: Cheil Industries Inc.
    Inventors: Pil Ho Kim, Sun Ho Song, In Sik Shim, Sang Hwa Lee, Jong Cheol Lim
  • Patent number: 8815978
    Abstract: A process for modifying natural rubber and modified natural rubber with improved processing performance. The process for modifying natural rubber includes at least the following process steps: comminuting the natural rubber in a first process step; blending and purifying the natural rubber in a second process step; further comminuting the natural rubber in a third process step; and, drying the natural rubber in a fourth process step. The modified natural rubber is modified by at least four process steps.
    Type: Grant
    Filed: February 16, 2011
    Date of Patent: August 26, 2014
    Assignee: Continental Reifen Deutschland GmbH
    Inventors: Sandra Stollberg, Hajo Weinreich
  • Patent number: 8807699
    Abstract: An ink composition including: initiator particles including a water-insoluble polymerization initiator and a water-soluble polymer and having a volume average particle diameter of 500 nm or less; a water-soluble polymerizable compound; a pigment; and water.
    Type: Grant
    Filed: March 10, 2011
    Date of Patent: August 19, 2014
    Assignee: FUJIFILM Corporation
    Inventors: Yasufumi Ooishi, Yuji Kume
  • Patent number: 8809444
    Abstract: The present invention is directed to a network composition the reaction product of: (i) at least one anionic polymerizable ethylenically unsaturated monomer (I) selected from the group consisting of [CH2?C(R3)C(O)OXa(C2H4O)b(C3H6O)c(C4H8O)d]pP(O)(OY)q(OZ)r where R3?H or alkyl of 1 to about 6 carbon atoms; X=alkyl, aryl, or alkaryl diradical connecting group of 0 to about 9 carbon atoms; a is 0 to about 100; b is 0 to about 100; c is 0 to about 100; d is 0 to about 100; q is 0 to about 2; r is 0 to about 2; p is 1 to about 3 subject to the limitation that p+q+r=3; and Y and Z is H, or metal ion; and CH2?C(R3)C(O)OXa?(C2H4O)b?(C3H6O)c?(C4H8O)d?—SO3—Y) where R3?H or alkyl of from 1 to about 6 carbon atoms; X=alkyl, aryl, or alkaryl diradical connecting group of 0 to about 9 carbon atoms; a? is 0 to about 100; b? is 0 to about 100; c? is 0 to about 100; d? is 0 to about 100; Y is H, or metal ion; and (ii) one or more additional monomers (II) selected from the group consisting of acrylic acid/acrylate
    Type: Grant
    Filed: December 23, 2009
    Date of Patent: August 19, 2014
    Assignee: Momentive Performance Materials Inc.
    Inventors: Ning Lu, Sigfredo Gonzalez, Ernie M. Silvestre, Geng Wang
  • Patent number: 8802761
    Abstract: A ?-conjugated polymer composition including: (a) a solvent; (b) a ?-conjugated polymer which is dissolved in the solvent and doped with a dopant; (c) at least one of an acidic substance and a salt of an acidic substance; and (d) a phenolic compound; wherein when only the acidic substance is contained as the component (c), the acidic substance is different from the phenolic compound, when only the salt of an acidic substance is contained, the salt of an acidic substance is different from the phenolic compound, and when both the acidic substance and the salt of an acidic substance are contained, at least one of the acidic substance and the salt of an acidic substance is different from the phenolic compound.
    Type: Grant
    Filed: June 14, 2010
    Date of Patent: August 12, 2014
    Assignee: Idemitsu Kosan Co., Ltd.
    Inventors: Shingo Onodera, Norihiro Kuroda
  • Patent number: 8802760
    Abstract: Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: August 12, 2014
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Yong Sung Eom, Jong Tae Moon, Sangwon Oh, Keonsoo Jang
  • Patent number: 8796374
    Abstract: A conditioner, surface treatment method, and metal plating film forming method for a moist method of providing a plating film with strong adhesion towards a surface with low roughness without forming a metal film or performing an adhesion promoter pretreatment using a wet method, when plating a resin substrate containing a blend of resin material and glass material, and the like.
