Patents Examined by Erin B Saad
  • Patent number: 11185949
    Abstract: Method of manufacturing first structural component for or joining with second structural component by groove weld is provided. The first structural component has first surface, second surface and end portion. The component is bent at end portion to form bent portion defining convex and concave faces. First portion of bent portion is removed at convex face in form outer weld surface having first face extending from first surface, and second face connected to first face. Second portion of bent portion is removed at concave face to form inner edge surface having arcuate profile. Inner edge surface extends from second surface and connects to second face via transition portion. A portion of first face, second face, transition portion, and inner edge surface define root protrusion, having a root protrusion height, for first structural component. The root protrusion defines stress protected weld root region isolated beyond and away from root stress flow path.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: November 30, 2021
    Assignee: Caterpillar Inc.
    Inventors: Chad William Kerestes, William Jay Ulrich, IV
  • Patent number: 11184984
    Abstract: A solder printing inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder on the substrate on which a thermosetting adhesive is applied, the solder printing inspection device including: an irradiator that irradiates the solder with light; an imaging device that takes an image of the irradiated solder; a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group; outputs mounting position adjustment information to the component mounting machine.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: November 23, 2021
    Assignee: CKD CORPORATION
    Inventors: Manabu Okuda, Tsuyoshi Ohyama, Norihiko Sakaida
  • Patent number: 11179813
    Abstract: Provided is a flux that includes a heat-resistant activator having low reactivity with thermosetting resins, and a solder paste in which the flux is used. The flux includes 5 wt % or more and 20 wt % or less of any one of a dimer acid, a trimer acid, a hydrogenated dimer acid obtained by hydrogenating the dimer acid, and a hydrogenated trimer acid obtained by hydrogenating the trimer acid, on in total, of two or more of a dimer acid, a trimer acid, a hydrogenated dimer acid obtained by hydrogenating the dimer acid, and a hydrogenated trimer acid obtained by hydrogenating the trimer acid; 30 wt % or more and 70 wt % or less of a thermosetting resin; and 3 wt % or more and 15 wt % or less of an amine. The solder paste includes solder powder and the flux.
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: November 23, 2021
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Yasuhiro Kajikawa, Hiroshi Sugii, Hiroyoshi Kawasaki, Yoshinori Hiraoka
  • Patent number: 11173493
    Abstract: The present invention discloses an adaptive and rapid repairing device for single roller, which includes a working module and a mechanical arm module, which are fixedly connected, where the mechanical arm module is connected with a movable module; the working module includes a supporting frame, symmetrical dovetail grooves are opened in two sides of the supporting frame, the dovetail grooves are movably connected with four sliding supports symmetrically arranged along the supporting frame; a connecting rod support penetrates the two through holes opened in the top of the sliding support, the top end of the connecting rod support is hinged with a long connecting rod; the supporting frame is provided with a worm gear mounting support, the worm gear mounting support is equipped with worm gears and worms through rotating shafts, and the worm is fixedly connected with an output shaft of a worm motor.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: November 16, 2021
    Assignees: Nanchang Hangkong University, Fangda Special Steel Technology Co., Ltd.
    Inventors: Yuhua Chen, Timing Zhang, Jinyang Hu, Shuchun Yuan, Shanlin Wang, Yongde Huang, Yutian Xie, Tao Chen
  • Patent number: 11173567
    Abstract: Bonding processing for a plurality of bonding points of different distances with respect to a reference position (origin) of an object to be bonded without changing a moving distance of bonding means is provided. The bonding means, a bonding stage having a work-holder and a rotary mechanism unit for rotating the work-holder, and a control unit for controlling rotation of the work-holder are provided. The bonding means is movable relative to a placement surface of the work-holder in a reference orientation and has a reference position on its moving direction. The plurality of bonding points include bonding points of different separation distances from the reference position along the moving direction while the object to be bonded is being held to the work-holder in the reference orientation. The control unit corrects differences in the separation distances of the plurality of bonding points by controlling rotation of the work-holder.
