Patents Examined by Hoang Tran
  • Patent number: 10228528
    Abstract: The bond between abutting layers is controlled by introducing particulate matter at the interface of the layers.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: March 12, 2019
    Assignee: Corning Optical Communications LLC
    Inventors: Bradley J. Blazer, Anne G. Bringuier, Michael J. Gimblet, Cory F. Guenter, Douglas S. Hedrick, Jason C. Lail, Reginald Roberts
  • Patent number: 10222571
    Abstract: A telecommunications chassis comprises a cable sealing portion defining at least one cable opening configured to sealably receive a cable and a module mounting portion extending from the cable sealing portion, which further comprises a housing defining an open front closable by a door to define an interior, a rear wall, a right wall, and a left wall. A plurality of module mounting locations is provided in a vertically stacked arrangement, each configured to receive a telecommunications module through the open front. An exterior of the housing includes a first column of radius limiters defining curved profiles for guiding cables from the front toward the rear with bend control. A second column of radius limiters in the form of spools is spaced apart and generally parallel to the first column of radius limiters and a third column of radius limiters, at least some of which are in the form of spools, is also spaced apart and generally parallel to the first and second columns of radius limiters.
    Type: Grant
    Filed: April 5, 2017
    Date of Patent: March 5, 2019
    Assignee: CommScope Technologies LLC
    Inventors: James J. Solheid, Kristofer Bolster, Soutsada Vongseng, Thomas G. LeBlanc
  • Patent number: 10215921
    Abstract: Disclosed are a method and structure providing a silicon-on-insulator substrate on which photonic devices are formed and in which a core material of a waveguide is optically decoupled from a support substrate by a shallow trench isolation region.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: February 26, 2019
    Assignee: Micron Technology, Inc.
    Inventor: Roy E. Meade
  • Patent number: 10215918
    Abstract: An optical system is disclosed. The optical system comprising: a substrate; and a subwavelength photonic crystal waveguide atop the substrate, wherein the subwavelength photonic crystal waveguide comprises a periodic one or two-dimensional array of two or more interleaved dielectric pillars; wherein the periodicity of the one or two-dimensional array is constant, a combination of two or more periods, or random; wherein the one or two-dimensional array is substantially linear or curved; wherein each of the pillars of the one or two-dimensional array is at least one of a triangular prism, a trapezoidal prism, an elliptic cylinder, a cylinder, a tube, a frustum, a pyramid, a trapezoidal prism, and an asymmetric frustum; and wherein each of the pillars of the one or two-dimensional array comprises a solid, liquid, and/or gas. Other embodiments are described and claimed.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: February 26, 2019
    Assignee: Omega Optics, Inc.
    Inventors: Xiaochuan Xu, Ray T. Chen
  • Patent number: 10197737
    Abstract: Embodiments of the present disclosure are directed toward an optical apparatus that includes a semiconductor layer to propagate light from at least one light source. The optical apparatus may further include a curved echelle grating with a plurality of grating teeth, the echelle grating at an outer side of the semiconductor layer. The curved echelle grating may include a plurality of grating teeth, and a grating tooth of the plurality of grating teeth may have a grating facet and a shadow facet. A shadow facet may have an angle of grating greater than 0 degrees with respect to a normal of a curve of the curved echelle grating. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: February 5, 2019
    Assignee: Intel Corporation
    Inventor: Wenhua Lin
  • Patent number: 10173286
    Abstract: Certain aspects of the present disclosure provide techniques and corresponding apparatus for making armored cables with one or more optical fibers contained therein. The techniques may be utilized to control an amount of excess fiber length (EFL) in the armored cables. The techniques may also allow introduction of one or more optical fibers directly into a welding process without using an inner tube in the final armored cable. The techniques may also be utilized to reduce friction and static charge on the optical fiber(s) as the fiber(s) are pushed through one or more guide tubes that protect the fiber(s) during the welding process.
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: January 8, 2019
    Assignee: Weatherford Technology Holdings, LLC
    Inventors: Edward M. Dowd, Jason Scott Kiddy, Mary Margaret Sequino
  • Patent number: 10175436
    Abstract: An optical fiber ribbon includes a plurality of optical fibers and a ribbon matrix having an inner matrix surrounding and encapsulating the optical fibers, wherein the inner matrix is the cured product of an inner matrix composition substantially free of oligomer components, and an outer matrix surrounding the inner matrix, wherein the outer matrix is the cured product of an outer matrix composition substantially free of oligomer components.
