Abstract: A cross-cylinder objective assembly includes a fast axis objective (FAO) situated along an optical axis for focusing an incident laser beam along a fast axis, a slow axis objective (SAO) situated along the optical axis for focusing the incident laser beam along a slow axis, and a lens cell having fast and slow axis objective receiving portions for registering the FAO and SAO at a predetermined spacing along the optical axis.

Abstract: Fiber optic connectors and adapters may be automatically secured and released via a management system. Such automation may inhibit accidental and/or unauthorized insertion of fiber optic connectors into adapter ports. The automation also may inhibit accidental and/or unauthorized removal of the fiber optic connectors from the adapter ports.

Abstract: An optical bench subassembly including an integrated photonic device. Optical alignment of the photonic device with the optical bench can be performed outside of an optoelectronic package assembly before attaching thereto. The photonic device is attached to a base of the optical bench, with its optical input/output in optical alignment with the optical output/input of the optical bench. The optical bench supports an array of optical fibers in precise relationship to a structured reflective surface. The photonic device is mounted on a submount to be attached to the optical bench. The photonic device may be actively or passively aligned with the optical bench. After achieving optical alignment, the submount of the photonic device is fixedly attached to the base of the optical bench. The optical bench subassembly may be structured to be hermetically sealed as a hermetic feedthrough, to be hermetically attached to a hermetic optoelectronic package.

Abstract: Wavelength division multiplexing devices, and methods of forming the same, include a coupling lens and a waveguide, the lens being positioned over a mirror formed in a transmission path of the waveguide. The mirror reflects incoming light signals out of the transmission path through the lens and further reflects light signals coming from the lens and into the transmission path. An optical chip is positioned near a focal length of the lens. The optical chip has an optical filter configured to transmit a light signal at a first wavelength and to reflect received light signals at wavelengths other than the first wavelength.

Abstract: A reinforced multi-body optical device that in one embodiment includes a multi-body optical device having a thickness that is less than or equal to about 1.0 millimeter and a supporting plate bonded without epoxy to the multi-body optical device. In an embodiment the supporting plate has a coefficient of thermal expansion (CTE) that is within about 0.5 parts per million of the CTE of the multi-body optical device.

Abstract: A high density interconnect arrangement takes the form of a backplane-pluggable card, with electrical connections formed along a single (pluggable) edge and all remaining connections provided via optical fibers. An exemplary interconnect arrangement also includes on-board optical sources and silicon photonic-based circuitry for providing optical transceiver functionality. Passively aligned fiber arrays are utilized to provide I/O connections to external elements, as well as between laser sources and on-board silicon photonics.

Abstract: An expanded beam fiber optic connection system is disclosed which overcomes the problems associated with known expanded beam fiber optic connection systems. In particular, the expanded beam fiber optic connection system in accordance with the present invention includes a pair of mating fiber optic connectors. Each fiber optic connector includes a connector body and fiber optic termini. In accordance with an important aspect of the invention, the fiber optic termini utilize expanded beam technology and are configured with virtually the same form factor as existing physical contact fiber optic termini. The configuration of the expanded beam termini provides several benefits.

Abstract: A hermetic optical fiber alignment assembly includes a ferrule portion having a plurality of grooves receiving the end sections of optical fibers, wherein the grooves define the location and orientation of the end sections with respect to the ferrule portion. The assembly includes an integrated optical element for coupling the input/output of an optical fiber to the opto-electronic devices in the opto-electronic module. The optical element can be in the form of a structured reflective surface. The end of the optical fiber is at a defined distance to and aligned with the structured reflective surface. The structured reflective surfaces and the fiber alignment grooves can be formed by stamping.

Abstract: An optical fiber array with high reliability, which relates to the technical field of optical fibers is disclosed. The optical fiber array is composed of three parts, namely, optical fiber positioning substrate (1), cover plate (2) and optical fiber ribbon (3). One end of the optical fiber ribbon is striped to be a naked fiber (4). The naked fiber (4) is pressed into the micro-groove array of the optical fiber positioning substrate (1) by the cover plate (2) and glued and fixed with a glue layer (5), and a transitional region between the stripped part and the unstripped part of the optical fiber ribbon (3) is glued and fixed onto a rear half of the optical fiber positioning substrate (1) with the glue layer (5). It has a reasonable and novel structural design.

Abstract: Novel tools and techniques are provided for implementing installation of optical fiber, non-fiber lines, and/or power lines in a ground surface. In various embodiments, a foldable base might be placed in a channel in a ground surface. The foldable base might include a base portion, two side wall portions, at least two points of articulation, and two plug contacts. Each point of articulation allows each side wall portion to fold relative with the base portion, forming a cavity. One or more lines may be placed within the cavity. A plug, placed above the lines in the cavity, may engage with the two plug contacts to secure the plug to the foldable base. Capping material, placed in microchannel on a top surface of the plug, may flow beyond the microchannel and over any openings between the plug and the foldable base and between the foldable base and edges of the channel.

