Patents Examined by Ellen E. Kim
  • Patent number: 11971581
    Abstract: The present disclosure provides a protected cable connector assembly. The protected cable connector assembly includes a cable gland body, a gland nut, a grommet, an optical fibre cable, a protected connector and a protective grip. The cable gland body includes a first threaded portion, a second threaded portion and an unthreaded portion. The gland nut includes internal threads. In addition, the internal threads of the gland nut engage with threads of the first threaded portion of the cable gland body. Further, a total length of the gland nut is about 17.87 millimeters. The grommet is positioned partially inside the cable gland body. The protected cable connector enables the optical fibre cable to terminate into an optical fibre distribution box.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: April 30, 2024
    Assignee: Sterlite Technologies Limited
    Inventor: Chris Taylor
  • Patent number: 11841536
    Abstract: A bi-directional optical communication device comprising a reduced number of components for speedier and less costly manufacture includes a plate and a wavelength-division multiplexer disposed on the plate. An optical-signal transmitter disposed on the board emits first beam to the wavelength-division multiplexer and an optical-signal receiver disposed on the board detects the second beam emitted by the wavelength-division multiplexer. An optical receptacle is disposed on the plate for actual connection to an optical fiber. The optical fiber emits the second beam to the wavelength-division multiplexer, and the multiplexer emits the first beam to the optical fiber.
    Type: Grant
    Filed: December 27, 2022
    Date of Patent: December 12, 2023
    Assignee: SHUNYUN TECHNOLOGY (ZHONG SHAN) LIMITED
    Inventor: Jie Huang
  • Patent number: 11835758
    Abstract: A microLED based optical chip-to-chip interconnect may optically couple chips in a variety of ways. The microLEDs may be positioned within a waveguide, and the interconnects may be arranged as direct connections, in bus topologies, or as repeaters.
    Type: Grant
    Filed: November 28, 2022
    Date of Patent: December 5, 2023
    Assignee: AvicenaTech Corp.
    Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
  • Patent number: 11815691
    Abstract: Provided is a light guide plate for an image display device which uses lead-free glass, has excellent color reproducibility and a light weight, and may obtain a wide viewing angle. A light guide plate for an image display device, which guides image light inputted from an image display element and outputs the image light toward a user's pupil, is configured to be made of lead-free glass having a refractive index of 1.8 or more with respect to a wavelength of the image light, and to have internal transmittance of 0.6 or more with respect to a wavelength of 400 nm when a plate thickness is 10 mm.
    Type: Grant
    Filed: November 16, 2022
    Date of Patent: November 14, 2023
    Assignee: HOYA CORPORATION
    Inventor: Yasuo Kogure
  • Patent number: 11799554
    Abstract: An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.
    Type: Grant
    Filed: July 16, 2022
    Date of Patent: October 24, 2023
    Assignee: Ayar Labs, Inc.
    Inventors: Chen Sun, Roy Edward Meade, Mark Wade, Alexandra Wright, Vladimir Stojanovic, Rajeev Ram, Milos Popovic, Derek Van Orden, Michael Davenport
  • Patent number: 11796735
    Abstract: A method includes forming a first photonic die, which includes forming a first silicon waveguide, and forming a first nitride waveguide. The method further includes forming a first through-via extending into a first plurality of dielectric layers in the first photonic die, and bonding a second photonic die to the first photonic die. The second photonic die includes a second nitride waveguide. The first silicon waveguide is optically coupled to the second nitride waveguide through the first nitride waveguide. A second through-via extends into a second plurality of dielectric layers in the second photonic die.
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: October 24, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chen-Hua Yu, Hsing-Kuo Hsia
  • Patent number: 11788908
    Abstract: Methods and apparatuses for quantitatively measuring strain in an optical fiber. An optical source comprising an optical beam generator and a pulse generator receives instructions from a controller and generates a pulsed optical beam in response to those instructions. The pulsed optical beam is directed into an optical fiber to generate a reflected beam from scattering centers within the optical fiber. A detector records a plurality of frames of data generated by the reflected beam, and the controller tracks an evolution of a speckle pattern carried by the reflected beam from the plurality of frames and calculates a strain induced in a section of the optical fiber from the evolution of the speckle pattern.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: October 17, 2023
    Assignee: The Government of the United States of America, as represented by the Secretary of the Navy
    Inventors: Matthew J. Murray, Brandon Redding, Allen Davis, Clay Kirkendall
  • Patent number: 11782207
    Abstract: An optical fiber is provided that includes a core region, a cladding region having a radius less than about 62.5 microns; a polymer coating comprising a high-modulus layer and a low-modulus layer, wherein a thickness of the low-modulus inner coating layer is in a range of 4 microns to 20 microns, the modulus of the low-modulus inner coating layer is less than or equal to about 0.35 MPa, a thickness of the high-modulus coating layer is in a range of 4 microns to 20 microns, the modulus of the high-modulus inner coating layer is greater than or equal to about 1.6 GPa, and wherein a puncture resistance of the optical fiber is greater than 20 g, and wherein a microbend attenuation penalty of the optical fiber is less than 0.03 dB/km, and wherein an outer diameter of the coated optical fiber is less than or equal to 175 microns.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: October 10, 2023
    Assignee: CORNING INCORPORATED
    Inventors: Scott Robertson Bickham, Matthew Ryan Drake, Shandon Dee Hart, Ming-Jun Li, Joseph Edward McCarthy, Weijun Niu, Pushkar Tandon
  • Patent number: 11774679
    Abstract: A ring resonator device includes a passive optical cavity having a circuitous configuration into which is built a photodetector device. The photodetector device includes a first implant region formed within the passive optical cavity that includes a first type of implanted doping material. The photodetector device includes a second implant region formed within the passive optical cavity that includes a second type of implanted doping material, where the second type of implanted doping material is different than the first type of implanted doping material. The photodetector device includes an intrinsic absorption region present within the passive optical cavity between the first implant region and the second implant region. A first electrical contact is electrically connected to the first implant region and to a detecting circuit. A second electrical contact is electrically connected to the second implant region and to the detecting circuit.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: October 3, 2023
    Assignee: Ayar Labs, Inc.
