Patents Examined by Hung Q Lam
  • Patent number: 10935733
    Abstract: An end connector for a jacketed cable includes a rear body having a cylindrical retention portion with an outer surface that includes a plurality of recessed annular grooves. The cylindrical crimp comprises a plurality of thicker annular regions adjacent to and separated by a plurality of thinner annular regions. Each thicker annular region of the cylindrical crimp is axially aligned with a corresponding recessed annular groove on the outer surface of the cylindrical retention portion of the rear body, and such alignment is maintained during crimping to trap strength members of the jacketed cable.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: March 2, 2021
    Assignee: Intri-Plex Technologies Inc.
    Inventors: Paul Wesley Smith, Ryan John Schmidt
  • Patent number: 10921619
    Abstract: Embodiments provide for an optical modulator that includes a first silicon region, a polycrystalline silicon region; a gate oxide region joining the first silicon region to a first side of the polycrystalline region; and a second silicon region formed on a second side of the polycrystalline silicon region opposite to the first side, thereby defining an active region of an optical modulator between the first silicon region, the polycrystalline region, the gate oxide region, and the second silicon region. The polycrystalline silicon region may be between 0 and 60 nanometers thick, and may be formed or patterned to the desired thickness. The second silicon region may be epitaxially grown from the polycrystalline silicon region and patterned into a desired cross sectional shape separately from or in combination with the polycrystalline silicon region.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: February 16, 2021
    Assignee: Cisco Technology, Inc.
    Inventors: Alexey V. Vert, Mark A. Webster
  • Patent number: 10914898
    Abstract: A photonic chip includes a connecting means, a substrate, and a waveguide layer. The photonic integrated waveguide and the optical fiber each have a front end portion. The connecting means includes a groove configured to receive the front end portion of the optical fiber. The groove is essentially U-shaped in its cross section, and the groove has a bottom surface and two inner side surfaces. A least one of both inner side surfaces of the U-shaped groove has a coating of an elastic material configured to hold in place the optical fiber after it is inserted into the groove. The invention further relates to an optical device which includes a photonic chip and an optical fiber, as well as a method or production of such a photonic chip.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: February 9, 2021
    Assignee: ADVA Optical Networking SE
    Inventor: Benjamin Wohlfeil
  • Patent number: 10914896
    Abstract: An elementary photonic interconnect switch is integrated into an optoelectronic chip and includes four simple photonic interconnect switches. Each simple photonic interconnect switch has two optical waveguides that cross and are linked by a ring resonator having one ring. A basic photonic interconnect switch, a complex photonic interconnect switch and/or a photonic interconnect network are integrated into an optoelectronic chip and including at least two elementary photonic interconnect switches.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: February 9, 2021
    Assignee: STMicroelectronics (Crolles 2) SAS
    Inventors: Nicolas Michit, Patrick Le Maitre
  • Patent number: 10908372
    Abstract: Embodiments described herein improve the performance of active sensing systems, such as LiDAR systems, and enable detection of objects closer to the system's sensor. Illustrative embodiments enable spatial separation of the excitation and return signal on a photonic integrated chip (“PIC”) such that separate waveguides can be used for the excitation and return signals, enabling isolation of the system's detectors from the excitation source without the use of a splitter or circulator. For example, preferred embodiments avoid loss due to the use of splitters and the need for gating the detector, and are desirably compatible with chip-scale systems. Moreover, illustrative embodiments enable keeping the excitation and detection paths on the same PIC (e.g. in an interleaved configuration), which helps keep the system more compact and avoid issues introduced by parallax.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: February 2, 2021
    Assignee: The Charles Stark Draper Laboratory, Inc.
    Inventors: Michael G. Moebius, Steven J. Spector
  • Patent number: 10901157
    Abstract: The present invention discloses a type of optical fibre connector, comprising: an external shell; an internal shell, installed within said external shell; an inserted core component, contained within said internal shell and comprising an inserted core and a length of optical fibre pre-installed within said inserted core; and a spring, contained within said internal shell and located behind said inserted core, and being for exerting a pre-set axial force on said inserted core. Said internal shell includes a front part and a rear part; said rear part is assembled on said front part. Additionally, said spring is compressed between said rear part and said inserted core. In the present invention, the rear part can act as a retainer for the compressed spring and can also be for securing the Kevlar fibre extension tube of the optical cable.
    Type: Grant
    Filed: December 31, 2018
    Date of Patent: January 26, 2021
    Assignee: CommScope Telecommunications (Shanghai) Co., Ltd.
