Abstract: The present invention relates to a method for printing a substrate, in particular a printed circuit board, with a printing paste, in particular a solder paste, comprising the following steps: —applying a printing screen to the substrate, —printing the substrate using screen printing technology through openings in the printing screen so as to achieve at least one printed structure consisting of printing paste, —separating the printing screen and the substrate by lifting these parts off from one another, —inserting an optical inspection unit between the printing screen and the substrate, —checking the printed structure in terms of the printing paste thickness thereof by means of the inspection unit, —ending the printing when the result of the printing corresponds to at least one preset value. The invention furthermore relates to an inspection unit (1) and a printing device (2).

Abstract: Solder bumps of uniform height are provided on a substrate through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned layer of photoresist. Solder is injected over the pillars or BLM, filling the channels. The solder, which does not contain flux, is allowed to solidify. It forms a plurality of solder structures (bumps) of equal heights. Solder injection and solidification are preferably carried out in a nitrogen environment or a forming gas environment. Molten solder can be injected in channels formed in round wafers without spillage using a carrier assembly that accommodates such wafers and a fill head.

Abstract: A method of shortening an end of a well car includes removing a plurality of parts that would inhibit the shortening process; cutting a shear plate and a set of side sill angles at a location on the well side of the end assembly; detaching the end assembly from a main body of the well car; on each side of the main body: cutting the top tube at a location above a monument plate that is just beyond a reinforcement plate attached to the monument plate; cutting through a weld between the monument and reinforcement plates and a side sheet; cutting through the side sheet generally at the attachment location of the monument and reinforcement plates; and cutting the shear plate of the main body with a contoured cut such that the remaining shear plate has a contoured pattern substantially matching the cut shear plate under the removed end assembly.

Abstract: A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.

Abstract: A friction stir welding includes a main body for holding a tool and a hot air and cool air separating unit. The separating unit is disposed at the main body and separates a supplied gas into hot air hotter than the gas and cool air cooler than the gas in a tube portion and ejects the cool air from a first end of the tube portion and ejects hot air from a second end of the tube portion. The hot air is supplied to a front side of a movement direction of the tool in the surface of the work piece from a tool side of the friction stir welding apparatus and the cool air is supplied to a rear side of the movement direction of the tool in the surface of the work piece from the tool side of the friction stir welding apparatus.

Abstract: A reflow soldering system wherein a heating oven is provided with a contact heating unit which has a transport rail and a top heat transfer heater, and with a hot gas blowing heating unit, the transport rail and top heat transfer heater are respectively provided with heaters which heat the outer edge part of the printed circuit board, and the transport rail or top heat transfer heater moves in an up-down direction so that the transport rail and top heat transfer heater clamp and heat the outer edge part of the printed circuit board.

Abstract: A hole in a metal workpiece is filled by friction plug welding. The weld between the workpiece and the plug is reinforced by a weld land in the workpiece that surrounds one end of the plug. The weld land is formed by extruding a portion of the plug into a cavity in an anvil used in the welding process.

Abstract: A method for controlling friction stir welding is provided. The method may include initiating friction stir welding and determining the position of a friction stir welding tool and at least one part being welded. The method may also include adjusting the position of the friction stir welding tool while friction stir welding based at least in part on the positions of the tool and at least one of the parts. The position of the parts may be determined downstream of the friction stir welding tool in order to prospectively account for the position of the parts. Accordingly, the position of the friction stir welding tool may be dynamically adjusted during friction stir welding to account for part movement. Related systems and computer code are provided.

Abstract: In a method for producing an electronic component device, a heat bonding step is performed in a state in which low melting point metal layers including low melting point metals including, for example, Sn as the main component, are arranged to sandwich, in the thickness direction, a high melting point metal layer including a high melting point metal including, for example, Cu as the main component, which is the same or substantially the same as high melting point metals defining first and second conductor films to be bonded. In order to generate an intermetallic compound of the high melting point metal and the low melting point metal, the distance in which the high melting point metal is to be diffused in each of the low melting point metal layers is reduced. Thus, the time required for the diffusion is reduced, and the time required for the bonding is reduced.

Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

Abstract: In a method for manufacturing a substrate, connections are provided through metal columns of bumps press-fitted into an insulating resin layer between metal foils contact-bonded to a thermosetting insulating resin layer. Bumps of a conductive paste containing metal fillers are formed on a metal foil which is to be contact-bonded to an insulating resin layer, the bumps are heated to bound the metal fillers to each other, and form a metallic bond between the bumps and the metal foil, the metal columns are press-fitted into the insulating resin layer to contact-bond the metal foil to the insulating resin layer, and join the tips of the metal columns to a metal foil, the metal columns are then reheated to form a metallic bond between the metal columns and the metal foil.