Abstract: A method for passively coupling an optical fiber to an optoelectronic chip, the method may include connecting the optical fiber to an optical cable interface of a first portion of an optical coupler; wherein the optical coupler further comprises a second portion; wherein the first portion comprises first optics that comprises a first lens array, an optical cable interface and three contact elements, each contact element has a spherical surface; and wherein the second portion comprises second optics that comprise a second lens array, and three elongated grooves; connecting the optical coupler to a substrate that supports the optoelectronic chip; and mechanically coupling the first portion to the second portion by aligning the three contact elements of the first portion with the three elongated grooves of the second portion thereby an optical axis related to a first lens array of the first portion passes through a point of intersection between longitudinal axes of the three elongated grooves, and an optical axi

Abstract: A fiber distribution hub includes an enclosure defining an interior region and a frame body having a longitudinal axis. The frame body is rotatably mounted within the interior region of the enclosure such that the frame body can rotate about the longitudinal axis relative to the enclosure between a first terminal angular position and a second terminal angular position. The frame body is rotatably mounted within the interior region of the enclosure also such that the entire frame body remains within the interior region as the frame body rotates between the first terminal angular position and the second terminal angular position. The fiber distribution hub also includes a splitter coupled to the frame body, and having a splitter input and a splitter output.

Abstract: Fiber laser having a monolithic laser resonator having laser affected zones for providing laser beams having wavelengths below 800 nm and from between 400 nm to 800 nm. Methods of using femtosecond lasers to form fiber Bragg gratings, volume Bragg gratings, space gratings, and laser beam delivery patterns for changing the index of refraction within optical fibers.

Abstract: A light coupling unit includes a first major surface comprising one or more substantially parallel first grooves oriented along a first direction for receiving one or more optical waveguides. A second major surface for slidably contacting a mating light coupling unit comprises an optically transmitting window for propagating an optical signal therethrough, and a region of second grooves and lands configured to capture particulate contaminants in the second grooves.

Abstract: The invention comprises a delivery fiber assembly suitable for delivering broad band light and comprising a delivery fiber and a connector member. The delivery fiber has a length, an input end for launching light and a delivery end for delivering light. The delivery fiber comprises along its length a core region and a cladding region surrounding the core region wherein the cladding region comprises a cladding background material having a refractive index Nbg and a plurality of microstructures in the form of inclusions of solid material having refractive index up to Ninc and extending in the length of the longitudinal axis of the delivery fiber, wherein Ninc<Nbg. The plurality of inclusions in the cladding region is arranged in a cross-sectional pattern comprising at least two rings of inclusions surrounding the core region. The connector member is mounted to the delivery fiber at a delivery end section of the delivery fiber comprising the delivery end.

Abstract: A photonic chip includes a substrate, an electrical isolation region formed over the substrate, and a front end of line (FEOL) region formed over the electrical isolation region. The photonic chip also includes an optical coupling region. The electrical isolation region and the FEOL region and a portion of the substrate are removed within the optical coupling region. A top surface of a the substrate within the optical coupling region includes a plurality of grooves configured to receive and align a plurality of optical fibers. The grooves are formed at a vertical depth within the substrate to provide for alignment of optical cores of the plurality of optical fibers with the FEOL region when the plurality of optical fibers are positioned within the plurality of grooves within the optical coupling region.

Abstract: A fiber panel, a light module, and a method for transmitting light using the fiber panel are provided. The fiber panel includes a plurality of optical fibers; and wherein each of the optical fibers have at least one base surface, and the fibers being arranged such that the at least one base surface of each optical fiber have a common orientation with each other.

Abstract: An optical cavity is formed to have a circuitous configuration. The optical cavity is configured to receive light coupled from a waveguide. At least two photodetector sections are formed over respective portions of the optical cavity. Each of the at least two photodetector sections is configured to detect light present within the optical cavity. Each of the at least two photodetector sections is configured for separate and independent control.

Abstract: The various technologies presented herein relate to integrating an IC having at least one waveguide incorporated therein with a v-groove array IC such that an optical fiber located in a v-groove is aligned relative to a waveguide in the IC maximizing optical coupling between the fiber and the waveguide. The waveguide IC and the v-groove array IC are bonded in a stacked configuration. Alignment of the waveguide IC and the array IC in the stacked configuration enables advantage to be taken of lithographic accuracy of features formed with respect to the Z-direction. Further, kinematic pins and sockets are utilized to provision accuracy in the X- and Z-directions, wherein advantage is taken of the placement accuracy and fabrication tolerance(s) which can be utilized when forming the and sockets. Accordingly, automated alignment of the waveguide IC and the array IC is enabled, facilitating accurate alignment of the respective waveguides and fibers.

Abstract: An amplification waveguide device and an amplification beam steering apparatus are provided. The amplification beam steering apparatus includes a beam steerer configured to control emission directions of light beams output therefrom, a plurality of waveguides configured to guide the light beams output from the beam steerer, and a light amplifier configured to amplify the light beams traveling through the plurality of waveguides.