Patents Examined by Guillermo Egoavil
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Patent number: 10395835Abstract: A multilayer ceramic electronic component includes a laminated body, a first external electrode, a pair of second external electrodes, and a pair of insulating coating portions. The pair of insulating coating portions extends in a laminating direction between each of the pair of second external electrodes and the first external electrode on a second principal surface, from the second principal surface to respective portions of a first side surface and a second side surface. As viewed from at least one direction in the laminating direction, an end of the first external electrode and pair of second external electrodes, which is located closest to a first principal surface, is located closer to the first principal surface than an end of the pair of insulating coating portions, which is located closest to the first principal surface.Type: GrantFiled: June 2, 2017Date of Patent: August 27, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takashi Sawada, Yasuo Fujii, Takayuki Kayatani
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Patent number: 10224704Abstract: A welding sleeve for armored cables including a first sleeve part arranged to receive an armored cable, wherein the first sleeve part has a perimeter surface for welding armoring wires of an armored cable thereto, a second sleeve part arranged to receive an armored cable, wherein the second sleeve part has a perimeter surface for welding armoring wires of an armored cable thereto, wherein the first sleeve part is arranged to receive the second sleeve part, the second sleeve part being axially displaceable relative to the first sleeve part, along a common central axis, between an extended position and a retracted position, in which retracted position the first sleeve part receives a greater portion of the second sleeve part than in the extended position, and a rotation preventing arrangement arranged to prevent rotational motion of the first sleeve part relative to the second sleeve part.Type: GrantFiled: February 19, 2016Date of Patent: March 5, 2019Assignee: NKT HV Cables GmbHInventors: Anders Hansson, Andreas Tyrberg, Johan Hedlund
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Patent number: 10201079Abstract: A flexible electronic device including a substrate and a line layer disposed on the substrate. The line layer includes a first conductive layer disposed on the substrate, a plurality of polymer walls disposed on the first conductive layer and spaced apart from each other in a horizontal direction parallel to the substrate, and a second conductive layer including first portions disposed between the polymer walls and a second portion disposed on the polymer walls. A portion of the first conductive layer contacts the first portions.Type: GrantFiled: March 21, 2017Date of Patent: February 5, 2019Assignee: Samsung Display Co., Ltd.Inventors: Jaeneung Kim, Jungha Son, Yong-hwan Ryu
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Patent number: 10192684Abstract: A multilayer capacitor includes a capacitor body including dielectric layers and a plurality of first and second internal electrodes exposed through the third and fourth surfaces, and having first to sixth surfaces; first and second external electrodes including first and second connection portions disposed on the third and fourth surfaces, and first and second band portions extending from the first and second connection portions to portions of the first and second surfaces and the fifth and sixth surfaces; first and second conductive resin layers covering portions of the first and second band portions; an insulating layer disposed on the first surface; and first and second terminal electrodes spaced apart from each other, covering portions of the insulating layer, and connected to the first and second external electrodes.Type: GrantFiled: July 7, 2017Date of Patent: January 29, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Heung Kil Park, Jong Hwan Park, Se Hun Park
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Patent number: 10194568Abstract: Semi-finished product made from composite material comprising a thermoplastic or thermosetting matrix and reinforcement fillers. The semi-finished product comprises an electromagnetic shielding film positioned in the thickness of the semi-finished product, the electromagnetic shielding film comprising holes.Type: GrantFiled: December 22, 2014Date of Patent: January 29, 2019Assignee: Compagnie Plastic OmniumInventors: Gerald Andre, Hugues Cheron
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Patent number: 10186354Abstract: A mounting structure includes a PCB on which first and second conductive patterns are formed, and a shunt resistor mounted on one surface of a substrate via a conductive bonding material. Each of the first and second conductive patterns includes: a first/second lead-out portion and a first/second pull-out portion which is pulled out to the outside of a region of the shunt resistor from the first/second lead-out portion. A resistance value of the shunt resistor is detected between the first pull-out portion and the second pull-out portion. A bonding material flow-out preventing resist is disposed at a portion of a surface of at least one of the first lead-out portion and the second lead-out portion, and a fillet of the bonding material terminates at a position corresponding to a position where the bonding material flow-out preventing resist is disposed.Type: GrantFiled: September 14, 2017Date of Patent: January 22, 2019Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.Inventor: Yohei Shinotake
