Patents Examined by Erin B Saad
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Patent number: 12179294Abstract: A device for jointing elements of a pipeline for the transport of fluids includes a support structure on which a pipeline section to be jointed is intended to be mounted, two parallel fixed rails, four plates each comprising a first element capable of cooperating with a rail and a second element fixed on the support structure. The first and the second elements of each plate is linked by a first cylinder aligned along a first adjustment axis and a second cylinder aligned along a second adjustment axis, and a system for controlling the cylinders of the plates to achieve movements along the first and second adjustment axes and capable of cooperating with a system for guiding in translation the support structure along the longitudinal axis of the pipeline section to allow jointing of the pipeline section and the pipeline element.Type: GrantFiled: November 12, 2019Date of Patent: December 31, 2024Assignee: SAIPEM S.A.Inventor: Liborio Moceri
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Patent number: 12179281Abstract: The present invention relates to a sonotrode for crimping an edge of a container having an end face, which is intended to contact the edge of the container during a relative movement along a longitudinal axis, wherein the end face comprises a crimping portion, at least portions of which form an angle with the longitudinal axis that is greater than 0° and is less than 90°, and the crimping portion is intended to contact the edge being crimped.Type: GrantFiled: March 18, 2023Date of Patent: December 31, 2024Assignee: HERRMANN ULTRASCHALLTECHNIK GMBH & CO. KGInventor: Valentin Buchty
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Patent number: 12179290Abstract: Provided is a system for detecting a poor weld in a welded portion of a battery module, the system including a battery module fixation unit fixing the battery module to be inspected, an inspection position movement unit moving the battery module fixation unit to a welding inspection position, a welding inspection unit including a frictional reaction force measurement unit inducing a slight movement of the welded portion of the battery module and measuring a frictional reaction force generated thereby and a vision inspection camera detecting an amount of change in a position of the welded portion of the battery module, and a control unit determining whether the welded portion of the battery module is poorly welded based on the frictional reaction force and the amount of position change, measured by the welding inspection unit.Type: GrantFiled: March 4, 2022Date of Patent: December 31, 2024Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventor: Kyungmo Kim
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Patent number: 12179279Abstract: A method for producing a joining connection between at least two metal sheets or at least two components made of hot-workable sheet metal with a scaling-resistant coating, is provided. The method includes at least one step in which a connection is produced between the at least two metal sheets or sheet-metal components by hot-press soldering, wherein the surface of the metal sheets or components to be connected is pretreated in order to break up the coating.Type: GrantFiled: February 26, 2021Date of Patent: December 31, 2024Assignee: MAGNA INTERNATIONAL INC.Inventors: Jörg Lerch, Stephan Kaufhold, Edward Schleichert
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Patent number: 12176319Abstract: A system for reflowing a semiconductor workpiece including a stage, a first vacuum module and a second vacuum module, and an energy source is provided. The stage includes a base and a protrusion connected to the base, the stage is movable along a height direction of the stage relative to the semiconductor workpiece, the protrusion operably holds and heats the semiconductor workpiece, and the protrusion includes a first portion and a second portion surrounded by and spatially separated from the first portion. The first vacuum module and the second vacuum module respectively coupled to the first portion and the second portion of the protrusion, and the first vacuum module and the second vacuum module are operable to respectively apply a pressure to the first portion and the second portion. The energy source is disposed over the stage to heat the semiconductor workpiece held by the protrusion of the stage.Type: GrantFiled: February 22, 2023Date of Patent: December 24, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Cheng-Shiuan Wong, Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Hsuan-Ting Kuo, Wei-Yu Chen, Chia-Shen Cheng, Philip Yu-Shuan Chung
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Patent number: 12168260Abstract: A method of welding a first member and a second member together includes preparing the first member and the second member, bringing the first member and the second member into contact to form a space between the first member and the second member, and bringing a welding horn into contact with the first member or the second member. The method of welding further includes performing a vibration process to vibrate the welding horn to weld the first member and the second member together by frictional heat, and performing a fluid-flow process to make fluid flow through the space. The fluid-flow process is performed during the vibration process.Type: GrantFiled: November 17, 2021Date of Patent: December 17, 2024Assignee: Canon Kabushiki KaishaInventors: Masatoshi Ohira, Masato Takikawa, Kenji Fujii, Naoki Nakajo
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Patent number: 12169104Abstract: A stainless-steel heat-exchanger port with a braze joint interface formed from a brazing filler material by vacuum melting and molding, including: a stainless-steel port, an annular groove provided at a to-be-brazed end face of the stainless-steel port, a brazing filler material correspondingly arranged in the annular groove, and a sealing cover for preventing overflowing of the brazing filler material when melted, wherein the brazing filler material is one of copper, brass, phosphorus copper, and silver brazing filler materials. A processing method for the stainless-steel heat-exchanger port with a braze joint interface formed from the brazing filler material by vacuum melting and molding.Type: GrantFiled: July 21, 2022Date of Patent: December 17, 2024Inventor: Shangzhong Ji
