Patents Examined by Harry D. Wilkins, III
-
Patent number: 10975484Abstract: The invention concerns non-ferrous metallurgy, in particular the composition of an electrolyte for electrically obtaining aluminum by the electrolysis of fluoride melts. The electrolyte proposed contains, in % by weight: sodium fluoride 26-43, potassium fluoride up to 12, lithium fluoride up to 5, calcium fluoride 2-6, alumina 2-6, aluminum fluoride and admixtures—the remainder. The technical result is to increase the solubility of alumina in the electrolyte at a temperature of 830-930° C. In the electrolyte being applied for, the carbon and inert electrode materials are not destroyed, and the use of special methods to purify the aluminum of melt components is not required.Type: GrantFiled: July 9, 2013Date of Patent: April 13, 2021Assignee: United Company RUSAL Engineering and Technology Centre LLCInventors: Dmitry Aleksandrovich Simakov, Aleksandr Olegovich Gusev
-
Patent number: 10961633Abstract: A process for recovering copper from copper sulfide minerals, the method comprising the steps of leaching copper sulfide minerals with an aqueous solution of ammonium chloride containing cupric chloride at a temperature of between about 40° C. and about 95° C. at atmospheric pressure, to produce a solution of cuprous/cupric chloride.Type: GrantFiled: April 12, 2016Date of Patent: March 30, 2021Assignee: THE DOE RUN RESOURCES CORPORATIONInventor: Timothy Roy Hymer
-
Patent number: 10927475Abstract: Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating system; (b) electroplating the metal onto the substrate while the substrate is held in a cathode chamber of an electroplating cell of electroplating system; (c) supplying the make-up solution to the electroplating system via a make-up solution inlet; and (d) supplying the secondary electroplating solution to the electroplating system via a secondary electroplating solution inlet. The secondary electroplating solution includes some or all components of the electroplating solution. At least one component of the secondary electroplating solution has a concentration that significantly deviates from its target concentration.Type: GrantFiled: November 1, 2018Date of Patent: February 23, 2021Assignee: Lam Research CorporationInventors: Zhian He, Shantinath Ghongadi, Quan Ma, Hyungjun Hur, Cian Sweeney, Quang Nguyen, Rezaul Karim, Jingbin Feng
-
Patent number: 10920331Abstract: A film deposition device (1A) of a metal film (F) includes a positive electrode (11), a solid electrolyte membrane (13), and a power supply part (14) that applies a voltage between the positive electrode (11) and a base material (B) to be a negative electrode. The solid electrolyte membrane (13) allows a water content to be 15% by mass or more and is capable of containing a metal ion. The power supply part (14) applies a voltage between the positive electrode and the base material in a state where the solid electrolyte membrane is disposed on a surface of the positive electrode such that metal made of metal ions contained inside the solid electrolyte membrane (13) is precipitated on a surface of the base material (B).Type: GrantFiled: August 4, 2014Date of Patent: February 16, 2021Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yuki Sato, Hiroshi Yanagimoto, Motoki Hiraoka
-
Patent number: 10920335Abstract: Methods of electroplating metal on a substrate while controlling azimuthal uniformity, include, in one aspect, providing the substrate to the electroplating apparatus configured for rotating the substrate during electroplating, and electroplating the metal on the substrate while rotating the substrate relative to a shield such that a selected portion of the substrate at a selected azimuthal position dwells in a shielded area for a different amount of time than a second portion of the substrate having the same average arc length and the same average radial position and residing at a different angular (azimuthal) position. The shield is positioned in close proximity of the substrate (e.g., within a distance that is equal to 0.1 of the substrate's radius). The shield in some embodiments may be an ionically resistive ionically permeable element having an azimuthally asymmetric distribution of channels.Type: GrantFiled: June 13, 2018Date of Patent: February 16, 2021Assignee: Novellus Systems, Inc.Inventors: Steven T. Mayer, David W. Porter, Bryan L. Buckalew, Robert Rash