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Patent number: 10188016Abstract: The present disclosure is directed to a configurable extension space for a computer server or node blade that has the ability to expand data storage or other functionality to a computer system while minimizing any disruption to computers in a data center when the functionality of a computer server or a node blade is extended. Apparatus consistent with the present disclosure may include multiple electronic assemblies where a first assembly resides deep within an enclosure to which an expansion module may be attached in an accessible expansion space. Such apparatus may also include liquid cooling.Type: GrantFiled: October 31, 2016Date of Patent: January 22, 2019Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LPInventors: Harvey Lunsman, Steven J. Dean, Roger Ramseier, Russell Stacy
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Patent number: 10176907Abstract: A cable (100) includes a power wire (1), a ground wire (3), data transmission wires (2) between the power wire and the ground wire, and an insulating outer layer (4) enclosing the outer side of the power wire, the ground wire, and the data transmission wires. The power wire includes a conductor (11), an insulating layer (12) outside the conductor, and a metal shielding layer (13) outside the insulating layer. The power wire and the data transmission wires are spaced from each other by plastic materials.Type: GrantFiled: February 19, 2017Date of Patent: January 8, 2019Assignee: FOXCONN INTERCONNECT TECHNOLOGY LIMITEDInventors: A-Nan Yang, Hong-Ping Wang, Lu-Yu Chang
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Patent number: 10172238Abstract: A multilayer capacitor includes a capacitor body including first and second internal electrodes alternately stacked with dielectric layers interposed therebetween. The first and second internal electrodes are exposed at a mounting surface of the capacitor body. The capacitor body includes first and second groove parts at the mounting surface, spaced apart in a length direction of the capacitor body, and contacting exposed portions of the first and second internal electrodes, respectively. The multilayer capacitor includes first and second external electrodes in the first and second groove parts, respectively, and electrically connected to the exposed portions of the first and second internal electrodes, respectively.Type: GrantFiled: April 20, 2017Date of Patent: January 1, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ho Sam Choi, Ki Pyo Hong
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Patent number: 10164348Abstract: A one piece integral electrical terminal has a mount portion and a wire receiving portion. The wire receiving portion has a continuous annular interior wall having a contact portion with an integral oxide breaker especially suited to breaking through the oxide layer on aluminum wire. The wire receiving portion also has a sealing portion with at least one integral seal ring. An electrical cable is made by crimping the electrical terminal to an aluminum wire using a modified hexagonal crimp.Type: GrantFiled: July 5, 2016Date of Patent: December 25, 2018Assignee: Carlisle Interconnect Technologies, Inc.Inventors: Kenneth J. Peters, William L. Arenburg
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Patent number: 10164418Abstract: Mounting devices for an elongate flexible member, such as an electrical cable passing through the wall of a structure, are described. The mounting devices may include an elongate body having a longitudinal axis and elongate recesses that are inclined with respect to the longitudinal axis. An internal passageway for the elongate flexible member may pass through the elongate body parallel to the longitudinal axis, and apertures corresponding to the recesses may be disposed in the outer peripheral face of the elongate body. An engagement member, such as a ball, may be mounted in each recess and move along the recess. The engagement members, recesses and the apertures may be dimensioned to allow the engagement members to project partially beyond the outer peripheral face of the elongate body but to prevent the engagement members from leaving the recesses through the apertures in the outer peripheral face of the elongate body.Type: GrantFiled: February 10, 2016Date of Patent: December 25, 2018Assignee: First Subsea LimitedInventors: Craig Richard Thomson, John Stuart Shaw
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Patent number: 10158219Abstract: An electric field control device for a high voltage cable includes a stress cone and a field grading adapter, wherein the stress cone and the field grading adapter are chemically bonded by vulcanization. An electric installation includes a power cable and the electric field control device. A method for producing the electric field control device is also disclosed.Type: GrantFiled: August 22, 2014Date of Patent: December 18, 2018Assignee: ABB HV CABLES (SWITZERLAND) GMBHInventors: Fredrik Fälth, Markus Saltzer, Santhosh Bvmp, Hossein Ghorbani
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Patent number: 10153064Abstract: An interface device comprises a layer of a material thoroughly crossed by metal electrodes intended to electrically connect two electronic circuits. According to the present invention, the layer of material comprises a graphene layer and the electrodes each comprise a central electrically-conductive element formed across the thickness of the graphene layer and an electrically-insulating peripheral layer, interposed between the central element and the graphene layer.Type: GrantFiled: March 26, 2015Date of Patent: December 11, 2018Assignee: Commissariat A L'Energie Atomique Et Aux Energies AlternativesInventors: Abdelkader Aliane, Philippe Coronel
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Patent number: 10147517Abstract: A wire harness that includes an electric wire provided with a conductor and an insulator that coats an outer periphery of the conductor, a terminal connected to the conductor at a terminal end of the electric wire, and a molded resin portion that covers an outer periphery of the insulator at the terminal end of the electric wire and an outer periphery of an end portion on the electric wire side of the terminal. A storage modulus E? of the insulator that is measured using a dynamic viscoelasticity measurement device in a tensed mode at a temperature increase rate of 5° C./min and a frequency of 10. Hz is 100 MPa or less at 25° C. and 1 MPa or more at 250° C., and a starting temperature (T) of a rubbery plateau region (G) is 150° C. or less.Type: GrantFiled: November 18, 2016Date of Patent: December 4, 2018Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Kazuo Nakashima, Katsufumi Matsui, Kouji Fukumoto, Kentaro Tachi
