Abstract: An acoustic waveguide having high-Q resonator characteristics is disclosed and a fabrication method is described. Various waveguide-based test-vehicles, implemented in single crystal silicon and transduced by thin aluminum nitride films, are demonstrated. Silicon resonators with type-I and type-II dispersion characteristics are presented to experimentally justify the analytical mode synthesis technique for realization of high quality-factor silicon Lamb wave resonators. An analytical design procedure is also presented for geometrical engineering of the waveguides to realize high-Q resonators without the need for geometrical suspension through narrow tethers or rigid anchors. The effectiveness of the dispersion engineering methodology is verified through development of experimental test-vehicles in 20 ?m-thick single-crystal silicon (SCS) waveguides with 500 nm aluminum nitride transducers.

Abstract: Acoustic resonator devices, filters, and methods are disclosed. An acoustic resonator includes a substrate, a lithium niobate plate having front and back surfaces, wherein Euler angles of the lithium niobate plate are [0°, ?, 0°], where ? is greater than or equal to 0° and less than or equal to 60°, and an acoustic Bragg reflector between the surface of the substrate and the back surface of the lithium niobate plate. An interdigital transducer (IDT) is formed on the front surface of the piezoelectric plate. At least one finger of the IDT is disposed in a groove in the lithium niobate plate.

Abstract: An acoustic wave device includes a piezoelectric body portion, an interdigital transducer electrode connected to a first terminal and a second terminal, and a reflector connected to the second terminal. In the interdigital transducer electrode, in the interdigital transducer electrode, where, of a group of electrode fingers, the electrode finger located at one end in a second direction is a first end electrode finger and the electrode finger located at another end is a second end electrode finger, the first end electrode finger is located between the reflector and the second end electrode finger in the second direction. An outer busbar portion of one of a first busbar and a second busbar, not connected to the first end electrode finger, is located on an inner side in the second direction relative to a center portion, in a first direction, of the first end electrode finger.

Abstract: An inductor device includes a first coil and a second coil. The first coil is wound into a plurality of first circles, and the second coil is wound into a plurality of second circles. At least two of the second circles are interlaced with at least two of the first circles on a first side. The at least two of the second circles are disposed adjacent to each other on the first side. At least one of the first circles is only interlaced with at least one of the second circles on a second side. At least another one of the first circles is only interlaced with at least another one of the second circles on the second side.

Abstract: Described is a method for forming a planar transmission line low-pass filter and a resulting filter. The method comprises several acts, including using lithographic processes and a castable polymer with absorptive matrix as a spin-on dielectric to form the planar transmission line low-pass filter.

Abstract: A power amplifier circuit includes a substrate and a semiconductor chip disposed on or above the substrate. The semiconductor chip includes a power amplifier unit that amplifies an RF signal, a ground terminal to which a ground of the power amplifier unit is coupled, and a first circuit element having a first end electrically coupled to the ground terminal without any portion outside the semiconductor chip interposed therebetween, and having a second end. The substrate includes a second circuit element having a first end electrically coupled to an output of the power amplifier unit and a second end electrically coupled to the second end of the first circuit element. The first and second circuit elements constitute a harmonic wave termination circuit. The harmonic wave termination circuit reflects, to the power amplifier unit, a harmonic wave component of the amplified RF signal output from the power amplifier unit.

Abstract: RF transistor amplifiers are provided that include a submount and an RF transistor amplifier die that is mounted on top of the submount. A multi-layer encapsulation is formed that at least partially covers the RF transistor amplifier die. The multi-layer encapsulation includes a first dielectric layer and a first conductive layer, where the first dielectric layer is between a top surface of the RF transistor amplifier die and the first conductive layer.

Abstract: Acoustic resonator devices, filters, and methods are disclosed. An acoustic resonator includes a substrate and a piezoelectric plate having front and back surfaces, the back surface attached to a surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm that spans a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the piezoelectric plate such that interleaved fingers of the IDT are disposed on the diaphragm. The IDT is configured to excite a primary acoustic mode in the diaphragm in response to a radio frequency signal applied to the IDT. At least one finger of the IDT is disposed in a groove in the diaphragm. A depth of the groove is less than a thickness of the at least one finger of the IDT.

Abstract: An acoustic wave device is disclosed. The acoustic wave device can include a piezoelectric layer positioned over a substrate. The acoustic wave device can also include an interdigital transducer electrode positioned over the piezoelectric layer. The acoustic wave device can also include a grounding structure positioned over the piezoelectric layer. The acoustic wave device can also include a conductive layer positioned between the piezoelectric layer and the substrate. The acoustic wave device can further include an electrical pathway that electrically connects the conductive layer to the grounding structure.

Abstract: Acoustic resonator devices, filters, and methods are disclosed. An acoustic resonator includes a substrate, a piezoelectric plate having front and back surfaces, and an acoustic Bragg reflector between a surface of the substrate and the back surface of the piezoelectric plate. An interdigital transducer (IDT) is formed on the front surface of the piezoelectric plate. The IDT is configured to excite a shear primary acoustic mode in the piezoelectric plate in response to a radio frequency signal applied to the IDT. All fingers of the IDT are disposed in a respective grooves in the piezoelectric plate.

