Patents Examined by Erin Saad
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Patent number: 8973807Abstract: In some cases, it is difficult to carry out ultrasonic joining of high quality with a conventional bonding tool. A bonding tool includes: a horn that transmits an ultrasonic vibration; an ultrasonic vibrator that is provided at one end of the horn, and generates the ultrasonic vibration; and an electronic component holding part that holds an electronic component, wherein the electronic component holding part has a male fitting part in a shape of a tapering-off, and an electronic component holding face that holds the electronic component on an opposite side to the male fitting part, a female fitting part in a shape according to a shape of the male fitting part is formed in a predetermined face of the horn, and the male fitting part is fitted into the female fitting part via an adhesion layer.Type: GrantFiled: April 12, 2011Date of Patent: March 10, 2015Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Ryo Fujita, Hiroshi Ebihara
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Patent number: 8960524Abstract: A burring apparatus for a friction welding machine comprises a clamp unit provided at the front end of a horizontal main spindle, for holding work piece W1 coaxial with the main spindle, a clamp unit provided at the front end of a slide movable to and away from the main spindle in the direction of the axis of the main spindle and a doughnut-shaped cutter for shearing off a burr. Work piece W2 is moved forward together with the slide until work piece W2 comes into contact with work piece W1 so that the mated ends of work pieces W1 and W2 are friction welded together to form a joint work piece W. The burr formed on the jointed work piece W is sheared off by the cutter. The jointed work piece W is then liberated from the main spindle.Type: GrantFiled: November 25, 2010Date of Patent: February 24, 2015Assignee: Nittan Valve Co., Ltd.Inventors: Takehiro Okuno, Ryo Onose, Koji Sakane, Koichi Homma
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Patent number: 8955733Abstract: A clamping module for a pipe line-up system uses bell crank linkages to transmit pipe alignment and clamping forces between radially moving clamping feet and a central axially moving driving head. The clamping feet are arranged in axially spaced sets to internally engage two pipe sections to be welded independently on either side of a weld zone between the pipe sections, with welding shoes in between the clamping feet and spanning the weld zone. The bell crank linkages provide a force multiplier between the driving heads and the clamping feet.Type: GrantFiled: September 28, 2012Date of Patent: February 17, 2015Assignee: Tri Tool Inc.Inventors: Jerald Vanderpol, Vinh T. Hoang
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Patent number: 8950648Abstract: Apparatus for assisting in weld assembling a box column from a tack-welded pre-assembly of planar plate components. The apparatus features (1) an elongate frame defining a rotational-assembly axis, and (2) plural pre-assembly-receiving, rotational support structures mounted at spaced locations on the frame—each support structure including (a) an openable/closable yoke possessing a collar-reception zone, (b) an openable/closable collar rotatably receivable within this reception zone, and possessing a central throughpassage having a cross-sectional configuration which is larger than that of a box-column which is to be assembled, and (c) a pair of removably-collar-attachable, throughpassage clamping shoes for forming cooperatively, within the collar throughpassage, a window for complementarily, receiving extension therethrough of a box-column pre-assembly's cross section.Type: GrantFiled: April 28, 2012Date of Patent: February 10, 2015Assignee: ConXtech, Inc.Inventor: Robert J. Simmons
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Patent number: 8944309Abstract: A solder joint may be used to attach components of an organic vapor jet printing device together with a fluid-tight seal that is capable of performance at high temperatures. The solder joint includes one or more metals that are deposited over opposing component surfaces, such as an inlet side of a nozzle plate and/or an outlet side of a mounting plate. The components are pressed together to form the solder joint. Two or more of the deposited metals may be capable of together forming a eutectic alloy, and the solder joint may be formed by heating the deposited metals to a temperature above the melting point of the eutectic alloy. A diffusion barrier layer and an adhesion layer may be included between the solder joint and each of the components.Type: GrantFiled: February 22, 2013Date of Patent: February 3, 2015Assignee: The Regents of The University of MichiganInventors: Stephen R. Forrest, Gregory McGraw
