Abstract: The present invention provides a polyester, a polyester composition and a pressure-sensitive adhesive composition capable of obtaining a pressure-sensitive adhesive which is global-environmentally friendly and is excellent in pressure-sensitive adhesion properties, using a plant-derived raw material; and a pressure-sensitive adhesive layer and a pressure-sensitive adhesive sheet which can be obtained by using the same. A polyester of the present invention is a polyester comprising at least a lactic acid unit, a dibasic acid unit and a glycol unit, wherein the dibasic acid unit contains dimer acid, and the polyester has a glass transition temperature as measured at a temperature rising rate of 20° C./minute using a differential scanning calorimeter, of ?70 to ?20° C., a weight average molecular weight of 20,000 to 300,000 and a hydroxyl value of 1 to 100 mgKOH/g.

Abstract: There is provided an adhesive tape for manufacturing electronic components comprising a heat-resistant substrate and an adhesive layer containing an adhesive composition disposed on the heat-resistant substrate, wherein the adhesive composition comprises a phenoxy resin, a curing agent, an energy ray curable acrylic resin and a photoinitiator, and wherein the adhesive layer is cured by heat and an energy ray.

Abstract: A nonwoven web is provided. The nonwoven web contains a side-by-side composite fiber having crimps. The composite fiber contains first and second propylene polymers. The nonwoven web contains a bonded portion that contains a bonding pattern containing zigzag unit patterns. The zigzag unit patterns are continuous and substantially parallel with a first direction and are disposed in a second direction at predetermined intervals. A triangle formed by adjacent three contact points of a first diagonal line and a second diagonal line of the unit pattern contains a part of the unit pattern that is adjacent to the triangle in the second direction.

Abstract: A thermoplastic transparent resin which is produced by hydrogenating 70% or more of aromatic double bonds of a copolymer. The copolymer is produced by polymerizing a monomer composition containing at least one (meth)acrylic ester monomer and at least one aromatic vinyl monomer and has a molar ratio (A/B) of from 1 to 4 wherein A is a molar amount of a constitutional unit derived from the (meth)acrylic ester monomer and B is a molar amount of a constitutional unit derived from the aromatic vinyl monomer. The thermoplastic transparent resin is suitable for the production of a molded article such as optical article having a good color tone because molding defect is less produced.

Abstract: In a repairing method for an electrostatic chuck device in which at least an adhesive layer and an attracting layer are provided on a metal base, a side surface of an eroded adhesive layer is wound with a string-like adhesive and thermal compression is performed thereafter. A repairing apparatus for an electrostatic chuck device, which is used in the repairing method, includes a rotatable table for rotating the electrostatic chuck device and a bobbin for supplying the adhesive to the adhesive layer.

Abstract: A thermally removable pressure-sensitive adhesive sheet includes a substrate and a pressure-sensitive adhesive layer that is provided on at least one side of the substrate and made from a polyester-based pressure-sensitive adhesive composition containing a polyester including at least a lactic acid unit, a dibasic acid unit, and a glycol unit, a foaming agent, and a crosslinking agent. The dibasic acid unit includes a dimer acid, the polyester has a weight average molecular weight of 20,000 to 200,000 and a glass transition temperature of ?70 to ?20° C. as measured using a differential scanning calorimeter at a temperature rise rate of 20° C./minute, and the polyester has a hydroxyl value of 1 to 60 mgKOH/g.

Abstract: A device is provided to produce an embossed multi-ply material, comprising: a first embossing-laminating unit (3) comprising a first embossing cylinder (5) equipped with first projections (5P) defining a first pattern, a first pressure roller (7) cooperating with said first embossing cylinder (5), a first laminating roller (9) and a first glue dispenser (11), disposed between said first pressure roller (7) and said first laminating roller (9); an embossing unit comprising at least a second embossing cylinder (25) provided with second projections (25P) defining a second pattern and a second pressure roller (27) cooperating with said second embossing cylinder (25); a first path (P1) through said first embossing-laminating unit (3); a second path (P2) for at least a second ply (V2) towards and through said second embossing unit (23); a third path (P3) for said third ply (V3).

Abstract: A surface-protecting pressure-sensitive adhesive sheet includes: a substrate; and a pressure-sensitive adhesive layer that is provided on at least one side of the substrate and made from a polyester-based pressure-sensitive adhesive composition containing a crosslinking agent and a polyester including at least a lactic acid unit, a dibasic acid unit, and a glycol unit. The dibasic acid unit includes a dimer acid, the polyester has a weight average molecular weight of 20,000 to 200,000 and a glass transition temperature of ?70 to ?20° C. as measured using a differential scanning calorimeter at a temperature rise rate of 20° C./minute, the polyester-based pressure-sensitive adhesive composition has a hydroxyl value of 20 to 60 mgKOH/g, and the pressure-sensitive adhesive layer has a gel fraction of 85 to 99% by weight.

Abstract: Farnesene interpolymer comprises units derived from a farnesene (e.g., ?-farnesene or ?-farnesene) and units derived from at least one vinyl monomer. The farnesene interpolymer can be prepared by copolymerizing the farnesene and at least one vinyl monomer in the presence of a catalyst. In some embodiments, the farnesene is prepared from a sugar by using a microorganism. In other embodiments, the at least one vinyl monomer is ethylene, an ?-olefin, or a substituted or unsubstituted vinyl halide, vinyl ether, acrylonitrile, acrylic ester, methacrylic ester, acrylamide or methacrylamide, or a combination thereof.

