Patents Examined by Ellen E. Kim
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Patent number: 11971581Abstract: The present disclosure provides a protected cable connector assembly. The protected cable connector assembly includes a cable gland body, a gland nut, a grommet, an optical fibre cable, a protected connector and a protective grip. The cable gland body includes a first threaded portion, a second threaded portion and an unthreaded portion. The gland nut includes internal threads. In addition, the internal threads of the gland nut engage with threads of the first threaded portion of the cable gland body. Further, a total length of the gland nut is about 17.87 millimeters. The grommet is positioned partially inside the cable gland body. The protected cable connector enables the optical fibre cable to terminate into an optical fibre distribution box.Type: GrantFiled: November 14, 2019Date of Patent: April 30, 2024Assignee: Sterlite Technologies LimitedInventor: Chris Taylor
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Patent number: 11841536Abstract: A bi-directional optical communication device comprising a reduced number of components for speedier and less costly manufacture includes a plate and a wavelength-division multiplexer disposed on the plate. An optical-signal transmitter disposed on the board emits first beam to the wavelength-division multiplexer and an optical-signal receiver disposed on the board detects the second beam emitted by the wavelength-division multiplexer. An optical receptacle is disposed on the plate for actual connection to an optical fiber. The optical fiber emits the second beam to the wavelength-division multiplexer, and the multiplexer emits the first beam to the optical fiber.Type: GrantFiled: December 27, 2022Date of Patent: December 12, 2023Assignee: SHUNYUN TECHNOLOGY (ZHONG SHAN) LIMITEDInventor: Jie Huang
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Patent number: 11835758Abstract: A microLED based optical chip-to-chip interconnect may optically couple chips in a variety of ways. The microLEDs may be positioned within a waveguide, and the interconnects may be arranged as direct connections, in bus topologies, or as repeaters.Type: GrantFiled: November 28, 2022Date of Patent: December 5, 2023Assignee: AvicenaTech Corp.Inventors: Bardia Pezeshki, Robert Kalman, Alex Tselikov
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Patent number: 11815691Abstract: Provided is a light guide plate for an image display device which uses lead-free glass, has excellent color reproducibility and a light weight, and may obtain a wide viewing angle. A light guide plate for an image display device, which guides image light inputted from an image display element and outputs the image light toward a user's pupil, is configured to be made of lead-free glass having a refractive index of 1.8 or more with respect to a wavelength of the image light, and to have internal transmittance of 0.6 or more with respect to a wavelength of 400 nm when a plate thickness is 10 mm.Type: GrantFiled: November 16, 2022Date of Patent: November 14, 2023Assignee: HOYA CORPORATIONInventor: Yasuo Kogure
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Patent number: 11799554Abstract: An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.Type: GrantFiled: July 16, 2022Date of Patent: October 24, 2023Assignee: Ayar Labs, Inc.Inventors: Chen Sun, Roy Edward Meade, Mark Wade, Alexandra Wright, Vladimir Stojanovic, Rajeev Ram, Milos Popovic, Derek Van Orden, Michael Davenport
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Patent number: 11796735Abstract: A method includes forming a first photonic die, which includes forming a first silicon waveguide, and forming a first nitride waveguide. The method further includes forming a first through-via extending into a first plurality of dielectric layers in the first photonic die, and bonding a second photonic die to the first photonic die. The second photonic die includes a second nitride waveguide. The first silicon waveguide is optically coupled to the second nitride waveguide through the first nitride waveguide. A second through-via extends into a second plurality of dielectric layers in the second photonic die.Type: GrantFiled: January 19, 2022Date of Patent: October 24, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chen-Hua Yu, Hsing-Kuo Hsia
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Patent number: 11788908Abstract: Methods and apparatuses for quantitatively measuring strain in an optical fiber. An optical source comprising an optical beam generator and a pulse generator receives instructions from a controller and generates a pulsed optical beam in response to those instructions. The pulsed optical beam is directed into an optical fiber to generate a reflected beam from scattering centers within the optical fiber. A detector records a plurality of frames of data generated by the reflected beam, and the controller tracks an evolution of a speckle pattern carried by the reflected beam from the plurality of frames and calculates a strain induced in a section of the optical fiber from the evolution of the speckle pattern.Type: GrantFiled: September 21, 2020Date of Patent: October 17, 2023Assignee: The Government of the United States of America, as represented by the Secretary of the NavyInventors: Matthew J. Murray, Brandon Redding, Allen Davis, Clay Kirkendall