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Patent number: 8939347Abstract: The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic compound interconnect. The intermetallic compound interconnect may be exposed to a magnetic field, which can heat a solder material to a reflow temperature for attachment of microelectronic components comprising the microelectronic packages.Type: GrantFiled: April 28, 2010Date of Patent: January 27, 2015Assignee: Intel CorporationInventors: Rajasekaran Swaminathan, Ravindranath V. Mahajan
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Patent number: 8925791Abstract: A system includes host and learning machines. Each machine has a processor in electrical communication with at least one sensor. Instructions for predicting a binary quality status of an item of interest during a repeatable process are recorded in memory. The binary quality status includes passing and failing binary classes. The learning machine receives signals from the at least one sensor and identifies candidate features. Features are extracted from the candidate features, each more predictive of the binary quality status. The extracted features are mapped to a dimensional space having a number of dimensions proportional to the number of extracted features. The dimensional space includes most of the passing class and excludes at least 90 percent of the failing class. Received signals are compared to the boundaries of the recorded dimensional space to predict, in real time, the binary quality status of a subsequent item of interest.Type: GrantFiled: April 29, 2014Date of Patent: January 6, 2015Assignee: GM Global Technology Operations LLCInventors: Jeffrey A Abell, John Patrick Spicer, Michael Anthony Wincek, Hui Wang, Debejyo Chakraborty
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Patent number: 8919631Abstract: Disclosed is an apparatus for mounting a transducer to a bond head of a wire bonder. In particular, the bond head of the wire bonder is operative to mechanically drive the transducer when forming electrical interconnections between separate locations within a semiconductor package. Specifically, the apparatus comprises: i) a flexural structure having a connector for connecting to the transducer, the flexural structure being configured to bend; and ii) at least one actuator attached to the flexural structure, the at least one actuator being operative to bend the flexural structure to thereby cause a displacement of the transducer connected thereto via the connector.Type: GrantFiled: March 15, 2012Date of Patent: December 30, 2014Assignee: ASM Technology Singapore Pte LtdInventors: Yam Mo Wong, Ka Shing Kwan, Hing Leung Li, Xiang Chao Li
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Patent number: 8910850Abstract: A method and a device for controlling a thermal cycle of a weld joining one end of a first strip to an end of a second strip, suited to a joining machine of a strip treatment plant. The control device includes connections intended to connect the control device to a central automation system of the strip treatment plant and to the joining machine respectively, so as respectively to allow an exchange of at least one strip data item and an exchange of at least one operating data item. A computer is capable of computing, from the strip and operating data items, at least one thermal parameter of the weld. A weld control and characterization device is capable of controlling the welding as a function of the thermal parameter.Type: GrantFiled: August 3, 2010Date of Patent: December 16, 2014Assignee: Siemens VAI Metals Technologies SASInventor: Marc Michaut
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Patent number: 8910849Abstract: A high temperature brazing fixture and method of manufacture for a gas turbine component made of a superalloy is disclosed herein. The high temperature brazing fixture includes a first and second frame member, a support member, and positioning member, all of which are made from the superalloy and fastened together using tab and tab lock couplings. The support member is configured to interface with and support the gas turbine engine component, and the positioning member is configured to interface with and position at least a first location of or hold a first dimension of the gas turbine component.Type: GrantFiled: March 29, 2012Date of Patent: December 16, 2014Assignee: Solar Turbines Inc.Inventors: Thomas C. Schacht, John Michael Irwin
