Abstract: Acoustic resonator devices and filters are disclosed. A piezoelectric plate is attached to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a chip cavity in the substrate. A first conductor pattern is formed on a surface of the piezoelectric plate. The first conductor pattern includes interleaved fingers of an interdigital transducer on the diaphragm, and first contact pads. An interposer has walls on its back surface that are attached to the chip front surface and that surround the diaphragm. An interposer cover layer spans the walls creating an enclosed interposer cavity over the diaphragm. A second conductor pattern formed on the walls and cover layer includes second contact pads on the interposer back surface. Electrical connections between the second contact pads and connection points on the chip electrically connect the first contact pads to respective ones of the second contact pads.

Abstract: Acoustic resonator devices and filters are disclosed. An acoustic resonator includes a substrate and a piezoelectric plate having parallel front and back surfaces. The substrate includes a silicon base having a trap-rich region adjacent to a surface and a dielectric layer on the surface. The back surface of the piezoelectric plate faces the dielectric layer. The piezoelectric plate comprises a diaphragm that spans a cavity in the substrate. An interdigital transducer (IDT) is provided on the front surface of the piezoelectric plate such that interleaved fingers of the IDT are on the diaphragm.

Abstract: Spatial power-combining devices with reduced dimensions are disclosed. Spatial power-combining devices are provided that employ a hybrid structure including both a planar splitter/combiner and an antipodal antenna array. Planar splitters may be arranged to divide an input signal while antipodal antenna arrays may be arranged to combine amplified signals. In other applications, the order may be reversed such that antipodal antenna arrays are arranged to divide an input signal while a planar combiner is arranged to combine amplified signals. Advantages of such spatial power-combining devices include reduced size and weight while maintaining suitable performance for operation in desired frequency bands.

Abstract: Systems and methods for adjusting impedances or power or a combination thereof across multiple plasma processing stations are described. One of the systems includes a first radio frequency (RF) generator that generates a first RF signal having a first frequency, a second RF generator that generates a second RF signal having a second frequency, and a first matching network coupled to the first RF generator to receive the first RF signal. The first impedance matching network outputs a first modified RF signal upon receiving the first RF signal. The system further includes a second matching network coupled to the second RF generator to receive the second RF signal. The second matching network outputs a second modified RF signal upon receiving the second RF signal. The system further includes a combiner and distributor coupled to an output of the first matching network and an output of the second matching network.

Abstract: Apparatus and methods for a no-load-modulation power amplifier are described. No-load-modulation power amplifiers can comprise multiple amplifiers connected in parallel to amplify a signal that has been divided into parallel circuit branches. One of the amplifiers can operate as a main amplifier in a first amplification class and the remaining amplifiers can operate as peaking amplifiers in a second amplification class. The main amplifier can see essentially no modulation of its load between the power amplifier's fully-on and fully backed-off states. The power amplifiers can operate in symmetric and asymmetric modes. Improvements in bandwidth and drain efficiency over conventional Doherty amplifiers are obtained. Further improvements can be obtained by combining signals from the amplifiers with hybrid couplers.

Abstract: Acoustic filters and methods of fabrication are disclosed. A filter device includes a substrate and a single-crystal piezoelectric plate, a back surface of the piezoelectric plate attached to a surface of the substrate. The filter device includes a plurality of acoustic resonators including one or more shunt resonators and one or more series resonators. Each of the plurality of acoustic resonators includes an interdigital transducer (IDT) formed on the front surface of the piezoelectric plate, interleaved fingers of the IDT disposed on a respective diaphragm formed by a respective portion of the piezoelectric plate that spans a respective cavity in the substrate. A divided frequency setting layer is formed on at least some of the one or more shunt resonators but not on the one or more series resonators.

