Patents Examined by Hoang Tran
  • Patent number: 10228528
    Abstract: The bond between abutting layers is controlled by introducing particulate matter at the interface of the layers.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: March 12, 2019
    Assignee: Corning Optical Communications LLC
    Inventors: Bradley J. Blazer, Anne G. Bringuier, Michael J. Gimblet, Cory F. Guenter, Douglas S. Hedrick, Jason C. Lail, Reginald Roberts
  • Patent number: 10222571
    Abstract: A telecommunications chassis comprises a cable sealing portion defining at least one cable opening configured to sealably receive a cable and a module mounting portion extending from the cable sealing portion, which further comprises a housing defining an open front closable by a door to define an interior, a rear wall, a right wall, and a left wall. A plurality of module mounting locations is provided in a vertically stacked arrangement, each configured to receive a telecommunications module through the open front. An exterior of the housing includes a first column of radius limiters defining curved profiles for guiding cables from the front toward the rear with bend control. A second column of radius limiters in the form of spools is spaced apart and generally parallel to the first column of radius limiters and a third column of radius limiters, at least some of which are in the form of spools, is also spaced apart and generally parallel to the first and second columns of radius limiters.
    Type: Grant
    Filed: April 5, 2017
    Date of Patent: March 5, 2019
    Assignee: CommScope Technologies LLC
    Inventors: James J. Solheid, Kristofer Bolster, Soutsada Vongseng, Thomas G. LeBlanc
  • Patent number: 10215921
    Abstract: Disclosed are a method and structure providing a silicon-on-insulator substrate on which photonic devices are formed and in which a core material of a waveguide is optically decoupled from a support substrate by a shallow trench isolation region.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: February 26, 2019
    Assignee: Micron Technology, Inc.
    Inventor: Roy E. Meade
  • Patent number: 10215918
    Abstract: An optical system is disclosed. The optical system comprising: a substrate; and a subwavelength photonic crystal waveguide atop the substrate, wherein the subwavelength photonic crystal waveguide comprises a periodic one or two-dimensional array of two or more interleaved dielectric pillars; wherein the periodicity of the one or two-dimensional array is constant, a combination of two or more periods, or random; wherein the one or two-dimensional array is substantially linear or curved; wherein each of the pillars of the one or two-dimensional array is at least one of a triangular prism, a trapezoidal prism, an elliptic cylinder, a cylinder, a tube, a frustum, a pyramid, a trapezoidal prism, and an asymmetric frustum; and wherein each of the pillars of the one or two-dimensional array comprises a solid, liquid, and/or gas. Other embodiments are described and claimed.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: February 26, 2019
    Assignee: Omega Optics, Inc.
    Inventors: Xiaochuan Xu, Ray T. Chen
  • Patent number: 10197737
    Abstract: Embodiments of the present disclosure are directed toward an optical apparatus that includes a semiconductor layer to propagate light from at least one light source. The optical apparatus may further include a curved echelle grating with a plurality of grating teeth, the echelle grating at an outer side of the semiconductor layer. The curved echelle grating may include a plurality of grating teeth, and a grating tooth of the plurality of grating teeth may have a grating facet and a shadow facet. A shadow facet may have an angle of grating greater than 0 degrees with respect to a normal of a curve of the curved echelle grating. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: February 5, 2019
    Assignee: Intel Corporation
    Inventor: Wenhua Lin
  • Patent number: 10173286
    Abstract: Certain aspects of the present disclosure provide techniques and corresponding apparatus for making armored cables with one or more optical fibers contained therein. The techniques may be utilized to control an amount of excess fiber length (EFL) in the armored cables. The techniques may also allow introduction of one or more optical fibers directly into a welding process without using an inner tube in the final armored cable. The techniques may also be utilized to reduce friction and static charge on the optical fiber(s) as the fiber(s) are pushed through one or more guide tubes that protect the fiber(s) during the welding process.
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: January 8, 2019
    Assignee: Weatherford Technology Holdings, LLC
    Inventors: Edward M. Dowd, Jason Scott Kiddy, Mary Margaret Sequino
  • Patent number: D977394
    Type: Grant
    Filed: October 22, 2020
    Date of Patent: February 7, 2023
    Assignee: Guangzhou Songxianjun Trading Co., Ltd.
    Inventor: Jiakai Chen
  • Patent number: D978044
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: February 14, 2023
    Assignee: FORMOSA SAINT JOSE CORP.
    Inventor: Ming-Shun Yang
  • Patent number: D978045
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: February 14, 2023
    Assignee: FORMOSA SAINT JOSE CORP.
    Inventor: Ming-Shun Yang
  • Patent number: D978752
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: February 21, 2023
    Assignee: NINGBO GONGYI INDUSTRY AND TRADE CO., LTD.
    Inventor: Guchang Ruan
  • Patent number: D981924
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: March 28, 2023
    Assignee: Ford Global Technologies, LLC
    Inventors: Martin B. Coons, Paul Wraith, Dong H. Park, James Marleau, Brian Purcell
  • Patent number: D981934
    Type: Grant
    Filed: July 27, 2021
    Date of Patent: March 28, 2023
    Inventor: Anquan Wang
  • Patent number: D983113
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: April 11, 2023
    Assignee: THERMOFLEX CORP.
    Inventors: Robert Price, Jacob Price, David Reband
  • Patent number: D983717
    Type: Grant
    Filed: July 2, 2021
    Date of Patent: April 18, 2023
    Assignee: MACNEIL IP LLC
    Inventors: Keith Lawrence, Benjamin Popper
  • Patent number: D983718
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: April 18, 2023
    Assignee: AMERICAN HONDA MOTOR CO., INC.
    Inventors: Jeffery L. Miller, Ryan George Rex
  • Patent number: D984342
    Type: Grant
    Filed: June 26, 2021
    Date of Patent: April 25, 2023
    Inventor: Daping Huang
  • Patent number: D984351
    Type: Grant
    Filed: September 29, 2021
    Date of Patent: April 25, 2023
    Assignee: PACCAR Inc
    Inventors: Vaibhav Pradip Mahajan, Mike B. Adams, Andrew Brady
  • Patent number: D984933
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: May 2, 2023
    Assignee: Black Horse Off Road of GA, Inc.
    Inventor: Fadi Ajam
  • Patent number: D984937
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: May 2, 2023
    Inventor: Emiel Burki
  • Patent number: D984938
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: May 2, 2023
    Inventor: Emiel Burki