Abstract: A method and apparatus for manufacturing, on an automatic continuous basis, successive album pages, each of which consists of a base sheet having a reinforcing tape bound thereto in overlapping relation with each side edge thereof, is disclosed. The apparatus includes a registration station for guiding and initially folding a pair of tapes in proper laterally spaced relation to receive a base sheet therebetween. A compression station is positioned downstream from the registration station and includes a pair of releasable clamps having engagement surfaces for completing the folding of the pairs of tapes into adhering relation with respective side edges of the base sheet thereby forming a web of album pages interconnected by the pair of tapes. A drive mechanism includes a servo-motor driven linear actuator for pulling at least one of the base sheets and the web of album pages downstream.

Abstract: The present invention comprises perovskite-phase thin films, of the general formula A.sub.x B.sub.y O.sub.3 on a substrate, wherein A is selected from beryllium, magnesium, calcium, strontium, and barium or a combination thereof; B is selected from niobium and tantalum or a combination thereof; and x and y are mole fractions between approximately 0.8 and 1.2. More particularly, A is strontium or barium or a combination thereof and B is niobium or tantalum or a combination thereof. Also provided is a method of making a perovskite-phase thin film, comprising combining at least one element-A-containing compound, wherein A is selected from beryllium, magnesium, calcium, strontium or barium, with at least one element-B-containing compound, wherein B niobium or tantalum, to form a solution; adding a solvent to said solution to form another solution; spin-coating the solution onto a substrate to form a thin film; and heating the film to form the perovskite-phase thin film.

Abstract: A compact disc labeling device for manual application of a label to a compact disc includes an assembly having a circumferential flange with an upper flange surface, a piston, a first rod having a diameter approximately equal to the diameter of the label's central aperture and that extends from the upper surface of the piston, and a second rod having a diameter approximately equal to the diameter of the disc's central aperture and that extends from the first rod. In use, a label is placed on the flange with the first rod projecting through its central aperture and the disc positioned on the second rod through its central aperture. When the piston is moved from an upper first position to a lower second position, the disc is applied to the label.

Abstract: Method and system for measuring and adjusting pressure of tires of vehicles in order to set the appropriate pressure to a tire when the latter is in temperature and pressure conditions different from nominal conditions, the method and system comprising the steps of measuring the pressure inside the tire, measuring the temperature inside the tire, calculating a pressure value equivalent to the nominal value as a function of said measured values, visualizing the measured values, introducing said values in an air supplying machines, and supplying said calculated pressure to the tire.

Abstract: The invention proposes that a casting mold be provided with a lining for the manufacture of a crystal body. The lining is removed from the casting mold together with the crystal body that has solidified in the lining and the lining serves as a protective cap for the crystal body. Additional functional layers for the protective cap or the scintillator plate can be integrated into the lining.

Abstract: According to the present invention, there is proposed a laminating apparatus for laminating materials to be laminated. The apparatus includes at least one laminating section (9). Each laminating section (9) comprises an upper chamber (5) and an under chamber (6) wherein both chambers are divided with a diaphragm means (4). The apparatus further includes a heating stage (10) for heating the materials put on the stage in the under chamber (6). The stage (10) is movable between an upward position and a downward position. Further the apparatus includes a supporting means (13) which can support the materials in a position above and apart form the upper surface of the stage (10) when the stage locates in its downward position.

Abstract: A photo-fiber link glue control system (10) for accurately placing a pattern of glue on a sequential series of targets traveling with a conveyor (54) through the system (10). The system (10) includes an air reservoir (18) and a glue tank (24) for storing glue to be applied to the series of targets. A glue head (32) is connected to receive glue from the glue tank (24) for application to the series of targets. The lead and trailing edge of the target is detected by photo-eye sensors (44, 46) which generate a target position signal indicative of the sensed position. The pressure within the air reservoir (18) and glue tank (24) are monitored and a control device (36) stores a pattern in which the glue is to be applied to the target.

Abstract: A hybrid module comprises a plurality of insulating layers which are laminated on one another, circuit patterns formed on each surface of the insulating layers and/or formed between the insulating layers, wherein the circuit patterns are connected with one another by through hole conductors. Further, the insulating layers are formed of layers having a transmittance of a laser beam, wherein the circuit patterns, which are formed between the insulating layers and overlaid on top of another, are irradiated with a laser beam to be thermally fused.

Abstract: An apparatus and method for uniformly planarizing a surface of a semiconductor wafer and accurately stopping CMP processing at a desired endpoint. In one embodiment, a planarizing machine has a platen mounted to a support structure, an underpad attached to the platen, a polishing pad attached to the underpad, and a wafer carrier assembly. The wafer carrier assembly has a chuck with a mounting cavity in which the wafer may be mounted, and the wafer carrier assembly moves the chuck to engage a front face of the wafer with the planarizing surface of the polishing pad. The chuck and/or the platen moves with respect to the other to impart relative motion between the wafer and the polishing pad. The planarizing machine also includes a pressure sensor positioned to measure the pressure at an area of the wafer as the platen and the chuck move with respect to each other and while the wafer engages the planarizing surface of the polishing pad.

Abstract: An end effector in a transport module includes a body and a web defined by a panel and first and second flanges at opposite panel ends. The first flange is attached to the body. The second flange is displaced from, and transverse to, the panel. Rods extending through the flanges into the body rigidify the web. Springs disposed in holes in the body and extending between the first flange and the body balance the web relative to the body. The second flange and a ledge on the body adjacent the first flange support the substrate opposite ends with the central portion of the substrate displaced from the body and the web. A robotic assembly formed from a plurality of arms is coupled to the body. The arms are pivotable relative to one another and to the body between contracted and expanded relationships. With the arms contracted, the body and the web are rotatable in the transport module between positions facing the cassette module or the process module.

