Abstract: Performing refresh operation in a memory device is provided. A refresh operation without address rotation is performed in a cell array of the memory device. Performing the refresh operation without address rotation is repeated for a predetermined number of times. After repeating performing the refresh operation with address rotation for the predetermined number of times, a refresh operation with address rotation is performed in the cell array.

Abstract: Provided herein may be a memory system and a method of operating the same. The memory system may include a memory device including a plurality of memory blocks, the memory device being configured to output voltage information indicating whether an unstable state of an input voltage has occurred, the input voltage being provided to the memory device from an external power source, and a memory controller configured to store a read count indicating a number of times that one or more read operations are performed on each of the plurality of memory blocks and to control the memory device to move data stored in a first memory block for which the read count exceeds a threshold count to a second memory block, and configured to adjust the threshold count based on the voltage information.

Abstract: Methods, systems, and apparatuses for self-referencing sensing schemes are described. A cell having two transistors, or other switching components, and one capacitor, such as a ferroelectric capacitor, may be sensed using a reference value that is specific to the cell. The cell may be read and sampled via one access line, and the cell may be used to generate a reference voltage and sampled via another access line. For instance, a first access line of a cell may be connected to one read voltage while a second access line of the cell is isolated from a voltage source; then the second access line may be connected to another read voltage while the first access line is isolate from a voltage source. The resulting voltages on the respective access lines may be compared to each other and a logic value of the cell determined from the comparison.

Abstract: A memory controller may control a memory device including a plurality of memory blocks each including a plurality of pages. The memory controller may include a scan voltage controller configured to control the memory device to apply a plurality of scan voltages to any one page of the plurality of pages, a counter configured to obtain, based on sensed data obtained by reading the any one page using the plurality of scan voltages, the number of memory cells having a threshold voltage included in at least one voltage range defined by the plurality of scan voltages from among a plurality of memory cells included in the any one page, and a data manager configured to control the memory device to store data stored in a memory block including the any one page in another memory block, based on the number of memory cells.

Abstract: Technology is disclosed herein for semi receiver side write training in a non-volatile memory system. The transmitting device has delay taps that control the delay between a data strobe signal and data signals sent on the communication bus. The delay taps on the transmitting device are more precise that can typically be fabricated on the receiving device (e.g., NAND memory die). However, the receiving device performs the comparisons between test data and expected data, which alleviates the need to read back the test data. After the different delays have been tested, the receiving device informs the transmitting device of the shortest and longest delays for which data was validly received. The transmitting device then sets the delay taps based on this information. Moreover, the write training can be performed in parallel on many receiving devices, which is very efficient.

Abstract: A method of manufacturing a low program voltage flash memory cell with an embedded heater in the control gate creates, on a common device substrate, a conventional flash memory cell in a conventional flash memory area (CFMA), and a neuromorphic computing memory cell in a neuromorphic computing memory area (NCMA). The method comprises providing a flash memory stack in both the CFMA and the NCMA, depositing a heater on top of the flash memory stack in the NCMA without depositing a heater on top of the flash memory stack in the CFMA.

Abstract: A device includes a memory array and a sense amplifier (SA), which receives bits of data over an input/output (I/O) data line in association with a program operation. A digital-to-analog converter (DAC) is to convert the bits of data to an analog voltage value. A first analog memory element is coupled with the DAC. A pre-charge transistor is coupled with a voltage supply and the first analog memory element, the pre-charge transistor to charge the first analog memory element to an initial voltage level. A second analog memory element is coupled in parallel with the first analog memory element. Transistor logic is coupled between the first analog memory element and the second analog memory element and to selectively enable the second analog memory element to consume charge from the first analog memory element until the first analog memory element stores the analog voltage value.

Abstract: A non-volatile memory device includes a memory cell region including a first metal pad and a memory cell array including a plurality of memory cells, and a peripheral circuit region including a second metal pad and an output driver to output a data signal, and vertically connected to the memory cell region by the first metal pad and the second metal pad. The output driver includes a pull-up driver and a pull-down driver. The pull-up driver includes a first pull-up driver having a plurality of P-type transistors and a second pull-up driver having a plurality of N-type transistors. The pull-down driver includes a plurality of N-type transistors. One or more power supply voltages having different voltage levels are selectively applied to the pull-up driver. A first power supply voltage is applied to the first pull-up driver, and a second power supply voltage is applied to the second pull-up driver.

Abstract: Many error correction schemes fail to correct for double-bit errors and a module must be replaced when these double-bit errors occur repeatedly at the same address. This helps prevent data corruption. In an embodiment, the addresses for one of the memory devices exhibiting a single-bit error (but not the other also exhibiting a single bit error) is transformed before the internal memory arrays are accessed. This has the effect of moving one of the error prone memory cells to a different external (to the module) address such that there is only one error prone bit that is accessed by the previously double-bit error prone address. Thus, a double-bit error at the original address is remapped into two correctable single-bit errors that are at different addresses.