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: January 8, 2019
    Assignee: Corning Optical Communications LLC
    Inventors: Michelle Dawn Fabian, Kevin Robert McCarthy
  • Patent number: 10146024
    Abstract: Novel tools and techniques are provided for implementing installation of optical fiber, non-fiber lines, and/or power lines in a ground surface. In various embodiments, a foldable base might be placed in a channel in a ground surface. The foldable base might include a base portion, two side wall portions, at least two points of articulation, and two plug contacts. Each point of articulation allows each side wall portion to fold relative with the base portion, forming a cavity. One or more lines may be placed within the cavity. A plug, placed above the lines in the cavity, may engage with the two plug contacts to secure the plug to the foldable base. Capping material, placed in microchannel on a top surface of the plug, may flow beyond the microchannel and over any openings between the plug and the foldable base and between the foldable base and edges of the channel.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: December 4, 2018
    Assignee: CenturyLink Intellectual Property LLC
    Inventors: Michael L. Elford, Michael P. Winterrowd, Patrick J. Sims
  • Patent number: 10139563
    Abstract: A method is for making a photonic chip including EO devices having multiple thicknesses. The method may include forming a first semiconductor layer over a semiconductor film, forming a second semiconductor layer over the first semiconductor layer, and forming a mask layer over the second semiconductor layer. The method may include performing a first selective etching of the mask layer to provide initial alignment trenches, performing a second etching, aligned with some of the initial alignment trenches and using the first semiconductor layer as an etch stop, to provide multi-level trenches, and filling the multi-level trenches to make the EO devices having multiple thicknesses.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: November 27, 2018
    Assignees: STMICROELECTRONICS SA, STMICROELECTRONICS (CROLLES 2) SAS
    Inventors: Charles Baudot, Alain Chantre, Sébastien Cremer
  • Patent number: 10139568
    Abstract: An optical fiber splicing tool of the invention include: an optical fiber splicing unit that includes: an optical fiber grasper that grasps a first optical fiber at a mechanical splice; and a guide target that is slidable along a guide provided at a connecting jig that fixes a second optical fiber to be butt-jointed to the first optical fiber; and a connecting jig that includes: a guide that guides the optical fiber splicing unit; and an optical fiber fixer that fixes the second optical fiber. The optical fiber splicing unit provides a first flexure width between one end side of the mechanical splice and the optical fiber grasper, and a second flexure width shorter than the first flexure width is ensured between the other end side of the mechanical splice and the optical fiber fixer when butt-jointing is carried out.
    Type: Grant
    Filed: February 28, 2014
    Date of Patent: November 27, 2018
    Assignees: FUJIKURA LTD., NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Takashi Yamaguchi, Takaharu Matsuda, Kazuhiro Takizawa, Kazutoshi Takamizawa, Yuuji Aoyagi, Atsushi Daido, Masahiro Ida
  • Patent number: 10120146
    Abstract: There is provided an opto-electric hybrid module in which an optical element of an optical element unit and a core of an optical waveguide of an opto-electric hybrid unit are aligned with each other simply and precisely. This opto-electric hybrid module includes: a connector including an optical element; and an opto-electric hybrid unit including an electric circuit board and an optical waveguide which are stacked together. The connector includes aligning protrusions positioned and formed in a predetermined position with respect to the optical element. The opto-electric hybrid unit 2 includes recesses for fitting engagement with the aligning protrusion, the recesses being positioned and formed in a predetermined position with respect to an end surface of a core of the optical waveguide.
    Type: Grant
    Filed: March 7, 2014
    Date of Patent: November 6, 2018
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yuichi Tsujita, Naoki Shibata, Naoyuki Tanaka, Shotaro Masuda
  • Patent number: 10114173
    Abstract: An aspect of the disclosure provides a microring resonator (MRR). Such an MRR includes a ring optical waveguide and an optical waveguide, with the optical waveguide configured such that a first portion of the optical waveguide overlaps a second portion of the ring waveguide. In some embodiments, the optical waveguide has a first refractive index and the ring optical waveguide has a second refractive index such that the first refractive index is less than the second refractive index. In some embodiments, the optical waveguide is a polymer optical waveguide and the ring optical waveguide is a silicon optical waveguide. In some embodiments, the optical waveguide is larger in height than the ring waveguide and the first portion of the optical waveguide is configured to provide space for the second portion of the ring waveguide.
    Type: Grant
    Filed: March 14, 2017
    Date of Patent: October 30, 2018
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Chunshu Zhang, Dominic John Goodwill
  • Patent number: D977394
    Type: Grant
    Filed: October 22, 2020
    Date of Patent: February 7, 2023
    Assignee: Guangzhou Songxianjun Trading Co., Ltd.
    Inventor: Jiakai Chen
  • Patent number: D978044
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: February 14, 2023
    Assignee: FORMOSA SAINT JOSE CORP.
    Inventor: Ming-Shun Yang
  • Patent number: D978045
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: February 14, 2023
    Assignee: FORMOSA SAINT JOSE CORP.
    Inventor: Ming-Shun Yang
  • Patent number: D978752
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: February 21, 2023
    Assignee: NINGBO GONGYI INDUSTRY AND TRADE CO., LTD.
    Inventor: Guchang Ruan
  • Patent number: D981924
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: March 28, 2023
    Assignee: Ford Global Technologies, LLC
    Inventors: Martin B. Coons, Paul Wraith, Dong H. Park, James Marleau, Brian Purcell
  • Patent number: D981934
    Type: Grant
    Filed: July 27, 2021
    Date of Patent: March 28, 2023
    Inventor: Anquan Wang
  • Patent number: D983113
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: April 11, 2023
    Assignee: THERMOFLEX CORP.
    Inventors: Robert Price, Jacob Price, David Reband
  • Patent number: D983718
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: April 18, 2023
    Assignee: AMERICAN HONDA MOTOR CO., INC.
    Inventors: Jeffery L. Miller, Ryan George Rex