Abstract: A projection exposure apparatus includes a catadioptric projection objective, an illumination system, a stage, and a control unit. The catadioptric projection objective includes multiple objective parts, and one or more active manipulators coupled to one or more optical elements of the projection objective. The control unit is programmed to cause the one or more active manipulators to act on one or more corresponding optical elements while the stage scans a wafer with respect to an image field to reduce errors in the image at the image field.

Abstract: An exposure apparatus and method exposes a substrate via a projection optical system and a liquid supplied to an immersion region below the projection optical system. First and second holding members move below the projection optical system and each can hold a substrate in a hole of an upper surface thereof. A controller is arranged to control a drive system such that, when one holding member of the first and second holding members is arranged opposite to the projection optical system, the other holding member of the first and second holding members comes close to the one holding member, and such that the close first and second holding members are moved relative to a liquid immersion member so that the other holding member is arranged opposite to the projection optical system in place of the one holding member while the immersion region is substantially maintained below the projection optical system.

Abstract: A metrology target formed by a lithographic process on a substrate includes a plurality of component gratings. Images of the target are formed using +1 and ?1 orders of radiation diffracted by the component gratings. Regions of interest (ROIs) in the detected image are identified corresponding the component gratings. Intensity values within each ROI are processed and compared between images, to obtain a measurement of asymmetry and hence overlay error. Separation zones are formed between the component gratings and design so as to provide dark regions in the image. In an embodiment, the ROIs are selected with their boundaries falling within the image regions corresponding to the separation zones. By this measure, the asymmetry measurement is made more tolerant of variations in the position of the ROI. The dark regions also assist in recognition of the target in the images.

Abstract: A liquid immersion member forms a liquid immersion space on an object movable below an optical member so that a light path of exposure light emitted from an emission surface of the optical member is filled with liquid. The liquid immersion member includes a first member which is disposed in at least a portion of a periphery of the optical member, a second member which is movable relative to the first member and which includes a recovery port that recovers at least a portion of the liquid in the liquid immersion space, and a gas supply opening facing a gap between the first member and the second member, from which gas is supplied to the gap.

Abstract: A collector transfers EUV illumination light from a radiation source region to illumination optics. Imaging optics of the collector image the radiation source region in a downstream focal region. The imaging optics are embodied so that the radiation source is imaged with at least one first imaging scale by the EUV illumination light, which is emitted with beam angles <20° between the radiation source region and the downstream focal region. The imaging optics are also embodied so that the radiation source is imaged with at least one second imaging scale by the illumination light emitted with beam angles >70°. The two imaging scales for the beam angles <20° on the one hand and >70° on the other hand differ by no more than a factor of 2.5. In addition to a corresponding collector, an illumination system contains field facets transfer optics.

Abstract: A system for cleaning or suppressing contamination or oxidation in a EUV optical setting includes an illumination source, a detector, a first set of optical elements to direct light from the illumination source to a specimen and a second set of optical elements to receive illumination from the specimen and direct the illumination to the detector. The system also includes one or more vacuum chambers for containing the first and second set of optical elements and containing a selected purge gas ionizable by the light emitted by the illumination source. The first or second set of optical elements includes an electrically biased optical element having at least one electrically biased surface. The electrically biased optical element has a bias configuration suitable to attract one or more ionic species of the selected purge gas to the electrically biased surface in order to clean contaminants from the electrically biased surface.

Abstract: An optical imaging apparatus includes an optical element support sub-structure and an auxiliary support sub-structure. The optical element support sub-structure is configured to support an optical element and has a first temporary support interface arrangement. The optical element is configured to form part of a group of optical elements of the optical imaging apparatus configured to transfer, in an exposure process using exposure light, an image of a pattern of a mask onto a substrate. The auxiliary support sub-structure is configured to support an auxiliary component and has a second temporary support interface arrangement. The auxiliary component is configured to execute, during the exposure process, an auxiliary function of the exposure process other than transferring the image of the pattern onto the substrate.

Abstract: In a lithographic apparatus, a localized area of the substrate surface under a projection system is immersed in liquid. The height of a liquid supply system above the surface of the substrate can be varied using actuators. A control system uses feedforward or feedback control with input of the surface height of the substrate to maintain the liquid supply system at a predetermined height above the surface of the substrate.

Abstract: The invention relates to a method for compensating at least one defect of an optical system which includes introducing an arrangement of local persistent modifications in at least one optical element of the optical system, which does not have pattern elements on one of its optical surfaces, so that the at least one defect is at least partially compensated.

Abstract: According to measurement results of an encoder system, a stage driving system that is a magnetic levitation type planar motor is controlled to drive and control a wafer stage, and in the case where an abnormality of the driving and control of the wafer stage has been detected, the stage driving system is controlled to apply a thrust in a vertical direction to the wafer stage. With this operation, the pitching of the wafer stage can be avoided, which makes it possible to prevent damage of the wafer stage and structures placed immediately above the stage upper surface.

