Patents Examined by Hoang Q Tran
  • Patent number: 10527852
    Abstract: Examples are disclosed that relate to the use of diffractive filtering in a waveguide display system. One example provides a display system including a light source, a first waveguide configured to conduct light of a first wavelength band from the light source, the first waveguide comprising a first input coupler, a second waveguide configured to conduct light of a second wavelength band from the light source, the second waveguide comprising a second input coupler, and a diffractive filter positioned optically between the first waveguide and the second waveguide, the diffractive filter being configured to diffract light of the first wavelength band and transmit light of the second wavelength band.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: January 7, 2020
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: Lasse Pekka Karvonen, Andreas Langner
  • Patent number: 10527808
    Abstract: The present disclosure provides a flame retardant optical fiber cable. The flame retardant optical fiber cable includes a plurality of bundle binders. In addition, the flame retardant optical fiber cable includes a first layer, a second layer, a third layer, a fourth layer, a fifth layer, a sixth layer, a seventh layer and an eighth layer. The first layer surrounds a plurality of bundle binders. The second layer surrounds the first layer. The third layer surrounds the second layer. The fourth layer surrounds the third layer. The fifth layer surrounds the fourth layer. The sixth layer surrounds the fifth layer. The seventh layer surrounds the sixth layer. The eighth layer surrounds the seventh layer.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: January 7, 2020
    Assignee: STERLITE TECHNOLOGIES LIMITED
    Inventors: Kishore Sahoo, Venkatesh Murthy, Dnyaneshwar Wagh, Sunil Senapati, Ashutosh Pandey
  • Patent number: 10522975
    Abstract: An optical system includes a laser die that includes a gain medium and multiple laser waveguides that are each configured to guide a different laser light signal through the gain medium. Each of the laser waveguides outputs a laser light signal at a wavelength. The laser waveguides are arranged in multiple candidate groups. Each candidate group includes multiple laser waveguides. The wavelength spacing of the laser waveguides is the same or substantially the same in different candidate groups.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: December 31, 2019
    Assignee: Mellanox Technologies Silicon Photonics Inc.
    Inventors: Albert Michael Benzoni, Bhavin Bijlani, Amir Ali Tavallaee
  • Patent number: 10509184
    Abstract: In accordance with an embodiment, a welding assembly is disclosed that allows for a laser assembly to be coupled into a socket of the same and held at a fixed position, e.g., by a mechanical grabber of a welding system. The mechanical grabber may then travel along one or more axis to bring the TOSA module into mechanical alignment with an opening of an associated optical subassembly housing. The welding assembly may further include an alignment member that provides one or more alignment contact surfaces configured to be brought directly into contact with a surface of the associated subassembly housing. When the one or more alignment contact surfaces are “flush” with the surface of the subassembly housing the emission face of the TOSA module is substantially parallel, and by extension, optically aligned with the opening of the associated subassembly housing.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: December 17, 2019
    Assignee: Applied Optoelectronics, Inc.
    Inventors: I-Lung Ho, Hsiu-Che Wang, Hao-Hsiang Liao
  • Patent number: 10502911
    Abstract: The invention relates to a transparent auxiliary ring for the adjustment, for the long-term stable operation and for protection of fiber-coupled laser arrangements.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: December 10, 2019
    Assignee: JENOPTIK Optical Systems GmbH
    Inventor: Juergen Wolf
  • Patent number: 10502896
    Abstract: Disclosed are a method and structure providing a silicon-on-insulator substrate on which photonic devices are formed and in which a core material of a waveguide is optically decoupled from a support substrate by a shallow trench isolation region.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: December 10, 2019
    Assignee: Micron Technology, Inc.
    Inventor: Roy E. Meade
  • Patent number: 10473871
    Abstract: An optoelectronic assembly for a printed circuit board (PCB) assembly is described herein. The optoelectronic assembly may include a component carrier for mounting an active component, and a connector assembly for achieving a coupling between the component carrier and PCB-side optical infrastructure on a printed circuit board (PCB). The connector assembly can include a plurality of optical fibers connected to the component carrier, a first optical connector connected to the optical fibers for coupling with the PCB-side optical infrastructure on the PCB, and a housing member for housing the optical fibers and the first optical connector.