    Inventors: Liming Wang, Guanpeng Hu, Youfeng Lu
  • Patent number: 10884201
    Abstract: The present disclosure is generally directed to an on-board ROSA arrangement where a fiber receptacle element, optical components such as optical de-multiplexer (e.g., an arrayed waveguide grating (AWG)), turning mirror, photodiodes and light receiving chip are mounted to a common substrate. The fiber receptacle element includes a body that defines a slot to at least partially receive an end of the substrate and mount thereto. The body of the fiber receptacle further includes an aperture that extends through the body to receive an optical fiber and/or associated connector and align the same with ROSA components mounted on a surface of the substrate. The fiber receptacle body may be solid, e.g., formed from a single, monolithic piece of material, and may be manufactured from metal, plastic or other suitably rigid material.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: January 5, 2021
    Assignee: Applied Optoelectronics, Inc.
    Inventors: Kevin Liu, Kai-Sheng Lin, Hao-Chiang Cheng
  • Patent number: 10877221
    Abstract: A fiber optic connector comprises an outer housing, an inner housing installed in the outer housing, a fiber optic ferrule accommodated in the inner housing, an optical cable inserted into the inner housing and connected to the fiber optic ferrule, an elastic boot that is wrapped around both a connecting portion of the fiber optic ferrule connecting to the optical cable and a portion of the optical cable adjacent to the connecting portion, and a sealing structure. The sealing structure is disposed between a rear end portion of the outer housing and the elastic boot to provide a seal between the outer housing and the elastic boot.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: December 29, 2020
    Assignee: Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Haibo Zhang, Zhigang Song, Jinqiang Zhang, Zhiyun Zhong
  • Patent number: 10859765
    Abstract: Provided are an optical coupling device and a method for manufacturing the same. The optical coupling device includes a first waveguide including a first forward tapered part, a second waveguide disposed on the first waveguide and including a first reverse tapered part in a direction opposite to the first forward tapered part, and an interlayer waveguide disposed between the first and second waveguides and having a thickness corresponding to a distance between the first forward tapered part and the first reverse tapered part.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: December 8, 2020
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jaegyu Park, Gyungock Kim, Jiho Joo
  • Patent number: 10838194
    Abstract: An optical transmission module includes: an optical fiber a cross section of which has a circular shape and an end surface of which is an inclined surface; and an optical element part including an optical element, wherein a cutout surface extending in an optical axis direction is formed in an outer circumference of an end portion of the optical fiber, and the angle of the inclined surface with respect to the main surface of the optical element is defined by the cutout surface, such that light guided through the optical fiber is optically coupled to the optical element.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: November 17, 2020
    Assignee: OLYMPUS CORPORATION
    Inventors: Keiichi Kobayashi, Youhei Sakai
  • Patent number: 10841012
    Abstract: An optical reflective multiplexer chip, a laser transmitter chip, and an optical transmitter are disclosed. The optical transmitter includes the laser transmitter chip, an optical fiber, and the optical reflective multiplexer chip. The laser transmitter chip includes a bi-directional light emitting laser, a polarization splitter-rotator, and a first external port. The optical reflective multiplexer chip includes a combiner, a second external port, N third external ports, N microring resonant cavities, N polarization splitter-rotators, N first branch waveguides, and N second branch waveguides. The combiner is connected to the first branch waveguide, the second branch waveguide, and the second external port. The first external port is connected to the third external port by using the optical fiber.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: November 17, 2020
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Tao Wang, Ning Liu
  • Patent number: 10830959
    Abstract: A fiber optic cable slack management module includes a base defining a first cable management spool, an outer face of which is configured to contact cables when cables are pulled away from the base and a second cable management spool, within which the first cable management spool is located. An inner face of the second cable management spool is configured to contact cables when cables are in a relaxed, non-pulled state. The fiber optic cable slack management module defines a cable exit adjacent the first cable management spool and defined at least partially by the inner face of the second cable management spool, the cable exit defined by a channel positioned between the first and second cable management spools.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: November 10, 2020
    Assignee: CommScope Technologies LLC
    Inventors: Paula Rudenick, Brent Campbell, James J. Solheid, Duane R. Sand
  • Patent number: 10830955
    Abstract: A photonic interconnect switch is formed by first and second linear optical waveguides that cross to form an intersection. First and second redirecting photonic ring resonators are coupled together in an intermediate optical coupling zone and are controllable with an electrical signal. The first ring resonator is coupled to the first optical waveguide in a first optical coupling zone. The second ring resonator is coupled to the second optical waveguide in a second optical coupling zone.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: November 10, 2020
    Assignee: STMicroelectronics (Crolles 2) SAS
    Inventors: Nicolas Michit, Patrick Le Maitre
  • Patent number: 10809478
    Abstract: A fiber distribution assembly includes an enclosure defining an interior cavity. The enclosure includes an enclosure base defining a first plurality of openings, and a tray rotatably coupled to the enclosure base within the interior cavity. The tray defines a second plurality of spaced openings. The fiber distribution assembly also includes a plurality of cable management or fiber optic components each configured to be releasably coupled to the enclosure base and the tray using the first and second pluralities of openings.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: October 20, 2020
    Assignee: OPTERNA AM, INC.