    Type: Grant
    Filed: February 22, 2017
    Date of Patent: November 16, 2021
    Inventors: Yuji Komagino, Hodaka Yamaguchi, Hideki Yoshino
  • Patent number: 11161199
    Abstract: Provided are a simple and effective friction welding method that can suppress increases in hardness of the welded part and reductions in hardness (strength) in the heat affected zone regardless of the composition of ferrous material, and a welded structure obtained with the same. The present invention relates to a friction welding method wherein surfaces to be welded of two metal members (2, 4) to be welded are made to slide in contact with each other. The friction welding method is characterized in that at least one of the metal members (2, 4) to be welded is a ferrous material, and the maximum temperature reached during welding is equal to or less than the A3 point or equal to or less than the Acm point of the ferrous material. The maximum temperature reached during welding is preferably equal to or less than the A1 point of the ferrous material.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: November 2, 2021
    Assignee: OSAKA UNIVERSITY
    Inventors: Hidetoshi Fujii, Rintaro Ueji, Yoshiaki Morisada
  • Patent number: 11154945
    Abstract: A method for producing a gas-tight metal-ceramic join is disclosed. In an embodiment a method includes providing at least one ceramic main body having a first end face and a second end face, applying a metallization to at least a partial region of the end faces of the main body, applying a nickel layer to the metallized partial region of the end faces, applying a brazing paste to the metallized partial region of the first end face and/or the second end face of the main body, drying the brazing paste, and firing the brazing paste.
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: October 26, 2021
    Assignee: TDK ELECTRONICS AG
    Inventors: Robert Hoffmann, Stefan Obermair
  • Patent number: 11152328
    Abstract: A uniform pressure gang bonding device and fabrication method are presented using an expandable upper chamber with an elastic surface. Typically, the elastic surface is an elastomer material having a Young's modulus in a range of 40 to 1000 kilo-Pascal (kPA). After depositing a plurality of components overlying a substrate top surface, the substrate is positioned over the lower plate, with the top surface underlying and adjacent (in close proximity) to the elastic surface. The method creates a positive upper chamber medium pressure differential in the expandable upper chamber, causing the elastic surface to deform. For example, the positive upper chamber medium pressure differential may be in the range of 0.05 atmospheres (atm) and 10 atm. Typically, the elastic surface deforms between 0.5 millimeters (mm) and 20 mm, in response to the positive upper chamber medium pressure differential.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: October 19, 2021
    Assignee: eLux, Inc.
    Inventors: Wei-Yuan Ma, Jong-Jan Lee
  • Patent number: 11153976
    Abstract: A method and structure are provided for implementing manufacture of a printed circuit board (PCB) with one of an infrared (IR) reflective mask or a novel solder mask to minimize coefficient of thermal expansion (CTE) mismatch between PCB laminate and plated through hole (PTH) copper. At least one of an IR-reflective mask and a solder mask composition for use in IR reflow processes is created such that radiant heat is reflected away from the major portion of the PCB yet permitted to impinge upon the PTHs. The copper within the PTH expands due to radiant heating while the bulk laminate expansion is significantly reduced due to the reflected IR radiation. Consequently, the CTE mismatch is minimized and tensile strain of the copper in the PTH is reduced, providing enhanced reliability.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: October 19, 2021
    Assignee: International Business Machines Corporation
    Inventors: Kevin O'Connell, Mark Plucinski, Timothy Tofil, Joseph Kuczynski
  • Patent number: 11141812
    Abstract: A friction stir welding method in which a first member to be welded and a second member to be welded and having a first step portion are welded by friction stir welding using a welding tool includes the steps of arranging the first member to be welded on a step supporting surface of the first step portion with a gap between the first member to be welded and a side surface of the first step portion, pushing the welding tool into the first member to be welded from a surface of the first member to be welded while rotating the welding tool and inserting the welding tool until reaching the step supporting surface of the second member to be welded and stirring the first member to be welded and the second member to be welded by rotating the welding tool to form a welding part.