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Patent number: 11782207Abstract: An optical fiber is provided that includes a core region, a cladding region having a radius less than about 62.5 microns; a polymer coating comprising a high-modulus layer and a low-modulus layer, wherein a thickness of the low-modulus inner coating layer is in a range of 4 microns to 20 microns, the modulus of the low-modulus inner coating layer is less than or equal to about 0.35 MPa, a thickness of the high-modulus coating layer is in a range of 4 microns to 20 microns, the modulus of the high-modulus inner coating layer is greater than or equal to about 1.6 GPa, and wherein a puncture resistance of the optical fiber is greater than 20 g, and wherein a microbend attenuation penalty of the optical fiber is less than 0.03 dB/km, and wherein an outer diameter of the coated optical fiber is less than or equal to 175 microns.Type: GrantFiled: July 21, 2021Date of Patent: October 10, 2023Assignee: CORNING INCORPORATEDInventors: Scott Robertson Bickham, Matthew Ryan Drake, Shandon Dee Hart, Ming-Jun Li, Joseph Edward McCarthy, Weijun Niu, Pushkar Tandon
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Patent number: 11774679Abstract: A ring resonator device includes a passive optical cavity having a circuitous configuration into which is built a photodetector device. The photodetector device includes a first implant region formed within the passive optical cavity that includes a first type of implanted doping material. The photodetector device includes a second implant region formed within the passive optical cavity that includes a second type of implanted doping material, where the second type of implanted doping material is different than the first type of implanted doping material. The photodetector device includes an intrinsic absorption region present within the passive optical cavity between the first implant region and the second implant region. A first electrical contact is electrically connected to the first implant region and to a detecting circuit. A second electrical contact is electrically connected to the second implant region and to the detecting circuit.Type: GrantFiled: January 24, 2022Date of Patent: October 3, 2023Assignee: Ayar Labs, Inc.Inventors: Pavan Bhargava, John Fini, Derek Van Orden, Chen Sun, Mark Wade
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Patent number: 11768391Abstract: A carrier depletion-based Silicon Photonic (SiP) modulator using capacitive coupling includes a high-k dielectric material in or on slabs, between a rib. A capacitance (Ck) of the high-k dielectric material is larger than a capacitance (Cpn) of the rib, thereby reducing the high frequency impedance and improving bandwidth of the modulator. A modulator includes a first electrode; a first slab connected to the first electrode at a first end; a rib connected to the first slab at a second end of the first slab; a second slab connected to the rib at a first end; a second electrode connected to the second slab at a second end of the second slab; and a high-k dielectric material disposed in or on a portion of each of the first slab and the second slab, thereby enabling capacitive coupling.Type: GrantFiled: January 6, 2022Date of Patent: September 26, 2023Assignee: Ciena CorporationInventors: Michel Poulin, Alexandre Delisle-Simard, Charles Baudot
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Patent number: 11762158Abstract: An optoelectronic device, e.g. of a photocell or light barrier, comprising an electrical-to-optical or optical-to-electrical transducer, and an optical tube assembly comprising an optical chamber, a first aperture proximal with respect to the transducer, and a second, distal aperture being formed in chamber wall. In at least one first half-section taken e.g. along optical axis, at least an intermediate portion of the chamber wall extending between a first and a second line has a local tangent at each point (P) oriented so that any stray light ray incoming from the boundary point of the first aperture in the opposite half-section would be so deviated at that point (P) as to impinge upon the chamber wall at an impingement point (Q) in said first halfsection and more distal than the distal line.Type: GrantFiled: July 12, 2021Date of Patent: September 19, 2023Assignee: Datalogic IP Tech S.R.L.Inventor: Piero Lovato
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Patent number: 11754788Abstract: A multi-channel mode converter includes a lens array having a first lens and a second lens, a glass block coupled to the lens array, and a fiber assembly unit (FAU) array coupled to the glass block, the FAU array including a first fiber corresponding to the first lens, and a second fiber corresponding to the second lens. The FAU array provides for a corresponding number of fibers and lenses such that a specific single fiber corresponds to a specific single lens, there being a 1:1 relationship between fibers and lenses. A mode converter system comprises: a lens array comprising: a first silicon lens configured to convert a first mode between a first waveguide and a first fiber, and a second silicon lens configured to convert a second mode between a second waveguide and a second fiber, and a glass block coupled to the lens array and configured to provide an optical path for a first light beam corresponding to the first silicon lens and a second light beam corresponding to the second silicon lens.Type: GrantFiled: February 24, 2021Date of Patent: September 12, 2023Assignee: Huawei Technologies Co., Ltd.Inventors: Rongsheng Miao, Xueyan Zheng, Xiao Andy Shen, Yu Sheng Bai
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Patent number: 11754866Abstract: To enable several orders of magnitude increases in average power and energy handling capability of Faraday rotators, the technology utilizes high speed gas cooling to efficiently remove thermal loading from the Faraday optic faces while minimizing the thermal wavefront and thermal birefringence by creating a longitudinal thermal gradient. A recirculating gas cooling manifold accelerates the gas over the surface of the slab to create a turbulent flow condition which maximizes the surface cooling rate. The technology further provides a spatially uniform thermal profile on the Faraday slabs.Type: GrantFiled: August 27, 2018Date of Patent: September 12, 2023Assignee: Lawrence Livermore National Security, LLCInventors: Andrew J. Bayramian, Alvin C. Erlandson, Daniel C. Mason
