Patents Examined by Hung V. Ngo
  • Patent number: 11147152
    Abstract: The present disclosure provides a glass assembly, a manufacturing method thereof and a glass window. The glass assembly includes: a first glass plate and a second glass plate disposed opposite to each other, wherein inert gas is filled between the first glass plate and the second glass plate; a first electrode and a second electrode disposed between the first glass plate and the second glass plate, the inert gas is transformed into plasma in the case where an electric field is generated using the first electrode and the second electrode.
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: October 12, 2021
    Assignees: Beijing BOE Optoelectronics Technology Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Tienlun Ting, Xiangzhong Kong, Lei Wang, Ken Wen, Tuo Sun
  • Patent number: 11129569
    Abstract: Techniques for shielding wearable surface electromyography (sEMG) devices are described. According to some aspects, an sEMG device may comprise amplification circuitry comprising at least a first differential amplifier and at least two sEMG electrodes electrically connected to the amplification circuitry. The device may further comprise at least one auxiliary conductor not electrically connected to the amplification circuitry, wherein the at least one auxiliary conductor is configured to be electrically coupled to a wearer of the wearable device, and an electromagnetic shield surrounding the wearable device at least in part and electrically connected to the at least one auxiliary conductor.
    Type: Grant
    Filed: June 2, 2020
    Date of Patent: September 28, 2021
    Assignee: Facebook Technologies, LLC
    Inventors: Ning Guo, Alexandre Barachant, Jonathan Reid
  • Patent number: 11119543
    Abstract: A hybrid cooling server assembly can have a printed circuit board (PCB) with a processor socket disposed thereon and a hybrid cooling plate can be operably coupled with the processor socket. A radiator can having a working fluid received therein and be in fluidic communication with the radiator and the hybrid cooling plate by one or more tubular members. One or more cooling fans can be proximal to the radiator. The working fluid can be operable to receive heat from the cooling plate and reject heat at the radiator and the one or more cooling fans can be operable to produce an airflow across the hybrid cooling plate, thereby allowing the hybrid cooling plate transfer thermal energy to the airflow.
    Type: Grant
    Filed: May 11, 2020
    Date of Patent: September 14, 2021
    Assignee: Cisco Technology, Inc.
    Inventors: Anant Thakar, Rakesh Bhatia
  • Patent number: 11118393
    Abstract: Lightweight, glidable shielded components (e.g. doors) may be used in conjunction with accredited enclosures to provide electromagnetic, acoustic and CBR protection.
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: September 14, 2021
    Assignee: Intech Defense, LLC
    Inventor: Marc Cordes
  • Patent number: 11116092
    Abstract: An electronic housing assembly includes: a plurality of isolated mounting legs each with a conductive pin and an isolator sleeve; a bottom ring, including a ring body, a plurality of outward protruding ring portions with a central aperture; a bottom mounting assembly, including a bottom plate, and a plurality of inner walls; a top cover, including a top plate and an outer peripheral wall; such that the top cover can be pressed down onto the inner walls of the bottom mounting assembly; with an electronic member, such as an isolator/circulator member, mounted inside the electronic housing assembly.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: September 7, 2021
    Assignee: JQL Technologies Corporation
    Inventor: Jiewen Zhu
  • Patent number: 11116099
    Abstract: Provided is a riveted metal middle frame including a middle plate and a border frame riveted to the middle plate. The middle plate is made of aluminum alloy, and the periphery of the middle plate is convexly provided with convex edge. The border frame includes members connected end to end in sequence. The members are made of metal material with hardness not less than aluminum alloy, and are riveted to the periphery of the middle plate; and the inner sides of the members are respectively provided with slots for connecting the convex edge. The convex edge is riveted to the slot by press-fitting the border frame. Meanwhile, an electronic device including the above-described riveted metal middle frame is also provided. The beneficial effects are that the middle plate and the border frame are riveted together by press-fitting deformation, thereby improving production efficiency and reducing manufacturing cost.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: September 7, 2021
    Assignee: GUANGDONG EVERWIN PRECISION TECHNOLOGY CO., LTD.
    Inventors: Xiangsheng Ren, Lidong Wang, Lilei Wang, Ke Zhang, Hao Huang
  • Patent number: 11116116
    Abstract: An enclosure includes a power flow control device to attach to a high voltage transmission line, a plurality of panels formed of metal, a shorting connection provided between each pair of panels, an electrical connection from at least one panel of the plurality of panels to the high voltage transmission line, a receiving region provided on each panel for each shorting connection, and an equipotential surface for reducing electromagnetic interference from the high voltage transmission line to internal components of the power flow control device, and from the internal components of the power flow control device to the high voltage transmission line.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: September 7, 2021
    Assignee: Smart Wires Inc.
