Abstract: A telecommunications rack system includes a first element defining splice locations and a second element defining adapters for receiving connectorized cabling, wherein the first and second elements are positioned on the same rack. A first end of a fiber optic pigtail is spliced at and extends from the splice locations of the first element. A second end is connectorized with a fiber optic connector that is coupled to an adapter of the second element. The pigtail extends between the first and second elements. A cable manager is removably mounted at the side of at least one of the first and second elements. The cable manager defines a U-shaped passage including ends that open toward one end of the elements and a closed end opposite the open ends.

Abstract: An integrated circuit package and a method of forming the same are provided. The integrated circuit package includes a photonic integrated circuit die. The photonic integrated circuit die includes an optical coupler. The integrated circuit package further includes an encapsulant encapsulating the photonic integrated circuit die, a first redistribution structure over the photonic integrated circuit die and the encapsulant, and an opening extending through the first redistribution structure and exposing the optical coupler.

Abstract: An optical ferrule includes an optical coupling member with a light redirecting element that redirects input light from a waveguide toward an output window. The optical coupling member has a mating surface configured to slidably mate with a mating optical coupling member along a longitudinal axis of the optical ferrule. The optical ferrule also includes at least one stacking member along a longitudinal edge of the optical coupling member. The stacking member has a distal end extending beyond one of the mating surface and a top surface opposed to the mating surface. The stacking member also has a contact surface opposed to the distal end. The contact surface is configured to rotatably interface with a corresponding distal end of a of an adjacently stacked optical ferrule.

Abstract: A quantum communication system that includes a multiphoton entanglement generator, a plurality of photon detector units, and a plurality of optical fiber links. The plurality of photon detector units include a first photon detector unit and a second photon detector unit. The multiphoton entanglement generator is structurally configured to output more than two entangled photons. The plurality of optical fiber links comprise a first optical fiber link optically coupled to the multiphoton entanglement generator and disposed between the multiphoton entanglement generator and the first photon detector unit. The plurality of optical fiber links comprise a second optical fiber link optically coupled to the multiphoton entanglement generator and disposed between the multiphoton entanglement generator and the second photon detector unit. Further, at least one of the plurality of optical fiber links has a core, a cladding, and a scattering region having a plurality of scattering structures.

Abstract: Optical modulators are described having a Mach-Zehnder interferometer and a pair of RF electrodes interfaced with the Mach-Zehnder interferometer in which the Mach-Zehnder interferometer comprises optical waveguides formed from semiconductor material. The optical modulator also comprises a ground plane spaced away in a distinct plane from transmission line electrodes formed from the association of the pair of RF electrodes interfaced with the Mach-Zehnder interferometer. The ground plane can be associated with a submount in which an optical chip comprising the Mach-Zehnder interferometer and the pair of RF electrodes is mounted on the submount with the two semiconductor optical waveguides are oriented toward the submount. Methods for forming the modulators are described.

Abstract: A fiber splice cassette includes a main chassis, a removable cover, splice sleeve holders, and four cable clamp boots. The main chassis forms a cavity having a plurality of cable organizing tabs for cable management. Splice sleeve holders are located in the cavity of the main chassis, each of the splice sleeve holders being selectively removable from a corresponding splice sleeve holder nest and being configured for specific splicing capabilities while maintaining the structural strength of the holders. The splice sleeve holder nests may be selectively and removably attached to an interior surface of the fiber cable enclosure via a variety of means to allow the splice sleeve holder nests to be easily rotated, relocated, or accessed for maintenance.

Abstract: Structures for a wavelength-division multiplexing filter and methods of forming a structure for a wavelength-division multiplexing filter. A waveguide core of the wavelength-division multiplexing filter includes a first bend having a first curvature and a second bend having a second curvature different than the first curvature. The structure further includes a waveguide core region having a first end surface, a second end surface, and a bend arranged between the first and second end surfaces. The bend is positioned over the first bend of the waveguide core in an overlapping relationship.

Abstract: Aspects of the present disclosure are directed to process flow to fabricate a waveguide structure with a silicon nitride core having atomic-level smooth sidewalls achieved by wet etching instead of the conventional dry etching process.

Abstract: An optical connection identification assembly includes first and second connectors for conveying optical signals within and away from the optical connection identification assembly, first and second optical filters configured for conveying optical signals to and from the respective first and second connectors and between each other, and first and second photodiodes. The first photodiode is configured for receiving optical signals from the first optical filter to confirm the optical connection identification assembly is receiving optical signals. The second photodiode is configured for receiving optical signals from the second optical filter to confirm the optical connection identification assembly is receiving optical signals. The first and the second connectors are on opposite sides of each of the first and the second optical filters and each of the first and the second photodiodes.

Abstract: A fiber management tray (10) is disclosed. The fiber management tray (10) can have a body (12) including a bottom wall (14) with side walls (16) extending outwardly from the bottom wall (14). The fiber management tray (10) can include a termination region (18) that has a first side (24) and a second side (26). The termination region (18) includes a termination panel (13) that holds connectors (20). The fiber management tray (10) can include a hinge area (56) for mounting said tray (10) to a tray tower (58) and a storage basket (32) located between the termination region (18) and the hinge area (56). The storage basket (32) can include a first pocket (44) that communicates with the second side (26) of the termination region (18) and an opposite second pocket (48) that communicates with the first side (24) of the termination region (18). The fiber management tray (10) can define at least one fiber routing path on each of the first and second pockets (44, 48) of the storage basket (32).