-
Patent number: 10920328Abstract: Embodiments of the present disclosure describe a photoelectrochemical (PEC) cell comprising a semiconductor photoelectrode configured with at least two light-harvesting faces; a catalyst layer deposited on at least one light-harvesting face and in contact with an electrolyte; a reference electrode deposited on at least another light-harvesting face; and a counter electrode in contact with the electrolyte.Type: GrantFiled: November 14, 2017Date of Patent: February 16, 2021Assignee: KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGYInventors: Jr-Hau He, Hui-Chun Fu
-
Patent number: 10920336Abstract: The present disclosure relates to methods of monitoring the concentrations of silver ion and complexing agent in tin-silver (SnAg) electrodeposition solutions, and analysis and process control using such methods. Methods can include adding a precipitating agent to an electrodeposition solution including at least tin ions, silver ions, and complexing agent to cause a reaction between at least a portion of the precipitating agent and substantially all of the silver ions (to precipitate silver ions as a precipitant); adding a metallic salt to the electrodeposition solution to cause a reaction with substantially all of the remaining precipitating agent; measuring the endpoint of the silver ion back titration; further adding metallic salt to cause a further reaction with the complexing agent; and measuring the endpoint of the complexing agent titration.Type: GrantFiled: July 23, 2019Date of Patent: February 16, 2021Assignee: ECI Technology, Inc.Inventors: Vishal Parekh, Eugene Shalyt
-
Patent number: 10916674Abstract: Titania is a semiconductor and photocatalyst that is also chemically inert. With its bandgap of 3.2 and greater, to activate the photocatalytic property of titania requires light of about 390 nm wavelength, which is in the ultra-violet, where sunlight is very low in intensity. A method and devices are disclosed wherein stress is induced and managed in a thin film of titania in order to shift and lower the bandgap energy into the longer wavelengths that are more abundant in sunlight. Applications of this stress-induced bandgap-shifted titania photocatalytic surface include photoelectrolysis for production of hydrogen gas from water, photovoltaics for production of electricity, and photocatalysis for detoxification and disinfection.Type: GrantFiled: April 7, 2015Date of Patent: February 9, 2021Assignee: NANOPTEK CORPORATIONInventor: John Michael Guerra
-
Patent number: 10914019Abstract: A plating apparatus for plating a substrate is provided to reduce vibration of a paddle. The plating apparatus includes a plating bath configured to accommodate plating solution; a paddle that is arranged in the plating bath, and configured to move in a reciprocating direction along a surface of the substrate to stir the plating solution; a support member for supporting a first end portion of the paddle; a first magnet provided on the paddle; and a second magnet provided on the plating bath. The first magnet and the second magnet are configured to exert a magnetic force on each other so that a second end portion on an opposite side to the first end portion of the paddle is suppressed from vibrating in directions approaching and leaving the substrate while the paddle is moving.Type: GrantFiled: October 29, 2018Date of Patent: February 9, 2021Assignee: EBARA CORPORATIONInventors: Shao Hua Chang, Yasuyuki Masuda, Jumpei Fujikata, Masashi Shimoyama, Tsutomu Nakada
-
Patent number: 10889511Abstract: A fluid conditioning and treatment system generally comprising an electronic controller component in communication with an energy delivery module (“energy chamber”) through an interconnecting cable. The electronic controller can be housed in a fiberglass enclosure and develops and transmits preprogrammed high-energy electronic signals to the energy chamber through the interconnecting cable. The energy chamber can have a series of computer designated, matched, electrodes placed through its walls. The electrodes contact the fluid flowing through the energy chamber. Each of the controllers circuit boards are programmed to produce precisely a given range of electronic output signals that when applied to the fluid accomplishes specific functions. The controller can be programmed to supply a number of electronic hits that are applied to the water as the water passes through the energy chamber.Type: GrantFiled: April 25, 2016Date of Patent: January 12, 2021Assignee: AQUATRON USA, INC.Inventors: John W. Clark, Willi Lentelmann
