Abstract: A method for manufacturing passports comprising a first recording step of reading visually readable personal data from a data base of a passport book-making line and recording the same on a personal data sheet base at an entrance of a passport book-making line; a passport bookmaking step including a step of binding the personal data sheet together with a visa sheet, etc.; and a second recording step of reading the visually readable personal data on the personal data sheet after the passport bookmaking step is performed and recording the same on the personal data sheet in a mechanically readable personal data form.

Abstract: A method for attaching reclosable zipper strips transversely to thermoplastic film material which may be used to make reclosable bags or packages in a form-fill-seal machine is claimed. The zipper strip includes a male profile and a female profile. The male profile includes a male interlocking member and an integral web comprising a trailing flange and, optionally, a leading flange. Likewise, the female profile includes a female interlocking member and an integral web comprising a trailing flange and, optionally, a leading flange. As the film material is advanced into the form-fill-seal machine in bag length increments, the interlocked zipper strip is disposed on the film material transversely thereto with the trailing flange oriented in a direction opposite to the motion of the film material. The zipper strip is then sealed to the film material at its extremities. In this manner the male and female profiles are sealed to each other and to the film material.

Abstract: A bonding apparatus for bonding a magnetic piece to a backiron includes a base and a back assembly next to the base and having at least one back surface. A front assembly having a front surface facing the back assembly has at least one aperture for a locating pin. The locating pin is slip fit into the aperture of the front assembly. In addition, a method for replacing locating pins is provided.

Abstract: The present invention includes stack flexible circuit layers having raised features or bumps for Z-axis interconnection to another circuit layer or electrical component. An intermediate or adhesive layer separates each circuit layer. The multiple layers are stacked with the raised features from one layer aligning with pads of an overlying or underlying layer and are laminated so that the raised features pierce the intermediate or adhesive layer and make electrical contact with the corresponding pad of the adjacent circuit layer. The raised features may have a shape sufficient to penetrate the intermediate and/or the adhesive layer allowing blind vias to be made without pre-drilling the intermediate or adhesive layers. The intermediate layer of film can have a function other than or in addition to that of an adhesive.

Abstract: By means of the interlocking methods skillful applying on the combination of the blanks, the supporting structures of the inflation products are easily constructed by these complementary blanks, and the same features of these products can be achieved by the economical usage of the sheet bars. Also, the strength of these products can be increased by the multiple supporting area of the interlocked blanks. This interlocking methods can be not only satisfied the all purposes of the inflation products but also met the standards of the environmental requirements because of its less scraps.

Abstract: A method and apparatus (10) for securing a fragile wafer (14) to a wafer tape (51) secured taut across a wafer frame (50). A controlled jet of gas (46) is directed by a nozzle (45) against the backside of the wafer tape (51) to securely adhere the wafer tape (51) to the backside of the wafer (14). Preferably, a spiral pattern (70) of air is directed by the nozzle (45) to secure the wafer tape (51) to the wafer (14) without forming air bubbles or creases between the wafer tape and wafer. Such a method and apparatus is especially suitable for securely adhering fragile wafers to wafer tape that are subsequently broken along kerfs and which wafers are inverted to allow particles to drop downwardly.

Abstract: The batch manufacturing of laminated cells whose spacing is kept constant by means of spacers (11) of diameter d, comprises the steps of forming a first line on a substrate (1), with a hot melt adhesive material for the sealing frames (3) and junction portions (5) between the holes (6) of spacing e and a second line (7) closed at one end (8) to create a filling channel (9), said lines having a constant cross-section So and a height h; depositing the spacers (11) over the substrate (1) and close to the holes (6), destructible or deformable spacers (12) of diameter D such that h>D>d; sealing a second flat deformable substrate (2) with a reduced application of pressure above the holes (6); filling all the cells; exerting a second pressure equal to or greater than the first and heating the zones above the holes to a temperature equal to or greater than that of the hot melt adhesive material; and cutting out each cell.

Abstract: The present invention relates to a manufacture procedure of vehicle sunshade curtain including:A. Two PET (polyethylene terephthalate) sheets in different thickness are used;B. Both sides of the interior and exterior films are electroplated;C. The interior and exterior films are glued together by a melted PE material constituting an inceptive sunshade curtain;D. The inceptive sunshade curtain is folded in two by facing the interior film inside and then curled up from the folding end; andE. The curled inceptive sunshade curtain is heated 40 minutes at about 110.degree. C. to shrink the interior and exterior films. After quick cooling down, the inceptive sunshade curtain is set to a curled finished sunshade curtain.The present invention is to simplify the vehicle sunshade curtain manufacture procedure, lower the manufacture cost, increase the production speed and enhance the sunlight reflecting feature.

Abstract: An apparatus and related method for manufacturing a full-fashioned glove from similar or dissimilar polymeric material includes a controller that actuates various components in the apparatus, a thumb mold that forms a thumb portion from two layers of a first material and a hand mold which forms a plurality of fingers and a cuff from the first material and a second material. Both the thumb mold and hand mold have appropriate cavities with apertures therethrough wherein a vacuum source, actuated by the controller, draws the appropriate material toward the surface of the mold prior to closure thereof. Upon closure of the molds, a fusing element is energized by the controller and the materials are fused to one another to form the appropriate portion of the full-fashioned glove. After the glove is removed from the remaining materials, it can be employed in various types of manufacturing industries.

