Abstract: Acoustic filters, resonators and methods of making acoustic filters are disclosed. An acoustic resonator device includes a substrate. A back surface of a piezoelectric plate is attached to the substrate, a portion of the piezoelectric plate forming a diaphragm that spans a cavity in the substrate. A conductor pattern is formed on the front surface of the piezoelectric plate, the conductor pattern including an interdigital transducer (IDTs) with interleaved fingers of the IDT disposed on the diaphragm. A ratio of the mark of the interleaved fingers to the pitch of the interleaved fingers is greater than or equal to 0.2 and less than or equal to 0.3.

Abstract: A radio frequency (RF) power amplifier device package includes a substrate and a first die attached to the substrate at a bottom surface of the first die. The first die includes top gate or drain contacts on a top surface of the first die opposite the bottom surface. At least one of the top gate or drain contacts is electrically connected to a respective bottom gate or drain contact on the bottom surface of the first die by a respective conductive via structure. An integrated interconnect structure, which is on the first die opposite the substrate, includes a first contact pad on the top gate contact or the top drain contact of the first die, and at least one second contact pad connected to a package lead, a contact of a second die, impedance matching circuitry, and/or harmonic termination circuitry.

Abstract: An acoustic wave device is disclosed. The acoustic wave device includes a support layer, a ceramic layer positioned over the support layer, a piezoelectric layer positioned over the ceramic layer, and an interdigital transducer electrode positioned over the piezoelectric layer. The support layer has a higher thermal conductivity than the ceramic layer. The ceramic layer can be a polycrystalline spinel layer. The acoustic wave device can be a surface acoustic wave device configured to generate a surface acoustic wave.

Abstract: Filter devices and methods are disclosed. A filter device includes a substrate and a piezoelectric plate attached to the substrate, the piezoelectric plate forming diaphragms spanning respective cavities in the substrate. A first portion of the piezoelectric plate has a first thickness. A front surface of a second portion of the piezoelectric plate is recessed relative to a front surface of the first portion of the piezoelectric plate such that the second portion of the piezoelectric plate has a second thickness less than the first thickness. A conductor pattern is formed on the front surfaces of the first and second portions of the piezoelectric plate. The conductor pattern includes a first interdigital transducer (IDT) with interleaved fingers on a diaphragm having the first thickness, and a second IDT with interleaved fingers on a diaphragm having the second thickness.

Abstract: Disclosed in the present invention are a balanced radio frequency power amplifier, a chip and a communication terminal. The radio frequency power amplifier divides, by means of a 90-degree power splitter unit, a radio frequency input signal into two equal-amplitude signals having a phase difference of 90 degrees, the two radio frequency input signals are amplified and then inputted into an adjustable 90 -degree power combiner, and the values of a adjustable capacitor and an adjustable resistor in the adjustable 90-degree power combiner are controlled by means of a control unit, so as to synthesize the two radio frequency input signals into one radio frequency input signal when the phase difference and amplitude difference of the two signals at different frequencies are the smallest, and to input the radio frequency input signal into a circuit of the next stage by means of a specific radio frequency transmission path.

Abstract: A negative resistance amplifier including a negative resistance network where the negative resistance network may be any known circuit element characterized by a negative ratio of the voltage a between its output terminals and to the current flowing through the element: a reactance network resonant at the center frequency of the amplifier where the reactive network may contain a varactor for tuning of the resonant frequency of the reactance network: and a circulator whose port 1 is the input terminal of the amplifier, whose port 3 is the output port of the amplifier and whose port 2 is connected to the combination of the negative resistance network and the reactance network.

Abstract: A method for isolating transmission lines of a radio frequency power amplifier and a transmission structure of the radio frequency power amplifier are provided. The method includes steps of setting a distance between adjacent two of transmission lines on a chip substrate to be greater than 2.5 times a width of each of the transmission lines, and disposing shielding lines at an inner side of each of the transmission lines and an outer side of each of the transmission lines opposite to the inner side; wrapping a permalloy layer on an outer wall of each of the transmission lines; and wrapping an aluminum layer on an outer wall of the permalloy layer, defining a plurality of grooves on an outer wall of the aluminum layer at intervals, where the plurality of the grooves are recessed inward and in an inverted triangular structure.

Abstract: A Doherty amplifier includes a divider configured to divide input power into first input power and second input power, and a carrier amplifier configured to amplify the first input power. The Doherty amplifier includes an adaptive attenuator configured to attenuate the second input power, the adaptive attenuator being configured to increase an attenuation amount upon detecting that the second input power is less than a predetermined value. The Doherty amplifier includes a peaking amplifier configured to amplify the attenuated second input power, and a combiner configured to combine output power of the carrier amplifier with output power of the peaking amplifier.

Abstract: Acoustic filters, resonators and methods are disclosed. An acoustic resonator device includes a piezoelectric plate forming a diaphragm and a conductor pattern formed on the piezoelectric plate, the conductor pattern including an interdigital transducer (IDT). Interleaved fingers of the IDT are on the diaphragm. A ratio of the mark of the interleaved fingers to a pitch of the interleaved fingers is greater than or equal to 0.2 and less than or equal to 0.3.