    Type: Grant
    Filed: November 2, 2009
    Date of Patent: August 5, 2014
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventor: Katsuhiro Yoshida
  • Patent number: 8796375
    Abstract: A prepreg that yields a semiconductor device which, even when using Cu wire, exhibits excellent reliability under conditions of high temperature and high humidity (heat-resistant and moisture-resistant reliability), a metal-clad laminate and a printed wiring board that use the prepreg, and a semiconductor device that uses the printed wiring board. Specifically disclosed are a prepreg comprising a substrate and a B-staged resin composition comprising (a) a thermosetting resin, (b) a hydrotalcite compound having a specific composition, (c) zinc molybdate, and (d) lanthanum oxide.
    Type: Grant
    Filed: October 5, 2012
    Date of Patent: August 5, 2014
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventor: Shoichi Osada
  • Patent number: 8796367
    Abstract: A thermoplastic polyester resin composition comprising 100 parts by weight of a thermoplastic polyester resin (A), 5 to 40 parts by weight of a phosphinate (B), and an organosiloxane (X); wherein the phosphinate is a calcium salt or aluminum salt of phosphine acid having the anion part having a particular structure; which, as the organosiloxane (X), comprises 1.5 to 10 parts by weight of an organosiloxane compound (X-1) or 0.01 to 5 parts by weight of an organosiloxane polymer (X-2), relative to 100 parts by weight of the thermoplastic polyester resin (A); and wherein the organosiloxane compound (X-1) comprises organic groups bonding to a silicon atom directly or through an oxygen atom, and 40 mole % or more of the organic groups are an aryl group, and the organosiloxane polymer (X-2) is in the form of solid at 25° C.
    Type: Grant
    Filed: July 22, 2009
    Date of Patent: August 5, 2014
    Assignee: Mitsubishi Engineering-Plastics Corporation
    Inventors: Morio Tsunoda, Osamu Takise, Yasushi Yamanaka
  • Patent number: 8796358
    Abstract: An ink for high-speed printing is formulated by controlling the phase angle of the ink to less than 60° at a frequency of 10 Hz when the ratio of the total non-volatiles volume fraction of the ink to the maximum total non-volatiles volume fraction of the ink is a ratio between about 0.40 to about 0.90. An ink for high-speed printing includes one or more resins, one or more colorants, one or more solvents, and one or more additives. The ink can be a flexographic ink, a rotogravure ink, a heatset offset ink, or a publication gravure ink. A print of the ink includes less than 1% of pinholes by area. The ink is applied to a substrate, which moves at a speed of greater than 1200 feet/min.
    Type: Grant
    Filed: March 1, 2011
    Date of Patent: August 5, 2014
    Assignee: Sun Chemical Corporation
    Inventors: Richard R. Durand, Jr., Saeid Savarmand, Stephen Postle
  • Patent number: 8791173
    Abstract: An insulating ink composition for forming an insulating film, which sufficiently achieves a low calcination temperature, solvent resistance and an insulating property, is provided. Furthermore, an ink composition for forming an insulating film which can form, by the printing method, fine insulating film patterns necessary for formation of highly integrated organic transistors is provided. The present invention provides an ink composition which forms an insulating film, and includes an organic solvent, a polyvinylphenol-based resin, an epoxy resin and a cross-linking aid. Particularly, the ink composition is a composition wherein the organic solvent includes an organic solvent which has a vapor pressure of 11.3×102 Pa or higher at 20° C. and a boiling point of lower than 115° C. under atmospheric pressure and an organic solvent which has a vapor pressure of less than 11.3×102 Pa at 20° C. and a boiling point of 115° C.
    Type: Grant
    Filed: June 3, 2009
    Date of Patent: July 29, 2014
    Assignee: DIC Corporation
    Inventors: Masayoshi Kotake, Hideki Etori, Toshihiro Ebine, Hiroshi Isozumi, Masanori Kasai
  • Patent number: 8791187
    Abstract: A polyester composition containing: a) aluminum atoms; and b) alkaline earth atoms or alkali metal atoms or alkali compound residues such as lithium atoms; and c) particles comprising titanium, zirconium, vanadium, niobium, hafnium, tantalum, chromium, tungsten, molybdenum, iron, or nickel atoms or combinations thereof, where the particles improve the reheat rate of the polyester composition. The polyester polymer compositions may also contain phosphorus catalyst deactivators/stabilizers. The polyester compositions and the articles made from the compositions such as bottle preforms and stretch blow molded bottles have improved reheat rate while maintaining low haze, high L*, a b* below 3, and have low levels of acetaldehyde. In the process for making the polyester polymer, the polymer melt is polycondensed in the presence of a) and b), with the particles c) added in a melt phase process or added to the polymer in an injection molding machine or extruder.