Abstract: Apparatus for manufacturing heat sealed products from high temperature film materials exhibiting superior barrier properties, such as films made from LCP resin. The apparatus has in relevant part a first compression member having a heating element that is capable of being continuously or intermittently heated to a temperature of about 300.degree. C. (c. 575.degree. F.) backed by a layer of material capable of supporting the heating element, a second compression member that opposes the first compression member and having an electrically conductive tubular sealing element, capable of being flash-heated by means of a pulse of electric current to a temperature of about 425.degree. C. (c. 800.degree. F.) and immediately flash-cooled to room temperature or below by means of forcing vortex-chilled coolant fluid through the tubular lumen, backed by a layer of material capable of supporting the sealing element, and two floating sheets or tapes of high-temperature release material disposed therebetween.

Abstract: The process calls for extrusion of a multilayer tubular structure with semiconducting innermost layer. In production of the sleeve the inner layer is partially removed leaving only a central portion forming an electrode. In addition the intermediate layer is made with a compound having pre-determined relative dielectric constant and dielectric rigidity.

Abstract: Described is a method for manufacturing of carrier element modules of a thin carrier element (4) and a thereon mounted semiconductor chip (2). This method renders possible the application of chips (2) with great dimensions (macro-chips) and a wide variety of different types. A chip transfer moulding process is designed so that a minimised height--without the need for reworking--is achievable, and therefore a less costly surface mounting of the chips can be applied. The manufactured module according to the invention can be used as well as in flexible circuit boards (e.g. for cameras) or in chipcards. The method according to the present invention has a first step of putting the at least one IC (2) onto the carrier element (4), a second step of contacting the at least one IC (2) with the carrier element (4) and a third step of transfer moulding a transfer moulding compound (18) to encapsulate the IC (2).

Abstract: A non-metal window muntin formed from plastic or wood is described for use in hermetically sealed insulated glass windows. The process for forming the muntin includes machining polystyrene sheets which are painted with a latex paint and baked prior to use between sealed glass of the window.

Abstract: A hub and hub-holder assembly for vehicles equipped with a central tire iation system having a rotating joint such that tightness is assured by wear-resistant rigid parts during the inflation of the tires.

Abstract: A process for manufacturing a laminated glass window equipped with sealing at one or more edges, wherein the laminated glass window contains at least two glass sheets and laminated plastic placed between the two glass sheets, wherein the laminated plastic is made of at least one principal carrier sheet, having on at least one side at least one layer that reflects infrared radiation and outer layers made of one or more thermoplastic polymers; the process involving:a) forming a plate from the laminated plastic, the plate having a geometrical shape substantially the same as the glass sheets, but wherein the plate is shorter, by an offset distance, on each of one or more edges to be sealed;b) preparing a preliminary laminated sheet by positioning the plate in relation to the glass sheets while respecting the offset distance on each of the one or more edges to be sealed and removing air from between the layers formed by the glass sheets and the plate;c) filling the interstice of the one or more edges to be sealed

Abstract: A device for supporting the tread of a tire which includes a rigid support 1) and an elastic top cap rubber (2) made of a vulcanized rubber compound, a lubricant (5) arranged between said support (1) and said top cap rubber (2) allowing circumferential displacement between the support (1) and the top cap rubber (2), wherein each shoulder (122) of the bearing ring (12) of the support (1) is equipped on its edge with at least one straight circumferential groove (124) in which there is housed the corresponding circumferential rib (25) of the radially internal face (200) of the top cap rubber (2), said rib (25) being in contact with the bottom of the groove (124) of the support (1).

Abstract: The distance A between opposite end nozzles 4e and 4e on the nozzle plate 4 is set smaller than the distance B between opposite end link channels 3e and 3e in the actuator. The difference between the distances A and B is determined dependent on the difference between the thermal expansion coefficients of the actuator and of the nozzle plate. After being heated, the nozzles will be properly located in correspondence with the ink channels. During the heating step, the nozzle plate is placed on the actuator via an adhesive. Then, the heater block is placed on the nozzle plate to heat the adhesive via the nozzle plate and to press the nozzle plate from upwardly. Accordingly, the temperature of the adhesive rapidly increases, whereby gas is completely discharged from the adhesive before the adhesive is completely hardened.

Abstract: A method of manufacturing a downhole electrical cable is described. The method comprises arranging an elongate member adjacent to a flat elongate sheet of material, where the length of the elongate member is greater than the length of the flat elongate sheet. The elongate sheet is then formed into a cylindrical shape around the elongate member, and the adjacent longitudinal edges of the cylindrical shape are joined, preferably by seam welding, to form the elongate sheet into a tube with an end of the elongate member adjacent each end of the -tube. Thereafter, an elongate conductor is connected to one end of the elongate member, and the other end of the elongate member is pulled to draw the elongate conductor through the tube until the elongate member is removed from the tube and the elongate conductor is located within the tube. At this final point in the method, an end of the elongate conductor is adjacent each end of the tube.

Abstract: The process of the invention to make miniaturized multipolar cables includes the steps of combining together a plurality of individually insulated conductors, inserting a filling in a pasty state and containing mineral fillers into the gaps existing between the conductors, partly hardening the filling and disposing the other cable components, in particular the sheath, around the conductors-filling assembly, and letting the filling become completely hard within the produced cable.

Abstract: Methods of fixturing a flexible circuit substrate to a processing carrier are disclosed. In one implementation, the flexible circuit substrate and processing carrier are attached with an adhesive film provided therebetween. The adhesive film comprises acrylic, silicone or a silicone acrylic blend in a preferred embodiment of the present invention. Ideally, substantially the total surface area of a first surface of the flexible circuit substrate is attached to the processing carrier. The flexible circuit substrate is removed from the adhesive film following processing thereof. In a preferred embodiment of the present invention, the adhesive film is monolithic. An electrical component is attached to the flexible circuit substrate and the flexible circuit substrate is encapsulated in accordance with one implementation of the present invention.