    Type: Grant
    Filed: January 31, 2014
    Date of Patent: November 12, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Kevin B Leigh, Paul Kessler Rosenberg, George D Megason
  • Patent number: 10451795
    Abstract: A optical fiber having core and cladding regions, a primary coating, and a secondary coating may be defined in part by a curve relating the microbend sensitivity to a ratio of the elastic modulus of the secondary coating to the elastic modulus of the primary coating (as plotted on respective y and x axes). The curve has a substantially peaked shape defined by a positive-slope region and a negative-slope region. The ratio of the elastic modulus of the secondary coating to the elastic modulus of the primary coating is within the positive-slope region.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: October 22, 2019
    Assignee: OFS FITEL, LLC
    Inventors: Kariofilis Konstadinidis, David W Peckham, Debra A Simoff
  • Patent number: 10451807
    Abstract: A sensing device is used for measuring physical characteristics. The sensing device may include an optical fiber disposed in a tube. The optical fiber may have a section containing a fiber Bragg grating (FBG) sensor. A support member may be coupled to the ends of the section, such that the section includes a length greater than a length of the portion of the support member disposed between the ends of the section. The support member is configured to isolate the FBG sensor from strain in the optical fiber.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: October 22, 2019
    Assignee: WEATHERFORD TECHNOLOGY HOLDINGS, LLC
    Inventors: Domino Taverner, John J. Grunbeck
  • Patent number: 10422967
    Abstract: An optical coupling apparatus and method are described. An embodiment of an optical coupling apparatus may include a first optical chip, a second optical chip, and an optical writing waveguide block. In the apparatus, the first optical chip is coupled to the optical writing waveguide block in a first coupling manner, and the second optical chip is coupled to the optical writing waveguide block in a second coupling manner. Furthermore, in the apparatus, the first optical chip is optically interconnected to the second optical chip by using the optical writing waveguide block. Compatibility between a plurality of coupling manners is therefore enabled by using the technical solutions described herein.
    Type: Grant
    Filed: July 16, 2018
    Date of Patent: September 24, 2019
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Qing Zhao, Xiaolu Song, Li Zeng, Ruiqiang Ji, Yanbo Li
  • Patent number: 10422936
    Abstract: Alighting device includes an optical fiber having a first end portion from which a light emitted by a light source is introduced, and a second end portion, the optical fiber allowing the light to pass therethrough while radiating from a side surface of the optical fiber to an outside; a tube having light-transmissivity and covering the side surface of the optical fiber, such that a gap is located between the side surface of the optical fiber and the tube; a light-shielding cylindrical body covering the second end portion of the optical fiber, such that a space is located between the second end portion of the optical fiber and the cylindrical body, at least a portion of the light-shielding cylindrical body being disposed in the tube; and a light conductive part on a side surface of the cylindrical body, the light conductive part allowing light radiated from the second end portion of the optical fiber to be conducted to a portion of the tube at an outside of the cylindrical body in a diametrical direction of th
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: September 24, 2019
    Assignee: NICHIA CORPORATION
    Inventors: Katsuyuki Onozuka, Yoshitaka Tanaka
  • Patent number: 10413953
    Abstract: A composite structure includes a base and an auxiliary portion of dissimilar materials. The auxiliary portion is shaped by stamping. As the auxiliary portion is stamped, it interlocks with the base, and at the same time forming a desired structured feature on the auxiliary portion, such as a structured reflective surface, an alignment feature, etc. With this approach, relatively less critical structured features can be shaped on the bulk of the base with less effort to maintain a relatively larger tolerance, while the relatively more critical structured features on the auxiliary portion are more precisely shaped with further considerations to define dimensions, geometries and/or finishes at relatively smaller tolerances. The auxiliary portion may include a composite structure of two dissimilar materials associated with different properties for stamping different structured features.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: September 17, 2019
    Assignee: NANOPRECISION PRODUCTS, INC.
    Inventors: Shuhe Li, Robert Ryan Vallance, Michael K. Barnoski, Yongsheng Zhao, Matthew Gean, Tewodros Mengesha, Rand D. Dannenberg
  • Patent number: 10416526
    Abstract: An object of the invention is to provide an optical waveguide device which is able to efficiently absorb or remove leaked light propagating in a substrate. An optical waveguide device in which an optical waveguide is formed on a substrate, in which the optical waveguide includes a main waveguide through which signal light propagates, and a metal layer (a bonding layer or an electrode) is formed, through a high refractive index layer having a refractive index higher than the refractive index of the substrate, in at least a part of a region on which the main waveguide is not formed.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: September 17, 2019
    Assignee: SUMITOMO OSAKA CEMENT CO., LTD.
    Inventor: Katsutoshi Kondou
  • Patent number: 10401703
    Abstract: The invention relates to a folded Mach-Zehnder modulator. The modulator may comprise a beam splitter configured to split an input light beam into a plurality of light beams. The modulator may comprise a plurality of Mach-Zehnder devices configured to receive one or more of the plurality of light beams. The modulator may comprise a U-turn section configured to receive light beams from the Mach-Zehnder devices and to change the direction of the light beams by substantially 180 degrees. The modulator may comprise a polarization management section configured to combine light beams received from the U-turn section and to output a polarization multiplexed phase modulated light beam.
