Abstract: An apparatus for formation of a three dimensional object comprising a sealed container; an electron beam subsystem capable of directing energy within said container; a positioning subsystem contained within said container; a wire feed subsystem contained within said container; an instrumentation subsystem electronically connected to said electron beam subsystem, positioning subsystem, and wire feed subsystem; and a power distribution subsystem electrically connected to said electron beam subsystem, positioning subsystem, wire feed subsystem, and said instrumentation subsystem.

Abstract: There is provided an injection molding machine provided with an injection mechanism that enables a high-speed injection.

Abstract: An apparatus for casting a patterned surface on both sides of a web. The apparatus includes a first patterned roll; a second pattered roll; and a means for rotating the first and second patterned rolls such that their patterns are transferred to opposite sides of the web while it is in continuous motion. During this process, their patterns are maintained in continuous registration to within at least 100 microns, and preferably at least 20 microns.

Abstract: A fixed mold (10) has engaging pins (17) projecting towards a movable mold (20). Each engaging pin (17) includes a shaft (17A) and a large-diameter portion (17C) formed at the leading end of the shaft (17A). The large-diameter portions (17C) of the engaging pins (17) interfere with the bottom surfaces of recesses (53) of an ejector plate (50) in the process of separating the movable mold (20). Thus, the ejector plate (50) is moved forward relative to the movable mold (20) and leading ends of ejector pins (90) project from the movable mold (20).

Abstract: A system and method for real time deposition process control based on resulting product detection, where the system and method detect an amount of at least one reaction product in real time, while the deposition process is being performed, the detected amount of reaction product is compared with a reference amount, and a comparison result is fed back in real time to adjust a supply of one or more reactants. The system and method provide real time control over the deposition process and/or reduce the number of wafers produced that do not meet processing target values.

Abstract: The present invention is directed toward a system to vary dimensions of a template in order to attenuate if not prevent distortions in an underlying pattern formed by the template. To that end, the system features a compression device that includes a pair of spaced-apart contact members to compress a perimeter surface of the template between the pair of spaced-apart contact members. The compression device includes first and second bodies, each has a contact member and an actuator arm. One of the actuator arms is coupled to the first body to reciprocate about an axis in response to variations of a volume of a bladder disposed adjacent to the actuator arm. In this manner, the distance between the two contact members may be varied.

Abstract: A process for injection-foaming a thermoplastic resin by using an injection molding machine with a two-stage-compression screw, injecting a physical foaming agent into the cylinder of the machine at a pressure lower than the storage pressure of the physical foaming agent, mixing it with a melted resin and expanding the volume of the cavity of the mold at the time of injection, and an injection molding machine and resin composition suitable therefore.

Abstract: A die tip adapted for extruding a plurality of meltblown multicomponent filaments that includes at least two series of conduits that extend and converge in to the interior of the die tip to convey a multicomponent thermoplastic structure in to the interior of the die tip to a series of capillaries that extend to a series of die opening for extruding multicomponent filaments is provided.

Abstract: An atomic layer deposition method includes positioning a semiconductor substrate within an atomic layer deposition chamber. A first precursor gas is flowed to the substrate within the atomic layer deposition chamber effective to form a first monolayer on the substrate. After forming the first monolayer, a reactive intermediate gas is flowed to the substrate within the deposition chamber. The reactive intermediate gas is capable of reaction with an intermediate reaction by-product from the first precursor flowing under conditions of the reactive intermediate gas flowing. After flowing the reactive intermediate gas, a second precursor gas is flowed to the substrate within the deposition chamber effective to form a second monolayer on the first monolayer. Other aspects and implementations are contemplated.

Abstract: When a SiC substrate is heated up to around 1800°C., sublimation of SiC occurs from the SiC substrate. Moreover, temperature of the front surface of the SiC substrate is lower than that of the back surface of the SiC substrate. Therefore, sublimation gas sublimed from a back-surface vicinity of the substrate, where temperature is high, moves to a front-surface vicinity of the substrate, where temperature is low, through the hollow micro-pipe defect. Epitaxial growth proceeds on the front surface of the substrate while the sublimation gas is recrystallized at the front-surface vicinity of the substrate, so that the micro-pipe defect is occluded.

Abstract: A stereolithographic method which comprises irradiating the surface of a photohardenable resin composition with light through an image drawing mask capable of changing its mask image with the image drawing mask being moved in parallel to the surface of the photohardenable resin composition and the mask image of the image drawing mask being changed in synchronism with the movement of the image drawing mask according to the sectional shape pattern on the photohardened resin layer to be formed to form a photohardened resin layer having a predetermined sectional shape pattern and a stereolithographic apparatus therefor.

