Abstract: An adhesive bonding system joins flat webs when changing rolls of such webs. The adhesive bonding system comprises two adhesive tape boundary edges, and further comprises a top carrier layer and a bottom carrier layer, a flat connecting element that connects the two carrier layers to one another and is suitable for opening the connection under the conditions of a static or flying roll change. At least one of the boundary edges of the connecting element does not extend in a straight line, and a straight-line emphasis line is defined in relation to this boundary edge, the emphasis line of this boundary edge extends along a preferential direction, and this boundary edge has a multiplicity of regions lying on one side of its emphasis line and also a multiplicity of regions lying on the other side of its emphasis line.

Abstract: Die-cuttable and printable adhesive containing labelstocks for use in preparing die cut adhesive labels, and methods of preparing the labelstocks and die cut labels are described. The labelstocks comprise extruded machine direction oriented monolayer or multilayer films and an adhesive layer. The monolayer films comprise a mixture of about 25% to 80% by weight of a propylene polymer or copolymer, and from about 20% to about 75% by weight of a polyethylene. The films are stretch oriented in the machine direction at a temperature at about or above the melting temperature of the polyethylenes.

Abstract: Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 5˜20%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of burrs during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.

Abstract: Provided is a pressure-sensitive adhesive capable of realizing a pressure-sensitive adhesive layer having satisfactory adhesion performance and a high ink step absorbability. A radiation-curable pressure-sensitive adhesive, which contains a (meth)acryl-based polymer obtained by polymerizing a monomer component containing 30 to 90% by weight of an alkyl(meth)acrylate having an alkyl group of 10 to 22 carbon atoms at an ester end, and having a radically polymerizable functional group containing a carbon-carbon double bond.

Abstract: An activatable adhesive that is formulated to readily absorb energy from a given radiation source, an activatable adhesive label that incorporates such an activatable adhesive, a system for activating such labels, and related methods and uses are described. The activatable adhesive includes a plasticizer, a tackifier, and an adhesive base polymer that includes butyl acrylate, styrene, methyl methacrylate, methacrylic acid, and acrylic acid.

Abstract: A label for in-mold forming comprising a thermoplastic resin film with a heat-sealable layer, a printable thermoplastic resin film, and an antenna and an IC chip. The antenna and the IC chip are interposed between the thermoplastic resin films. The label is strong and water resistant with a high adhesive strength. The label has the function of an IC label and has a printable surface. Also provided is a thermoplastic resin container bearing the label. Bonding the label to a thermoplastic resin container does not damage the IC chip and antenna.

Abstract: Optically clear stretch releasing pressure sensitive adhesive films containing a silicone pressure sensitive adhesive composition and a tacky tab are provided. The pressure sensitive adhesive compositions are formed from elastomeric silicone polymer selected from the group consisting of urea-based silicone copolymers, oxamide-based silicone copolymers, amide-based silicone copolymers, urethane-based silicone copolymers, polydiorganosiloxane polymers, or mixtures of these copolymers. The pressure sensitive adhesive compositions may also contain an MQ tackifying resin. The pressure sensitive adhesive compositions may be used to form adhesive articles.

Abstract: A description is given of a pressure-sensitive adhesive dispersion comprising a water-dispersed polymer P1 formed by emulsion polymerization. The polymer P1 is formed from a monomer mixture comprising (a) at least 40% by weight of C4 to C20 alkyl (meth)acrylates which when polymerized as homopolymers have a glass transition temperature of ?30° C. or less, (b) at least 0.05% by weight of (meth)acrylate monomers having a substituent of the formula where X is CH2, O, NH or NR and R is a C1 to C4 alkyl group, (c) at least 0.1% by weight of acid monomers. The monomer mixture comprises alternatively at least 0.05% by weight of glycidyl (meth)acrylate and/or the pressure-sensitive adhesive dispersion comprises at least one further polymer P2 which contains glycidyl groups.

Abstract: A sealant composition for roofing shingles that includes a base asphalt, a linear and/or a radial copolymer, oil, and a wax is provided. The linear copolymer has an A-B di-block or an A-B-A tri-block structure. The radial copolymer may have an (A-B)n radial structure, where n is at least 4, or a tri-block (A-B-A) radial structure having from 4 to 8 arms. Blocks A and B may individually represent (1) styrene and butadiene or (2) styrene and isoprene. The oil is a petroleum-based oil that both “softens” the asphalt and reduces the viscosity of the sealant composition. The wax may be a bis-stearamide wax. Additionally, the sealant composition may be reacted with elemental sulfur to crosslink the copolymer blend. The sealant composition seals at temperatures lower than conventional sealants and promotes the easy release of the shingle from a shingle bundle.

