Abstract: The vibrator element includes a vibrating arm provided with an arm part, and a weight part which has a weight, the weight is provided with at least one processing scar, when an axis which overlaps a center in a width direction of the vibrating arm, and which extends along an extending direction of the vibrating arm is a central axis, and an axis which overlaps a centroid of the vibrating arm, and which extends along the extending direction of the vibrating arm is a centroid axis, the processing scar is formed in at least an area at an opposite side to the centroid axis, and S1<S2 an area of the processing scar located at the centroid axis side with respect to the central axis is S1, and an area of the processing scar located at an opposite side to the centroid axis with respect to the central axis is S2.

Abstract: An acoustic imaging system coupled to a sensing plate to define an imaging surface. The acoustic imaging system includes an array of piezoelectric acoustic transducers coupled to the sensing plate opposite the imaging surface and formed using a thin-film manufacturing process over an application-specific integrated circuit that, in turn, is configured to leverage the array of piezoelectric actuators to generate an image of an object at least partially wetting to the imaging surface.

Abstract: A micromechanical component. The micromechanical component includes: a mount; a displaceable part; and a first serpentine spring and a second serpentine spring which is embodied mirror-symmetrically with respect to the first serpentine spring in terms of a first plane of symmetry; a first actuator device and a second actuator device being embodied in such a way that by way of the first actuator device and the second actuator device, periodic deformations, mirror-symmetrical in terms of the first plane of symmetry, of the first serpentine spring and of the second serpentine spring are excitable; the micromechanical component also encompassing a first torsion spring and a second torsion spring that each extend along a rotation axis; and the displaceable part being displaceable, at least by way of the periodic and mirror-symmetrical deformations of the first serpentine spring and of the second serpentine spring, around the rotation axis with respect to the mount.

Abstract: A vibrator device includes a vibrating body having obverse and reverse principal surfaces and a side surface connecting the obverse and reverse principal surfaces to each other, a package configured to house the vibrating body, and a bonding material configured to fix the vibrating body to the package, wherein the vibrating body has a coupling part including a recess recessed from the side surface toward a center of the principal surfaces, and a protrusion protruding from a side surface of the recess, the protrusion is one of breaking-off parts with which a plurality of the vibrating bodies is broken off from a wafer to which the plurality of the vibrating bodies is coupled, and the bonding material has contact with a side surface of the protrusion in the recess.

Abstract: An ultrasound transducer includes: a drive unit including a piezoelectric device; a proximal end block; and a distal end block. The distal end block includes a first portion, a supported portion, a second portion, and a third portion. The distal end block is configured such that a position of a boundary between the second portion and the third portion corresponds to or substantially corresponds to an antinode of the ultrasonic vibration while the piezoelectric device generates the ultrasonic vibration, and the ultrasonic vibration is being propagated to the proximal end block, the first portion, the second portion, and the third portion. A resonance frequency of the ultrasonic vibration differs according to a position of the boundary between the second portion and the third portion under a condition that a distance from the supported portion to a distal end of the third portion along the longitudinal axis is constant.

Abstract: The present disclosure provides an acoustic wave transducer and a driving method thereof. The acoustic wave transducer includes cell groups, at least part of which each include acoustic wave transducer cells configured to perform a same operation, each acoustic wave transducer cell being configured to perform at least one of: converting an acoustic wave signal into an electrical signal and converting an electrical signal into an acoustic wave signal; and array element signal terminals, each of which is coupled to at least two adjacent cell groups, and is coupled to different cell groups through different switch devices, each switch device being configured to control connection and disconnection between the array element signal terminal and the cell group coupled to the switch device, and the cell groups coupled to an array element signal terminal and the cell groups coupled to an adjacent array element signal terminal are partly the same.

Abstract: An energy harvesting apparatus using an electroactive material includes an electricity generator including the electroactive material to generate a voltage due to deformation caused by an external stimulus, and an impact generator including a deformable and restorable material capable of repetitive deformation and restoration and configured to generate a dynamic behavior based on the repetitive deformation and restoration in the electricity generator. A stimulus of the impact generator with respect to the electricity generator enables energy harvest. An electrode unit for deformation includes an electricity generator including an electroactive material to generate a voltage due to deformation caused by an external stimulus, and an electrode part electrically connected to at least one surface of the electricity generator, and including an elastically deformable material to achieve relative deformation while in contact with the electricity generator.

