Abstract: A dual channel differential can include a first channel, the first channel configured to produce a first component signal, and a second channel that is independent from the first channel, the second channel configured to produce a second component signal. The sensor can include a sensing circuit configured to obtain the first component signal and the second component signal, the first component signal having a first polarity and the second component signal having a second polarity, the second polarity opposing the first polarity, determine a first cross-channel differential signal based at least in part on the first component signal and the second component signal, and provide the first cross-channel differential signal as a first output of the dual channel differential sensor.

Abstract: A testing system includes a truck carrying a circuit breaker, a fixed contact, and an actuator piston connected to a movable contact. A test platform supports the truck in a contact testing position and includes a sensor circuit mounted on the test platform and positioned under the truck and aligned with the circuit breaker when the truck is on the test platform in the contact testing position. The sensor circuit is configured to acquire displacement data of the actuator piston when the movable electrical contact is moved between the open and closed positions. A controller is coupled to the sensor circuit and configured to receive the displacement data and determine electrical contact erosion within the circuit breaker.

Abstract: The present invention provides a display device and detection method for impedance of the display device. The display device includes a display panel, a circuit board, and a chip-on-film. The chip-on-film includes pins, and the pins include conducting pins and test pins. The conducting pins are electrically connected to a first detection part of the circuit board, and the test pins are electrically connected to a second detection part of the circuit board. The conducting pins electrically connected to the first detection part are connected to the test pins by test wires.

Abstract: A capacitive touch sensor includes a touch interface, a switch, and a sensing circuit. The switch circuit switches based on sensing conditions of self-capacitance and mutual capacitance. The sensing circuit is used for both the self-capacitance mode and the self-capacitance mode to simplify circuit structure and save circuit area and power consumption. The output sensing voltage from the sensing circuit is stable. A differential mode is designed to improve noise interference and enhance accuracy of judging the touch effect. Then, the self-capacitance mode is utilized for the areas of possible touches to save operation time for the capacitance mode.

Abstract: A sensor includes a base member and a sensor sheet, and the sensor sheet includes a sensor main body including sensor electrodes and a tail portion that includes wiring lines electrically connected to the sensor electrodes and that projects and extends with respect to the base member. The base member includes a joint surface portion that is fixed to the sensor main body and a separation portion that is disposed at a position facing a tail support portion of the tail support portion to which the tail portion is connected and that is not fixed to the tail support portion.

Abstract: A semiconductor tester and a method for calibrating a probe card and a device under testing (DUT) are disclosed. The semiconductor tester includes: a support platform, including a support surface and configured to be able to move along a direction parallel to the support surface and rotate around a rotating shaft perpendicular to the support surface; a probe card including a plurality of probes stretching towards the support platform; and an alignment assembly, including: at least two first laser emitting apparatuses emitting a plurality of first laser beams; and a second laser emitting apparatus emitting a plurality of second laser beams. The first laser beams and the second laser beams are perpendicular to each other and are each arranged sequentially along a direction perpendicular to the support surface. The semiconductor tester aligns a probe card to a DUT with improved accuracy, thereby preventing the damage to the probe card.

Abstract: An AC resistance detection circuit and system. The circuit includes: a working state control module, generating a working state control signal; a sampling module, outputting a sampling signal of a resistance between a neutral wire and a live wire in the detection state; a comparison module, receiving a reference signal and the sampling signal, and outputting a comparison result; a counting signal generation module, receiving an oscillation signal and the working state control signal, and outputting the oscillation signal as a counting signal in the detection state; a zero clearing module, receiving the comparison result and the working state control signal, and outputting an active zero clearing signal when resistance between the neutral wire and the live wire is greater than a threshold; and a counting module, connected to the counting signal and the zero clearing signal, and outputting a high level when a count value reaches a preset value.

Abstract: A sulfurization detection sensor 10 comprises: a rectangular parallelepiped insulation substrate 1, a pair of front electrodes 2 provided at both ends of a front surface in the longitudinal direction of the insulation substrate 1, respectively, a sulfurization detection conductor 3 connected between the front electrodes 2, a pair of protective films 4 for covering a part of the sulfurization detection conductor 3 and that of the front electrodes 2, respectively, a pair of back electrodes 5 provided at both ends of a back surface in the longitudinal direction of the insulation substrate 1, respectively, a pair of end face electrodes 6 provided at both ends in the longitudinal direction of the insulation substrate 1, respectively, and external electrodes 7 provided on front surfaces of the end face electrodes 6, respectively. Specific regions 3b in which a current hardly flows are formed at both ends in the Y-direction of a sulfurization detection portion 3A.

Abstract: A system for capacitive object detection. In order to provide means for efficiently using the circuitry of an electrical heating device for capacitive object detection, the system includes: an elongate conductive element extending between a first terminal and a second terminal, wherein the first terminal is coupled to ground via a capacitive element and is connectable to an electrical power source, and the second terminal is connected to ground; and a detection circuit connected to at least one detection node disposed on the conductive element between the first and second terminal. The detection circuit is adapted to capacitively detect the presence of an object in the proximity of the conductive element based on an impedance associated with the object.

Abstract: A method for in situ threshold voltage determination of a semiconductor device includes sourcing a current to a first terminal of the semiconductor device. A gate terminal of the semiconductor device is driven with a plurality of gate levels. Each gate level includes one of a plurality of different gate voltages. A transistor voltage is measured between the first terminal and a second terminal of the semiconductor device during each gate level. The respective gate voltage is stored in response to the semiconductor device voltage transitioning past a voltage limit. A temperature dependent threshold voltage of the semiconductor device is estimated for a first measured temperature measured during the storing of the stored gate voltage from a previously stored gate voltage and a second measure temperature.

