Abstract: A grounding system, structured to ground a number of cables supported by a support assembly, includes a multi-function line assembly and a number of conductive mounting assemblies. Each conductive mounting assembly is structured to be coupled to the multi-function line and to a conductive pile.

Abstract: The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. The titanium thermal module may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages. The thermal module may also have a metal layer which may act as a shield for radiation or an antenna for radiation, or may add mechanical strength to the thermal module.

Abstract: The disclosure relates to a heat dissipation module, a display device having the same, and an assembly method thereof. Place the heat dissipation structure in between the chip of the COF (chip-on-film) and the thermal-conductive supporting component, heat generated by the chip of the COF can be absorbed by the heat dissipation structure and then be transferred to the thermal-conductive supporting component through the heat dissipation structure. As a result, the temperature of the chip is decreased, and the chip is avoided from operating at high temperature to deteriorate its performance and to result in thermal deformation or any other negative effects on the nearby components.

Abstract: Improved methods and devices for shielding electrical and electronic aircraft components and their associated cables and wires from cross-coupling and electrical and magnetic interference and dissipating excess heat from the electrical and electronic aircraft components and cables and wires. An aircraft structure formed primarily of composite materials includes an outer wall; an inner wall; and a plurality of spaced-apart dividers extending transversely from and integrally formed with the inner wall. The dividers define a series of spaced-apart channels that are each partially enclosed by adjacent pairs of the dividers. A layer of electrically conductive foil covers the dividers and the channels to create a current return network in the channels. Wires and cables may be placed in the channels between adjacent pairs of the dividers to reduce cross-coupling between the wires and cables and shield the wires and cables from electromagnetic fields.

Abstract: A system includes a shield for a low noise amplifier. The shield includes a top and one or more walls extending from the top defining a cavity. The shield further comprises at least one conducting member extending outwardly from the top and within the cavity. The shield may enclose an amplifier circuit and improve its signal-to-noise ratio.

Abstract: An information handling system housing vents air at a grid of openings formed in a wall with a member extending outward from each intersection of the grid to define air channels. Each member terminates with a polished planar surface that reflects light against a flat underlying material. Variable angles of the polished planar surface relative to the plane of the wall creates a presentation of isolated reflections against the flat background that vary based upon a viewing angle of the housing wall.

Abstract: A case of a semiconductor device has sidewall portions which surround sides of a metal substrate along the sides and a coating portion which covers the front surface of the metal substrate surrounded by the sidewall portions and which has through ring holes corresponding to fixing holes. Protrusions are formed on inner surfaces of the sidewall portions opposed to one another in plan view with the ring holes therebetween. The metal substrate is inserted in this way into an area surrounded by the sidewall portions of the case and is reliably fixed. Furthermore, alignment is performed with accuracy between each fixing hole of the metal substrate inserted in this way and its corresponding ring hole of the case.

Abstract: A casing includes a substrate, a protective layer, a plurality of conductive shielding components and a plurality of waterproof layers. The substrate has a first surface and a second surface. The protective layer encapsulates the first surface and the second surface, wherein the protective layer has a plurality of openings and a part of the first surface is exposed from the openings. The conductive shielding components contact the protective layer encapsulating the first surface, and the conductive shielding components respectively cover the openings. The waterproof layers respectively cover edges of the conductive shielding components and contact the protective layer. A manufacturing method of casing is also provided.

Abstract: An electronic assembly includes a printed circuit board (PCB) and an electromagnetic interference (EMI) shield. The PCB includes a plurality of electronic components and a plurality of electrically-conductive traces. The EMI shield is sized and shaped to form a perimeter around at least one of the plurality of electronic components on the PCB. The plurality of electrically-conductive traces cross the perimeter formed by the EMI shield. The EMI shield includes a plurality of decoupling, filtering, or matching components electrically connected between the EMI shield and the plurality of electrically-conductive traces such that the plurality of decoupling, filtering, or matching components are configured to shunt signal noise from the plurality of electrically-conductive traces. The EMI shield is electrically connected to the PCB via the plurality of decoupling, filtering, or matching components to encapsulate and electromagnetically isolate the plurality of electronic components.

Abstract: A thermally conductive composition is provided, which has a base material; and at least one of a permittivity adjusting filler having a lower permittivity than the base material and a high permeability filler having a higher permeability than the base material. The entire thermally conductive composition has a relative permeability higher than 1 and a relative permittivity of 7 or lower.

Abstract: A printed circuit board includes a first insulating layer having a cavity, a metal pattern including a first shielding pattern disposed on an inner wall of the cavity and a second shielding pattern spaced apart from the first shielding pattern and covering the first shielding pattern, an electronic device positioned in the cavity and surrounded by the first shielding pattern and the second shielding pattern, and a second insulating layer stacked on the first insulating layer and embedding the electronic device therein.

Abstract: An electric connection box includes a frame having a cylindrical outer wall, and a cover having a side wall fitted into one end in an axial direction of the outer wall. The outer wall has a plate-shaped protruded portion, and the protruded portion has a pair of side portions respectively placed at one end and the other end in a width direction. The side wall has a pair of edge portions and has a notch between the pair of edge portions. Each of the pair of edge portions has a first facing surface and a second facing surface. The first facing surface abuts on the pair of side portions in a thickness direction of the protruded portion, and the second facing surface faces the pair of side portions in the width direction and positions the cover with respect to the frame.

