Patents Examined by Elizabeth Collister
  • Patent number: 11142485
    Abstract: A circumferential coating material to be applied to a circumferential surface of a honeycomb structure made of ceramics formed by extrusion, the circumferential coating material including a ceramic raw material that forms a circumferential coating layer, wherein the ceramic raw material contains: a ceramic mixture of first ceramic particles having particulate shapes, and second ceramic particles having particulate shapes and an average particle diameter different from an average particle diameter of the first ceramic particles; and a fiber material having an elongated strip-like shape, wherein the ceramic mixture has particle size distribution including at least two local maximum values, and the fiber material has an average fiber length ranging from 30 to 100 ?m in a longitudinal direction.
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: October 12, 2021
    Assignee: NGK Insulators, Ltd.
    Inventors: Shingo Tokuda, Shuji Ueda
  • Patent number: 11135576
    Abstract: A honeycomb structure includes plugged honeycomb segments, circumferential bonding layers, central bonding layers and a circumferential wall. An angle ? between a first direction of extension of at least one of the circumferential bonding layers and a second direction of extension of a line segment that connects a centroid of the honeycomb structure and an intersection point at which the circumferential bonding layer in the first direction intersects with the circumferential wall is 25 to 45°, and the outermost segment bonded by the circumferential bonding layer in the first direction exists on a parallel line to a direction of extension of the central bonding layer passing through the centroid.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: October 5, 2021
    Assignee: NGK Insulators, Ltd.
    Inventor: Kazuya Yuki
  • Patent number: 11101234
    Abstract: A material for Cu pillars is formed as cylindrical preforms in advance and connecting these cylindrical preforms to electrodes on a semiconductor chip to form Cu pillars. Due to this, it becomes possible to make the height/diameter ratio of the Cu pillars 2.0 or more. Since electroplating is not used, the time required for production of the Cu pillars is short and the productivity can be improved. Further, the height of the Cu pillars can be raised to 200 ?m or more, so these are also preferable for moldunderfill. The components can be freely adjusted, so it is possible to easily design the alloy components to obtain highly reliable Cu pillars.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: August 24, 2021
    Assignees: NIPPON MICROMETAL CORPORATION, NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    Inventors: Takashi Yamada, Daizo Oda, Teruo Haibara, Shinichi Terashima
  • Patent number: 11091399
    Abstract: A pillar-shaped honeycomb structure body of a honeycomb structure includes a circumferential cell structure, a central cell structure and a boundary wall therebetween. On a surface orthogonal to the cells there are a circumferential reinforcing region having the partition wall thicker than a basic partition wall thickness in the circumferential cell structure and existing outside a range of a distance from a centroid of the surface; and at least one of a first boundary reinforcing region having the partition wall thicker than the basic partition wall thickness and existing in a range of a distance from the centroid within a range of the circumferential cell structure and a second boundary reinforcing region having the partition wall thicker than a basic partition wall thickness in the central cell structure and existing outside of a range of a distance from the centroid within a range of the central cell structure.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: August 17, 2021
    Assignee: NGK Insulators, Ltd.
    Inventors: Akifumi Kawakami, Takashi Kinoshita, Yuji Sasaki, Mitsuhiro Ito
  • Patent number: 11066336
    Abstract: A honeycomb structure includes honeycomb segments, bonding layers and a circumferential wall. The bonding layers include bottomed-hollow voids which extend toward an internal side in an axial direction from an end face of the honeycomb structure and which are formed at at least one of intersections, and a ratio of a depth of each void in the axial direction to a length of each honeycomb segment in the axial direction is 5% or more.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: July 20, 2021
    Assignee: NGK Insulators, Ltd.
    Inventor: Tomohiro Ishioka
  • Patent number: 11059754
    Abstract: A honeycomb structure includes plugged honeycomb segments, bonding layers and a circumferential wall. The bonding layers includes bottomed-hollow unbonded portions, which extend toward an internal side in an axial direction from an end face of the honeycomb structure, in portions of circumferential bonding layers bonding the honeycomb segments on an outermost circumference. The unbonded portions exist on respective extended lines extending from an intersection of the bonding layers which is closest to a centroid of the end face. An opening length of the unbonded portion is 1 to 10 mm, a ratio of an opening depth of the unbonded portion to a length of the honeycomb segment is 10 to 45%, and a ratio of a distance from the circumferential wall to a point at which an open end of the unbonded portion ends to a length of the circumferential bonding layer is 5 to 100%.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: July 13, 2021
    Assignee: NGK Insulators, Ltd.
