Abstract: This application relates to a protective apparatus. The protective apparatus is configured to protect a to-be-welded part, the to-be-welded part includes a welding region, and the protective apparatus includes a base and a protective mechanism. The base is configured for embedding the to-be-welded part. The protective mechanism is connected to the base. The protective mechanism includes a welding hole, where the welding hole is provided corresponding to the welding region; and a surface of the protective mechanism facing the welding hole is provided with a thermally conductive coating, where the thermally conductive coating is configured to guide substances formed in welding the to-be-welded part to slide down along the surface of the thermally conductive coating. The protective apparatus in this application can improve welding quality of the welding region, thereby enhancing performance of the to-be-welded part.

Abstract: The present invention includes: a primary joining process in which a coarse portion having a predetermined width is formed in the vicinity of a step side face within a plasticized region while the rotary tool is being moved one round along a first butted portion to perform friction stirring in a state that a tip of a stirring pin of a rotary tool being rotated is inserted to the same depth as or slightly deeper than a step bottom face and a bottom face of a shoulder portion is in contact with a front face of a sealing body and the stirring pin is slightly in contact with at least an upper portion of a jacket body; and an inspection process in which a passed position of the stirring pin is specified by performing, after the primary joining process, a flaw detection to detect the coarse portion.

Abstract: An apparatus for use in a continuous welding system including a welding head configured to remain stationary relative to translating steel sheets or plates. The apparatus includes a hollow elongate body and a port. The body extends between two closed ends. The port is coupled to a non-oxidizing gas source and in communication with the body. The body defines a plurality of openings. The openings are configured to direct non-oxidizing gas towards the steel sheets or plates to simultaneously shield a weld formed by the welding head from atmosphere and cool the weld.

Abstract: A repair welding system includes an inspection device configured to inspect an appearance of a welded portion of a workpiece, and a robot control device that controls a robot configured to weld the workpiece. The inspection device determines whether there is a defective portion among welded portions of the workpiece based on a predetermined standard, and sets one of a plurality of defect ranks to the defective portion in a case that the defective portion is detected. The robot control device generates a repair welding program corresponding to the defect rank, and instructs the robot to execute, in accordance with the repair welding program, a repair welding on the defective portion to which the defect rank is set.

Abstract: An arrangement for making a diffusion solder connection between an electrically conductive contact element and a workpiece includes a protective chamber and an acceleration device. The protective chamber has a workpiece position at which at least a portion of the workpiece is arranged. The acceleration device shoots the electrically conductive contact element into the workpiece arranged at the workpiece position.

Abstract: A bonding member (10) includes surface-processed silver surfaces (11a, 11b).

Abstract: A soldering system comprising a solder pot and a nozzle exchange unit. The solder pot is configured to detachably couple to a solder nozzle during a soldering operation. The nozzle exchange unit is arranged to: store a plurality of solder nozzles; detach a first nozzle from the nozzle coupling; and attach a stored second nozzle to the nozzle coupling.

Abstract: An example system for maintaining the shape of a circuit board includes metal balls that are configured not to collapse in whole or part in response to a force below a predefined force and a temperature below a predefined temperature. The metal balls are configured to support a substrate and are part of electrical connections between the substrate and a circuit board. The system includes a fixture configured to apply force to the substrate while the substrate is subjected to the temperature. The fixture is configured to distribute the force across a surface of the substrate that is not in contact with the metal balls such that the force applied by the fixture and the support of the substrate by the metal balls maintains a shape of the substrate at the temperature.

Abstract: A brazing sheet may be used for brazing under an atmosphere of an inert gas without flux. The brazing sheet may include at least three layers. The at least three layers may include a core material, a brazing material layer, and an intermediate layer. The at least three layers may be cladded by an outermost layer of the brazing material layer. The intermediate layer may be disposed on a face of the core material. The core material may be composed of a first aluminum alloy including at least one of (i) 0.20 weight % to 1.0 weight % of Cu, (ii) 0.8 weight % to 1.8 weight % of Mn, and (iii) 0.25 weight % to 1.5 weight % of Mg. The intermediate layer may be composed of a second aluminum alloy including 0.20 weight % or less of each of Si and Fe and 0.10 weight % or less of each of Cu, Mn, and Cr.

Abstract: A method for soldering an SMD component to a circuit carrier in a positionally stable manner, includes: a) providing a circuit carrier including a printed circuit board (PCB) contact surface, which is coated with a soldering paste (SP); b) applying an adhesive point onto the circuit carrier wherein the adhesive point delimits the PCB contact surface coated with SP; c) placing an SMD component, which includes a component contact surface, on the PCB contact surface coated with SP wherein the component contact surface contacts the PCB contact surface via the SP and the SMD component rests on the SP without contacting the adhesive point; d) waiting to complete a curing process of the adhesive point; and e) heating, melting and subsequently cooling the SP to produce an electric, thermal and/or a mechanical connection between the component and PCB contact surfaces, wherein the SMD component is allowed to vertically sink in molten SP and is mechanically restricted from drifting horizontally on the molten SP by means

Abstract: A lead-free solder alloy comprising: from 1 to 9 wt. % copper, at least one of: from greater than 0 to 1 wt. % nickel, from greater than 0 to 10 wt. % germanium, from greater than 0 to 10 wt. % manganese, from greater than 0 to 10 wt. % aluminium, from greater than 0 to 10 wt. % silicon, from greater than 0 to 9 wt. % bismuth, from greater than 0 to 5 wt. % indium, from greater than 0 to 1 wt. % titanium, from greater than 0 to 2 wt. % lanthanum, from greater than 0 to 2 wt. % neodymium, optionally one or more of: up to 1 wt. % for: chromium, gallium, cobalt, iron, phosphorous, gold, tellurium, selenium, calcium, vanadium, molybdenum, platinum, magnesium; up to 5 wt. % silver, up to 1 wt. % zinc, up to 2 wt. % rare earth metals, excluding lanthanum and neodymium, and the balance tin together with any unavoidable impurities.