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Patent number: 12151303Abstract: The present invention includes: a primary joining process in which a coarse portion having a predetermined width is formed in the vicinity of a step side face within a plasticized region while the rotary tool is being moved one round along a first butted portion to perform friction stirring in a state that a tip of a stirring pin of a rotary tool being rotated is inserted to the same depth as or slightly deeper than a step bottom face and a bottom face of a shoulder portion is in contact with a front face of a sealing body and the stirring pin is slightly in contact with at least an upper portion of a jacket body; and an inspection process in which a passed position of the stirring pin is specified by performing, after the primary joining process, a flaw detection to detect the coarse portion.Type: GrantFiled: March 26, 2020Date of Patent: November 26, 2024Assignee: NIPPON LIGHT METAL COMPANY, LTD.Inventors: Hisashi Hori, Nobushiro Seo
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Patent number: 12151317Abstract: This application relates to a protective apparatus. The protective apparatus is configured to protect a to-be-welded part, the to-be-welded part includes a welding region, and the protective apparatus includes a base and a protective mechanism. The base is configured for embedding the to-be-welded part. The protective mechanism is connected to the base. The protective mechanism includes a welding hole, where the welding hole is provided corresponding to the welding region; and a surface of the protective mechanism facing the welding hole is provided with a thermally conductive coating, where the thermally conductive coating is configured to guide substances formed in welding the to-be-welded part to slide down along the surface of the thermally conductive coating. The protective apparatus in this application can improve welding quality of the welding region, thereby enhancing performance of the to-be-welded part.Type: GrantFiled: February 24, 2023Date of Patent: November 26, 2024Assignee: CONTEMPORARY AMPEREX TECHNOLOGY (HONG KONG) LIMITEDInventors: Yongli Zhang, Zhihua Wen, Yunru Shi, Cong Zhang, Yitai Guo
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Patent number: 12145221Abstract: An apparatus for use in a continuous welding system including a welding head configured to remain stationary relative to translating steel sheets or plates. The apparatus includes a hollow elongate body and a port. The body extends between two closed ends. The port is coupled to a non-oxidizing gas source and in communication with the body. The body defines a plurality of openings. The openings are configured to direct non-oxidizing gas towards the steel sheets or plates to simultaneously shield a weld formed by the welding head from atmosphere and cool the weld.Type: GrantFiled: April 3, 2020Date of Patent: November 19, 2024Assignee: Cleveland-Cliffs Steel Properties Inc.Inventors: James Frederick Evans, Steven Wayne Streibick, Stephen Bryant Tate
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Patent number: 12145219Abstract: A repair welding system includes an inspection device configured to inspect an appearance of a welded portion of a workpiece, and a robot control device that controls a robot configured to weld the workpiece. The inspection device determines whether there is a defective portion among welded portions of the workpiece based on a predetermined standard, and sets one of a plurality of defect ranks to the defective portion in a case that the defective portion is detected. The robot control device generates a repair welding program corresponding to the defect rank, and instructs the robot to execute, in accordance with the repair welding program, a repair welding on the defective portion to which the defect rank is set.Type: GrantFiled: December 27, 2021Date of Patent: November 19, 2024Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Takamichi Komatsu, Toshinari Mohri, Ryutaro Monden
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Patent number: 12138707Abstract: An arrangement for making a diffusion solder connection between an electrically conductive contact element and a workpiece includes a protective chamber and an acceleration device. The protective chamber has a workpiece position at which at least a portion of the workpiece is arranged. The acceleration device shoots the electrically conductive contact element into the workpiece arranged at the workpiece position.Type: GrantFiled: March 15, 2022Date of Patent: November 12, 2024Assignee: TE Connectivity Germany GmbHInventors: Rudi Blumenschein, Frank Kaehny, Manuel Eheim
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Patent number: 12134146Abstract: A bonding member (10) includes surface-processed silver surfaces (11a, 11b).Type: GrantFiled: July 13, 2022Date of Patent: November 5, 2024Assignee: OSAKA UNIVERSITYInventors: Katsuaki Suganuma, Chuantong Chen, Toshiyuki Ishina, Seungjun Noh, Chanyang Choe
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Patent number: 12128505Abstract: A soldering system comprising a solder pot and a nozzle exchange unit. The solder pot is configured to detachably couple to a solder nozzle during a soldering operation. The nozzle exchange unit is arranged to: store a plurality of solder nozzles; detach a first nozzle from the nozzle coupling; and attach a stored second nozzle to the nozzle coupling.Type: GrantFiled: July 7, 2021Date of Patent: October 29, 2024Assignee: Illinois Tool Works Inc.Inventors: Antonie Cornelis Colijn, Gerardus Johannes Adrianus Maria Diepstraten
