Abstract: A display device according to an exemplary aspect of the present disclosure includes a display panel including a display area and a non-display area, a flexible film disposed on the non-display area of the display panel, and a sealing member disposed on an overlapping area of the display panel and the flexible film to cover the flexible film, the flexible film includes a plurality of holes which passes through the flexible film in the overlapping area of the display panel and the flexible film, and the sealing member may be disposed to fill in the plurality of holes. Accordingly, the sealing member is filled in an area between the display panel and the flexible film so that the bonding reliability may be improved.

Abstract: A display device according to an embodiment of the present invention includes: a base material including a display region and a curved region; a wiring line disposed on the base material and disposed from the display region over the curved region; and a heat dissipating layer formed corresponding to a position at which the wiring line is disposed in the curved region.

Abstract: A display device includes a window, a display panel arranged below the window and including a display area and a peripheral area outside the display area; and a component arranged below the display panel and at least partially overlapping the peripheral area, wherein a black matrix is arranged on a bottom surface of the window in correspondence with an area in the peripheral area other than an area where the component is located.

Abstract: A display device includes a display panel; a back cover supporting the display panel on a rear surface of the display panel; a roller disposed on a rear surface of the back cover, wherein the display panel and the back cover are wound around or unwound from the roller; a flexible film electrically connected to a pad area of the display panel; and a sealing layer disposed to cover an end of the flexible film. At least some of elements of the display panel including a substrate may be extended beyond the sealing layer. Accordingly, it is possible to prevent cracks in the display panel due to the pressing by the cover plate and the overflow of the sealant, thereby solving the issues of driving failure and reliability of the display panel.

Abstract: A display device includes a substrate including a display area and a component area including a transmission area, and display elements disposed on the substrate. The substrate includes grooves corresponding to the transmission area of the component area.

Abstract: An electroluminescent display includes a display panel including a plurality of pixels, each pixel having an emission area and non-emission area; and a protective film attached on one surface of the display panel using a photo tunable adhesive, wherein the photo tunable adhesive includes: a light transmitting area corresponding to the emission area; and a light blocking area corresponding to the non-emission area.

Abstract: A display panel is divided into a display area and a camera area. The camera area includes a first through-hole, a first light-transmitting layer, an inorganic layer, a second through-hole, a second light-transmitting layer, and an image acquisition device. The manufacturing method of the display panel includes a rigid substrate providing step, a flexible substrate forming step, a first etching step, a first light- transmitting layer forming step, a first thin-film transistor (TFT) forming step, a second etching step, a second light-transmitting layer forming step, a second TFT forming step, a rigid substrate stripping step, and an image acquisition device disposing step.

Abstract: A flexible display device according to an exemplary embodiment of the present disclosure may include a substrate divided into a display area and a non-display area; a first buffer layer disposed on the substrate; a second buffer layer disposed under the substrate; a support member disposed under the second buffer layer; a transistor and a light emitting element disposed above the first buffer layer in the display area; a conductive layer disposed in the second buffer layer in the non-display area; and a connection member disposed on the first buffer layer in the non-display area and electrically connected to the conductive layer through a contact hole, so that an effect of minimizing luminance unevenness of a display panel due to the use of a polyimide (PI) substrate by grounding and removing charges accumulated in the PI substrate, can be provided.

Abstract: A display device includes: a base substrate including a first polymeric film; an active pattern on the base substrate and including a first channel region; and a first gate electrode overlapping the first channel region, wherein the first polymeric film has a first thickness in a first area overlapping the first channel region and a second thickness, which is smaller than the first thickness, in a second area different from the first area.

Abstract: A display apparatus includes a display area including pixels; a non-display area adjacent to the display area; a first planarization layer located in the display area and the non-display area; a second planarization layer on the first planarization layer; an organic insulating layer on the second planarization layer; a first dam on the first planarization layer, including the second planarization layer and the organic insulating layer, and surrounding the display area; a second dam disposed outside the first dam, including the second planarization layer and the organic insulating layer, and surrounding the first dam; and a monitoring bank disposed between the display area and the first dam and including the second planarization layer and the organic insulating layer. A thickness of the second planarization layer included in the monitoring bank is less than a thickness of the second planarization layer included in the first dam.