Abstract: A method includes receiving, by an RF receiving circuit of a passive wireless sensor of a wireless communication system, an RF signal. When a sensing element of the passive wireless sensor is exposed to an environmental condition, the method further includes affecting, by the sensing element, resonant frequency of the RF receiving circuit. The method further includes determining, by a processing module of the passive wireless sensor, a first value for an adjustable element for a known environmental condition, determining a second value for the adjustable element for an unknown environmental condition, determining a difference between the first and second values that correspond to a change, generating a coded value representative of the change, and transmitting the coded value. The method further includes receiving, by a second processing module of a sensor computing device of the wireless communication system, the coded value and determining a sensed environmental condition.

Abstract: An acoustic resonator device is formed using a sacrificial layer and a front side etched cavity by forming a recess in a silicon substrate with a trap-rich top layer and filling the recess with sacrificial silicon nitride. A bonding oxide (BOX) layer is formed over the trap-rich layer and the sacrificial silicon nitride filled recess and a piezoelectric plate is bonded to the BOX layer. The sacrificial silicon nitride is then removed to form a cavity by using an etchant introduced through holes in the piezoelectric plate and BOX layer without removing the BOX layer from over the cavity.

Abstract: Acoustic resonator devices and filters are disclosed. A piezoelectric plate is attached to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity in the substrate. A first conductor pattern is formed on a surface of the piezoelectric plate. The first conductor pattern includes interleaved fingers of an interdigital transducer disposed on the diaphragm, and a first plurality of contact pads. A second conductor pattern is formed on a back surface of an interposer, the second conductor pattern including a second plurality of contact pads. The interposer has layers of a LTCC circuit card, at least one layer of the tape comprising printed conductors. A plurality of conductive balls directly bonds the first plurality of contact pads formed on the plate to respective contact pads of the second plurality of contact pads formed on the interposer.

Abstract: Aspects of the present disclosure relate to a receiver including an amplifier circuit. The amplifier circuit includes a common-source amplifier having an input and an output, and a common-gate amplifier having an input and an output, wherein the input of the common-gate amplifier is coupled to the output of the common-source amplifier. The receiver also includes a first receive chain coupled to the output of the common-gate amplifier, and a second receive chain coupled to the output of the common-source amplifier.

Abstract: A system having a set of power amplifiers each having a primary inductive structure configured to provide an output signal. A secondary inductive structure is configured to inductively couple to each of the primary inductive structures. A transmission line is provided with a signal trace and a ground trace. The signal trace of the transmission line is connected to a first end of the secondary inductive structure. A return path from a second end of the secondary inductive structure is coupled via a resonant network to the ground trace of the transmission line, in which the return path is spaced away from the secondary inductive structure to minimize inductive coupling to the primary structures.

Abstract: There is disclosed acoustic resonators and filter devices. An acoustic resonator includes a substrate and a piezoelectric diaphragm that spans a cavity in the substrate. An interdigital transducer (IDT) has interleaved fingers on the diaphragm. A thickness of the interleaved fingers is greater than or equal to 0.85 times a thickness of the diaphragm and less than or equal to 2.5 times the thickness of the diaphragm.

Abstract: An optical amplifying module and a manufacturing method are provided. The optical amplifying module includes a current amplifying element, a light emitting element and a light receiving element. A main substrate of the current amplifying element has a first surface and a second surface, which are opposed to each other. Moreover, plural first main electrodes are installed on the first surface, and plural second main electrodes are installed on the second surface. The light emitting element is installed beside the first surface of the current amplifying element. The light emitting units of the light emitting element are electrically coupled with the corresponding first main electrodes. The light receiving element is installed beside the second surface of the current amplifying element. The light receiving units of the light receiving element are electrically coupled with the corresponding second main electrodes.