-
Patent number: 10883182Abstract: A microfluidic electrolyzer includes a housing having a power source, a sea water reservoir, a downstream microfluidic reactor connected to the reservoir and a collector for storing the separated gases emanating from the microfluidic reactor. The downstream microfluidic reactor includes a substrate, a microchannel embedded with respect to the substrate and providing a water inlet end at one end and a product outlet at the other, and a pair of electrodes. The electrodes are electrically connected with the power source and each electrode has an operative end inserted within the microchannel constituting an anode and a cathode. The cathode and the anode are positioned one ahead of the other, from the water inlet end and maintained in direct contact with the water to generate the oxygen and hydrogen involving electrolysis of the water and in-situ separate pathways of the hydrogen and oxygen free of any mixing with each other.Type: GrantFiled: January 16, 2017Date of Patent: January 5, 2021Assignee: INDIAN INSTITUTE OF TECHNOLOGY, GUWAHATIInventors: Dipankar Bandyopadhyay, Tapas K Mandal, Saptak Rarotra
-
Patent number: 10883181Abstract: Provided is a hydrogen generator which is provided with: an electrolytic cell; an anion exchange membrane which divides the electrolytic cell into a cathode chamber and an anode chamber; a cathode chamber water supply part which supplies water to the cathode chamber; an anode chamber water supply part which supplies water to the anode chamber; a cathode that is provided on the cathode chamber-side surface of the anion exchange membrane; an anode that is provided on the anode chamber-side surface of the anion exchange membrane; a cathode feeder that is arranged within the cathode chamber and feeds power to the cathode; an anode feeder that is arranged within the anode chamber and feeds power to the anode; and an active oxygen reduction material that is arranged within the anode chamber and reduces active oxygen generated within the anode chamber.Type: GrantFiled: October 17, 2016Date of Patent: January 5, 2021Assignee: MITSUBISHI HEAVY INDUSTRIES ENVIRONMENTAL & CHEMICAL ENGINEERING CO., LTD.Inventors: Hiroyuki Takanami, Yusaku Nasu
-
Patent number: 10876216Abstract: A stainless steel suspension component such as a mount plate is chemically activated by exposure to an activating solution. Gold is then spot plated onto the mount plate in the activated area using an elastomeric mask that is clamped over the mount plate. A component may then be bonded to the gold bond pads. The component may include a PZT microactuator bonded to the gold bond pads using a conductive adhesive such as silver epoxy. The gold acts as an interface metal that provides to a low resistance and environmentally robust ground path for the microactuator.Type: GrantFiled: February 27, 2017Date of Patent: December 29, 2020Assignee: Magnecomp CorporationInventors: Marcos Lazatin, Brett Holaway
-
Patent number: 10872705Abstract: A method of direct oxide reduction includes forming a molten salt electrolyte in an electrochemical cell, disposing at least one metal oxide in the electrochemical cell, disposing a counter electrode comprising a material selected from the group consisting of osmium, ruthenium, rhodium, iridium, palladium, platinum, silver, gold, lithium iridate, lithium ruthenate, a lithium rhodate, a lithium tin oxygen compound, a lithium manganese compound, strontium ruthenium ternary compounds, calcium iridate, strontium iridate, calcium platinate, strontium platinate, magnesium ruthenate, magnesium iridate, sodium ruthenate, sodium iridate, potassium iridate, and potassium ruthenate in the electrochemical cell, and applying a current between the counter electrode and the at least one metal oxide to reduce the at least one metal oxide. Related methods of direct oxide reduction and related electrochemical cells are also disclosed.Type: GrantFiled: February 1, 2018Date of Patent: December 22, 2020Assignee: Battelle Energy Alliance, LLCInventor: Prabhat K. Tripathy
-