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Patent number: 12127334Abstract: An example system for maintaining the shape of a circuit board includes metal balls that are configured not to collapse in whole or part in response to a force below a predefined force and a temperature below a predefined temperature. The metal balls are configured to support a substrate and are part of electrical connections between the substrate and a circuit board. The system includes a fixture configured to apply force to the substrate while the substrate is subjected to the temperature. The fixture is configured to distribute the force across a surface of the substrate that is not in contact with the metal balls such that the force applied by the fixture and the support of the substrate by the metal balls maintains a shape of the substrate at the temperature.Type: GrantFiled: February 26, 2019Date of Patent: October 22, 2024Assignee: Dis Tech America, LLCInventors: Heng-Kit Too, Xue-Bin Tan, Max Zhang, Rocky Tao, Brian Brecht, Iris Weng, Hale Deng
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Patent number: 12121998Abstract: A brazing sheet may be used for brazing under an atmosphere of an inert gas without flux. The brazing sheet may include at least three layers. The at least three layers may include a core material, a brazing material layer, and an intermediate layer. The at least three layers may be cladded by an outermost layer of the brazing material layer. The intermediate layer may be disposed on a face of the core material. The core material may be composed of a first aluminum alloy including at least one of (i) 0.20 weight % to 1.0 weight % of Cu, (ii) 0.8 weight % to 1.8 weight % of Mn, and (iii) 0.25 weight % to 1.5 weight % of Mg. The intermediate layer may be composed of a second aluminum alloy including 0.20 weight % or less of each of Si and Fe and 0.10 weight % or less of each of Cu, Mn, and Cr.Type: GrantFiled: February 5, 2021Date of Patent: October 22, 2024Assignees: Mahle International GmbH, Mahle Filter Systems Japan CorporationInventors: Masahiro Ariyama, Yohei Hatano, Hiroshi Kumagai
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Patent number: 12127350Abstract: A method for soldering an SMD component to a circuit carrier in a positionally stable manner, includes: a) providing a circuit carrier including a printed circuit board (PCB) contact surface, which is coated with a soldering paste (SP); b) applying an adhesive point onto the circuit carrier wherein the adhesive point delimits the PCB contact surface coated with SP; c) placing an SMD component, which includes a component contact surface, on the PCB contact surface coated with SP wherein the component contact surface contacts the PCB contact surface via the SP and the SMD component rests on the SP without contacting the adhesive point; d) waiting to complete a curing process of the adhesive point; and e) heating, melting and subsequently cooling the SP to produce an electric, thermal and/or a mechanical connection between the component and PCB contact surfaces, wherein the SMD component is allowed to vertically sink in molten SP and is mechanically restricted from drifting horizontally on the molten SP by meansType: GrantFiled: April 29, 2021Date of Patent: October 22, 2024Assignee: ZKW Group GmbHInventors: Christoph Haiden, Johannes Spitzer, Christoph Rainer
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Patent number: 12115602Abstract: A lead-free solder alloy comprising: from 1 to 9 wt. % copper, at least one of: from greater than 0 to 1 wt. % nickel, from greater than 0 to 10 wt. % germanium, from greater than 0 to 10 wt. % manganese, from greater than 0 to 10 wt. % aluminium, from greater than 0 to 10 wt. % silicon, from greater than 0 to 9 wt. % bismuth, from greater than 0 to 5 wt. % indium, from greater than 0 to 1 wt. % titanium, from greater than 0 to 2 wt. % lanthanum, from greater than 0 to 2 wt. % neodymium, optionally one or more of: up to 1 wt. % for: chromium, gallium, cobalt, iron, phosphorous, gold, tellurium, selenium, calcium, vanadium, molybdenum, platinum, magnesium; up to 5 wt. % silver, up to 1 wt. % zinc, up to 2 wt. % rare earth metals, excluding lanthanum and neodymium, and the balance tin together with any unavoidable impurities.Type: GrantFiled: December 26, 2019Date of Patent: October 15, 2024Assignee: Alpha Assembly Solutions Inc.Inventors: Ranjit Pandher, Niveditha Nagarajan, Anil Kumar, Morgana de Avila Ribas, Gyan Dutt, Siuli Sarkar, Carl Bilgrien
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Patent number: 12120257Abstract: A folding plate according to an embodiment of the present invention has first and second support portions located on both sides of a folding portion that is foldable, and is formed as a multilayer structure in which first and second metal sheets of different metal materials are braze-bonded, and thus, is thin and lightweight, has excellent flexibility, and easily dissipates heat.Type: GrantFiled: April 5, 2021Date of Patent: October 15, 2024Assignee: AMOSENSE CO., LTD.Inventor: Jihyung Lee
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Patent number: 12109647Abstract: A method for manufacturing a hollow container with use of a rotary tool including a tapered stirring pin, including: preparing a first metal member, a second metal member, and an auxiliary member; butting the first metal member and the second metal member to face with each other, the auxiliary member is interposed between the first metal member and the second metal member; and joining the first metal member with the second metal member via the auxiliary member. The first and second metal members, and the auxiliary member are made of aluminum or an aluminum alloy, and the first and second metal members have higher hardness than the auxiliary member. At least one of the first and second metal members has an inclined surface inclined outward, and the auxiliary member has an inclined surface, tapered from the external surface toward an internal surface, on at least one of the side surfaces.Type: GrantFiled: February 7, 2020Date of Patent: October 8, 2024Assignee: NIPPON LIGHT METAL COMPANY, LTD.Inventors: Nobushiro Seo, Keita Oikawa, Ryo Yoshida