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Patent number: 8910851Abstract: A system and method for modifying a work piece surface of high melting temperature materials such as Advanced High Strength Steels, wherein a friction stir welding tool may include cutting elements located on the outside diameter of a collar assembly, wherein the collar assembly may be retrofitted for existing friction stir welding tools, or may be designed as a custom attachment for a new hybrid friction stir welding tool, wherein the surface of the work piece may be modified by removing detrimental flash and burr created during operation of the friction stir welding tool.Type: GrantFiled: September 20, 2012Date of Patent: December 16, 2014Assignee: MegaStir Technologies LLCInventors: David Rosal, Paul T. Higgins, Russell J. Steel, Scott M. Packer, Jeremy Peterson, Steve W. Larsen, Samuel C. Sanderson, Jonathan A. Babb
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Patent number: 8899470Abstract: A method is disclosed for mechanically bonding a metal component to a ceramic material, comprising providing a metal component comprising an anchor material attached to at least a first portion of one surface of the metal component; providing a ceramic material having a first surface and a second surface, wherein the ceramic material defines at least one conduit extending from the first surface to the second surface, wherein the at least one conduit has a first open end defined by the first surface, a second open end defined by the second surface, a continuous sidewall and a cross sectional area; positioning the ceramic material such that at least a portion of the at least one conduit is in overlying registration with at least a portion of the anchor material; and applying a bonding agent into at least a portion of the at least one conduit.Type: GrantFiled: April 1, 2008Date of Patent: December 2, 2014Assignee: Corning IncorporatedInventors: David M. Lineman, Wenchao Wang, Randy D. Ziegenhagen
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Patent number: 8881966Abstract: An improvement in the quality of wire bonding is achieved by reducing the vibration of a lead frame or a wiring substrate after wire bonding. Over a heat block in a wire bond portion of a wire bonder, there is provided a cooling blower for cooling a wire-bonded matrix frame so that the temperature thereof may decrease stepwise. After wire bonding, cold air is blown from the cooling blower to the matrix frame, and temperature control of the matrix frame is performed so that the temperature of the matrix frame after wire bonding may decrease stepwise. Or, the wire-bonded matrix frame is fixed with a holding tool such as a frame holding member, a guide member, a roller means, or an elastic means until cooling is completed.Type: GrantFiled: December 9, 2009Date of Patent: November 11, 2014Assignee: Renesas Electronics CorporationInventors: Kazuyuki Misumi, Hideyuki Arakawa, Shunji Yamauchi, Mitsuru Aoki
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Patent number: 8875979Abstract: Disclosed is an apparatus for determining an alignment of a bondhead of a die bonder relative to a workchuck. Specifically, the apparatus comprises: i) a sensor configured to measure a distance between the bondhead and the sensor; and ii) a positioning device coupled to the sensor, the positioning device being configured to position the sensor relative to a plurality of locations on the bondhead facing the sensor. In particular, the sensor is operative to measure a set of distances between each of the plurality of locations on the bondhead and the sensor, the set of distances being for determining the alignment of the bondhead. A method of determining an alignment of a bondhead of a die bonder relative to a workchuck is also disclosed.Type: GrantFiled: May 4, 2012Date of Patent: November 4, 2014Assignee: ASM Technology Singapore Pte. Ltd.Inventors: Chung Sheung Yung, Chi Ming Chong, Gary Peter Widdowson
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Patent number: 8875980Abstract: In a friction stir welding apparatus, workpiece fixing surface plates (3a, 3b) are installed on a framework (1). In addition, a welding apparatus main body (8) including a bobbin tool (5) having a probe (5a) protruding upward from a gap (4), a spindle (6) configured to attach the bobbin tool (5) to an upper end section thereof, and a spindle driving apparatus (7) configured to pivot the spindle (6) is movably installed at the framework (1) in a longitudinal direction of the gap (4) via linear guide mechanisms (9) installed at both sides of the welding apparatus main body (8). Further, a moving apparatus (10) is installed to move the welding apparatus main body (8) in the longitudinal direction of the gap (4). According to the friction stir welding apparatus, since the welding apparatus main body (8) is supported by the framework (1) via both of the linear guide mechanisms (9), a large welding reaction force can be sufficiently received.Type: GrantFiled: November 4, 2011Date of Patent: November 4, 2014Assignee: IHI CorporationInventors: Hiroshi Saito, Naoki Oiwa, Rie Sakamoto, Tadafumi Kanayama, Satoshi Yamanaka