Abstract: Methods of making acoustic resonator devices and filters are disclosed. A method of fabricating an acoustic resonator device includes fabricating an acoustic resonator chip including: attaching a back surface of a piezoelectric plate to a front surface of a substrate, such that portions of the piezoelectric plate form at least first and second diaphragms spanning at least first and second cavities, and forming a first conductor pattern as one or more conductor layers on the piezoelectric plate. The first conductor pattern includes at least first and second interdigitated transducers (IDTs) and a first plurality of contact pads. The method further includes fabricating an interposer having front and back surface and a second plurality of contact pads on the interposer back surface, forming conductive balls, and bonding each of the first plurality of contact pads to a respective pad of the second plurality of contact pads using the respective conductive ball.

Abstract: Acoustic resonator devices, filters, and methods are disclosed. An acoustic resonator includes a substrate and a piezoelectric plate having front and back surfaces, the back surface attached to a surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm that spans a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the piezoelectric plate such that interleaved fingers of the IDT are disposed on the diaphragm. The IDT is configured to excite a primary acoustic mode in the diaphragm in response to a radio frequency signal applied to the IDT. At least one finger of the IDT is disposed in a groove in the diaphragm. A depth of the groove is less than a thickness of the at least one finger of the IDT.

Abstract: Acoustic resonators and filter devices. An acoustic resonator includes a piezoelectric plate having front and back surfaces, a portion of the piezoelectric plate forming a diaphragm, and a conductor pattern on the front surface, the conductor pattern including an interdigital transducer (IDT), fingers of the IDT on the diaphragm. A thickness of the interleaved fingers is greater than or equal to 0.85 times a thickness of the piezoelectric plate and less than or equal to 2.5 times the thickness of the piezoelectric plate. The IDT comprises a first portion having a first pitch and a first mark and a second portion having a second pitch and a second mark not equal to the first pitch and first mark.

Abstract: Resonator devices are disclosed. An acoustic resonator device includes a piezoelectric plate having front and back surfaces, an acoustic Bragg reflector on the back surface, and an interdigital transducer (IDT) on the front surface. The acoustic Bragg reflector reflects a primary shear acoustic mode excited by the IDT in the piezoelectric plate over a frequency range including a resonance frequency and an anti-resonance frequency of the acoustic resonator device.

Abstract: Acoustic resonator devices and filters; and methods of their fabrication are disclosed. A piezoelectric plate is bonded to a substrate, a portion of the piezoelectric plate forming a diaphragm spanning a cavity that is formed in the substrate. A first conductor pattern is formed on a surface of the piezoelectric plate. The first conductor pattern includes interleaved fingers of an interdigital transducer disposed on the diaphragm, and a first plurality of contact pads. A second conductor pattern is formed on a back surface of an interposer, the second conductor pattern including a second plurality of contact pads. The interposer is formed by cofiring layers of thin ceramic tape, at least one layer of the tape comprising printed conductors. A plurality of conductive balls is formed on and directly bonds the first plurality of contact pads to respective contact pads of the second plurality of contact pads.

Abstract: Acoustic resonator devices and filters, and methods of making the same. An acoustic resonator includes a piezoelectric plate and an interdigital transducer (IDT) including interleaved fingers on the piezoelectric plate. The piezoelectric plate and the IDT are configured such that a radio frequency signal applied to the IDT excites a shear primary acoustic mode within the piezoelectric plate. The acoustic resonator further includes a front-side dielectric layer on the piezoelectric plate between the fingers of the IDT, wherein a resonance frequency of the acoustic resonator device has an inverse dependence on a thickness of the front-side dielectric layer.

Abstract: A method for fabricating a film bulk acoustic resonator (FBAR) filter device is provided. The method includes: forming a first electrode of each one of a first resonator and a second resonator on a first surface of a piezoelectric layer, forming a first passivation layer of each one of the first resonator and the second resonator on a corresponding one of the first electrodes, forming a second electrode of each one of the first resonator and the second resonator on a second surface of the piezoelectric layer, conducting a radio frequency (RF) performance test on the FBAR filter device, adjusting a thickness of the second electrode of the first resonator based on a result of the RF performance test, and forming a second passivation layer of each one of the first resonator and the second resonator on a corresponding one of the second electrodes.