    Inventors: Haroon Inam, Ali Farahani, Govind Chavan, Arthur Kelley, Shaiq Aman-ul-haq, Amrit Iyer
  • Patent number: 11102895
    Abstract: Provided is an electrical junction box that enables suppression of entry of water even when the electrical junction box is installed in a vehicle in different orientations. Disclosed is an electrical junction box including a first case having an opening, a second case configured to cover the opening, and an accommodated component that includes a circuit assembly and is housed between the first case and the second case. The second case includes a peripheral wall formed by connecting a plurality of flat faces in a polygonal shape to cover an outer periphery of the first case adjacent to the opening. The first case includes water guard walls extending along at least two of the flat faces to cover a region not covered with the peripheral wall.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: August 24, 2021
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Toru Takahashi
  • Patent number: 11079044
    Abstract: An isolator for an aircraft fuel tank configured to separate an electrically conductive internal panel of the fuel tank from an electrically conductive pipe that passes through the panel. The isolator includes: a plurality of first attachment points for attaching the isolator to the panel, a plurality of second attachment points for attaching the isolator to the pipe, and an aperture defined by an outer wall and extending from a first side of the isolator to a second side of the isolator. The aperture is configured to receive the pipe in use, wherein the isolator is formed of a non-electrically conductive material.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: August 3, 2021
    Assignee: Airbus Operations Limited
    Inventor: Nicholas West
  • Patent number: 11083118
    Abstract: According to various aspects, exemplary embodiments are disclosed of frames for shielding assemblies including detachable or severable pickup members. Also disclosed are exemplary embodiments of shielding assemblies (e.g., board level shields, etc.) including the same.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: August 3, 2021
    Assignee: Laird Technologies, Inc.
    Inventors: Zhongliang Li, Youhong Li
  • Patent number: 11076498
    Abstract: A fixing device used with an electronic device having a base includes a housing and two pressing elements. The housing includes an accommodating space for accommodating the base. Each pressing element includes a pressing portion and a latch portion. The pressing portions protrude from opposite sides of the housing, and the latch portions protrude from a bottom of the accommodating space. The base includes two positioning structures corresponding to the latch portions. When the electronic device is in the locked state, the base is accommodated in the accommodating space, and the positioning structure and the latch portion are coupled so the electronic device is fixed in the accommodating space. When the electronic device is in the unlocked state, the pressing portions are simultaneously subjected to external opposing forces, and the positioning structure is uncoupled from the latch portion so the electronic device can be disassembled from the accommodating space.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: July 27, 2021
    Assignee: Compal Electronics, Inc.
    Inventors: Chen-Hsien Cheng, Li-Fang Chen, Ruei-Hong Hong
  • Patent number: 11076512
    Abstract: An electronic device according to various embodiments of the present disclosure may include: a printed circuit board including one face; at least one electronic component mounted on the printed circuit board; and a conductive shield can structure attached to the one face of the printed circuit board while surrounding the at least one electronic component.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: July 27, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sungyoung Lee, Changho Kim
  • Patent number: 11058038
    Abstract: Electromagnetic shields for sub-modules of electronic modules are disclosed. Electronic modules may include multiple sub-modules arranged on a substrate with an electromagnetic shield arranged to conformally cover the sub-modules as well as portions of the substrate that are uncovered by the sub-modules. Electromagnetic shields are disclosed that are configured to extend between sub-modules to form one or more divider walls. The one or more divider walls may be configured to extend below mounting surfaces of electronic components in the sub-modules to provide improved reduction of electromagnetic interference (EMI) or crosstalk between various sub-modules. Electromagnetic shields are also disclosed that form perimeter sidewalls that extend below mounting surfaces of electronic components of sub-modules to provide improved reduction of EMI from other modules or other external sources.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: July 6, 2021
    Assignee: Qorvo US, Inc.
    Inventors: Kelly M. Lear, Thomas Scott Morris, Jeffrey Miller, Jeffrey Dekosky
  • Patent number: 11056864
    Abstract: An electrical junction box includes an electronic component, a circuit assembly that has a conductive path and on which the electronic component is mounted, and a cover member for covering at least a portion of the circuit assembly, and the cover member is provided with an air valve that allows air permeation while inhibiting water from entering the circuit assembly side.