    Type: Grant
    Filed: February 1, 2018
    Date of Patent: October 12, 2021
    Assignee: MITSUBISHI ELECTRIC CORPRATION
    Inventors: Takuya Ikeda, Muneaki Mukuda, Keisuke Murase, Seiiyu Ishimoto
  • Patent number: 11141811
    Abstract: A tool for friction stir welding includes a tool part, a shank part and a cap part. The tool part and the shank part have a hexagonal frustum-shaped concave section and a hexagonal frustum-shaped convex section to enable movement of the tool part with respect to the shank part in a direction parallel to an axis of rotation while movement of the tool part with respect to the shank part in a direction around the axis of rotation is restricted, by the hexagonal frustum-shaped concave section and the hexagonal frustum-shaped convex section of the tool part and the shank part are fitted to each other. After the hexagonal frustum-shaped concave section and the hexagonal frustum-shaped convex section are fitted to each other, by the tool part and the shank part being covered by the cap part, the tool part is fixed to the shank part.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: October 12, 2021
    Assignee: FURUYA METAL CO., LTD.
    Inventors: Tomohiro Maruko, Tomoaki Miyazawa, Yuichi Iwamoto
  • Patent number: 11145620
    Abstract: A wire bonding method, comprising the steps of: extending a length of bonding wire from a capillary to form a wire tail; deforming a point on the wire tail to form a weakened portion between the wire tail and a remainder of the bonding wire retained within the capillary; and retracting at least a portion of the wire tail including the weakened portion into the capillary prior to bonding the wire tail to at least one of a bonding pad and a substrate.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: October 12, 2021
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Mow Huat Goh, Jiang Huang, Ya Ping Zhu, Chi Kwan Park, Keng Yew Song
  • Patent number: 11141807
    Abstract: A wire automatic soldering system includes a carrier adapted to load an electrical product to be soldered, a robot adapted to grip and move the carrier on which the electrical product is loaded, a solder paste container containing a solder paste, and a heater configured to heat the solder paste and melt the solder paste into a liquid. The robot moves a plurality of wires of the electrical product into the solder paste container to solder the wires together with the solder paste.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: October 12, 2021
    Assignees: Tyco Electronics (Shanghai) Co. Ltd., TE Connectivity Servies GmbH, Measurement Specialties (Chengdu) Ltd., Shenzhen AMI Technology Co, Ltd.
    Inventors: Fengchun Xie, Dandan Zhang, Roberto-Francisco Yi Lu, Lvhai Hu, Qinglong Zeng, Lan Gong, Qian Ying, Yingcong Deng, Yun Liu
  • Patent number: 11139626
    Abstract: A thermocompression apparatus includes a stage and a heater chip. The stage includes an installation surface on which a component having a scheduled portion of thermocompression is placed. The heater chip is disposed to be freely movable to and from the scheduled portion of thermocompression of the component opposite to the installation surface of the stage and is configured to heat and press the scheduled portion of thermocompression. The installation surface includes a maximum convex and a pair of slope surfaces. The maximum convex is configured to contact with a bottom surface of the component. The pair of slope surfaces has heights decreasing respectively from the maximum convex toward both sides of the installation surface in a width direction of the component.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: October 5, 2021
    Assignee: TDK CORPORATION
    Inventor: Koki Sato
  • Patent number: 11135674
    Abstract: A method of performing friction stir spot welding of a plurality of steel plates, includes the steps of: friction stirring a spot welding portion of the plurality of steel plates by pressing a tool against the spot welding portion while rotating the tool, to plasticize the spot welding portion by friction heat; cooling the spot welding portion to cause martensitic transformation to occur in the spot welding portion, after the step of friction stirring the spot welding portion; and tempering the spot welding portion by the friction heat by re-pressing the tool against the spot welding portion while rotating the tool, after the step of cooling the spot welding portion.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: October 5, 2021
    Assignee: KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventors: Ryoji Ohashi, Yoshitaka Muramatsu, Masahiro Miyake, Takuya Fukuda
  • Patent number: 11130188
    Abstract: A jet solder bath for performing soldering by jetting molten solder to bring the molten solder into contact with a substrate is provided with a primary jet nozzle that jets the molten solder by a first jet pump, as a first jet nozzle, and a secondary jet nozzle, as a second jet nozzle, which is arranged at a downstream side of the primary jet nozzle along a carrying direction of the substrate and jets the molten solder by a second jet pump. The primary jet nozzle includes a first nozzle body, and a first solder-flow-forming plate that is provided at an upper end of the first nozzle body and has a plurality of jet holes, and the secondary jet nozzle includes a second nozzle body and a second solder-flow-forming plate that is provided at an upper end of the second nozzle body and has a plurality of jet holes.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: September 28, 2021
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Takashi Sugihara, Kaname Nagata
  • Patent number: 11130194
    Abstract: The friction stir welding tool member according to the present invention is made of a ceramic member in which a shoulder portion and a probe portion are integrally formed, wherein a root portion of the probe portion and an end portion of the shoulder portion have a curved surface shape; and the friction stir welding tool member has a ratio (R1/D) of 0.02 or more and 0.20 or less when a curvature radius of the end portion of the shoulder portion is defined as R1 (mm) and an outer diameter of the shoulder portion is defined as D (mm). In addition, the ceramic member is preferably made of a silicon nitride sintered body having a Vickers hardness of 1400 HV1 or more. According to the above-described configuration, a friction stir welding tool member having excellent durability can be provided.