Abstract: An exposure apparatus may include a laser light source capable of varying a wavelength of a laser beam that is emitted from the laser light source, a mask on which a pattern is formed, the pattern being configured to generate diffracted light by being irradiated with the laser beam, and a controller configured to control, in accordance with a distance between the mask and a substrate, the wavelength of the laser beam that is emitted from the laser light source, wherein the mask is irradiated with the laser beam emitted from the laser light source to perform proximity exposure on a surface of the substrate.

Abstract: A lithographic system includes an immersion type lithographic apparatus, which includes a support constructed and arranged to support a substrate, a projection system constructed and arranged to project a patterned beam of radiation onto a target portion of the substrate, a liquid confinement structure configured to at least partially fill a space between the projection system and at least one of the substrate and support with an immersion liquid, a liquid supply system arranged to provide the immersion liquid to the liquid confinement structure, and a cleaning liquid supply system arranged to provide a cleaning liquid to a surface of the lithographic apparatus that comes into contact with the immersion liquid. The system includes a switch to provide the cleaning liquid directly to the liquid confinement structure and to provide the immersion liquid indirectly to the liquid confinement structure via a liquid purification system.

Abstract: An exposure apparatus includes a projection system having a final element that projects exposure light to an upper surface of a substrate through liquid between the final element and the substrate. A liquid confinement member has a recovery outlet, via which the liquid is removed along with gas, arranged such that the upper surface of the substrate faces the recovery outlet, and the recovery outlet surrounds a path of the exposure light. The liquid confinement member confines the liquid to an area smaller than an area of the upper surface of the substrate by removing the liquid via the recovery outlet from a gap between the liquid confinement member and the upper surface of the substrate. An anti-vibration system is disposed such that transmission of vibrations between the liquid confinement member and the projection system is limited.

Abstract: A fine-motion module for use in a wafer stage of a photolithography tool includes: a base (201); a fine-motion plate (210); a plurality of vertical motors (203), fixed between the base and the fine-motion plate; a plurality of gravity compensators (202), each having one end fixed on the base and the other end configured to support the fine-motion plate; a plurality of absolute-position sensors (205, 211), configured to measure an absolute position of the fine-motion plate and to adjust pressures in the gravity compensators based on the obtained absolute-position measurements such that the absolute position of the fine-motion plate is changed to a predetermined initial vertical position; and a plurality of relative-position sensors (204, 207), configured to measure a relative position of the fine-motion plate to the base and to control the fine-motion plate based on the obtained relative-position measurements, thereby moving the fine-motion plate to a relative zero position.

Abstract: Embodiments of the present disclosure provide a mask device, an exposure apparatus and an exposure method, which enable a reduction in the possibility that the mask is scratched during exposure so as to protect the mask, and in turn a reduction in production cost of the semiconductor devices. The mask device comprises a mask carrier, a mask disposed on a lower surface of the mask carrier, and at least one protection unit provided on the mask carrier, wherein a lower end of the at least one protection unit is arranged to be lower than the lower surface of the mask during exposure. The mask device is applicable in exposure of a substrate to be exposed.

Abstract: A lithographic apparatus is disclosed including a liquid supply system configured to at least partly fill a space between the projection system and the substrate with a liquid, an outlet configured to remove a mixture of liquid and gas passing through a gap between a liquid confinement structure of the liquid supply system and the substrate, and an evacuation system configured to draw the mixture through the outlet, the evacuation system having a separator tank arranged to separate liquid from gas in the mixture and a separator tank pressure controller, connected to a non-liquid-filled region of the separator tank, configured to maintain a stable pressure within the non-liquid-filled region.

Abstract: A maskless exposure device includes an exposure head including a digital micro-mirror device and an exposure source, the digital micro-mirror device being configured to reflect a source beam outputted from the exposure source to a substrate and a system controller configured to control the digital micro-mirror device by using a graphic data system file. The graphic data system file includes data regarding patterns to be formed on the substrate. A pattern extending in a direction parallel to a scan direction of the exposure head includes a first pattern portion having a first width that is greater than a target width and a second pattern portion alternately disposed with the first pattern portion and having a second width that is less than the target width.

Abstract: A lithographic projection apparatus, including a liquid supply system configured to supply a liquid to a space between a projection system and a movable table; a member to at least partly confine liquid in the space, the member including a recovery opening facing toward the movable table, the recovery opening including a first porous structure configured to recover fluid; and a chamber configured to receive recovered fluid and to separate liquid from gas in the recovered fluid, the chamber including a second porous structure.

Abstract: A method for determining an offset between a center of a substrate and a center of a depression in a chuck includes providing a test substrate to the depression, the test substrate having a dimension smaller than a dimension of the depression, measuring a position of an alignment mark of the test substrate while in the depression, and determining the offset between the center of the substrate and the center of the depression from the position of the alignment mark.

Abstract: An immersion lithography apparatus comprises a temperature controller configured to adjust a temperature of a projection system, a substrate and a liquid towards a common target temperature. Controlling the temperature of these elements and reducing temperature gradients may improve imaging consistency and general lithographic performance. Measures to control the temperature may include controlling the immersion liquid flow rate and liquid temperature, for example, via a feedback circuit.