    Inventors: Subin Panakkal Sadasivan, Derek Furtado, Icy Kollielil Varghese, Ravindra K. Vora
  • Patent number: 10809466
    Abstract: Switch sub-chassis systems and methods for rack-scale servers are disclosed. A switch sub-chassis is arranged for modular installation in an enclosure and includes structural support features that allow multiple hot-serviceable line-cards and an integrated high-density optical fiber connectivity within the sub-chassis. Various features of the switch sub-chassis and associated line-cards allow liquid-electro-optical blindmate of the line-cards so that the line-cards are serviceable, allow high-density and complex fiber shuffle assemblies support, and facilitate ease of installation and/or servicing of fiber assemblies.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: October 20, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Kevin Leigh, Everett Salinas, John Franz
  • Patent number: 10795100
    Abstract: Examples relate to a removable transceiver module that comprises a base frame installable in a rail-pair receptacle that surrounds a first connector in a system board. It further comprises a module base board, a second connector attached thereto and a lever handle pivotally attached to the base frame and coupled to the module base board. The transceiver module is installed in the rail-pair receptacle in response to a lateral movement of the base frame to the receptacle to align the first and second connectors. The lever handle is movable between a closed position to couple the second connector to the first connector and an open position to install the transceiver module into the receptacle. This lever handle determines a vertical move of the module base board between the closed position and the open position.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: October 6, 2020
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Kevin B. Leigh, Sunil Rao Ganta Papa Rao Bala, Arlen L Roesner
  • Patent number: 10788729
    Abstract: A laser beam phase-modulation device, a laser beam steering device, and a laser beam steering system including the same are provided. The laser beam phase-modulation device includes a refractive index conversion layer having a refractive index that is changed according to an electrical signal applied thereto, the refractive index conversion layer including an upper surface on which the laser beam is incident and a lower surface opposite the upper surface, at least one antenna pattern embedded in the upper surface of the refractive index conversion layer, and a metal mirror layer provided under the lower surface of the refractive index conversion layer and configured to reflect the laser beam.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: September 29, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sunil Kim, Changgyun Shin, Byounglyong Choi
  • Patent number: 10782474
    Abstract: Detachable optical connectors including a connector support for optical chips and methods of their fabrication are disclosed. In one embodiment, an optical assembly includes an optical chip including a surface, an edge extending from the surface, and at least one chip waveguide proximate the surface and terminating at the edge. The optical assembly further includes a waveguide support having a chip coupling surface, and at least one waveguide disposed within the waveguide support and terminating at the chip coupling surface, wherein the chip coupling surface is coupled to the edge of the optical chip such that the at least one waveguide within the waveguide support is optically coupled to the at least one chip waveguide of the optical chip. The optical assembly further includes a connector support having a first portion coupled to the optical chip, and a second portion coupled to the waveguide support.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: September 22, 2020
    Assignee: Corning Research & Development Corporation
    Inventors: Lars Martin Otfried Brusberg, Douglas Llewellyn Butler, Michael de Jong, Alan Frank Evans, Andreas Matiss, James Scott Sutherland
  • Patent number: 10775569
    Abstract: An optical connector comprises a first optical waveguide including a plurality of cores each extending along a first direction, the first optical waveguide having a first end face, wherein the cores are arranged on the first end face at positions except a position of a central axis of the first optical waveguide, and a first lens having a second end face and a third end face in the first direction, the first lens having an optical axis extending along the first direction. The first optical waveguide and the first lens are arranged so that the central axis of the first optical waveguide coincides with the optical axis of the first lens. The second end face is positioned facing the first end face, and the third end face extends along a plane perpendicular to an optical axis of the first optical waveguide.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: September 15, 2020
    Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Tetsu Morishima, Osamu Shimakawa
  • Patent number: 10768433
    Abstract: An apparatus includes a laser system that includes a first fiber having an output end and situated to propagate a first laser beam with a first beam parameter product (bpp) and a second fiber having an input end spliced to the output end of the first fiber at a fiber splice so as to receive the first laser beam and to form a second laser beam having a second bpp that is greater than the first bpp, wherein the output end of the first fiber and the input end of the second fiber are spliced at a tilt angle so as to increase the first bpp to the second bpp.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: September 8, 2020
    Assignee: nLIGHT, Inc.
    Inventors: David Logan, Ryan Hawke, David R. Balsley, Ron Stevens