    Type: Grant
    Filed: July 31, 2013
    Date of Patent: September 3, 2019
    Assignee: Lumentum Technology UK Limited
    Inventors: Stefano Balsamo, Giuseppe Cusmai, Marco Villa, Nicola Rettani, Paolo Vergani, Haydn Jones
  • Patent number: 10401581
    Abstract: A module heatsink lifter for raising and lowering a heatsink enabling insertion and removal of a module includes a fixed base; a hinge connector of the fixed based coupled to the heatsink; and an actuator mechanism to raise and lower the heatsink through rotation about the hinge connector, wherein the actuator mechanism operates from a front faceplate based on push and pull movement to raise and lower the heatsink into a raised position and a lowered position. The heatsink includes a Thermal Interface Material (TIM) on a bottom portion which creates a thermal connection with the module when the heatsink is in the lowered position. The module can include a pluggable optical module.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: September 3, 2019
    Assignee: Ciena Corporation
    Inventor: Adrianus Van Gaal
  • Patent number: 10393971
    Abstract: Some embodiments of the present disclosure disclose a pluggable optical module, comprising a housing and an electromagnetic interference shielding clip clamped on the housing; a conductive member is provided between the housing and the electromagnetic interference shielding clip; and when the pluggable optical module is inserted into an optical module cage, the conductive member can block a gap between the housing and the electromagnetic interference shielding clip.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: August 27, 2019
    Assignees: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense USA Corp., Hisense International Co., Ltd.
    Inventors: Wei Zhao, Hongchao Pan, Yinlong Liu, Wei Cui, Lin Yu
  • Patent number: 10386575
    Abstract: An optical assembly generally having a substrate; a photonic-integrated circuit (PIC) mounted on the substrate, the PIC having a plurality of optical ports; a first structure having a bottom surface connected to the substrate, and a first planar surface extending perpendicularly to the substrate; a second structure having a second planar surface being connected to the first planar surface of the first structure via an adhesive, and a support surface; and a waveguide array having a support surface being connected to the support surface of the second structure, the waveguide array having a plurality of waveguides each defining an optical path, with the optical paths lying in a waveguide plane, the waveguide plane being perpendicular to the first and second planar surfaces, the optical paths being maintained in optical alignment with corresponding ones of the optical ports via the adhered first and second planar surfaces.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: August 20, 2019
    Assignee: INSTITUT NATIONAL D'OPTIQUE
    Inventors: Patrice Côté, Patrick Paradis, Marc Lévesque, Jacques Régnier, Alex Paquet
  • Patent number: 10365436
    Abstract: A system and method for packing optical and electronic components. A module includes an electronic integrated circuit and a plurality of photonic integrated circuits, connected to the electronic integrated circuit by wire bonds or by wire bonds and other conductors. A metal cover of the module is in thermal contact with the electronic integrated circuit and facilitates extraction of heat from the electronic integrated circuit. Arrays of optical fibers are connected to the photonic integrated circuits.
    Type: Grant
    Filed: January 4, 2018
    Date of Patent: July 30, 2019
    Assignee: Rockley Photonics Limited
    Inventors: Gerald Cois Byrd, David Arlo Nelson, Javid Messian, Thomas Pierre Schrans
  • Patent number: 10359338
    Abstract: There is provided apparatus and a method for assessing the integrity of a bonded joint and a bonded joint assembly. The assembly has a bonded joint monitored for bond integrity and comprises first (1) and second (2) components each defining a bonding surface (3,4); the joint (5) is formed between the bonding surfaces (3,4) and the first component (1) defines a passage (15) therethrough from the bonding surface to an exterior of the component. The joint (5) includes an optical fiber (11) extending along the joint (5) between the bonding surfaces, through the passage (15) and emerging from the passage (15) to the exterior of the component. The method of constructing the assembly includes the steps of passing the optical fiber (11) through the passage (15) and adhering the optical fiber (11) to the bonding surface (3) of the first component (1), thus bringing the two bonding surfaces (3,4) together and forming the bond (5).
    Type: Grant
    Filed: December 15, 2014
    Date of Patent: July 23, 2019
    Assignee: BAE Systems plc
    Inventor: Ian James Read
  • Patent number: 10353227
    Abstract: The present invention provides an optical in-fiber chiral fiber isolator, capable of transmitting a signal of a predetermined optical polarization in a forward direction therethrough, while rejecting all signals traveling in a backward direction therethrough, and a method of fabrication thereof.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: July 16, 2019
    Assignee: Chiral Photonics, Inc.
    Inventors: Victor ll'ich Kopp, Guoyin Zhang