    Type: Grant
    Filed: February 7, 2019
    Date of Patent: July 6, 2021
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Yoshikazu Sasaki, Yuichi Hattori
  • Patent number: 11051397
    Abstract: A shield enclosure includes a housing with a peripheral wall that defines a cavity, and a cover removably coupleable to the housing to at least partially seal the cavity. The cavity is sized to receive a printed circuit board therein. The housing shields the printed circuit board from electromagnetic interference and noise during noise figure testing of a radiofrequency component on the printed circuit board.
    Type: Grant
    Filed: April 2, 2020
    Date of Patent: June 29, 2021
    Assignee: Skyworks Solutions, Inc.
    Inventors: Cesar Verdugo Muñoz, Jorge Luis Pineda, Edgar Antonio Martinez, Daniel Murillo, Adrian Flores Baca
  • Patent number: 11051419
    Abstract: Example implementations relate a chassis for a circuit assembly. The chassis includes a chassis body defining an access opening and a volume to house the circuit assembly including a circuit module and an input-output (IO) unit. The chassis body houses the circuit assembly such that the circuit module is enclosed within the volume defined by the chassis body and the IO unit remains accessible for cabling at the access opening. The chassis further includes an IO enclosure attached to the chassis body to seal the access opening from surrounding environment, where the IO enclosure includes a cabling port to allow the cabling to the IO unit.
    Type: Grant
    Filed: September 6, 2019
    Date of Patent: June 29, 2021
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Sunil Rao Ganta Papa Rao Bala, Joseph Allen
  • Patent number: 11032928
    Abstract: A system is provided for releaseably connecting a first device housing with a second device housing. The system includes at least three connection units, wherein each of which includes a headed bolt and a corresponding keyhole-shaped recess. The keyhole-shaped recess is configured for receiving the headed bolt such that the headed bolt can be inserted into the recess in a first section and held in the recess in a second section. At least one of the connection units includes a locking mechanism configured for locking the bolt in the second section of the recess. The locking mechanism includes a movable locking element which is movable with respect to the headed bolt and configured to hold the headed bolt in the second section of the recess in a locking position. Another configuration uses a corresponding connection arrangement includes such a system.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: June 8, 2021
    Assignee: ROHDE & SCHWARZ GMBH & CO. KG
    Inventors: Andreas Fischl, Thomas Walger
  • Patent number: 11032927
    Abstract: The present invention relates to a latch mechanism and a tenon structure thereof. The tenon structure includes a trigger portion and a fastening rail portion adapted to be respectively installed at a hollow opening and a side edge of a sliding cover plate to accordingly achieve a single-piece tenon structure. The tenon structure is connected to the sliding cover plate, moves in a second direction along with the sliding cover plate, and is capable of displacing in a first direction relative to the sliding cover plate. The tenon structure includes a front latch portion and a trigger portion exposed at the sliding cover plate, so as to achieve effects of a simple assembly structure and reduced production costs.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: June 8, 2021
    Assignee: GETAC TECHNOLOGY CORPORATION
    Inventor: Kun-Cheng Lee
  • Patent number: 11019863
    Abstract: A conductive assembly (10) includes a conductive fabric core (12) which includes at least one electrically conductive element woven with the fabric core, optionally first and second impermeable layers (14, 16) enveloping the fabric core (12), first and second spacer layers (18, 20) overlying or within the impermeable layers (14, 16) and first and second conductive shield or screen layers (22, 24) overlying the spacer layers. The shield layers are electrically coupled together in the preferred embodiment for electromagnetic shielding. The spacer layers (18, 20) provide a stable and uniform spacing between the shield or screen conductors (22, 24) and the conductive fabric core (12).
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: June 1, 2021
    Inventors: Stanley Shigezo Swallow, Asha Peta Thompson
  • Patent number: 11026357
    Abstract: In one example in accordance with the present disclosure an electro-magnetic interference (EMI) containment device is described. The EMI containment device includes a number of spring devices to maintain contact between an electronic module and an enclosure. The spring device includes a spring portion to contact an electronic module disposed in the enclosure. A guide device of the spring device controls movement of the spring portion and an alignment mechanism maintains alignment of the spring portion.
    Type: Grant
    Filed: January 11, 2016
    Date of Patent: June 1, 2021
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: James Jeffery Schulze, Earl W. Moore, Keith A. Sauer