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Patent number: 10149384Abstract: A support structure located at a bottom of a ball grid array (BGA) is provided. The support structure includes a printed circuit board (PCB) having first positioning pin holes, an interface plate having second positioning pin holes which correspond to the first positioning pin holes arranged on the PCB, a support film arranged on the PCB and having support portions, and positioning components penetrating the first positioning pin holes and the second positioning pin holes corresponding to the first positioning pin holes to assemble the support film on the PCB and the interface plate.Type: GrantFiled: July 4, 2018Date of Patent: December 4, 2018Assignee: CHUNGHWA PRECISION TEST TECH. CO., LTD.Inventors: Yung-Tai Su, Ching-Fang Cheng, Ti-Chiang Chiu
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Patent number: 10144369Abstract: Provided is a curvature restricting member, allowing for a curvature of the wire harness in a predetermined allowable direction, and regulating the curvature of the wire harness in a regulating direction beyond a predetermined limit state or more, the curvature restricting member includes: a plurality of member pieces arranged along the wire harness; a flexible connecting portion connecting adjacent ones of the plurality of member pieces to each other, wherein the curvature is allowed in the allowable direction by adjacent ones among the plurality of member pieces at the curbed portions separating from each other on the side opposite to the connecting portion and the connection portion bending, and wherein the curvature is not allowed in the restricting direction beyond the limit state by adjacent ones among the plurality of member pieces at the curbed portion abutting against each other on the side opposite to the connecting portion.Type: GrantFiled: April 10, 2017Date of Patent: December 4, 2018Assignee: YAZAKI CORPORATIONInventors: Tsukasa Sekino, Mitsunobu Kato, Masaki Yokoyama, Tatsuya Otuka
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Patent number: 10143087Abstract: A circuit module includes a first and second monolithic ceramic capacitors encapsulated by a mold resin layer on a wiring board. The first and second monolithic ceramic capacitors are lined up along a direction parallel or substantially parallel to the main surface of the wiring board and are electrically connected in series or in parallel through a conductive pattern provided on the wiring board. One of a pair of end surfaces of the first monolithic ceramic capacitor is opposed to one of the width-direction side surfaces as a pair of side surfaces of the second monolithic ceramic capacitor with the mold resin layer interposed.Type: GrantFiled: May 4, 2017Date of Patent: November 27, 2018Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Kazuo Hattori, Isamu Fujimoto
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Patent number: 10136541Abstract: An electronic device includes a Printed Circuit Board (PCB), a housing, an inner cover, and an outer cover. The PCB mounts a first socket and a second socket thereon. The housing includes a first slot disposed to correspond to the first socket and a second slot disposed to correspond to the second socket. The housing receives the PCB. The inner cover opens/closes the first slot. The outer cover opens/closes the second slot. The first socket and the second socket are open toward the first slot and the second slot, respectively. When the outer cover is open, the inner cover is exposed and is in an openable state.Type: GrantFiled: July 11, 2014Date of Patent: November 20, 2018Assignee: Samsung Electronics Co., Ltd.Inventor: Bong-Jae Rhee
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Patent number: 10122159Abstract: An electric connection box includes: a main body case; and an upper cover which engages with the main body case. The main body case includes a base wall which has an electric component mounting portion; a peripheral wall which is disposed on the base wall and partitions an inside and an outside of the main body case; a main body interior drainage port which is disposed at a place with possibility of water infiltration into an inside of the peripheral wall along a gap portion between the upper cover and the peripheral wall and passes through the base wall; and at least one main body interior drainage wall which is erected on the base wall and extends toward an opening edge of the main body interior drainage port on a surface of the base wall.Type: GrantFiled: February 15, 2017Date of Patent: November 6, 2018Assignee: YAZAKI CORPORATIONInventors: Eiji Okada, Tomoyasu Murakami
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Patent number: 10116125Abstract: A cold shrinkable termination for an electric power cable that includes an insulation tube and stress control glue. When the cold shrinkable termination is mounted on the electric power cable, the stress control glue fills a gap between the electric power cable and the insulation tube so as to prevent local electric field concentration from occurring at an exposed end of the electric power cable. The stress control glue has a dielectric constant within a range of 5 to 100. In this cold shrinkable termination, a stress control glue with high dielectric constant is provided to optimize the electric-field distribution on an insulation surface of the electric power cable. Thereby, the structure of the cold shrinkable termination is simplified and the cost thereof is reduced. The cold shrinkable termination may be adapted to an electric power cable used to transmit voltage less than 26/35 kV.Type: GrantFiled: July 30, 2015Date of Patent: October 30, 2018Assignee: Tyco Electronics (Shanghai) Co. Ltd.Inventors: Yugang Li, Lizhang Yang, Haowei Yang, Peng Li, Song Xue