Abstract: Provided is a packaging structure, including an inorganic packaging layer and an organic packaging layer that are laminated on a substrate, wherein the organic packaging layer includes a microstructure layer and a planarization layer, a refractive index of the planarization layer being lower than that of the microstructure layer; wherein the microstructure layer includes a base structure on the inorganic packaging layer and a plurality of protrusion structures spaced apart on a surface of the base structure away from the inorganic packaging layer; and the planarization layer fills at least gaps between adjacent protrusion structures, and a side of the planarization layer away from the inorganic packaging layer is of a planar structure.

Abstract: An organic light emitting display device includes a substrate having a display area displaying an image and a non-display area surrounding the display area; a camera disposition area provided within the display area; a panel identification area provided in the non-display area; and an upper protective layer covering the camera disposition area and the panel identification area.

Abstract: A display device includes an electronic panel, a window, an optical sheet, and a stress control member. The electronic panel includes a first non-bending area having a first area overlapping the optical sheet and a second area overlapping at least part of the recessed area, a bending area configured to be bent relative to the first non-bending area, and a second non-bending area extending from the bending area and movable to a position opposing the first non-bending area. The optical sheet is disposed between the electronic panel and the window and having a recessed area defined therein extending toward a center of the optical sheet. The stress control member overlaps with at least a portion of the second area, at least a portion of the bending area, and at least a portion of the second non-bending area, respectively.

Abstract: A package includes a die, first conductive structures, second conductive structures, an encapsulant, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The first conductive structures and the second conductive structures surround the die. A shape of the first conductive structures is different a shape of the second conductive structures. The second conductive structures include elliptical columns having straight sidewalls. A distance between the first conductive structure that is closest to the die and the die is greater than a distance between the second conductive structure that is closest to the die and the die. The encapsulant encapsulates the die, the first conductive structures, and the second conductive structures. The redistribution structure is over the die and the encapsulant. The redistribution structure is electrically connected to the die, the first conductive structures, and the second conductive structures.

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a photonic receiver; and a die coupled to the photonic receiver by interconnects, wherein the die includes a device layer between a first interconnect layer of the die and a second interconnect layer of the die. In still some embodiments, a microelectronic assembly may include a photonic transmitter; and a die coupled to the photonic transmitter by interconnects, wherein the die includes a device layer between a first interconnect layer of the die and a second interconnect layer of the die.

Abstract: A display device includes a display panel; a polarizing film disposed on the display panel; a touch film disposed on the polarizing film; a light control film disposed on the touch film; a barrier film disposed over the polarizing film; and a cover window disposed on the barrier film.

Abstract: The display device includes a substrate, a display region arranged on the substrate and including a plurality of pixels, a first wiring provided on the substrate, an insulating layer overlapping a portion of the first wiring, an oxide conductive layer provided on the first wiring and electrically connected to the first wiring, a sealing layer overlapping the display region and at least an end of the oxide conductive layer and sealing the plurality of pixels, a sensor electrode provided on the sealing layer and overlapping the display region, and a second wiring passing over the at least end of the oxide conductive layer provided with the sealing layer and electrically connecting the sensor electrode and the oxide conductive layer.

Abstract: A display apparatus includes a display panel including a display area, a porous metal substrate disposed below the display panel and including a porous metal material, and a cover substrate disposed above the display panel. The porous metal substrate includes a flat substrate portion and first and second bent substrate portions convexly curved in opposite directions, and thicknesses of the first and second bent substrate portions are different from each other.

Abstract: A conductive structure includes a core portion, a plurality of electronic devices and a filling material. The core portion defines a cavity. The electronic devices are disposed in the cavity of the core portion. The filling material is disposed between the electronic devices and a sidewall of the cavity of the core portion.

Abstract: A light-emitting device or a display device that is less likely to be broken is provided. Provided is a light-emitting device including an element layer and a substrate over the element layer. At least a part of the substrate is bent to the element layer side. The substrate has a light-transmitting property and a refractive index that is higher than that of the air. The element layer includes a light-emitting element that emits light toward the substrate side. Alternatively, provided is a light-emitting device including an element layer and a substrate covering a top surface and at least one side surface of the element layer. The substrate has a light-transmitting property and a refractive index that is higher than that of the air. The element layer includes a light-emitting element that emits light toward the substrate side.