Abstract: Acoustic resonator devices and filters are disclosed. An acoustic resonator includes a substrate having a surface and a single-crystal piezoelectric plate having front and back surfaces, the back surface attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm that spans a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the single-crystal piezoelectric plate such that interleaved fingers of the IDT are disposed on the diaphragm. The piezoelectric plate and the IDT configured such that a radio frequency signal applied to the IDT excites a shear primary acoustic mode in the diaphragm. A half-lambda dielectric layer is formed on one of the front surface and back surface of the piezoelectric plate.

Abstract: Disclosed is a bulk acoustic wave resonator (BAWR). The BAWR includes a bulk acoustic wave resonance unit with a first electrode, a second electrode, and a piezoelectric layer. The piezoelectric layer is disposed between the first electrode and the second electrode. An air edge is formed at a distance from a center of the bulk acoustic wave resonance unit.

Abstract: A vibrator device includes a vibrator element, a container in which the vibrator element is housed, a circuit which is disposed in the container, and which overlaps the vibrator element in a plan view, and an inductor which is disposed in the container, which fails to overlap the vibrator element in the plan view, and which is electrically coupled to the circuit. The container includes at least a first member and a second member, and a bonding area configured to bond the first member and the second member to each other, and the inductor is disposed in the bonding area.

Abstract: Ultrasonic devices include a transducer having a piezoelectric element therein that may operate as an acoustic signal receiving surface and/or an acoustic signal generating surface. At least one acoustic matching layer is provided on the piezoelectric element. This at least one acoustic matching layer may be configured as a composite of N acoustic matching layers, with a first of the N acoustic matching layers contacting the primary surface of the piezoelectric element. This first acoustic matching layer may have an acoustic impedance equivalent to ZL1, where N is a positive integer greater than zero. In some embodiments of the invention, the magnitude of ZL1 may be defined as: 0.75 ((Zp)N+1(Zg))1/(N+2)?ZL1?1.25 ((Zp)N+1(Zg))1/(N+2), where Zp is the acoustic impedance of the piezoelectric element (e.g., lead zirconate titanate (PZT)) and Zg is the acoustic impedance of a compatible gas.

Abstract: A structure includes a substrate including a wafer or a portion thereof; and a piezoelectric bulk material layer comprising a first portion deposited onto the substrate and a second portion deposited onto the first portion, the second portion comprising an outer surface having a surface roughness (Ra) of 4.5 nm or less. Methods for depositing a piezoelectric bulk material layer include depositing a first portion of bulk layer material at a first incidence angle to achieve a predetermined c-axis tilt, and depositing a second portion of the bulk material layer onto the first portion at a second incidence angle that is smaller than the first incidence angle. The second portion has a second c-axis tilt that substantially aligns with the first c-axis tilt.

Abstract: A method for producing an ultrasonic transducer or ultrasonic transducer array, the method comprising providing or depositing a layer of piezoelectric material on a substrate. The piezoelectric material is a doped, co-deposited or alloyed piezoelectric material. The piezoelectric material comprises: a doped, co-deposited or alloyed metal oxide or metal nitride, the metal oxide or metal nitride being doped, co-deposited or alloyed with vanadium or a compound thereof; or zinc oxide doped, co-deposited or alloyed with a transition metal or a compound thereof. Optionally, the deposition of the layer of piezoelectric material is by sputter coating, e.g. using a sputtering target that comprises a doped or alloyed piezoelectric material. In examples, the layer of piezoelectric material is deposited onto the substrate using high power impulse magnetron sputtering (HIPIMS). Further enhancement may be obtained using substrate biasing (e.g. DC and/or RF) during deposition of the layer of piezoelectric material.