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: September 28, 2021
    Assignees: OSAKA UNIVERSITY, TOSHIBA MATERIALS CO., LTD.
    Inventors: Hidetoshi Fujii, Yoshiaki Morisada, Kai Funaki, Isao Ikeda, Yutaka Abe, Masahiro Kato
  • Patent number: 11130193
    Abstract: A friction stir welding tool includes a housing and a stir pin. The housing includes a first surface, a housing hole formed in the housing and having a housing hole opening on the first surface, and a discharge hole through which the housing hole is in communication with an outside of the housing. The stir pin includes a pin holder and a pin body. The pin holder has a first end portion and a second end portion. The first end portion is configured to be connected to a rotation spindle. The pin body is provided in the housing hole, is detachably attached to the second end portion, and is rotatable together with the pin holder around the rotation axis. The pin body includes a stir portion that protrudes from the first surface via the housing hole opening.
    Type: Grant
    Filed: July 14, 2020
    Date of Patent: September 28, 2021
    Assignee: YAMAZAKI MAZAK CORPORATION
    Inventors: Masayasu Hachiya, Eiji Matsubara, Toru Murakami, Seigo Ouchi
  • Patent number: 11127890
    Abstract: The method for assembling a carrier comprises a step A), in which a plurality of pigments (100), each with an electronic component (1), is provided. Further, each pigment comprises a meltable solder material (2) directly adjoining a mounting side (10) of the component. At least 63% by volume of each pigment is formed by the solder material. The mounting side of each component has a higher wettability with the molten solder material than a top side (12) and a side surface (11) of the component. In a step B), a carrier (200) with pigment landing areas (201) is provided, the pigment landing areas having higher wettability with the molten solder material of the pigments than the regions laterally adjacent to the pigment landing areas and than the side surfaces and the top sides of the components. In a step C), the pigments are applied to the carrier. In a step D), the pigments are heated so that the solder material melts.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: September 21, 2021
    Assignee: OSRAM OLED GmbH
    Inventor: Andreas Ploessl
  • Patent number: 11123825
    Abstract: A copper-based brazing material comprises an alloy having nickel in a proportion of from 20 to 35 percent by weight, zinc in a proportion of from 5 to 20 percent by weight, manganese in a proportion of from 5 to 20 percent by weight, chromium in a proportion of from 1 to 10 percent by weight, silicon in a proportion of from 0.1 to 5 percent by weight and molybdenum in a proportion of from 0 to 7 percent by weight, each based on the total weight of the alloy, and the remainder being copper and unavoidable impurities. The alloy is in particular free from boron, phosphorus and lead. The brazing material can be used for induction brazing of components made of iron materials for exhaust systems in motor vehicles.
    Type: Grant
    Filed: August 16, 2017
    Date of Patent: September 21, 2021
    Inventors: Marc Steigerwald, Simon Burger, Yasir Muhammad, Helmut Wieser