    Inventor: Kazuya Yuki
  • Patent number: 11052493
    Abstract: The invention relates generally to welding and, more specifically, to corrosion resistant weld deposits created during arc welding, such as Gas Metal Arc Welding (GMAW) or Flux Core Arc Welding (FCAW). A disclosed corrosion resistant weld deposit comprises nickel, chromium, and copper, and has a low porosity.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: July 6, 2021
    Assignee: HOBART BROTHERS LLC
    Inventors: Mario Anthony Amata, Steven Edward Barhorst, Tre′ Dorell Heflin-King
  • Patent number: 11052440
    Abstract: An outer layer of a rolling roll having a chemical composition comprising by mass 1.3-2.8% of C, 0.3-1.8% of Si, 0.3-2.5% of Mn, 0-6.5% of Ni, 1-10% of Cr, 0.9-6% of Mo, 0-8% of W, 0.5-6% of V, 0-3% of Nb, and 0% or more and less than 0.01% of B, the balance being Fe and inevitable impurities, and meeting the formulae (1): 1000?1177?52C+14Si?11Mn+6.8Cr+1W+0.65Mo+12V+15Nb?1115, and (2): 5?Cr+Mo+0.5W+V+1.2Nb?15, wherein C, Si, Mn, Cr, W, Mo, V and Nb represent % by mass of these elements, and a structure containing eutectic carbide without graphite.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: July 6, 2021
    Assignee: HITACHI METALS, LTD.
    Inventors: Yasunori Nozaki, Nozomu Oda, Shiho Fukumoto
  • Patent number: 11046859
    Abstract: A coating material for a honeycomb structure, the coating material containing: from 1% by mass to 10% by mass of first ceramic fibers having an average axial length of from 80 ?m to 200 ?m in an inorganic raw material; and from 0.1% by mass to 15% by mass of second ceramic fibers having an average axial length of from 50 ?m to 70 ?m in the inorganic raw material.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: June 29, 2021
    Assignee: NGK Insulators, Ltd.
    Inventors: Keisuke Kimura, Suguru Kodama
  • Patent number: 11046621
    Abstract: The honeycomb structure is equipped with a pillar-shaped honeycomb structure body having a porous partition wall that defines a plurality of cells extending from an inflow end face to an outflow end face and serving as a through channel of a fluid and a circumferential wall placed to surround the circumference of the partition wall. The honeycomb structure body has, in a face orthogonal to an extending direction of the cells of the honeycomb structure body, a circumferential cell structure, a center cell structure, and a boundary wall placed at a boundary between the circumferential cell structure and the center cell structure and incomplete cells of 5% or more to 50% or less of the total number of the incomplete cells of the center cell structure is communicated with incomplete cells of the circumferential cell structure with each other.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: June 29, 2021
    Assignee: NGK Insulators, Ltd.
    Inventor: Takashi Kinoshita
  • Patent number: 11027514
    Abstract: The presently disclosed subject matter relates to nanocardboard structures and methods of fabrication thereof. An exemplary nanocardboard structure includes at least two parallel planar films and webbing. The planar films can be separated from each other by a gap of from about 0.1 micrometers to about 1000 micrometers.
    Type: Grant
    Filed: August 15, 2018
    Date of Patent: June 8, 2021
    Assignee: THE TRUSTEES OF THE UNIVERSITY OF PENNSYLVANIA
    Inventors: Igor Bargatin, Chen Lin, Samuel Nicaise
  • Patent number: 11020800
    Abstract: Apparatus and methods for sealing powder holes in additively manufactured parts are presented herein. Powder holes are co-printed to facilitate post processing sealing. Embodiments include co-printed caps, friction welded caps, rivets, silicone plugs, co-printed tangs, multiple micro holes, layup, and spin forming. By using one or more of the above techniques, powder holes can be sealed on additively manufactured parts.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: June 1, 2021
    Assignee: Divergent Technologies, Inc.
    Inventors: Eahab Nagi El Naga, Ross Harrison Byers, Keith Allen Fleming, Steven Blair Massey, Jr., Narender Shankar Lakshman, Antonio Bernerd Martinez
  • Patent number: 11020700
    Abstract: A honeycomb structure body has cell walls, inner cells and outer cells, and a boundary partition wall. The inner cells are arranged in a high cell density area and the outer cells are arranged in a low cell density area. A cell density of the high cell density area is higher than a cell density of the low cell density area. Cell reinforced parts are formed at a first intersection part at which the cell walls intersect each other. Boundary reinforced parts are formed at a second intersection part at which the cell walls and the boundary partition wall intersect each other. The honeycomb structure body satisfies a relationship of Sb>Sc, where Sb indicates an average value of a cross sectional area of the overall boundary reinforced parts, and Si indicates an average value of a cross sectional area of the overall inner cell reinforced parts.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: June 1, 2021
    Assignee: DENSO CORPORATION
    Inventor: Koji Tamai
  • Patent number: 11000841
    Abstract: A honeycomb structure comprising a pillar-shaped honeycomb structure body, wherein the honeycomb structure body has at least one missing part, the average size of the missing part is such that the radial length on the end face of the honeycomb structure body is 0.8 to 8.0 mm, the perimeter along the rim of the end face of the honeycomb structure body is 0.8 to 41.0 mm, and the axial length in the extending direction of the cells of the honeycomb structure body is 0.1 to 32.0 mm, and a percentage of a ratio of total area of the missing part is 1.40% or less.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: May 11, 2021
    Assignee: NGK Insulators, Ltd.
