Abstract: The present invention provides a bonding wire for a semiconductor device suitable for cutting-edge high-density LSIs and on-vehicle LSIs by improving the formation rate of Cu—Al IMC in ball bonds. A bonding wire for a semiconductor device contains Pt of 0.1 mass % to 1.3 mass %, at least one dopant selected from a first dopant group consisting of In, Ga, and Ge, for a total of 0.05 mass % to 1.25 mass %, and a balance being made up of Cu and incidental impurities.

Abstract: Composite honeycomb that may be contoured to form composite honeycomb structures, which have tight radii of curvatures and/or compound curvatures, and which are suitable for use in high temperature environments. The method for making the composite honeycomb involves using high temperature prepreg to make a flexible composite honeycomb that is formed into a composite honeycomb precursor. A high temperature coating resin is applied to the composite honeycomb precursor to form the high temperature composite honeycomb.

Abstract: A structural component includes at least one wall surrounding a component interior space. The structural component also includes a first cellular structure positioned within the component interior space. The first cellular structure includes a plurality of cells each having a twelve-cornered cross section including twelve sides and twelve corners creating nine internal angles and three external angles.

Abstract: A sintered blank (1) for producing a dental prosthesis is provided, in which the sintered blank (1) include at least one product area (2), from which the dental prosthesis is produced, and at least one auxiliary sintering body (3) and connecting webs (4) for bracing the product area (2), wherein the auxiliary sintering body (3) is connected to the product area (2) by the connecting webs (4), the auxiliary sintering body (3) including one, preferably precisely one, at least in some areas, preferably completely curved support surface (5).

Abstract: A reinforcing structure made of a sheet-like cellular base material which comprises material attenuations (3) in a distribution over its area in a view from above, wherein the material attenuations sub-divide the base material into a multitude of material islands (1R; 1T) which are delineated from each other by the material attenuations (3) but are still connected to each other, wherein (a) the material islands (1R; 1T) are convex base polygons in a view from above; (b) a respective plurality of the material islands (1R; 1T) jointly form a convex and preferably regular compound polygon (1H) in a view from above; and (c) the compound polygons (1H) differ, in their number of corners and/or in a ratio of the lengths of their sides, from the base polygons which form the material islands (1R; 1T).

Abstract: In various embodiments, three-dimensional layered metallic parts are substantially free of gaps between successive layers, are substantially free of cracks, and have densities no less than 97% of the theoretical density of the metallic material.

Abstract: A mixed powder for a low temperature cofired ceramic material that contains 65 to 80 parts by weight of SiO2, 5 to 25 parts by weight of BaO, 1 to 10 parts by weight of Al2O3, 0.1 to 5 parts by weight of MnO, 0.1 to 5 parts by weight of B2O3, and 0.1 to less than 3 parts by weight of Li2O. The ceramic sintered body is used for, for example, ceramic electronic components, e.g., a multilayer circuit board or a coupler.

Abstract: Surfaces of metals and alloys that exhibit hydrophilic, omniphilic or hydrophobic properties, and methods of preparation thereof. The surface is roughened by surface polishing, thermo-catalytic etching, and temperature gradient etching. This procedure produces a hierarchical micro-/nano-scale roughness in the surface which comprises grooves, micro-cavities, and nano-cavities. This greatly enhances the hydrophilic and omniphilic properties of the pure surface without the need for coatings or oxidation. A further step of immersing the roughened surface in a stearic acid solution makes the surface hydrophobic or superhydrophobic.

Abstract: The invention relates to a porous multi-layered coloured zirconia dental mill blank comprising a bottom layer B having the composition COMP-B which comprises ceramic components CER-COMP-B, colouring components COL-COMP-B and stabilizing components STAB-COMP-B, a top layer E having the composition COMP-E which comprises ceramic components CER-COMP-E, colouring components COL-COMP-E stabilizing components STAB-COMP-E, at least one intermediate layer Ex having the composition COMP-E of top layer E, at least one intermediate layer Bx having the composition COMP-B of bottom layer B, x being an integer and indicating the number of intermediate layers, wherein the layers with compositions COMP-B and COMP-E are arranged in alternating order, and wherein the thickness of the individual layers B, Bx is decreasing from bottom to top and the thickness of the individual layers E, Ex is decreasing from top to bottom. The dental mill blank can be used for producing dental articles.

Abstract: A composite includes a board. The board includes: a pair of corrugated layers, each corrugated layer being formed from two corrugated sheets bonded together; and a cardboard honeycomb disposed between and bonded to the corrugated layers, the honeycomb being orientated such that the cells extend between the corrugated layers. The board can be cut using conventional machinery without fraying [thereby requiring little or no sanding] and can be edgetaped without being crushed using conventional edge taping machinery.