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Patent number: 8870053Abstract: A method of forming a brazed joint is provided in which a surface portion of a first metal part is placed in contact with a surface portion of a second metal part to form a contact area therebetween, and the first and second metal parts include copper, silver and/or gold as the primary base metal(s) and at least the surface portion of the first metal part is a modified alloy of the primary base metal(s) having 0.5-12 wt. % phosphorus as a modifier. The surface portion of the first metal part is heated to a temperature sufficient to cause the phosphorus to wet the surface portion of the second metal part and to flow a low melting portion of the first metal part into the contact area by capillary attraction to form the brazed joint between the first and second metal parts.Type: GrantFiled: July 19, 2012Date of Patent: October 28, 2014Inventor: Joseph W. Harris
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Patent number: 8857698Abstract: The present invention relates to a method for manufacturing at least one portion of a seal ensuring gas-tightness between at least one first and one second glass panel in a glazing system, the method including the following steps: depositing a first adhesive layer on a first peripheral area of the first panel and a second adhesive layer on a second peripheral area of the second panel; welding a first metal seal element to the first adhesive layer; welding a second metal seal element or said first metal seal element to the second adhesive layer. According to the invention, the first and second adhesive layers are deposited using a high-speed oxy-fuel flame-spraying method.Type: GrantFiled: November 17, 2010Date of Patent: October 14, 2014Assignee: AGC Glass EuropeInventors: Olivier Bouesnard, Francois Closset
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Patent number: 8851358Abstract: One plate-like member and the other plate-like member to be aligned with each other are provided with guide holes and guide portions to be received in the guide holes, respectively. The plate-like members are aligned appropriately, and in a state in which this alignment is held, the guide portions are formed on land portions provided on the other plate-like member so as to be aligned with the guide holes. Accordingly, regardless of presence/absence or size of a process error in the guide holes, the guide portions appropriate to the respective guide holes can be formed. Consequently, by aligning the guide portions with the guide holes, the plate-like members can be aligned appropriately without relative fine adjustment between the members.Type: GrantFiled: December 19, 2012Date of Patent: October 7, 2014Assignee: Kabushiki Kaisha Nihon MicronicsInventors: Tomokazu Saito, Seito Moriyama
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Patent number: 8844796Abstract: Disclosed herein is a method of making a structure by ultrasonic welding and superplastic forming. The method comprises assembling a plurality of workpieces comprising a first workpiece including a first material having superplastic characteristics; ultrasonically welding the first workpiece to a second workpiece, to form an assembly; heating the assembly to a temperature at which the first material having superplastic characteristics is capable of superplastic deformation, and injecting a fluid between the first workpiece and the second workpiece to form a cavity between the first workpiece and the second workpiece.Type: GrantFiled: March 5, 2013Date of Patent: September 30, 2014Assignee: The Boeing CompanyInventor: Kevin T. Slattery
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Patent number: 8833637Abstract: A device using the live welding method for aluminum electrolytic cell overhauling under series full current consists of short-circuit buses at the bottom of the cell (1), pillar buses (2), an anode bus (3), a balance bus (4), a inter-cell standby bus (5), a door-shaped pillar clamp (6), an arcuate clamp (7) of anode buses, a current conversion switch (8, a mechanical switching device (9) for the short-circuit port, a voltage sensor and wires thereof (10), a temperature sensor and wires thereof (11), a system (12) for data acquiring, displaying, analyzing and alarming, an A-side welding area (13), a B-side welding area (14) and compression-joint points (15) on pillar soft belts of overhauling cells; and the live welding method comprises the following steps: when welding is required to be performed in some zone, the currents of short-circuit buses at the bottom of the cell (1) and pillar buses (2) which influence the welding area most are cut off, the serial currents are shunted to other pillar buses (2), otherType: GrantFiled: November 17, 2010Date of Patent: September 16, 2014Assignee: China Aluminum International Engineering Corporation LimitedInventors: Tao Yang, Bin Cao