Abstract: The present invention relates to a gas purging block for use with injection molding and die casting systems, which includes a stationary-side block adapted to be removably mounted to a stationary-side mold half of the injection molding or die casting system, and an ejector-side block adapted to be removably mounted to an ejector-side mold half of the injection molding or die casting system. At least one of the stationary-side block and the ejector-side block includes a pair of channels extending through the block adapted to selectively function as conduits for cooling fluid and as mounting bores for mounting the block to the respective mold half.

Abstract: A sprue bushing includes a melt channel for receiving a melt stream of moldable material from a source. The melt channel includes a first portion, a second portion and a decompression cavity located between the first portion and the second portion. A manifold having a manifold channel receives the melt stream from the melt channel of the sprue bushing and delivers the melt stream through the nozzle channels of several hot runner nozzles towards at least one mold cavity. A decompression device, which includes a rod having an enlarged head, is movable by an actuator to reciprocate within the decompression cavity between a retracted position and an extended position. Movement of the enlarged head from the extended position to the retracted position causes the suck back of the molten material in the hot runner nozzle and causes a portion of the molten material to be drawn toward the decompression cavity.

Abstract: The present invention relates to a pellet-type non-crosslinked polypropylene foam having a melting point of 125 to 140° C., and a process and device for producing said foam. Since the pellet-type foams of non-crosslinked polypropylene of the present invention has a lower melting point and a closed cell content of 80% or more, it is advantageous to mold such foams. The present invention also relates to an article molded from the above pellet-type non-crosslinked polypropylene foams.

Abstract: A machine and a method for forming composite materials are provided. The machine includes a frame and at least one forming beam attached to the frame, the at least one beam being arranged to align with a mandrel. The forming beam is pivotally segmented into at least two segments to conform to the shape of the mandrel, or alternately is bendable to conform to the shape of the mandrel. The mandrel is receivable within the frame in alignment with the forming beam. An apparatus is also provided to position a composite charge over the mandrel, and to position the mandrel within the frame. A further apparatus is provided to transport the mandrel, and to urge the mandrel toward the forming beam, forming a composite charge.

Abstract: Within a process for recycling of PET-material and/or objects of PET, the PET-material to be processed is heated and dried in the course of a pre-treatment step and simultaneously is crystallized at elevated temperature. This pre-treatment step is followed by a main-treatment step under vacuum. In this main-treatment step, the processed material is again dried and crystallized at a temperature that is higher than the temperature of the pre-treatment step. Preferably, also in the main-treatment step no plasticizing of the material takes place; the plasticizing or, respectively, melting of the material takes place only after the main-processing step. An apparatus for performing this process comprises a pre-processing device (3) in which the processed material is dried and simultaneously crystallized at elevated temperature, and, if desired, is also comminuted.

Abstract: A three-dimensional laminating molding device includes ejection heads that eject support material for a support, and an ejection head that ejects mold material for a mold. The support material is sold at room temperature. An inner temperature of the laminating molding device during the laminating molding is controlled to a range of (a melting point of the support material?30)° C. to (the melting point of the support material?5)° C.

Abstract: A single-wafer, chemical vapor deposition reactor is provided with hydrogen and silicon source gas suitable for epitaxial silicon deposition, as well as a safe mixture of oxygen in a non-reactive gas. Methods are provided for forming oxide and silicon layers within the same chamber. In particular, a sacrificial oxidation is performed, followed by a hydrogen bake to sublime the oxide and leave a clean substrate. Epitaxial deposition can follow in situ. A protective oxide can also be formed over the epitaxial layer within the same chamber, preventing contamination of the critical epitaxial layer. Alternatively, the oxide layer can serve as the gate dielectric, and a polysilicon gate layer can be formed in situ over the oxide.

Abstract: An injection molding apparatus has a die having a fixed mold and a moveable mold disposed to face with each other. A frame structure is detachably provided on the outer surfaces of the fixed mold and the moveable mold, that is, opposite to the surface of the cavity defined by the fixed mold and the moveable mold. Each frame that constitutes the frame structure has a shape that can be combined together. One of frames provided on the fixed mold or the moveable mold is fixed thereto in a die clamping direction or a direction perpendicular thereto. The frame is fixed to the fixed mold of the die, leaving a predetermined gap in the direction perpendicular to that for fixing the frame structure to the die. The pressurizing mechanism that applies a pressing force in the direction other than for fixing the frame structure to the die. The hydraulic control mechanism is employed as the pressurizing mechanism.

Abstract: An extrusion molding apparatus comprises a shaping die for producing a ceramic molded product, and a screw extruder having built therein an extruding screw (40) for mixing while leading a ceramic material forward. The extruding screw (40) includes a pressing screw portion (410) having a first lead (411) and a dispersing screw portion (420) having a second lead (421) adjacent to a forward end (412) of the pressing screw portion (410). The second lead (421) is formed in such a manner that the rear ends of all the second lead surfaces (426) at the rear end (422) of the dispersing screw portion (420) and the forward end of the first lead surface (416) at the forward end (412) of the pressing screw portion (410) are displaced from each other.