Abstract: A supply modulator includes a linear regulator that generates an output voltage in an envelope tracking mode. A switching regulator operates with the linear regulator to generate the output voltage in the envelope tracking mode and to selectively generate the output voltage in an average power tracking mode. A single inductor multiple output converter operates selectively with the switching regulator to generate the output voltage in the average power tracking mode, operates to provide a power supply voltage to the linear regulator in the envelope tracking mode, and includes a first capacitor connected with a power supply terminal of the linear regulator and a second capacitor selectively connected with an output terminal of the linear regulator through a first switch. A main controller decides a tracking mode to be executed by the supply modulator.

Abstract: A filter device includes a first path, a second path, and a capacitor. The first path includes at least one ladder filter circuit and connects a first terminal and a second terminal. The at least one ladder filter circuit includes a parallel arm resonator connected to a ground terminal. The second path includes a grounded resonator and is connected in parallel with any of the at least one ladder filter circuit. One end of the capacitor is connected to the second path, and the other end of the capacitor is connected to a third path which connects the parallel arm resonator and the ground terminal.

Abstract: An elastic wave device includes a piezoelectric thin film, IDT electrodes on the piezoelectric thin film, an insulating layer surrounding the piezoelectric thin film on a primary surface of a support substrate, a spacer layer surrounding the piezoelectric thin film in plan view, and a cover on the spacer layer. The spacer layer includes an outer edge and an inner edge closer than the outer edge to the piezoelectric thin film in plan view. The primary surface of the insulating layer closer to the spacer layer includes a sloping region that extends where the insulating layer overlaps the spacer layer in plan view and in which the distance from the first primary surface of the support substrate along the direction perpendicular or substantially perpendicular to the support substrate increases from the outer edge toward the inner edge.

Abstract: The disclosure concerns a signal aggregator component designed to couple with an antenna element to form an antenna system, wherein the resulting antenna system can achieve one-hundred percent or greater efficiency in receiving mode. In addition, the antenna system can achieve specific polarization and gain in different sectors of the antenna radiation pattern. The signal aggregator functions to dynamically enable or disable any number of its RF ports to select the RF input signal to aggregate.

Abstract: An amplifier system including a push-pull power amplifier having an input to receive a radio frequency (RF) input signal and an output, the push-pull power amplifier being configured to amplify the RF input signal and provide at the output an RF output signal that is an amplified version of the RF input signal, a switchable shunt capacitance switchably connected between a load-line connected to the output of the push-pull power amplifier and a reference potential, and a switch configured to selectively connect the switchable shunt capacitance to the reference potential and disconnect the switchable shunt capacitance from the reference potential to vary an impedance of load-line.

Abstract: A variable-current trans-impedance amplifier (TIA) for an ultrasound device is described. The TIA may be coupled to an ultrasonic transducer to amplify an output signal of the ultrasonic transducer representing an ultrasound signal received by the ultrasonic transducer. During acquisition of the ultrasound signal by the ultrasonic transducer, one or more current sources in the TIA may be varied. The variable-current trans-impedance amplifier may include multiple stages, including a first stage having N-P transistor pairs configured to receive an input signal and produce a single-ended amplified signal.

Abstract: A conductive assembly may include a deformable substrate disposed around an axis, and a deformable conductor arranged on the deformable substrate. The substrate may be arranged to form a channel along the axis, and the deformable conductor may be arranged on the deformable substrate to form a waveguide. The deformable substrate, the first deformable conductor, and a second deformable conductor may be arranged to form a microstrip or a coaxial transmission line. A deformable transmission line may include a deformable substrate arranged in a substantially enclosed channel around an axis, a first deformable conductor arranged in a trace along the axis of the deformable substrate, and a second deformable conductor arranged on the deformable substrate to form a reference conductor for the first deformable conductor. A method of fabricating a deformable conductive assembly may include forming a deformable conductor on a deformable substrate, and disposing the deformable substrate around an axis.

Abstract: An amplification circuit includes: a power supply terminal that is connected to a power supply; a first transistor that has a first source terminal, a first drain terminal, and a first gate terminal to which a high-frequency signal is inputted; a second transistor that has a second source terminal that is connected to the first drain terminal, a second drain terminal that outputs a high frequency signal, and a second gate terminal that is grounded; a capacitor that is serially arranged on a second path that connects the second gate terminal and the power supply terminal; and a switch that is serially arranged on a first path, which connects the second drain terminal and the power supply terminal, or the second path. The second drain terminal and the second gate terminal are connected to each other via the switch and the capacitor.

Abstract: A TE20 launch guidance waveguide hybrid coupler includes a waveguide body, a cavity, a plurality of ports, and a bend along the H-plane. The waveguide body includes a hybrid center portion which is disposed between and is in direct communication with the plurality of ports. The bend along the H-Plane is defined within the hybrid center portion, assists in the launching of the TE20 mode, and results in typically half the axial ratio and mass when compared to traditional hybrid approaches.

Abstract: Provided herein are apparatus and methods for a multi-stage signal-processing circuit. The signal-processing circuit can include multiple configurable stages that can be cascaded and configured to process an input signal. Control circuitry can be used to select an output of the configurable stages. Serial data can be recovered with good signal integrity using a signal monitor with the configurable stages by virtually placing the signal monitor on a buffered output node.