Abstract: An apparatus for performing in-memory processing includes a memory cell array of memory cells configured to output a current sum of a column current flowing in respective column lines of the memory cell array based on an input signal applied to row lines of the memory cells, a sampling circuit, comprising a capacitor connected to each of the column lines, configured to be charged by a sampling voltage of a corresponding current sum of the column lines, and a processing circuit configured to compare a reference voltage and a currently charged voltage in the capacitor in response to a trigger pulse generated at a timing corresponding to a quantization level, among quantization levels, time-sectioned based on a charge time of the capacitor, and determine the quantization level corresponding to the sampling voltage by performing time-digital conversion when the currently charged voltage reaches the reference voltage.

Abstract: A memory device includes a memory cell array including a plurality of memory cells on which a programming loop is executed a plurality of times; a voltage generator configured to apply a verifying voltage to the memory cells, for verifying at least one programming state of the memory cells; and a voltage controller configured to control the voltage generator to change a level of the verifying voltage as a program loop count increases, based on temperature information about a temperature inside or outside the memory device.

Abstract: A method includes: providing a modulation circuit, determined an operation mode of a memory array, providing a first voltage corresponding to a positive temperature coefficient in response to a read operation of the memory array, and providing a second voltage corresponding to a negative temperature coefficient in response to a write operation of the memory array. The modulation circuit is configured to generate a temperature-dependent voltage and provide the same to the memory array.

Abstract: An array of programmable non-volatile devices are is adapted such that their logic state is controllably altered over time by quiescent changes, slow controlled changes, scheduled changes, or some combination thereof imposed at a physical level. This allows for improved security and privacy for data to be permanently deleted. In some applications a data refresh and/or automatic backup can be implemented as well.

Abstract: A non-volatile memory device includes a memory cell array including a plurality of cell strings, each of the plurality of cell strings includes a gate-induced drain leakage (GIDL) transistor and a memory cell group, and a control logic to apply a voltage to each of the plurality of cell strings. The control logic performs a first erase operation of erasing the memory cell groups of each of the plurality of cell strings, a first verification operation of detecting erase results of the memory cell groups of each of the plurality of cell strings, and a program operation of programming the GIDL transistors of some of the plurality of cell strings.

Abstract: An electronic device applicable to an artificial neuron network. The electronic device includes a first circuit, a second circuit, and first to sixth wirings. The first circuit includes a first transistor, a second transistor, and a capacitor. The second circuit includes a third transistor. A gate of the third transistor is electrically connected to the third wiring. The capacitor capacitively couples the third wiring and the gate of the second transistor. The first circuit is capable of storing a weight as an analog value. The first transistor is typically an oxide semiconductor transistor.

Abstract: The present disclosure includes apparatuses, methods, and systems for programming codewords for error correction operations to memory. An embodiment includes a memory having a plurality of groups of memory cells, wherein each respective one of the plurality of groups includes a plurality of sub-groups of memory cells, and circuitry configured to program a portion of a codeword for an error correction operation to one of the plurality of groups of memory cells by determining an address in that group of memory cells by performing an XOR operation on an address of one of the plurality of sub-groups of that group of memory cells, and programming the portion of the codeword to the determined address.

Abstract: A target value of programmed bits of a first programming distribution of a set of programming distributions associated with a memory device is established. A first read voltage level is applied to a wordline portion of the memory device. A count of programmed bits in the set of programming distributions corresponding to the first read voltage level is determined. A measured ratio of the programmed bits of the first programming distribution to the count of programmed bits in the set of programming distributions is determined. The target value is compared to the measured ratio to determine a comparison result. An action is executed in view of the comparison result.

Abstract: Numerous embodiments of a precision programming algorithm and apparatus are disclosed for precisely and quickly depositing the correct amount of charge on the floating gate of a non-volatile memory cell within a vector-by-matrix multiplication (VMM) array in an artificial neural network. Selected cells thereby can be programmed with extreme precision to hold one of N different values.

Abstract: Methods and apparatuses for erasing data on a plurality of ferroelectric memory cells in a memory cell array in a memory apparatus are disclosed. An example apparatus includes: a memory cell array including a first plurality of word lines; a digit line; and a plurality of ferroelectric memory cells; a control circuit that provides a section select signal and a word line select signal to select a second plurality of word lines among the first plurality of word lines responsive to an address; and an address decoder that activates the second plurality of word lines. Each ferroelectric memory cell includes: a ferroelectric capacitor having a first terminal coupled to a cell plate node and a second terminal coupled to a selection circuit that couples the digit line to the second terminal responsive to a signal on a corresponding word line of the second plurality of word lines.

Abstract: Methods of operating a memory, and memory configured to perform similar methods, may include determining a memory cell age of a plurality of memory cells, determining a desired programming step voltage for programming memory cells having the determined memory cell age, and performing a programming operation on the plurality of memory cells using the desired programming step voltage corresponding to the determined memory cell age. Methods may further include configuring a memory, including characterizing a read window budget for a programming operation of the memory as a function of a programming step voltage for a plurality of memory cell ages.