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Patent number: 11740404Abstract: One embodiment of the present disclosure relates to an optical fiber having lower transmission loss. The optical fiber is an optical fiber comprised of silica-based glass and includes a core including a central axis and a cladding. The cladding surrounds the core and has a refractive index lower than a refractive index of the core. The core contains phosphorus, chlorine, and fluorine. The core further includes an alkali metal element or an alkaline earth metal element. In a cross section of the optical fiber orthogonal to the central axis, a ratio Rp/Ra of a radius Rp of a phosphorus-containing region with respect to a radius Ra of the core is 0.3 or more.Type: GrantFiled: June 4, 2021Date of Patent: August 29, 2023Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Hirotaka Sakuma, Yoshiaki Tamura, Yuki Kawaguchi, Masato Suzuki
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Patent number: 11740409Abstract: A photonic device includes an optical coupler, a waveguide structure, a metal-dielectric stack, and a protection layer. The optical coupler is over a semiconductor substrate. The waveguide structure is over the semiconductor substrate and laterally connected to the optical coupler. A top of the waveguide structure is lower than a top of the optical coupler. The metal-dielectric stack is over the optical coupler and the waveguide structure. The metal-dielectric stack has a hole above the optical coupler. The protection layer lines the hole of the metal-dielectric stack.Type: GrantFiled: May 9, 2022Date of Patent: August 29, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Sui-Ying Hsu, Yueh-Ying Lee, Chien-Ying Wu, Chen-Hao Huang, Chien-Chang Lee, Chia-Ping Lai
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Patent number: 11726277Abstract: Systems and methods described herein relate to the manufacture of optical elements and optical systems. An example method includes providing a first substrate that has a plurality of light-emitter devices disposed on a first surface. The method includes providing a second substrate that has a mounting surface defining a reference plane. The method includes forming a structure and an optical spacer on the mounting surface of the second substrate. The method additionally includes coupling the first and second substrates together such that the first surface of the first substrate faces the mounting surface of the second substrate at an angle with respect to the reference plane.Type: GrantFiled: September 1, 2022Date of Patent: August 15, 2023Assignee: Waymo LLCInventors: Pierre-Yves Droz, David Schleuning
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Patent number: 11726258Abstract: Photonic devices having a photonic waveguiding layer, and a cladding layer, disposed on the photonic waveguiding layer, and where the cladding section is a material comprising Scandium. The cladding layer may include a material comprising Al1-xScxN material where 0<x?0.45.Type: GrantFiled: January 20, 2022Date of Patent: August 15, 2023Assignees: Raytheon BBN Technologies Corp., Raytheon CompanyInventors: Mohammad Soltani, Eduardo M. Chumbes
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Patent number: 11726332Abstract: A light projection apparatus is provided comprising: a source of light; a switchable grating on a first substrate; and a diffractive optical element. Light is diffracted at least once by the switchable grating and is diffracted at least once by the DOE.Type: GrantFiled: November 15, 2021Date of Patent: August 15, 2023Assignees: DigiLens Inc., Rockwell Collins, Inc.Inventors: Jonathan David Waldern, Milan Momcilo Popovich
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Patent number: 11719963Abstract: An apparatus having a segmented optical modulator includes an optical waveguide having three or more segments. Each of three or more optical modulators includes a corresponding waveguide segment and is configured to apply an optical modulation that is proportional to the length of the segment. Three or more electrical contacts receive respective bit values of binary values. Each binary value includes at least three bit values including a least significant bit (LSB) bit value, a most significant bit (MSB) bit value, and at least one intermediate bit (IB) bit value between the LSB bit value and the MSB bit value. At least one waveguide segment of a corresponding optical modulator receiving an LSB bit value is positioned between a first waveguide segment of a corresponding optical modulator receiving an MSB bit value and a second waveguide segment of a corresponding optical modulator receiving an IB bit value.Type: GrantFiled: April 28, 2021Date of Patent: August 8, 2023Assignee: Lightelligence, Inc.Inventors: Cheng-Kuan Lu, Gilbert Hendry, Huaiyu Meng, Yichen Shen
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Patent number: 11719886Abstract: A polarization volume grating, an optical waveguide system and an electronic device are disclosed. Parameters of the polarization volume grating satisfy with those derived by performing a multivariable optimization algorithm on a merit function of ƒk(d1,?1,d2,?2, . . . , dm,?m,d)=[1?n1(?,?)]2, wherein the parameters include d1,?1,d2,?2, . . . , dm,?m, where m=1,2,3, . . . , and d, m is the number of layers of the polarization volume grating, dm is a thickness of mth layer, ?m is a twist angle in mth layer, and d is a period of the polarization volume grating, k represents a central wavelength on which the multivariable optimization algorithm is performed, ? represents a polar angle of an incident light, ? represents an azimuth angle of the incident light, and n1(?,?) represents a first-order diffraction efficiency of the polarization. volume grating.Type: GrantFiled: February 8, 2022Date of Patent: August 8, 2023Assignee: Goertek Inc.Inventor: Lingshan Li