Patent number: 10844507Abstract: The present disclosure relates to an apparatus for electroplating an element. The apparatus may comprise a cathode cage assembly. The cathode cage assembly may include a cage member and at least one electrically conductive wire extending along at least a portion of the cage member. The wire may be arranged to form at least one volume within the cage member for retaining an element within the cage member. The cage member and the wire permit a degree of movement of the element during an electroplating process while retaining the element within the volume.Type: GrantFiled: April 27, 2018Date of Patent: November 24, 2020Assignee: Lawrence Livermore National Security, LLCInventors: Thomas L. Bunn, Corie Horwood
-
Patent number: 10844495Abstract: According to one embodiment, a photochemical reaction system comprises a CO2 production unit, a CO2 absorption unit, and a CO2 reduction unit. The CO2 reduction unit comprises a laminated body and an ion transfer pathway. The laminated body comprises an oxidation catalyst layer producing O2 and H+ by oxidizing H2O, a reduction catalyst layer producing carbon compounds by reducing CO2 absorbed by the CO2 absorption unit, and a semiconductor layer formed between the oxidation catalyst layer and the reduction catalyst layer and develops charge separation with light energy. The ion transfer pathways make ions move between the oxidation catalyst layer side and the reduction catalyst layer side.Type: GrantFiled: September 7, 2017Date of Patent: November 24, 2020Assignee: KABUSHIKI KAISHA TOSHIBAInventors: Akihiko Ono, Satoshi Mikoshiba, Yuki Kudo, Jun Tamura, Ryota Kitagawa, Chingchun Huang
-
Patent number: 10822967Abstract: An abrasive coating for a substrate comprises a strike layer is formed on a substrate top surface; a base layer is coupled to the strike layer; a tack layer is coupled to the base layer, wherein the tack layer is configured to adhere first grit particles to the base layer; a plurality of first grit particles are adapted to be coupled to the tack layer, a plurality of second grit particles are placed between each of the plurality of first grit particles, the second grit particles having a nominal size smaller than the first grit particles; and an overplate layer comprising a matrix material is bonded to the tack layer; the matrix material envelops the second grit particles and bonds and partially surrounds the first grit particles, wherein the first grit particles extend above the overplate layer.Type: GrantFiled: February 1, 2017Date of Patent: November 3, 2020Assignee: Raytheon Technologies CorporationInventors: Nathan T. Martel, Gary M. Lomasney
-
Patent number: 10815577Abstract: The present invention relates to a method and an apparatus of preparing a reduction product of carbon dioxide by electrochemically reducing carbon dioxide.Type: GrantFiled: July 14, 2016Date of Patent: October 27, 2020Assignee: KOREA INSTITUTE OF ENERGY RESEARCHInventors: Ki Tae Park, Soon Kwan Jeong, Hak Joo Kim, Seong Pil Kang, Min Hye Youn
-
Patent number: 10814306Abstract: The present disclosure provides Molecularly Imprinted Polymer (MIP) technology for selectively sequestering one or more target molecules from chemical mixtures. Also disclosed herein are MIP beads and methods of making and using thereof.Type: GrantFiled: June 8, 2016Date of Patent: October 27, 2020Assignee: 6th Wave Innovations Corp.Inventors: Jonathan P. Gluckman, Glen E. Southard
-
Patent number: 10801120Abstract: Disclosed herein are a system and method for electroplating an alpha emitting radionuclide, such as an actinide, for use in alpha spectroscopy. The electrodeposition system for electroplating an alpha emitting radionuclide can include an electroplating cell containing a solution of an electrolyte and the alpha emitting radionuclide, a metal target within the electroplating cell, and a metal anode at a distance from the metal target. The system also includes a platform for supporting the electroplating cell, coupling mechanism connected to the platform, an electric motor on the elastic cushion, and a flywheel with an uneven weight distribution operatively connected to the electric motor. Rotation of the unevenly distributed flywheel generates a vibration in the electroplating cell which dislodges gas bubbles that have formed between the metal target and the metal anode.Type: GrantFiled: January 26, 2018Date of Patent: October 13, 2020Assignee: Curium US LLCInventors: William Claude Uhland, Arend Booij, Marjolijn Gerritsen