Abstract: A package for an electric device is proposed based on a substrate (SU, SU1, SU2) that comprises at least a piezoelectric layer. Device structures are enclosed in a cavity of an integrally formed package layer structure (PK) of a thin film package applied on the first surface (SI). A first contact pad (PI) is arranged on the first surface of the substrate and electrically connected to the device structures. A second contact pad (P2) is arranged on a second surface (S2) of the substrate opposite to the first surface (SI). A via (V) is guided through the substrate and interconnects first and second contact pads electrically. Packages may be stacked on one another and connected via two pads of different kind. The first substrate (SU1) is connected via its second pad (P2) on the second surface thereof to the first pad of a second substrate (SU2) by means of connection means (CM).

Abstract: A method for fabricating nano-electro-mechanical tags for identification and authentication includes, in part, forming a protective layer above a substrate, forming a first conductive layer above the protective layer serving as a first electrode, forming a piezoelectric layer above the first conductive layer, forming a second conductive layer above the piezoelectric layer, patterning the second conductive layer to form a second electrode, patterning the piezoelectric layer to expose one or more portions of the first conductive layer, and forming one or more trenches that extends into a plurality layers formed above. In addition, a sacrificial layer can be formed above portions of the substrate, and the sacrificial layer can be removed by etching to release the nano-electro-mechanical tags from the substrate.

Abstract: A displacement sensor having a rectangular shaped elastic member. A piezoelectric element is attached to a first main face of the elastic member. The piezoelectric element has a rectangular-shaped piezoelectric sheet and electrodes on both main faces of the piezoelectric sheet. The piezoelectric sheet is made of poly-L-lactic acid and is at least uniaxially-stretched. The piezoelectric element is attached so that the uniaxial-stretching direction of the piezoelectric sheet is 45° relative to a long-side direction of the elastic member. When the elastic member is bent along the long-side direction, the piezoelectric sheet is stretched along the long-side direction, and the piezoelectric element generates voltage of predetermined level.

Abstract: Acoustic resonator devices and filters are disclosed. An acoustic resonator includes a substrate having a surface and a single-crystal lithium niobate (LN) plate having front and back surfaces, the back surface attached to the surface of the substrate except for a portion of the LN plate forming a diaphragm that spans a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the LN plate such that interleaved fingers of the IDT are disposed on the diaphragm. A half-lambda dielectric layer is formed on one of the front surface and back surface of the diaphragm. Euler angles of the LN plate are [0°, ?, 0°], where 20°???25°.

Abstract: Disclosed are device implementations for a hybrid energy harvesting device and methods for harvesting mechanical energy from the ambient. The various device implementations utilize a combination of electrostatic energy conversion and piezoelectric energy conversion elements. The method simultaneously converts mechanical energy into electrical charge by electrostatic and piezoelectric energy harvesting. The devices include a piezoelectric harvester including a pair of electrodes and piezoelectric nanocomposite polymer, an electrostatic harvester including an electret film and a pair of electrostatic electrodes.

Abstract: There is provided a vibrator device including: a vibrator element; a semiconductor substrate having a first surface on which the vibrator element is disposed and a second surface positioned on an opposite side of the first surface; a fractional N-PLL circuit disposed at the second surface; a wiring that is disposed at the first surface and electrically couples the vibrator element and the fractional N-PLL circuit; and an output terminal that is disposed at the second surface side of the semiconductor substrate, is electrically coupled to the fractional N-PLL circuit, and outputs a signal from the fractional N-PLL circuit, in which the output terminal does not overlap the wiring in a plan view along a thickness direction of the semiconductor substrate.

Abstract: A piezoelectric sensor assembly, a manufacturing method thereof, a display panel and an electronic device including the same are provided. The piezoelectric sensor assembly includes: a base substrate; a plurality of ultrasonic transducers, wherein a spacing area is provided between two adjacent ultrasonic transducers; and an acoustic matching layer, wherein the acoustic matching layer includes a plurality of acoustic matching areas, and an orthographic projection of at least one acoustic matching area on the base substrate falls into an orthographic projection of the ultrasonic transducer corresponding to the acoustic matching area on the base substrate, wherein an isolation cavity is provided between two adjacent acoustic matching areas.