Abstract: A structure of a silicon photonics device for LIDAR includes a first insulating structure and a second insulating structure disposed above one or more etched silicon structures overlying a substrate member. A metal layer is disposed above the first insulating structure without a prior deposition of a diffusion barrier and adhesion layer. A thin insulating structure is disposed above the second insulating structure. A first configuration of the metal layer, the first insulating structure and the one or more etched silicon structures forms a free-space coupler. A second configuration of the thin insulating structure above the second insulating structure forms an edge coupler.

Abstract: A sliding tray is configured to support one or more optical communications modules and includes a body portion having one or more mounting locations for the one or more optical communications modules. A trough projects from the body portion and is configured to support optical fibers connected to the one or more optical communications modules. A cover is pivotably connected to the tray for selectively covering the trough. A front wall of the cover may include a labeling surface, with a removable lens covering the labeling surface. A stop to limit the sliding direction of said sliding tray in the rearward direction may also be provided.

Abstract: An optical fiber system exploits a principle of topological confinement for guided higher-order modes, in contrast to more conventional total-internal-reflection (TIR) confinement. The optical fiber has a geometry and index profile defining a cutoff wavelength for a predetermined L-mode of optical signal propagation in the optical fiber, where L is azimuthal mode index. An optical source subsystem is coupled to the optical fiber to establish an optical signal propagating in the optical fiber, wherein the optical signal has the predetermined L-mode and a wavelength being either (1) at least 15% above the cutoff wavelength such that the optical beam propagates as a topologically confined mode, or (2) sufficiently above the cutoff wavelength that, based on the L-mode of the optical beam, the optical beam propagates as a topologically confined mode having propagation loss less than 3 dB/meter.

Abstract: An optical modulator has an optical modulation element including optical waveguides and a housing that accommodates the optical modulation element. The housing has a bottom surface wall having a quadrilateral shape in a plan view, first and second long side walls that are connected to two opposite edges of the bottom surface wall, and first and second short side walls, shorter than the long side walls, and connected to two other opposite edges of the bottom surface wall. The optical modulation element is accommodated in a space surrounded by the bottom surface wall and the side walls. The second long side wall has a wall thickness that is equal to or larger than that of the first long side wall, and at least one of the first and second short side walls has a wall thickness that is thinner than that of the first long side wall.

Abstract: A device providing efficient transformation between an initial optical mode and a second optical mode includes first, second and third elements fabricated on a common substrate. The first element includes first and second active sub-layers supporting initial and final optical modes with efficient mode transformation therebetween. The second element includes a passive waveguide structure supporting a second optical mode. The third element, at least partly butt-coupled to the first element, includes an intermediate waveguide structure supporting an intermediate optical mode. If the final optical mode differs from the second optical mode by more than a predetermined amount, a tapered waveguide structure in the second or third elements facilitates efficient transformation between the intermediate optical mode and the second optical mode. Precise alignment of sub-elements formed in one of the elements, relative to sub-elements formed in another one of the elements, is defined using lithographic alignment marks.

Abstract: Structures for an optical power modulator and methods of fabricating a structure for an optical power modulator. A waveguide core includes a longitudinal axis, a first section, and a second section spaced from the first section along the longitudinal axis. An active layer includes a portion positioned along the longitudinal axis between the first section and the second section of the waveguide core. The active layer contains a material configured to have a first state with a first refractive index in response to an applied stimulus and a second state with a second refractive index different from the first refractive index.

Abstract: A laser beam phase-modulation device, a laser beam steering device, and a laser beam steering system including the same are provided. The laser beam phase-modulation device includes a refractive index conversion layer having a refractive index that is changed according to an electrical signal applied thereto, the refractive index conversion layer including an upper surface on which the laser beam is incident and a lower surface opposite the upper surface, at least one antenna pattern embedded in the upper surface of the refractive index conversion layer, and a metal mirror layer provided under the lower surface of the refractive index conversion layer and configured to reflect the laser beam.

Abstract: An apparatus can include an optical transceiver having a body with a first end at which a circuitry interface is located to facilitate transfer of data between a network appliance and the optical transceiver. The apparatus further includes a four-cable interface at a second end of the body. The four-cable interface releasably receives four independently releasable connectors for transfer of optical signals between the optical transceiver and respective ferrules of the four independently releasable connectors. In some examples, a carrier may be provided that is releasably connected with the four-cable interface and that includes four sockets for respectively independently receiving the four independently receivable connectors so as to facilitate collective insertion and removal of the four independently releasable connectors relative to the four-cable interface.

Abstract: A wafer-level optoelectronic packaging method includes fabricating a pre-singulated wafer. The pre-singulated wafer has a plurality of sub-mounts. A first sub-mount of the plurality of sub-mounts includes an optical waveguide formed on a substrate, a multi-layered sub-mount boundary wall that is formed on the optical waveguide, and a v-groove that is external to the sub-mount boundary wall. A plurality of optical dies are attached to the corresponding plurality of sub-mounts, such that each optical die is aligned to the optical waveguide of the corresponding sub-mount. A cap-wafer including a plurality of caps is attached to the pre-singulated wafer to obtain an encapsulated pre-singulated wafer. The encapsulated pre-singulated wafer is diced to obtain a plurality of optoelectronic packages. The optical waveguide of each optoelectronic package serves as an interconnection conduit between the corresponding optical die and an optical fiber placed in the corresponding v-groove.

Abstract: Aspects of the present disclosure are directed to structural modifications introduced in a waveguide structure in order to more tightly pack adjacent waveguide turns in an optical gyroscope fabricated on a planar silicon platform as a photonic integrated circuit. Increasing number of turns of the gyroscope coil increases total waveguide length as well as enclosed area of the gyroscope loop, which translates to increased sensitivity to rotational measurement.