Abstract: A radiation-cure removable type pressure-sensitive adhesive sheet includes: a pressure-sensitive adhesive layer made from a polyester-based pressure-sensitive adhesive composition containing a polyester including at least a lactic acid unit, a dibasic acid unit, and a glycol unit, a radiation-cure resin, a radiation reaction initiator, and a crosslinking agent. The dibasic acid unit includes a dimer acid, the polyester has a glass transition temperature of ?70 to ?20° C., a weight average molecular weight of 20,000 to 200,000, and a hydroxyl value of 1 to 60 mgKOH/g, the composition contains 30 to 70 parts by weight of the radiation-cure resin based on 100 parts by weight of the polyester and contains 3 to 10% by weight of the radiation reaction initiator based on the amount of the radiation-cure resin.

Abstract: A bit patterned magnetic recording medium, comprises a non-magnetic substrate having a surface; a plurality of spaced apart magnetic elements on the surface, each of the elements constituting a discrete magnetic domain or bit; and a layer of a ferromagnetic material for regulating magnetic exchange coupling between said magnetic elements. The layer has a saturation magnetization Ms ranging from about 1 to about 2,000 emu/cm3, preferably below about 400 emu/cm3, more preferably below about 200 emu/cm3, and may overlie, underlie, or at least partially fill spaces between adjacent magnetic elements.

Abstract: An adhesive composition for semiconductor containing an organic-solvent-soluble polyimide (a), an epoxy compound (b) and a hardening accelerator (c), wherein per 100 wt parts of the epoxy compound (b), there are contained 15 to 90 wt parts of the organic-solvent-soluble polyimide (a) and 0.1 to 10 wt parts of the hardening accelerator (c), wherein the epoxy compound (b) contains a compound being liquid at 25° C. under 1.013×105 N/m2 and a compound being solid at 25° C. under 1.013×105 N/m2, and wherein a ratio of compound being liquid based on all the epoxy compounds is 20 wt % or more and 60 wt % or less.

Abstract: Provided herein are polyfarnesenes derived from a farnesene and at least two different vinyl monomers. Also provided herein are polyfarnesenes derived from a farnesene; at least two different vinyl monomers, such as (meth)acrylic acid, (meth)acrylic esters, styrene, and substituted styrenes; and at least one functional comonomer such as maleic anhydride.

Abstract: A wafer-processing tape, which has an adhesive layer and a removable adhesive layer formed on a surface of a base film, and which has an area where B>A, and an area where A>B, in which a peeling force between the base film and the adhesive layer is designated as A, and peeling forces between a target to be bonded and the adhesive layer and between a target to be bonded and the removable adhesive layer are designated as B, wherein the adhesive layer is transferred onto the chip side during pickup in the area where B>A, and the removable adhesive layer is not transferred onto the target to be bonded in the area where A>B during peeling off the tape.

Abstract: Provided herein are polyfarnesenes such as farnesene homopolymers derived from a farnesene and farnesene interpolymers derived from a farnesene and at least a vinyl monomer; and the processes of making and using the polyfarnesenes. The farnesene homopolymer can be prepared by polymerizing the farnesene in the presence of a catalyst such as a Ziegler-Natta catalyst, a Kaminsky catalyst, a metallocene catalyst, an organolithium reagent or a combination thereof. In some embodiments, the farnesene is prepared from a sugar by using a microorganism.

Abstract: Provided herein are polyfarnesenes such as farnesene homopolymers derived from a farnesene and farnesene interpolymers derived from a farnesene and at least a vinyl monomer; and the processes of making and using the polyfarnesenes. The farnesene homopolymer can be prepared by polymerizing the farnesene in the presence of a catalyst. In some embodiments, the farnesene is prepared from a sugar by using a microorganism.

Abstract: Farnesene interpolymer comprises units derived from a farnesene (e.g., ?-farnesene or ?-farnesene) and units derived from at least one vinyl monomer. The farnesene interpolymer can be prepared by copolymerizing the farnesene and at least one vinyl monomer in the presence of a catalyst. In some embodiments, the farnesene is prepared from a sugar by using a microorganism. In other embodiments, the at least one vinyl monomer is ethylene, an ?-olefin, or a substituted or unsubstituted vinyl halide, vinyl ether, acrylonitrile, acrylic ester, methacrylic ester, acrylamide or methacrylamide, or a combination thereof.

Abstract: A method of forming a label includes providing a semi-opaque or transparent film, disposing an ink receptive coating on at least one side of the semi-opaque or transparent film, forming an adhesive track on a perimeter of the ink receptive coating, and masking the adhesive track with a release member configured to provide access to the ink receptive coating for image formation.

Abstract: A panel for an indicating instrument has a base plate. The base plate has a line pattern with lines. The line pattern is defined by projections and grooves. A desired metal-like appearance is converted into a glossiness ratio Gp/Gv. The projections and grooves are formed at intervals and have at least one dimension in a direction perpendicular to the surface such that the surface has a predetermined glossiness ratio Gp/Gv. Gp is a glossiness measured in a direction parallel to an axis of at least one line. Gv is a glossiness measured in a direction perpendicular to an axis of at least one line.

Abstract: Provided herein are polyfarnesenes such as farnesene homopolymers derived from a farnesene and farnesene interpolymers derived from a farnesene and at least a vinyl monomer; and the processes of making and using the polyfarnesenes. The farnesene homopolymer can be prepared by polymerizing the farnesene in the presence of a catalyst. In some embodiments, the farnesene is prepared from a sugar by using a microorganism.