Abstract: A folding plate according to an embodiment of the present invention has first and second support portions located on both sides of a folding portion that is foldable, and is formed as a multilayer structure in which first and second metal sheets of different metal materials are braze-bonded, and thus, is thin and lightweight, has excellent flexibility, and easily dissipates heat.

Abstract: A method of calibrating an ultrasonic characteristic on a wire bonding system is provided. The method includes the steps of: (a) determining a reference ultrasonic characteristic for formation of a wire bond; (b) determining a reference non-stick ultrasonic characteristic that results in a non-stick wire bond condition; (c) determining a calibration non-stick ultrasonic characteristic, on a wire bonding system to be calibrated, that results in a non-stick wire bond condition; and (d) determining a calibration factor for the wire bonding system to be calibrated using the reference non-stick ultrasonic characteristic and the calibration non-stick ultrasonic characteristic.

Abstract: A method for manufacturing a hollow container with use of a rotary tool including a tapered stirring pin, including: preparing a first metal member, a second metal member, and an auxiliary member; butting the first metal member and the second metal member to face with each other, the auxiliary member is interposed between the first metal member and the second metal member; and joining the first metal member with the second metal member via the auxiliary member. The first and second metal members, and the auxiliary member are made of aluminum or an aluminum alloy, and the first and second metal members have higher hardness than the auxiliary member. At least one of the first and second metal members has an inclined surface inclined outward, and the auxiliary member has an inclined surface, tapered from the external surface toward an internal surface, on at least one of the side surfaces.

Abstract: A method of soldering one or more components to a substrate includes providing a substrate and applying an amount of solder material to the top planar surface of the substrate. One or more electrical components are mounted to the solder material in a predetermined position and orientation. A carrier is provided having one or more magnets embedded therein. The substrate is positioned above the carrier such that each of the one or more magnets is positioned directly below a corresponding electrical component. A carrier cover is positioned above the substrate and the electrical components. The solder material is heated to a predetermined temperature for a predetermined amount of time during which each of the magnets exerts a magnetic force on a corresponding electrical component to maintain its orientation relative to the substrate. The magnets reduce the occurrence of tombstoning of the electrical components during heating of the solder material.

Abstract: A method of welding includes providing first and second joining partners, providing a welding apparatus that includes a sonotrode comprising a structured working surface, arranging the first and second joining partners to contact one another, and forming a welded connection between the first and second joining partners by contacting the first joining partner with the structured working surface and vibrating the sonotrode at an ultrasonic frequency, wherein the structured working surface comprises a plurality of apexes, a plurality of nadirs between immediately adjacent ones of the apexes, and planar sidewalls that extend between the nadirs and the apexes, and wherein for each of the apexes the planar sidewalls on either side of the respective apex extend along first and second planes that intersect one another at an acute angle.

Abstract: A welded structural assembly and method, in one form, includes an upper substrate, a lower substrate adjacent the upper substrate, a fastener, and a sealing member. The fastener includes a shank portion, a first head portion, and a second head portion. The shank portion extends through the upper substrate and into the lower substrate. The shank is welded to the lower substrate. The first head portion has an outer periphery and an underside. The second head portion is frangibly coupled to the first head portion. The sealing member is disposed under the first head portion between the upper substrate and the first head portion. The sealing member contacts the underside and extends beyond the outer periphery such that the sealing member extends radially outward beyond all points of the first head portion.

Abstract: To provide a vibration conversion apparatus capable of reducing occurrence of cracks although using a longitudinal vibration converter for obtaining a torsional vibration. The vibration conversion apparatus comprises: a first longitudinal vibration converter and a longitudinal-torsional transducer having a one-wavelength torsional vibrator portion and a first flexural resonator portion. The first flexural resonator portion is interposed between the first longitudinal vibration converter and the one-wavelength torsional vibrator portion. The first flexural resonator portion is configured such that when a longitudinal vibration generated by at least the first longitudinal vibration converter is received from one end of the first flexural resonator portion, the first flexural resonator portion is bent and imparts a rotational force from the other end of the first flexural resonator portion to the one-wavelength torsional vibrator portion.

Abstract: A method and apparatus for joining using friction and current, wherein the friction/current joining apparatus includes a friction device, a forging device, an electrical current source, and a programmable controller, as well as workpiece holders for the workpieces to be joined. The friction/current joining apparatus is controlled such that, in a contacting phase, the workpieces are initially moved along a process axis, and their mutually facing joining surfaces oriented transverse to a common process axis are brought into contact. In a grinding phase, while subjected to contact pressure by mutual relative movement, the joining surfaces, are ground together and made smooth.

Abstract: A wire bonding device for performing a wire bonding process includes: a bonding tool for inserting a wire; an ultrasonic vibrator; a drive mechanism for moving the bonding tool; and a control part. The control part performs: a bonding step of bonding the wire to a bonding point; a tail feeding out step of feeding out a wire tail from the wire bonded to the bonding point; a tension applying step of raising the bonding tool to apply tension to the wire while the wire is clamped; a tension release step of lowering the bonding tool to release the tension applied to the wire; and after performing a series of steps including the tension applying step and the tension release step at least once, a tail cutting step of raising the bonding tool to cut the wire tail from the wire.