Abstract: Presented herein is a method and apparatus for enhanced power distribution to application specific integrated circuits (ASICs). The apparatus includes a substrate, an ASIC, and a voltage regulator module. The substrate includes a first side, a second side, and a vertical interconnect access (via) extending between the first side and the second side. The ASIC is mounted on the first side of the substrate in alignment with the via. The voltage regulator module is mounted on the second side of the substrate in alignment with the via so that the voltage regulator module is electrically coupled to the ASIC through the via.

Abstract: A conductor connecting structure includes a mounting board, a target board, and an anisotropic conductive material. The mounting board includes a base material including a first surface, a second surface, and an end surface. The mounting board also includes a first conductor layer and a second conductor layer. The target board includes a mounting surface and a third conductor layer formed on the mounting surface. The anisotropic conductive material includes a polymeric material and electrically conductive particles dispersed in the polymeric material. The electrically conductive particles, when heated, aggregate to connect an end portion of the first or second conductor layer to the third conductor layer. One of the end portions not subjected to connection established with the anisotropic conductive material is separated further from the end surface of the base material than another end portion which is connected to the third conductor layer.

Abstract: A conduit box assembly including: a housing defining an interior chamber; arms extending outward from the housing, wherein the arms each have a wall defining a passage into the chamber; a compressible seal for each of the arms, wherein each seal has an outer surface configured to seat in and abut the wall of the arm receiving the seal, and a cover configured to attached to the housing and cover an open side of the housing, wherein the cover includes arms extending outward from a center portion the cover and the arms are each configured to cover an open side of a respective one of the arms of the housing and compress the seal in the respective arm.

Abstract: An electronic component includes an inner electrode inside of a main body and exposed at a surface of the main body, and an outer electrode on a surface of the main body and electrically connected to the inner electrode, wherein a plurality of recesses are provided in a surface of the outer electrode, and each of the plurality of recesses includes a portion in which a diameter of an opening of the recess gradually decreases toward an opening side of the recess.

Abstract: A frame for a switch cabinet has a plurality of frame profiled elements connected to each other. At least two retainers vertically spaced apart from each other, which have holes for distribution bus bars, are arranged within the outer contour formed by the profiled elements. In an operating position, the retainers are oriented along a vertical axis. An electrically insulating bottom plate is arranged at a first end of the distribution bus bars, the bottom plate having a region of overlap with the distribution bus bars. The bottom plate is detachably supported in a retainer connected to the frame profiled elements.

Abstract: A portion of a flat conductor is exposed from an insulating layer covering at least one of surfaces of the flat conductor. A terminal includes a bottom plate on which the exposed portion of the flat conductor is provided, and crimp claws which are raised at two side edges of the bottom plate so that the exposed portion is disposed therebetween. The exposed portion is folded so as to define a bottom layer which faces the bottom plate and a top layer which faces opposite to the bottom plate. The top layer is configured to be plastically deformed so as to fill a gap between the top layer and inner surfaces of the crimp claws when the crimp claws are crimped onto the top layer, so that the bottom layer is in surface contact with the bottom plate.

Abstract: Provided are a circuit board structure and a fabrication method thereof, including the steps of: forming a first circuit layer in a first dielectric layer and exposing the first circuit layer therefrom; forming a second dielectric layer on the first dielectric layer and the first circuit layer, and forming a second circuit layer on the second dielectric layer; forming a plurality of first conductive vias in the second dielectric layer for electrically connecting to the first circuit layer to thereby dispense with a core board and electroplated holes and thus facilitate miniaturization. Further, the first dielectric layer is liquid before being hardened and is formed on the first dielectric layer that enhances the bonding between layers of the circuit board and the structure.

Abstract: An electronic device can include a circuit board, an electronic component mounted on the circuit board, a conductive contact disposed (e.g., deposited) on the circuit board, and a shielding polymer layer deposited over the electronic component. The shielding polymer layer includes a network of conductive pathways formed from sintered particles. The network of conductive pathways is electrically coupled to the conductive contact, which can be configured for connection to a power source ground. As such, the network of conductive pathways enables electromagnetic shielding of the electronic component.

Abstract: A copper alloy element wire 1 has a chemical composition including: 0.45 mass % or more and 2.0 mass % or less, in total, of at least one additive element selected from the group consisting of Fe, Ti, Sn, Ag, Mg, Zn, Cr and P; in mass ppm, 10 ppm or less of H content, and the balance being Cu and unavoidable impurities. A copper alloy stranded wire 2 includes a plurality of the copper alloy element wires 1 twisted together. An automotive electric wire 5 includes the copper alloy stranded wire 2 and an insulator 3 that covers the outer periphery of the copper alloy stranded wire 2.

Abstract: A power adapter including a first substrate, a second substrate, a transformer and an insulating frame is provided. The first substrate includes a first terminal set. The second substrate includes a second terminal set. The transformer includes a primary side connection terminal and a secondary side connection terminal, wherein the primary side connection terminal is connected to the first terminal set and the secondary side connection terminal is connected to the second terminal set. The insulating frame is disposed between the first substrate and the second substrate, and the transformer leans against the insulating frame.