    Inventors: Pavan Bhargava, John Fini, Derek Van Orden, Chen Sun, Mark Wade
  • Patent number: 11768391
    Abstract: A carrier depletion-based Silicon Photonic (SiP) modulator using capacitive coupling includes a high-k dielectric material in or on slabs, between a rib. A capacitance (Ck) of the high-k dielectric material is larger than a capacitance (Cpn) of the rib, thereby reducing the high frequency impedance and improving bandwidth of the modulator. A modulator includes a first electrode; a first slab connected to the first electrode at a first end; a rib connected to the first slab at a second end of the first slab; a second slab connected to the rib at a first end; a second electrode connected to the second slab at a second end of the second slab; and a high-k dielectric material disposed in or on a portion of each of the first slab and the second slab, thereby enabling capacitive coupling.
    Type: Grant
    Filed: January 6, 2022
    Date of Patent: September 26, 2023
    Assignee: Ciena Corporation
    Inventors: Michel Poulin, Alexandre Delisle-Simard, Charles Baudot
  • Patent number: 11762158
    Abstract: An optoelectronic device, e.g. of a photocell or light barrier, comprising an electrical-to-optical or optical-to-electrical transducer, and an optical tube assembly comprising an optical chamber, a first aperture proximal with respect to the transducer, and a second, distal aperture being formed in chamber wall. In at least one first half-section taken e.g. along optical axis, at least an intermediate portion of the chamber wall extending between a first and a second line has a local tangent at each point (P) oriented so that any stray light ray incoming from the boundary point of the first aperture in the opposite half-section would be so deviated at that point (P) as to impinge upon the chamber wall at an impingement point (Q) in said first halfsection and more distal than the distal line.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: September 19, 2023
    Assignee: Datalogic IP Tech S.R.L.
    Inventor: Piero Lovato
  • Patent number: 11754788
    Abstract: A multi-channel mode converter includes a lens array having a first lens and a second lens, a glass block coupled to the lens array, and a fiber assembly unit (FAU) array coupled to the glass block, the FAU array including a first fiber corresponding to the first lens, and a second fiber corresponding to the second lens. The FAU array provides for a corresponding number of fibers and lenses such that a specific single fiber corresponds to a specific single lens, there being a 1:1 relationship between fibers and lenses. A mode converter system comprises: a lens array comprising: a first silicon lens configured to convert a first mode between a first waveguide and a first fiber, and a second silicon lens configured to convert a second mode between a second waveguide and a second fiber, and a glass block coupled to the lens array and configured to provide an optical path for a first light beam corresponding to the first silicon lens and a second light beam corresponding to the second silicon lens.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: September 12, 2023
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Rongsheng Miao, Xueyan Zheng, Xiao Andy Shen, Yu Sheng Bai
  • Patent number: 11754866
    Abstract: To enable several orders of magnitude increases in average power and energy handling capability of Faraday rotators, the technology utilizes high speed gas cooling to efficiently remove thermal loading from the Faraday optic faces while minimizing the thermal wavefront and thermal birefringence by creating a longitudinal thermal gradient. A recirculating gas cooling manifold accelerates the gas over the surface of the slab to create a turbulent flow condition which maximizes the surface cooling rate. The technology further provides a spatially uniform thermal profile on the Faraday slabs.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: September 12, 2023
    Assignee: Lawrence Livermore National Security, LLC
    Inventors: Andrew J. Bayramian, Alvin C. Erlandson, Daniel C. Mason
  • Patent number: 11740404
    Abstract: One embodiment of the present disclosure relates to an optical fiber having lower transmission loss. The optical fiber is an optical fiber comprised of silica-based glass and includes a core including a central axis and a cladding. The cladding surrounds the core and has a refractive index lower than a refractive index of the core. The core contains phosphorus, chlorine, and fluorine. The core further includes an alkali metal element or an alkaline earth metal element. In a cross section of the optical fiber orthogonal to the central axis, a ratio Rp/Ra of a radius Rp of a phosphorus-containing region with respect to a radius Ra of the core is 0.3 or more.