Abstract: A semiconductor device according to an embodiment includes a holding circuit including a buffer configured to obtain a heat stress information having a temperature dependency every predetermined period and a stress counter configured to accumulate the heat stress information and hold the accumulated value as a cumulative stress count value, a control circuit including an operation determination threshold value, and a wireless communication circuit. According to the semiconductor device according to the embodiment, while reducing the power consumption, it is possible to wirelessly transmit the cumulative heat stress information.

Abstract: The differential capacitor device includes a differential capacitor sensing component, a calibration capacitor assembly and two output terminals. The differential capacitive sensing element has a common point terminal, a first non-common point terminal and a second non-common point terminal, and the common point terminal is configured to receive an input voltage. The calibration capacitor assembly has a first calibration capacitor and a second calibration capacitor, one terminal of the calibration capacitor assembly is coupled to the first non-common point terminal and the second non-common point terminal, and the other terminal of the calibration capacitor assembly is configured to receive a first calibration voltage and a second calibration voltage. The two output terminals are respectively coupled to the first non-common point terminal and the second non-common point terminal to output a first signal and a second signal.

Abstract: A capacitive voltage sensor assembly includes a first electrode extending along a longitudinal axis, a second electrode surrounding a portion of the first electrode and positioned radially outward from the longitudinal axis and the first electrode, the second electrode including a flexible tubular portion, and a mass of dielectric insulating material at least partially encapsulating the first electrode and the second electrode. The flexible tubular portion is configured to move during solidification of the mass of dielectric resin, and the mass of dielectric resin fills through openings formed in the second electrode and forms a unitary insulating carrier structure for the first electrode and the second electrode.

Abstract: Sensors having an advantageous design and methods for fabricating such sensors are generally provided. Some sensors described herein comprise pairs of electrodes having radial symmetry, pairs of nested electrodes, and/or nanowires. Some embodiments relate to fabricating electrodes by methods in which nanowires are deposited from a fluid contacted with a substrate in a manner such that it evaporates and is replenished.

Abstract: A switchgear system includes a switchgear frame and a truck carrying a circuit breaker, which includes a breaker housing, a fixed electrical contact and a movable electrical contact mounted within the breaker housing, an actuator piston connected to the movable electrical contact, and a drive assembly coupled to the actuator piston. A sensor circuit is mounted on the switchgear frame under the truck and aligned with the circuit breaker and configured to acquire displacement data of the actuator piston when in a contact testing position. A controller is coupled to the sensor circuit and configured to receive the displacement data and determine electrical contact erosion within the circuit breaker.

Abstract: Disclosed is a capacitive sensor chip based on a power-aware dynamic charge-domain amplifier array. The capacitive sensor chip is based on a zoom architecture and includes: an architecture having two or more stages for capacitive quantization in which a first stage performs coarse quantization using a successive approximation register (SAR) and a second stage performs fine quantization using a delta-sigma modulator, an amplifier in the capacitive sensor chip is powered by a floating capacitor, the floating capacitor is connected to a power supply to being charged and connected to the amplifier to power the amplifier by controlling switches; a first-order integrator of the delta-sigma modulator includes an amplifier array having a scale of N bits and 2N amplifiers where N is a positive integer.

Abstract: A resistance measurement device for measuring sheet resistance of an electrically conductive film being long in one direction includes two probes disposed to face each other in spaced apart relation so as to allow the electrically conductive film to be interposed therebetween without contacting with the electrically conductive film; a scanning unit that allows the two probes to scan in a cross direction crossing the one direction; and an arithmetic unit that calculates a sheet resistance of the electrically conductive film based on a voltage measured by the two probes. The arithmetic unit includes a memory that memorizes a reference voltage measured by allowing the two probes to scan in the cross direction without interposing the electrically conductive film between the probes. The arithmetic unit corrects an actual voltage by allowing the two probes to scan in the cross direction with the electrically conductive film being interposed between the probes.

Abstract: A disclosed method includes: setting a connector of an acquisition circuit and an associated capacitor to a predetermined potential; providing an energy pulse of a predetermined first time duration to the connector; at a time occurring substantially at a predetermined second time duration after an end of the predetermined first time duration of the energy pulse, coupling the associated capacitor and the connector of the acquisition circuit; and sampling a voltage being exhibited across the associated capacitor.

Abstract: To reduce the likelihood of erroneous detection resulting from improper engagement of an engaging part with an engaged part, a fixing member is made to have a recess formed therein and is provided with a plurality of conduction paths that are electrically insulated from each other and have portions that are exposed at a plurality of positions including a first position inside the recess and in the vicinity of the innermost part of the recess and a second position inside the recess and not in the vicinity of the innermost part of the recess and other portions that are exposed outside of the recess, and a prescribed member touching the first position and second position can push the area around the opening of the recess.

Abstract: An Integrated Circuit (IC) includes an electronic circuit and reliability monitoring circuitry. The electronic circuit includes multiple electronic components. The reliability monitoring circuitry is configured to assess, during operation of the IC in a host system, one or more parameters indicative of a reliability of one or more components-of-interest, selected from among the electronic components, and to provide an output indicative of the reliability.