Abstract: Acoustic resonators and filter devices. An acoustic resonator includes a piezoelectric plate having front and back surfaces, a portion of the piezoelectric plate forming a diaphragm, and a conductor pattern on the front surface, the conductor pattern including an interdigital transducer (IDT), fingers of the IDT on the diaphragm. A thickness of the interleaved fingers is greater than or equal to 0.85 times a thickness of the piezoelectric plate and less than or equal to 2.5 times the thickness of the piezoelectric plate. The IDT comprises a first portion having a first pitch and a first mark and a second portion having a second pitch and a second mark not equal to the first pitch and first mark.

Abstract: Connecting a waveguide and a coaxial conductor pin is disclosed. In an embodiment, a connector includes: a body, wherein the body includes a first interface configured to couple to the waveguide and a second interface configured to couple to the coaxial conductor pin; a cavity within the body, wherein the cavity takes up a region between the first interface and the second interface; and an impedance transformation structure located in the cavity.

Abstract: A radio frequency circuit includes a first acoustic wave filter that is connected to a common terminal and includes a first acoustic wave resonator, a first LC filter that is connected to the common terminal via the first acoustic wave filter and includes at least one of an inductor or a capacitor, a second acoustic wave filter that is connected to the common terminal and includes a second acoustic wave resonator, and a second LC filter that is connected to the common terminal via the second acoustic wave filter and includes at least one of an inductor or a capacitor.

Abstract: Acoustic filters, resonators and methods of making acoustic filters are disclosed. An acoustic resonator device includes a substrate. A back surface of a piezoelectric plate is attached to the substrate, a portion of the piezoelectric plate forming a diaphragm that spans a cavity in the substrate. A conductor pattern is formed on the front surface of the piezoelectric plate, the conductor pattern including an interdigital transducer (IDTs) with interleaved fingers of the IDT disposed on the diaphragm. A ratio of the mark of the interleaved fingers to the pitch of the interleaved fingers is greater than or equal to 0.2 and less than or equal to 0.3.

Abstract: Bulk acoustic wave resonators of two or more different filters can be on a common die. The two filters can be included in a multiplexer, such as a duplexer, or implemented as standalone filters. With bulk acoustic wave resonators of two or more filters on the same die, the filters can be implemented in less physical space compared to implementing the same filters of different die. Related methods, radio frequency systems, radio frequency modules, and wireless communication devices are also disclosed.

Abstract: An inductor is provided, comprising: a first ferrite core piece and a second ferrite core piece, each of which are made of substantially similar materials, exhibit desired electromagnetic properties, and which are fashioned in a substantially similar manner and shape, and wherein each of the first and second ferrite core pieces comprises a substantially planar mating surface, a center post, and a wire core assembly channel, and wherein a first substantially planar mating surface of the first ferrite core piece is adapted to planarly mate with a second substantially planar mating surface of the second ferrite core piece; and a wire core assembly adapted to be substantially self-locating and self-centering about a first or second center post when located in a respective first or second wire core assembly channel.

Abstract: Disclosed is a bias circuit for a radio frequency power amplifier, including a resistor voltage divider network, a power amplifier coupled with the resistor voltage divider network and a bias voltage adjusting loop coupled to the resistor voltage divider network and including one voltage divider resistor and one transistor pair; one terminal of the voltage divider resistor is connected with a reference voltage, and an other terminal is coupled with a gate of the first metal oxide semiconductor transistor; the transistor pair includes a first metal oxide semiconductor transistor and a second metal oxide semiconductor transistor, where a gate of the second metal oxide semiconductor transistor is coupled to the gate of the first metal oxide semiconductor transistor.

Abstract: A quantum computing devices includes: a qubit; a readout device coupled to the qubit, the readout device including a frequency filter having a filter frequency range; and an amplifier device coupled to the readout device, in which the amplifier device is configured to amplify a measurement signal from the readout device upon receiving a pump signal having a pump frequency that is outside of the filter frequency range of the frequency filter.

Abstract: An amplifying apparatus is provided, which includes a power-source main line, a plurality of amplifying control devices which include an amplifier, a power-source branch line, an over current protector. The amplifier amplifies a high-frequency signal. The power-source branch line is branched from the power-source main line. The over current protector disposed for the power-source branch line is connected to the amplifier and configured to disconnect the power-source branch line based on drive current flowing through the amplifier from the power-source branch line. The power-source main line is common to the plurality of amplifying control devices.

Abstract: Devices and processes for preparing devices are described for a bulk acoustic wave resonator. A stack includes a first electrode that is coupled to a first side of a piezoelectric layer and a second electrode that is coupled to a second side of the piezoelectric layer. The stack is configured to resonate in response to an electrical signal applied between the first electrode and the second electrode. A cavity frame is coupled to the first electrode and to the substrate. The cavity frame forms a perimeter around a cavity. Optionally, a heat dissipating frame is formed and coupled to the second electrode. The cavity frame and/or the heat dissipating frame improve the thermal stability of the bulk acoustic resonator.

Abstract: Segmented power amplifier (PA) arrangements are disclosed. An example PA arrangement includes at least first and second PA segments, each having a respective combination of a PA and a feedforward adaptive bias circuit, configured to generate a bias signal for the corresponding PA. Each bias signal has a first DC component, at least one tone component, and at least one harmonic of the at least one tone component. The PA arrangement further includes a power splitting circuit, configured to split an input signal for the PA arrangement into a first PA input signal for the first PA segment and a second PA input signal for the second PA segment, where a power of the first PA input signal is greater than a power of the second PA input signal.