    Inventors: Hirotaka Yamamoto, Tomohiro Ishioka
  • Patent number: 11001029
    Abstract: A honeycomb for curved surface lightweight components includes a plurality of elongate ribbons and connecting regions. The connecting regions are provided, respectively, between opposing ribbons to connect the ribbons together in a portion-wise manner in a firmly bonded relationship in a transverse direction. The connecting regions are arranged at regular spacings along the longitudinal direction of a ribbon. Honeycomb-like cells form cavities between the ribbons. With respect to three successive ribbons, a displacement of the connecting regions between first and second ribbons relative to the connecting regions between second and third ribbons toward a first side of the longitudinal direction is lesser than toward a second side of the longitudinal direction.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: May 11, 2021
    Assignee: EURO-COMPOSITES S.A.
    Inventors: Rolf-Mathias Alter, Willy Wintgens, Michael Willert, Ralf Schmitt
  • Patent number: 10995392
    Abstract: Embodiments of the present disclosure include compositions that include magnesium and gadolinium or magnesium and one or more metals.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: May 4, 2021
    Assignee: University of Florida Research Foundation, Inc.
    Inventors: Michele Viola Manuel, Hunter B. Henderson, Kelly A. Jordan
  • Patent number: 10988835
    Abstract: The present disclosure provides hard particles having improved wear resistance and a sintered sliding member using the hard particles. The present disclosure relates to a hard particle consisting of: 1% to 7% by mass of La, 30% to 50% by mass of Mo, 10% to 30% by mass of Ni, 10% by mass or less of Mn, 1.0% by mass or less of C, with the balance being unavoidable impurities and Co, and to a sintered sliding member using the hard particles.
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: April 27, 2021
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yuuki Kamo, Takayuki Yamada, Kimihiko Andou
  • Patent number: 10981602
    Abstract: A press-hardened shaped metal sheet has at least two adjacent zones having different sheet thicknesses and different strengths such that one of the zones is press-hardened and the other zone is non-hardened or only slightly hardened. A transition zone, which is simultaneously designed as a thickness transition zone and as a strength transition zone, is located between the zones. The press-hardened shaped metal sheet is preferably a pillar reinforcement for a motor vehicle body.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: April 20, 2021
    Assignee: Bayerische Motoren Werke Aktiengesellschaft
    Inventors: Lukasz Goldyn, Markus Pfestorf, Martin Kerscher, Daniel Augustin
  • Patent number: 10981326
    Abstract: A three-dimensional printed structure can include a photocurable resin, a sinterable material, and a plurality of elongated particles. The elongated particles are distributed within the printed structure. The elongated particles are shaped and distributed to promote porosity control (e.g., improved densification) within the structure.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: April 20, 2021
    Assignee: Tethon Incorporated
    Inventors: Gregory C. Pugh, Karen A. Linder
  • Patent number: 10960498
    Abstract: A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core includes: (a) pure silver consisting of silver and further components; or (b) doped silver consisting of silver, at least one doping element, and further components; or (c) a silver alloy consisting of silver, palladium and further components; or (d) a silver alloy consisting of silver, palladium, gold, and further components; or (e) a doped silver alloy consisting of silver, palladium, gold, at least one doping element, and further components, wherein the individual amount of any further component is less than 30 wt.-ppm and the individual amount of any doping element is at least 30 wt.-ppm, and the coating layer is a single-layer of gold or palladium or a double-layer comprised of an inner layer of nickel or palladium and an adjacent outer layer of gold.
    Type: Grant
    Filed: September 16, 2016
    Date of Patent: March 30, 2021
    Assignees: HERAEUS MATERIALS SINGAPORE PTE., LTD., HERAEUS DEUTSCHLAND GMBH & CO. KG
    Inventors: Il Tae Kang, Yong-Deok Tark, Mong Hyun Cho, Jong Su Kim, Hyun Seok Jung, Tae Yeop Kim, Xi Zhang, Murali Sarangapani