Abstract: A composite electronic component includes: a composite including a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes alternately disposed with respective dielectric layers interposed therebetween, external electrodes extending from third and fourth surfaces of the capacitor body to portions of the first, second, fifth, and sixth surfaces, respectively, a discharge layer disposed between the external electrodes on the second surface of the capacitor body, and a protective layer disposed on the discharge layer; and conductive resin layers overlapping the third and fourth surfaces and portions of the first, second, fifth, and sixth surfaces, respectively. Widths of portions of the external electrodes formed on the first surface of the capacitor body are greater than widths of portions of the first and second conductive resin layers overlapping the first surface of the capacitor body.

Abstract: An electronic transfer card is provided, including a bottom shell, an upper cover located above the bottom shell, and an accommodating cavity formed by enclosing the bottom shell and the upper cover and provided with a socket and a window, a first and second plastic component are arranged in the accommodating cavity, the first plastic component is clamped in the bottom shell and provided with a plurality of first connecting terminals capable of electrically contacting with a clip piece, the second plastic component is partly overlapped in the first plastic component, the first plastic component is provided with a plurality of second connecting terminals electrically contacting with the clip piece and an electric conduction portion capable of performing information transmission to an external electronic component, and electric conduction portion is electrically communicated with each of the second connecting terminals; an electronic device is further provided, comprising the above transfer card.

Abstract: A plurality of electronic wires are fixed by a mold part in a state arranged in at least two rows. The mold part has a first end face from which the electronic wires of a first row in the plurality of electronic wires protrude and a second end face from which the electronic wires of a second row in the plurality of electronic wires protrude. An angle of the first end face with respect to a direction of a central axis line of a multi-core cable differs from an angle of the second end face with respect to the direction of the central axis line. The electronic wires of the first row in the first end face protrude along a direction away from the electronic wires of the second row protruding from the second end face.

Abstract: [Object] Provided are an electrode substrate film which does not cause trouble in a process to create a circuit pattern formed of a metal thin line and in which the circuit pattern is less visible even under highly bright illumination, and a method of manufacturing the same. [Solving Means] An electrode substrate film with a transparent substrate 52 and a metal laminate thin line includes a metal absorption layer 51 with a film thickness of 20 nm to 30 nm inclusive as a first layer, and a metal layer 50 as a second layer, counted from the transparent substrate side. Optical constants of the metal absorption layer in a visible wavelength range (400 to 780 nm) satisfy conditions that a refractive index is 1.8 to 2.2 and an extinction coefficient is 1.8 to 2.4 at a wavelength of 400 nm, the refractive index is 2.2 to 2.7 and the extinction coefficient is 1.9 to 2.8 at a wavelength of 500 nm, the refractive index is 2.5 to 3.2 and the extinction coefficient is 1.9 to 3.

Abstract: An electronic control unit according to the present invention includes an electronic control element which includes a printed circuit board that electrically controls respective components of a vehicle, and a heat radiating portion that is provided at one side of the printed circuit board, a housing which accommodates the electronic control element, a connector which connects the electronic control element and the vehicle, a sealing unit which seals a connecting portion between the electronic control element and the connector, and a fixing bracket, and further includes a rivet fastening means in order to fastened the housing and the fixing bracket.

Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first circuit layer disposed on an upper surface of a substrate, an insulating layer disposed on the substrate and the first circuit layer, a second circuit layer disposed on an upper surface of the insulating layer, and a via configured to connect between the first circuit layer and the second circuit layer, and a lower part of the via is in contact with the upper surface of the substrate.

Abstract: An electric conductor may be provided. The electric conductor may comprise a conductor core and a plurality of conductor strands wrapped around the conductor core. The conductor core may comprise a plurality of core strands comprising an overall number of strands. The plurality of core strands may comprise a first portion of core strands and a second portion of core strands. The first portion of core strands may comprise a first number of strands. The first portion of core strands may comprise steel. The second portion of core strands may comprise a second number of strands. The second portion of core strands may comprise a composite material. A ratio of the first number of strands to the overall number of strands and a ratio of the second number of strands to the overall number of strands may be optimized to give the conductor core a predetermined characteristic.

Abstract: Embodiments of an apparatus for connection to a light adjustment sheet and conductive interfaces for connection to a light adjustment sheet are described. In one embodiment, an apparatus for connection to a light adjustment sheet include a power source interface configured to be connected to a power source and a sheet interface electrically connected to the power source interface. The sheet interface is configured to connect to the light adjustment sheet such that electricity can be conducted from the power source interface to the light adjustment sheet to switch the light adjustment sheet between different visibility states. Other embodiments are also described.

Abstract: A support structure located at a bottom of a ball grid array (BGA) is provided. The support structure includes a printed circuit board (PCB) having first positioning pin holes, an interface plate having second positioning pin holes which correspond to the first positioning pin holes arranged on the PCB, a support film arranged on the PCB and having support portions, and positioning components penetrating the first positioning pin holes and the second positioning pin holes corresponding to the first positioning pin holes to assemble the support film on the PCB and the interface plate.

Abstract: A method of manufacturing a through-hole electrode substrate includes forming a plurality of through-holes in a substrate, forming a plurality of through-hole electrodes by filling a conductive material into the plurality of through-holes, forming a first insulation layer on one surface of the substrate, forming a plurality of first openings which expose the plurality of through-hole electrodes corresponding to each of the plurality of through-hole electrodes, on the first insulation layer and correcting a position of the plurality of first openings using the relationship between a misalignment amount of a measured distance value of an open position of a leaning through-hole among the plurality of through-holes and of a design distance value of the open position of the leaning through-hole among the plurality of through-holes with respect to a center position of the substrate.