Abstract: An exposure apparatus in which by filling at least a portion between a projection optical system and a substrate with a liquid and by projecting an image of a pattern onto the substrate via said projection optical system and said liquid, said substrate is exposed, said exposure apparatus includes: a substrate holding member that holds said substrate and keeps liquid so that said substrate is immersed in the liquid; and a liquid supply mechanism that supplies, at a vicinity of the projection area of said projection optical system, liquid onto said substrate from above said substrate.

Abstract: The invention concerns imaging systems, in particular for a microlithographic projection exposure apparatus, for imaging a mask which can be positioned in an object plane of the imaging system on to a photosensitive layer which can be positioned in an image plane of the imaging system. An imaging system according to the invention comprises: an object plane-side subsystem which produces a first intermediate image with an object plane-side imaging scale ?o, at least one further subsystem which produces a further intermediate image between the first intermediate image and the image plane, and an image plane-side subsystem which images the further intermediate image into the image plane with an image plane-side imaging scale ?i, wherein the condition 0.75??o*?i?1.25 is satisfied.

Abstract: A lithographic projection apparatus is disclosed. The apparatus includes a radiation system for providing a beam of radiation, a first support structure for supporting a patterning device, a second support structure for supporting a substrate, and a projection system. At least one of the first and second support structures includes a planar base, a movable stage that can be moved over the planar base, and an actuator for moving the stage. The apparatus also includes a contactless position measuring device for measuring a position of the stage, and a first pump for generating a conditioned gas flow in a volume between the measuring device and the stage. The base includes a plurality of gas channels that provide a path for the conditioned gas to flow through the base.

Abstract: Additional vibrations are added during the exposure of a substrate so that vibrations occurring during exposure of a plurality of areas on the substrate are substantially uniform. This may improve CD uniformity.

Abstract: An EUV optical projection system includes at least six reflecting surfaces for imaging an object (OB) on an image (IM). The system is preferably configured to form an intermediate image (IMI) along an optical path from the object (OB) to the image (IM) between a secondary mirror (M2) and a tertiary mirror (M3), such that a primary mirror (M1) and the secondary mirror (M2) form a first optical group (G1) and the tertiary mirror (M3), a fourth mirror (M4), a fifth mirror (M5) and a sixth mirror (M6) form a second optical group (G2). The system also preferably includes an aperture stop (APE) located along the optical path from the object (OB) to the image (IM) between the primary mirror (M1) and the secondary mirror (M2). The secondary mirror (M2) is preferably concave, and the tertiary mirror (M3) is preferably convex. Each of the six reflecting surfaces preferably receives a chief ray (CR) from a central field point at an incidence angle of less than substantially 15°.

Abstract: Disclosed is a method of optimizing a design to be formed on a substrate. The method includes approximating rounding of at least one corner of an image of the design; generating a representation of the design further to the approximate rounding of the at least one corner; generating an initial representation of a mask utilized to image the design based on the representation; and performing Optical Proximity Correction (OPC) further to the initial representation of the mask.

Abstract: In a lithographic apparatus, a localized area of the substrate surface under a projection system is immersed in liquid. The height of a liquid supply system above the surface of the substrate can be varied using actuators. A control system uses feedforward or feedback control with input of the surface height of the substrate to maintain the liquid supply system at a predetermined height above the surface of the substrate.

Abstract: The present invention relates to a lithographic apparatus and a method of using the apparatus in the manufacture of a device such as an integrated circuit (IC). In particular, the present invention relates to a lithographic apparatus designed to be used with radiation having a wavelength in the Deep Ultra-Violet (DUV) and wherein radially polarized light is used to enhance the image contrast. In particular the present invention relates to partial clipping of the first order.

Abstract: In an immersion lithography apparatus or device manufacturing method, the position of focus of the projected image is changed during imaging to increase focus latitude. In an embodiment, the focus may be varied using the liquid supply system of the immersion lithographic apparatus.

Abstract: A sensor unit includes a substrate that has a first mark, and a second mark used to specify a position of the first mark, a sensor for detecting light that has transmitted through the first mark and the substrate, and a light shielding portion, provided between the second mark and the sensor, for shielding the light from the second mark against the sensor.