Abstract: A CMC article may include a CMC substrate defining a major surface and a plurality of CMC reinforcing pins at least partially embedded in the CMC substrate. Each CMC reinforcing pin of the plurality of CMC reinforcing pins defines a respective long axis. The respective long axes may be oriented at an angle substantially perpendicular to the major surface of the CMC substrate. A method may include inserting a plurality of CMC reinforcing pins into a major surface of a ceramic fiber preform. Each CMC reinforcing pin of the plurality of CMC reinforcing pins defines a respective long axis. As the plurality of CMC reinforcing pins are inserted into the major surface, the respective long axes may be oriented at an angle substantially perpendicular to the major surface. The method also includes forming a matrix of material within pores of the ceramic fiber preform to form a CMC article.

Abstract: A component, including a part, comprising a honeycomb-like structure formed from at least a seamless resin-infused fiber composite material. The honeycomb-like structure includes a first plurality of cells, and a second plurality of cells, different than the first plurality of cells.

Abstract: Disclosed is a microcracked ceramic body, comprising a predominant phase (greater than 50 wt %) of zirconium tin titanate and a dilatometric coefficient of thermal expansion (CTE) from 25 to 1000 C of not more than 40×10?7° C.?1 as measured by dilatometry and methods for the manufacture of the same.

Abstract: A honeycomb structure provided with cell walls which partition the inside of a cylindrical outer skin having openings at both ends, and a large number of cells which are surrounded by the cell walls and provided in parallel in an axial direction of the cylindrical outer skin. At least part of the large number of cells include a protruding piece. The protruding piece forms a through-hole which penetrates the cell wall, and a protruding wall which protrudes inward of the cell at an angle from an edge of the through-hole.

Abstract: An exhaust gas purification filter comprises: a casing; a porous dividing wall which partitions the inside of the casing into a honeycomb shape; and cells enclosed by the dividing wall. A pore path length distribution of the dividing wall, when expressed by a frequency histogram per 10 ?m of the pore path length of the dividing wall, has an integrated frequency of at least 58%. The integrated frequency is a maximum value of a value obtained by summing the frequencies of a total of three adjacent levels which include the maximum peak frequency. The dividing wall preferably has a gas permeability coefficient k of at least 0.8×10?12 m2.

Abstract: A honeycomb structure includes a porous partition wall defining a plurality of cells, wherein the plurality of cells include a first cell and a second cell, on the partition wall disposed to surround the at least one first cell, a protrusion is each provided with, the first protrusion and the second protrusion are each disposed to at least partially overlap with each other on extended lines in extending directions of the respective protrusions, and an inter-protrusion length (X) of a distal end of the first protrusion and a distal end of the second protrusion is equal to or more than 10% and equal to or less than 70% with respect to a mutual distance (W) from the one part to the other part on the partition walls facing each other.

Abstract: A fluorine plasma resistant coating on a substrate being a component in a semiconductor manufacturing system is disclosed. In one embodiment the composition includes an AlON coating that overlies a substrate, and an optional yttria coating layer that overlies the AlON coating, with a total coating thickness of about 5-6 microns.

Abstract: A sintered material for use in an internal combustion engine, such as a valve seat insert, is provided. The material includes a pressed base powder metal mixture and a Cu-rich phase infiltrated in pores of the base powder metal mixture. The base powder metal mixture includes at least one of Mo and W, and at least one additive, such as B, N, and/or C. The amount of the Mo and/or W is 50 wt. % to 85 wt. %, based on the total weight of the material. The at least one additive is present in a total amount of 0.2 to 25 wt. %, based on the total weight of the material, and the Cu-rich phase is present in an amount of 15 wt. % to 50 wt. %, based on the total weight of the material. The material also has a thermal conductivity of at least 70 W/mK.

Abstract: The present invention provides a bonding wire capable of simultaneously satisfying ball bonding reliability and wedge bondability required of bonding wires for memories, the bonding wire including a core material containing one or more of Ga, In, and Sn for a total of 0.1 to 3.0 at % with a balance being made up of Ag and incidental impurities; and a coating layer formed over a surface of the core material, containing one or more of Pd and Pt, or Ag and one or more of Pd and Pt, with a balance being made up of incidental impurities, wherein the coating layer is 0.005 to 0.070 ?m in thickness.

Abstract: Disclosed herein is a method comprising mixing a carrier liquid with particles and/or with a particle precursor to form a suspension or solution respectively; where the particles comprise a metal oxide; and where the particle precursor comprises a metal salt; injecting the suspension or solution through a plasma flame; and depositing the particles and/or the particle precursor onto a substrate to form an first abradable coating; where the first abradable coating comprises a plurality of cracks or voids that are substantially perpendicular to the substrate surface, where the substrate is a hub surface of a gas turbine engine or where the substrate is a cantilever stator.