Abstract: Provided are an adhesive film, an encapsulated product of an organic electronic device using the same, and a method of encapsulating an organic electronic device. Particularly, the adhesive film encapsulating the organic electronic device to cover an entire surface of the organic electronic device includes an adhesive layer including a curable resin and a moisture adsorbent. The adhesive layer has a viscosity in a temperature range of 30 to 130° C. of 101 to 106 Pa·s and a viscosity at room temperature of 106 Pa·s or more in an uncured state, and when the adhesive layer has a multilayered structure, a difference in melting viscosity between layers is less than 30 Pa·s. In addition, the method of encapsulating an organic electronic device using the adhesive film is provided.

Abstract: Adhesives suitable for use with low surface energy materials are described. The adhesive contain an acrylic copolymer, a high glass transition temperature tackifier and a low glass transition temperature tackifier. The acrylic copolymer is the reaction product of a first alkyl(meth)acrylate having at least 5 carbon atoms in the alkyl group, a second alkyl(meth)acrylate having 1 to 4 carbon atoms in the alkyl group, and a vinyl carboxylic acid. Both tackifiers have a Tg greater than the Tg of the acrylic copolymer. The high glass transition temperature tackifier has a Tg of at least 20° C. and the low glass transition temperature tackifier has a Tg of less than 0° C.

Abstract: An adhesive composition is described, which includes an acrylic polymer, an epoxy thermosetting resin having an unsaturated hydrocarbon group, and a thermosetting agent. The adhesive composition achieves high reliability in a package in which a semiconductor chip of reduced thickness is mounted even when exposed to severe reflow conditions. An adhesive sheet having an adhesive layer that includes the above adhesive composition is also described.

Abstract: Pressure sensitive adhesive compositions containing 92 to 99.9 parts of a block copolymer adhesive composition and 0.1 to less than 8 parts of an acrylic adhesive composition are described. Tapes including such adhesives, and methods of making such tapes are also described.

Abstract: A pressure-sensitive adhesive material including a visco-elastic layer and an elastic layer is provided. In some embodiments, a reusable pressure-sensitive adhesive material exhibiting high adhesive strength after repeated cycles of adhesion and detachment is provided. In some embodiments, methods of making a pressure sensitive adhesive material are provided.

Abstract: A sheet is produced by curing an energy ray curable composition which includes a urethane acrylate oligomer and a compound having a thiol group in the molecule. The sheet has heat resistance to prevent outgassing.

Abstract: Described is a pressure-sensitive adhesive (PSA) polymer formed from (i) 50%-95% by weight of n-butyl acrylate, (ii) 1%-20% by weight of ethyl acrylate, (iii) 1%-20% by weight of vinyl acetate, (iv) 0.1%-5% by weight of at least one ethylenically unsaturated acid or ethylenically unsaturated acid anhydride, and (v) 0% to 30% by weight of other ethylenically unsaturated compounds different from the monomers (i) to (iv). The PSA polymer can be used for producing self-adhesive articles, more particularly paper labels or film labels.

Abstract: A pressure-sensitive adhesive consisting of a homogeneous mixture of at least one natural rubber component and at least one polyacrylate component displays significantly improved properties in cohesion and aging and weathering resistance compared to the individual components. Particularly good properties are achieved when the adhesive contains x % by weight of at least one natural rubber component, y % by weight of at least one polyacrylate component, v % by weight of at least one adhesive resin component and w % by weight of additives, where 10?×x?80, 10?y<95, 0?v?50, 0?w?10 and x+y+v+w=100. A single- or double-sided adhesive tape consisting of at least one support and at least one layer of such a pressure-sensitive adhesive therefore likewise has good cohesion and aging resistance properties.

Abstract: The present invention provides a polarizer protective film excellent in optical properties (retardation and haze) and excellent in the adhesion property between a polarizer and a polarizer protective film (in particular, under high temperature and high humidity conditions). The polarizer protective film of the present invention includes a (meth)acrylic resin film and an easy-adhesion layer disposed on at least one side of the film. The easy-adhesion layer is formed from an aqueous (meth)acrylic resin dispersion.

Abstract: A pressure-sensitive adhesive composition is disclosed. The composition comprises a particulate polymer of a monomer mixture comprising (a) an alkyl (meth)acrylate monomer; (b) at least one of (b-1) an alkyl (meth)acrylate monomer with the alkyl group having a carbon number of 15 to 24 and the alkyl group being a linear alkyl group and (b-2) an alkyl (meth)acrylate monomer with the alkyl group having a carbon number of 15 to 24 and the alkyl group being a branched alkyl group; and (c) a monoolefmically unsaturated monomer having a ketone group with the alkyl group having a carbon number of 8 to 14. Pressure sensitive adhesive tapes incorporating such adhesive compositions are also described.

Abstract: A swelling tape for filling a gap and a method of filling a gap are provided. The swelling tape can be applied within the gap having a fluid to realize a 3D shape thereby filling the gap, and be used to fix a subject forming the gap as necessary.