Abstract: A method for determining an offset between a center of a substrate and a center of a depression in a chuck includes providing a test substrate to the depression, the test substrate having a dimension smaller than a dimension of the depression, measuring a position of an alignment mark of the test substrate while in the depression, and determining the offset between the center of the substrate and the center of the depression from the position of the alignment mark.

Abstract: Embodiments of the invention include an interferometer measurement system in which at least one reflective surface is arranged such that, in use, the beam path of interferometer radiation of the interferometer measurement system incident on the at least one reflective surface has an offset angle in the range of from 0.1 to 10 milliradians with respect to the normal to the at least one reflective surface. In that way, the effect of spurious radiation on the interferometer measurement system produced within the interferometer measurement system may be suppressed. In another embodiment, a parallel-sided plate is used in an interferometer measurement system to obtain a signal dependent on the angle of a beam of radiation reflected from a mirror. In that way, the flatness of the mirror can be mapped. One surface of the plate is a beam-splitter and the opposite surface of the plate is a reflector.

Abstract: A method of pre-aligning a substrate in a lithographic apparatus is described. The substrate has at least one alignment mark provided on a side of the substrate. The method includes determining a relationship between a position of the at least one alignment mark, at least part of an edge of the substrate, and a center of the substrate. A substrate support is provided to support a substrate, the substrate support having at least one optical view window at a predetermined location to view a part of the side of the substrate. The substrate is placed on the substrate support on the basis of the relationship to position the at least one alignment mark in the at least one optical view window.

Abstract: An exposure apparatus for exposing a substrate to light via a pattern of a reticle.

Abstract: A lithographic apparatus equipped with an improved alignment system, is presented herein. In one embodiment, the apparatus includes a radiation system for providing a projection beam of radiation, a support structure for supporting a patterning device that configures the projection beam according to a desired pattern, a substrate holder for holding a substrate, projection system for projecting the patterned beam onto a target portion of the substrate, and an alignment system. The alignment system includes a radiation source for illuminating at least one mark which is usable for alignment on a substrate and an imaging system for imaging light which has interacted with the at least one mark to generate alignment information.

Abstract: A lithographic apparatus uses polarized light to improve the imaging properties such as exposure latitude, while maintaining and extending the lifetime of an illumination system in a lithographic apparatus.

Abstract: A lithographic apparatus having an improved transfer unit, is presented. The lithographic apparatus includes a processing unit that performs a lithographic process involving exchangeable objects in which the processing unit includes an illumination system that provides a beam of radiation, a support structure configured to support a patterning device that imparts a desired pattern to the beam of radiation, a substrate holder configured to hold a substrate, and a projection system configured to project the patterned beam onto a target portion of the substrate. The lithographic apparatus also includes a transfer unit comprising a single robot. The single robot is configured to transfer a first exchangeable object from a loading station to the processing unit and to transfer a second exchangeable object from the processing unit to a discharge station.

Abstract: A method of pre-aligning a substrate in a lithographic apparatus is described. The substrate has at least one alignment mark provided on a side of the substrate. The method includes determining a relationship between a position of the at least one alignment mark, at least part of an edge of the substrate, and a center of the substrate. A substrate support is provided to support a substrate, the substrate support having at least one optical view window at a predetermined location to view a part of the side of the substrate. The substrate is placed on the substrate support on the basis of the relationship to position the at least one alignment mark in the at least one optical view window.

Abstract: Improved autofocusing (“AF”) methods and devices for lithography are provided. Some embodiments of the invention provide an AF system that includes one or more interferometers for measuring a distance to a wafer surface or a reticle surface. The invention includes methods and devices for calibrating the interferometer(s) according to known distances to a target. According to some embodiments of the invention, a spatial filter reduces the amount of undesired signal coming from the wafer or reticle surface. In some such embodiments, higher orders of diffracted light from the wafer or reticle multilayer surfaces are eliminated with a pinhole filter oriented to reject light that is not vertically directed. Other embodiments include a spatial filtering system that passes a selected diffraction order, e.g., the first order of diffracted light, from the target.

Abstract: A lithographic illumination apparatus and method includes receiving a plurality of source radiation beams from a plurality of corresponding radiation sources, deflecting the plurality of source radiation beams along a common beam path, thereby generating a projection beam of radiation, imparting the projection beam of radiation with a cross-section pattern, and projecting the patterned projection beam of radiation onto a target portion of a substrate.