    Type: Grant
    Filed: June 4, 2021
    Date of Patent: August 29, 2023
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hirotaka Sakuma, Yoshiaki Tamura, Yuki Kawaguchi, Masato Suzuki
  • Patent number: 11740409
    Abstract: A photonic device includes an optical coupler, a waveguide structure, a metal-dielectric stack, and a protection layer. The optical coupler is over a semiconductor substrate. The waveguide structure is over the semiconductor substrate and laterally connected to the optical coupler. A top of the waveguide structure is lower than a top of the optical coupler. The metal-dielectric stack is over the optical coupler and the waveguide structure. The metal-dielectric stack has a hole above the optical coupler. The protection layer lines the hole of the metal-dielectric stack.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: August 29, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Sui-Ying Hsu, Yueh-Ying Lee, Chien-Ying Wu, Chen-Hao Huang, Chien-Chang Lee, Chia-Ping Lai
  • Patent number: 11726277
    Abstract: Systems and methods described herein relate to the manufacture of optical elements and optical systems. An example method includes providing a first substrate that has a plurality of light-emitter devices disposed on a first surface. The method includes providing a second substrate that has a mounting surface defining a reference plane. The method includes forming a structure and an optical spacer on the mounting surface of the second substrate. The method additionally includes coupling the first and second substrates together such that the first surface of the first substrate faces the mounting surface of the second substrate at an angle with respect to the reference plane.
    Type: Grant
    Filed: September 1, 2022
    Date of Patent: August 15, 2023
    Assignee: Waymo LLC
    Inventors: Pierre-Yves Droz, David Schleuning
  • Patent number: 11726258
    Abstract: Photonic devices having a photonic waveguiding layer, and a cladding layer, disposed on the photonic waveguiding layer, and where the cladding section is a material comprising Scandium. The cladding layer may include a material comprising Al1-xScxN material where 0<x?0.45.
    Type: Grant
    Filed: January 20, 2022
    Date of Patent: August 15, 2023
    Assignees: Raytheon BBN Technologies Corp., Raytheon Company
    Inventors: Mohammad Soltani, Eduardo M. Chumbes
  • Patent number: 11726332
    Abstract: A light projection apparatus is provided comprising: a source of light; a switchable grating on a first substrate; and a diffractive optical element. Light is diffracted at least once by the switchable grating and is diffracted at least once by the DOE.
    Type: Grant
    Filed: November 15, 2021
    Date of Patent: August 15, 2023
    Assignees: DigiLens Inc., Rockwell Collins, Inc.
    Inventors: Jonathan David Waldern, Milan Momcilo Popovich
  • Patent number: 11719963
    Abstract: An apparatus having a segmented optical modulator includes an optical waveguide having three or more segments. Each of three or more optical modulators includes a corresponding waveguide segment and is configured to apply an optical modulation that is proportional to the length of the segment. Three or more electrical contacts receive respective bit values of binary values. Each binary value includes at least three bit values including a least significant bit (LSB) bit value, a most significant bit (MSB) bit value, and at least one intermediate bit (IB) bit value between the LSB bit value and the MSB bit value. At least one waveguide segment of a corresponding optical modulator receiving an LSB bit value is positioned between a first waveguide segment of a corresponding optical modulator receiving an MSB bit value and a second waveguide segment of a corresponding optical modulator receiving an IB bit value.
    Type: Grant
    Filed: April 28, 2021
    Date of Patent: August 8, 2023
    Assignee: Lightelligence, Inc.
    Inventors: Cheng-Kuan Lu, Gilbert Hendry, Huaiyu Meng, Yichen Shen
  • Patent number: 11719886
    Abstract: A polarization volume grating, an optical waveguide system and an electronic device are disclosed. Parameters of the polarization volume grating satisfy with those derived by performing a multivariable optimization algorithm on a merit function of ƒk(d1,?1,d2,?2, . . . , dm,?m,d)=[1?n1(?,?)]2, wherein the parameters include d1,?1,d2,?2, . . . , dm,?m, where m=1,2,3, . . . , and d, m is the number of layers of the polarization volume grating, dm is a thickness of mth layer, ?m is a twist angle in mth layer, and d is a period of the polarization volume grating, k represents a central wavelength on which the multivariable optimization algorithm is performed, ? represents a polar angle of an incident light, ? represents an azimuth angle of the incident light, and n1(?,?) represents a first-order diffraction efficiency of the polarization. volume grating.
    Type: Grant
    Filed: February 8, 2022
    Date of Patent: August 8, 2023
    Assignee: Goertek Inc.
    Inventor: Lingshan Li