Abstract: An adhesive and method for attaching a heat sink to a printing wiring assembly that provides a thermal path from electronic components on the printing wiring assembly to the heat sink. The adhesive is flexible and accommodates thermal expansion stresses and is readily reworkable. The adhesive comprises a filler material that is disposed between the heat sink and the printing wiring assembly, and an impregnant that impregnates the filler material, which impregnated filler material is cured. The filler material may comprise alumina particles that have a spherical shape. The impregnant comprises a polymer, typically selected from a group of epoxy resins and their curatives that form a flexible material when cured. In practicing the method, a heat sink is positioned adjacent to and spaced apart from a printing wiring assembly to provide an appropriate spacing between them. The periphery of the printing wiring assembly is sealed.

Abstract: A robotic conformal coating system has a end effector and multiple tiltable valves coupled to the end effector. The end effector is capable of X, Y and Z axis motion, as well as rotation about the Z axis. A programmable controller controls the movement of the end effector and valves, as well as the actual dispensing and/or spraying of conformal coating.

Abstract: A vapor deposition apparatus for supplying raw-material gas into a reactor to form a thin film on a wafer substrate disposed in the reactor by vapor deposition, including at least a rotator for mounting the wafer substrate thereon, a treatment gas introducing port, a straightening vane having plural holes, and a wafer substrate feed-in/out port, wherein the lowermost portion of the wafer feed-in/out port is located at a predetermined height from the upper surface of the rotator, and the difference in height between the lowermost portion of the wafer feed-in/out port and the upper surface of the rotator is set to be larger than the thickness of a transition layer of the upper portion of the rotator. In a vapor deposition method, a wafer substrate is mounted on the rotator to form a thin film having little defect and uniform film thickness on the wafer substrate by using the vapor deposition apparatus.

Abstract: A plastic moulding includes a rigid support (32) which is joined over at least one surface area (27, 29) to at least one film (5', 5"). The film (5', 5") has a fold at the edge of the plastic moulding which is placed around the plastic support. The manufacture of this plastic moulding (35) takes place such that first of all the film (5', 5") is brought into the final shape including the final fold and that only thereafter is the material of the plastic support (32) applied to the plastic film (5', 5") as a melt and both pressed into the completed fold and also collectively brought into the final shape by a compression moulding process (FIG. 7).

Abstract: A method of assembling a liquid crystal display device including a pair of substrates combined together with a sealing member and a liquid crystal interposed between the substrates, includes the steps of disposing a plurality of spacers in the area of the sealing member between the substrates, positioning a frame on an outside surface of each substrate, the frame being aligned with the sealing member, and applying pressure to each frame so that a region corresponding to a display area is substantially pressure-free and a uniform cell gap is obtained.

Abstract: A plastic product comprising an inner core portion made of plastic and having a solid shape or a hollow shape including an internal cavity, and a fiber-reinforced plastic layer formed on inner and/or outer surfaces of the inner core portion, whereby the plastic product has light weight, high strength and excellent vibration suppressing and noise shielding ability.

Abstract: The invention relates to assembling together at least two envelope elements with at least one deformable element between the two envelope elements so that the elements are secured together rigidly in irreversible manner, the assembled-together elements being designed to be subjected to compression stresses in a direction that at least intersects an assembly surface; bonding treatment is provided so that at least one compression pad has its first assembly surface in contact with the assembly surface of the first envelope element and so that a second assembly surface of a pad is in contact with an assembly surface of the second envelope element.

Abstract: Provided by the invention is a novel synthetic inorganic triboluminescent material in the form of a powder, sintered block or thin film, of which the matrix phase is a piezoelectric crystalline material of a wurtzite structure such as zinc sulfide and the activator to serve as the center of luminescence is a transition metal element such as manganese, copper and rare earth elements in an amount of 0.01 to 10% by weight. The triboluminescent material is prepared by subjecting a powder blend of the matrix phase material and a thermally decomposable compound of the activator element first to a preparatory calcination treatment at 500 to 800.degree. C. and then, preferably in the form of a powder compact, to a second calcination treatment at 900 to 1700.degree. C., preferably, in vacuum under a sealed condition, when the material is liable to cause sublimation, or in an atmosphere of a reducing gas.

Abstract: A method of manufacturing a semiconductor and a lamination therefor, in which fixing materials are temporarily fixed to the molding faces of a mold through release films. The semiconductor element is then placed in the mold and molding resin is injected into the mold. The resin is heated to produce the semiconductor device. During this process, the fixing materials become embedded in each of the opposite surfaces of the resin.

Abstract: A lamination apparatus having an upper platen and a lower platen that open and close to define a lamination chamber therebetween, an electric heater to melt a resin layer of the material to be laminate-molded, a film body provided on the surface of the lower platen, a smooth pressurizing surface formed on the surface of the upper platen, a frame which forms a wall of the lamination chamber in which the material to be laminate-molded is shaped by being clamped between the opposing surfaces of the upper platen and the lower platen, a suction device to depressurize the lamination chamber, a deformable pressurizing plate resiliently interposed between the film body and the material to be laminate-molded and a contact pressurizing mechanism which cause the film body to maintain contact with the surface of the lower platen and separate therefrom to pressurize the material to be laminate-molded through the pressurizing plate pressing against the pressurizing surface of the upper platen.