    Type: Grant
    Filed: May 31, 2011
    Date of Patent: July 29, 2014
    Assignee: Grupo Petrotemex, S.A. de C.V.
    Inventors: Donna Rice Quillen, Rodney Scott Armentrout, Mary Therese Jernigan, Steven Lee Stafford, Zhiyong Xia
  • Patent number: 8791195
    Abstract: Disclosed is a toughened film forming agent for use in a fiber sizing, a finish coating or a binder composition, where the toughened film forming agent includes a film forming polymer and a toughening agent both dispersed in water. The toughening agent may be core shell polymers, rubber, thermoplastic materials, nanomaterials, nanofibers, including any combination or subset thereof. The film forming polymer may be epoxy resins, polyurethane resins, epoxy-polyurethane resins, polyester resins, epoxy-polyester resins, polyvinylacetate resins, polypropylene resins, including any combination or subset thereof.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: July 29, 2014
    Assignee: Momentive Specialty Chemicals Inc.
    Inventors: Walter Henry Christiansen, III, Carlton E. Ash, Paul W. Langemeier
  • Patent number: 8779083
    Abstract: Disclosed are polylactide resin that may exhibit and maintain excellent mechanical properties, exhibit excellent heat resistance, and thus can be used for a semi-permanent use, a method for preparing the same, and a polylactide resin composition comprising the same. The polylactide resin has a low hydrolysis rate constant of 0.1 day?1 or less and a weight average molecular weight of 100,000˜1,000,000, under specific conditions.
    Type: Grant
    Filed: September 2, 2010
    Date of Patent: July 15, 2014
    Assignee: LG Chem, Ltd.
    Inventors: Sung-Cheol Yoon, Seung-Young Park, Do-Yong Shim, In-Su Lee
  • Patent number: 8779037
    Abstract: A polycarbonate resin composition is provided. The composition comprises (A) 50 to 90% by weight of a polycarbonate resin, (B) 5 to 30% by weight of a polymethyl methacrylate resin, (C) 5 to 20% by weight of a phosphate compound, (D) 0.01 to 2% by weight of a metal sulfonate as an organic salt, and (E) 0.05 to 2% by weight of a fluorinated olefin. The composition is highly flame retardant and scratch resistant.
    Type: Grant
    Filed: December 28, 2008
    Date of Patent: July 15, 2014
    Assignee: LG Chem, Ltd.
    Inventors: Seon Mo Son, Kyung Mo Park, Sung Tae Ahn, Yong Kim
  • Patent number: 8772391
    Abstract: Embodiments of the present disclosure present electrically conductive, thermosetting compositions for use in surfacing films and adhesives. The surfacing films possess enhanced electrical conductivity, comparable to metals, without the use of embedded metal screens or foils. Such surfacing films may be incorporated into composite structures (e.g., prepregs, tapes, and fabrics), for example, by co-curing, as an outermost surface layer. In particular, compositions formed using silver flakes as conductive fillers are found to exhibit very high electrical conductivity. For example, compositions including greater than 45 wt. % silver flake exhibit resistivities less than about 55 m?/sq. In this manner, the surfacing films as an outermost conductive layer may provide lighting strike protection (LSP) and electromagnetic interference (EMI) shielding when used in applications such as aircraft components.
    Type: Grant
    Filed: December 14, 2012
    Date of Patent: July 8, 2014
    Assignee: Cytec Technology Corp.
    Inventors: Junjie Jeffrey Sang, Dalip Kumar Kohli
  • Patent number: 8772413
    Abstract: Disclosed is a method for producing a water absorbent resin, by which a surface-crosslinked water absorbent resin having excellent physical properties can be efficiently obtained at low cost, while assuring high productivity. When the production scale is increased to a continuous production at 1 t/hr or more, the physical properties are improved and stabilized (for example, standard deviation of the physical properties is reduced) by a surface-crosslinking treatment, and the absorption against pressure (AAP) and liquid permeability (SFC) are further improved.
    Type: Grant
    Filed: August 27, 2010
    Date of Patent: July 8, 2014
    Assignee: Nippon Shokubai Co., Ltd.
    Inventors: Takahiro Kitano, Kozo Nogi, Kunihiko Ishizaki