Abstract: A fabric coated with functional silicone rubber, the fabric being configured such that a coating layer may not be easily separated from the fabric and may be used to form a power line or a signal line. The fabric includes: a woven fabric made by weaving and including uniform pores therein; and a coating layer formed by coating a surface of the woven fabric with liquid silicone rubber in which electrically conductive particles larger than the pores of the woven fabric are dispersed and mixed, wherein the liquid silicone rubber permeates into the pores of the woven fabric by the weight thereof and is cured such that the silicone rubber is anchored to the woven fabric, and an electrically conductive layer having electrical conductivity is formed as the electrically conductive particles are caught on the surface of the woven fabric and increase in density at the surface of the woven fabric.

Abstract: A connecting system for quickly securing a hollow tube to a structure or to another hollow tube using a connector that has a housing with a tapered interior edge that operably engages a locking element positioned therein. When the tube is inserted into the locking element, the locking element holds and locks the tube in place in the connector. A guide ring may be provided within the connector to facilitate proper alignment of the tube within the connector and provide electrical continuity throughout the entire tube connecting system. One or more bearings may be provided as part of the locking element to facilitate initial tube insertion and then compression locking of the tube by the locking element. The connector can include a variety of structure engaging portions to allow the connector to be operably secured to a variety of structures such as electrical junction boxes, electrical conduits, tubes, armored cables, metal clad cables, flexible metal cables and the like.

Abstract: A spark plug having a metal shell and an insulator, wherein a stepped portion that includes a rear-end-side facing surface that retains an insulator either directly or via another member is provided at an inner periphery of a metal shell. The stepped portion includes a first convex portion that includes the rear-end-side facing surface, a second convex portion that is disposed on a front end side of the first convex portion and that is adjacent to the first convex portion, and a connection portion that connects the first convex portion and the second convex portion to each other.

Abstract: An EMP-protective composite structure that includes at least one enclosure having walls, a ceiling, at least one ingress/egress portal and a base, each of the walls, the ceiling, the ingress/egress portal and the base including at least one blast-resistant structural panel and at least one layer of an EMP barrier that provides magnetic conduction, field absorption and field reflection fully-enclosing the structural panel. An encapsulation barrier is provided having a blast-deflecting surface overlying the at least one enclosure. A HEMP door or circuitous path is provided from an exterior of the EMP-protective structure, through the encapsulation barrier and to the at least one ingress/egress portal of the enclosure. The circuitous path is configured to absorb and deflect EMP as the EMP passes along the circuitous path. Embodiments of the blast-resistant structural panel are also disclosed.

Abstract: A shield, when coupled to a tracker device that is worn by an individual, reduces interfering signals originating from the human body that can adversely impact the detection of signals transmitted by the tracker device. The shield can include multiple layers of components. Specifically, the shield includes a base component that is attached to an adhesive element on the first side of the base and covered by a removable backing. Furthermore, the base, through a second side of the base, is attached to a first non-conductive element, which is further coupled to a second non-conductive element. Each of the non-conductive elements attenuates interfering signals that originate from the human body and therefore, enables the detection of signals transmitted by the patient tracking system. For example, in view of the reduced interference signals, a RF signal transmitted by the patient tracking system can be detected at remote distances.

Abstract: Disclosed are EMI shielded packages, electronic device packages, and related methods. EMI shielded packages are formed by applying an insulating material to a first side of a substrate strip, separating the substrate strip into segments, adhering the insulating material of the segments to a solid conductor, applying a conductive paste around lateral sides of the segments, curing the conductive paste, and cutting through the conductive paste and the solid conductor to form the EMI packages. An electronic device package includes a substrate including electronic circuitry, an EMI shield, and an insulating material insulating the substrate from the EMI shield. The EMI shield includes a solid conductor adhered to the insulating material, and a cured conductive paste at least partially surrounding a lateral edge of the substrate. The cured conductive paste electrically connects the solid conductor to a conductive terminal in a lateral side of the substrate.

Abstract: Provided is an electronic device including a printed circuit board (PCB) in which at least one electrical element is disposed; a shield can including a concave portion and an opening formed in part of the concave portion and configured to receive the at least one electrical element at an inside of the concave portion disposed on the PCB; a conductive plate configured to cover the opening at an outside of the concave portion; a support member disposed between the conductive plate and the outside of the concave portion; and a shielding member disposed between the support member and the outside of the concave portion and connected to at least part of the conductive plate extended in a direction of the opening from the support member and configured to cover the opening.

Abstract: A heatsink assembly including a substrate having an active circuitry, at least one cavity located adjacent to at least one heat producing element of the active circuitry, at least one vessel sealably coupled to said substrate in fluid communication with the at least one cavity, and a phase change material (PCM) contained inside the vessel. The vessel and at least one cavity are configured to facilitate migration of the PCM from the vessel into the at least one cavity for absorbing heat produced by the at least one heat producing element of the active circuitry.