Abstract: Reflow solderable, surface mount LED optic mounting devices are provided. Embodiments that include turnings (e.g., made on a swiss turning machine) and stampings (e.g., made with a progressive die) are provided. The LED optic mounting devices are suitably positioned by the same pick-and-place machine that is used to mount LED on planar surface with circuitry and solder pads and are attached to the solder pads by soldering.

Abstract: In various embodiments, protective layers are bonded to a steel layer and connected by a layer of unmelted metal powder produced by cold spray.

Abstract: A method is disclosed for controlling a process in which a component 4 is moved relative to another component 6 such that at least one of the components 4, 6 experiences a reduction in magnitude in at least one dimension. Such processes may include for example friction welding. The method comprises monitoring energy input to the process and adjusting an input parameter for the process based on the monitored energy input. The monitoring of energy input is performed before any reduction in component magnitude has begun to take place.

Abstract: The process for investment casting of complex shapes has historically had 6 basic steps in it. Depending upon the path taken, these discrete steps have been reduced to either 5 steps, or to 2 steps, discarding the unwanted steps. Instead of having to generate the shape of each sacrificial pattern, the process generates either (A) a male tree containing a plurality of sacrificial patterns, already on their runners, onto which a mold shell can be formed, or, (B) a female shell, made of a refractory material, and forming internally the outside surfaces of the plurality of patterns and runners. This process removes both capital expenditure for tooling and process time by up to 90%. By removing several lengthy, time-dependant steps from the process the part cost and lead time are reduced.

Abstract: A friction stir welding method in which a welding tool rotating around an axis is pressed against a welding target portion of workpieces supported by a backing member so that frictional heat is generated and the friction heat softens the welding target portion. The welding tool is at least partially inserted into the softened welding target portion and stirs the softened welding target portion so that the welding target portion is stir welded in a solid phase state. The friction stir welding method includes detecting a temperature of a temperature measurement point provided in the backing member, and calculating an estimated temperature of the welding tool from the detected temperature of the temperature measurement point, based on a predefined correlation between a temperature of the welding tool and a temperature of the backing member.

Abstract: A system includes host and learning machines in electrical communication with sensors positioned with respect to an item of interest, e.g., a weld, and memory. The host executes instructions from memory to predict a binary quality status of the item. The learning machine receives signals from the sensor(s), identifies candidate features, and extracts features from the candidates that are more predictive of the binary quality status relative to other candidate features. The learning machine maps the extracted features to a dimensional space that includes most of the items from a passing binary class and excludes all or most of the items from a failing binary class. The host also compares the received signals for a subsequent item of interest to the dimensional space to thereby predict, in real time, the binary quality status of the subsequent item of interest.

Abstract: Disclosed are an apparatus for adhering solder powder to finely adhere the solder powder to an electronic circuit board and a method for adhering solder powder to the electronic circuit board.

Abstract: A soldering system includes a track, a laying device, a boiler, a shelter, a transmission roller, a position sensor, a thermal radiation heating device, and a driving device. At least one hole is formed on the shelter, and a shape and a dimension of at least one hole on the shelter corresponds to a shape and a dimension of a DIP component. The transmission roller rotates the shelter according to a transmission speed of the track. The position sensor detects a position of a circuit board relative to the boiler. The thermal radiation heating device heats an area on a second surface of the circuit board different from a first surface adjacent to the DIP component through the at least one hole on the shelter continuously, so as to increase a temperature of the second surface when the first surface of the circuit board is passing through the boiler.

Abstract: A remote-controlled joining system for subsea pipelines for joining two smooth pipeline ends (pipe ends) that are arranged facing in line a distance apart. The system includes an apparatus arranged to move at least one of the pipeline ends sideways and in the longitudinal direction. The joining system includes a pipe sleeve having internal seals for sealing against each pipeline surface. The pipe ends are inserted into the sleeve to a facing position within the seals. The system also includes a welding clamp with an integrated welding tool for remotely welding of a first end of the pipe sleeve to the first pipeline and a second end of the pipe sleeve to the second pipeline. The welding clamp can be remotely fastened sealingly around the pipe ends and the sleeve and is equipped with means for establishing and maintaining a welding atmosphere in a volume that is delimited by the seals of the clamp and the seals of the sleeve.