Abstract: In a vibration unit, a first electrode of a sensor circuit of a control unit is electrically connected to a first external electrode of a first piezoelectric element, a second electrode of the sensor circuit is electrically connected to a second external electrode of the first piezoelectric element, a first electrode of a drive circuit is electrically connected to a first external electrode of a second piezoelectric element, and a second electrode of the drive circuit is electrically connected to a second external electrode of the second piezoelectric element. Only a relatively small voltage induced by an electromotive force occurring due to the flexure of the first piezoelectric element is applied to the sensor circuit. In addition, only a relatively large drive voltage to be applied to the second piezoelectric element is applied to the drive circuit.

Abstract: Provided is a piezoelectric thin film device containing: a first electrode layer; and a piezoelectric thin film. The first electrode layer contains a metal Me having a crystal structure. The piezoelectric thin film contains aluminum nitride having a wurtzite structure. The aluminum nitride contains a divalent metal element Md and a tetravalent metal element Mt. [Al] is an amount of Al contained in the aluminum nitride, [Md] is an amount of Md contained in the aluminum nitride, [Mt] is an amount of Mt contained in the aluminum nitride, ([Md]+[Mt])/([Al]+[Md]+[Mt]) is 36 to 70 atom %. LALN is a lattice length of the aluminum nitride in a direction that is approximately parallel to a surface of the first electrode layer with which the piezoelectric thin film is in contact, LMETAL is a lattice length of Me in a direction, and LALN is longer than LMETAL.

Abstract: A funnel-shaped underwater energy harvesting equipment includes a piezoelectric element configured to be installed at a seabed and to be moved by a fluid in order to convert vibration energy into electricity. The funnel-shaped underwater energy harvesting equipment further includes a fluid collector coupled to the piezoelectric element and configured to increase velocity of the fluid flowing toward the piezoelectric element. The harvesting equipment exhibits improved energy conversion efficiency, while simplifying the shape of the harvesting equipment.

Abstract: A bonded body having a supporting substrate and piezoelectric material layer is provided. The supporting substrate is composed of mullite, and the material of the piezoelectric material layer is LiAO3 where A represents one or more element selected from the group consisting of niobium and tantalum. An interface layer is present along an interface between the supporting body and piezoelectric material layer, and a supporting substrate-side intermediate layer is present between the interface layer and supporting substrate. Each of the interface layer and supporting substrate-side intermediate layer contains oxygen, aluminum, silicon and one or more element selected from the group consisting of niobium and tantalum as main components.

Abstract: A vortex-induced vibration wind energy harvesting device, including an array consisting of a plurality of oscillators and a plurality of piezoelectric microelectromechanical systems (MEMSs), is provided. An oscillator is mounted on each of the piezoelectric MEMSs. When any one of the oscillators is oscillated by and resonant with vortex shedding due to an incoming airflow, its vortices in the wake will enhance the oscillation of the downstream oscillators, so that overall oscillation of the oscillators in the array is strengthened. The piezoelectric MEMSs are deformed by the vibration of these oscillators to generate voltage and current to output. In the present invention, the oscillators are arranged closely. When the airflow passes the array, even weak airflow can generate periodic force and cause significant oscillation due to resonance. The MEMS can convert mechanical energy into electrical energy and output it in order to achieve the purpose of wind energy harvesting.

Abstract: An integrated self-sustainable power supply includes a piezoelectric energy harvesting (PEH) beam, a power management unit (PMU) circuit located on the PEH beam, a rechargeable battery located on the PEH beam, and a positive regulated power supply output and a negative regulated power supply output. The PMU circuit includes electrical inputs/outputs. The rechargeable battery includes a negative access pad and a positive access pad, which are in electrical communication with the electrical inputs/outputs of the PMU circuit. The positive regulated power supply output and the negative regulated power supply output are also in electrical communication with the electrical inputs/outputs of the PMU circuit.

Abstract: Provided are a haptic feedback fiber body, a haptic feedback fabric, and a wearable device. The haptic feedback fiber body can include a core fiber having a first electrode to surround the outer surface thereof, and a vibrating fiber, provided so as to intermittently contact the outer surface of the core fiber, including a second electrode on the inner surface thereof, wherein a piezoelectric polymer is provided on the outer surface of the first electrode or on the inner surface of the second electrode to generate fretting vibrations when the polymer is in close contact with the first electrode or the second electrode on which the piezoelectric polymer is disposed opposite to each other.

Abstract: An acoustic wave device includes an element substrate having piezoelectricity, an interdigital transducer electrode provided on the element substrate, and a mold resin covering the element substrate. When viewed in a cross section, the element substrate includes an interdigital transducer formation region in which the interdigital transducer electrode is provided and a pair of interdigital transducer non-formation regions in which the interdigital transducer electrode is not provided and located on both sides of the interdigital transducer formation region, and a thickness dimension of a center portion, in a width direction, of the interdigital transducer formation region is less than at least one of thickness dimensions of center portions, in the width direction, of the interdigital transducer non-formation regions.

Abstract: A torque sensor chip including a semiconductor substrate, an acoustic reflector formed on the semiconductor substrate, and first and second Lamb wave resonators (LWRs). The first LWR is formed on a side of the acoustic reflector opposite the semiconductor substrate. The first LWR is at a first angle with respect to an axis of the IC. The second LWR also is formed on the side of the acoustic reflector opposite the semiconductor substrate. The second LWR is at a second angle, different than the first angle, with respect to the axis of the IC.

Abstract: A laminated piezoelectric element 10 includes: a laminated body 11 in rectangle shape formed by alternately laminating a plurality of piezoelectric layers 15 and one or more internal electrode(s) 13; a connection electrode 14 connected to one end portion 13a of the internal electrode(s) 13; and an electric field relaxation region 16c or 16d formed discontinuously with regard to the internal electrode(s) 13 in at least one of two corner portions 13c and 13d of the other end portion 13b opposite to the one end portion 13a of the internal electrode(s) 13.

Abstract: An energy harvester includes a frame having a base, a first side member affixed to the base, and a second side member affixed to the base and spaced apart from the first side member. A beam is coupled between the first side member of the frame and the second side member of the frame. The beam has a substrate layer with a first end affixed to the first side member of the frame, a second end affixed to the second side member of the frame, a first face, and a second face opposite to the first face. The substrate is elastically deformable in response to the vibratory force. The beam further includes a first piezoelectric layer joined to the first face of the substrate layer and having a terminal for electrical connection to a load, the first piezoelectric layer comprising at least one piezoelectric patch.

Abstract: Disclosed herein are energy harvesting devices and methods of making and use thereof. The energy harvesting devices can efficiently harvest energy for motions at a frequency of 5 Hz or less.

Abstract: A MEMS structure may include a substrate, a first metal layer arranged over the substrate, an aluminum nitride layer at least partially arranged over the first metal layer and a second metal layer including one or more patterns arranged over the aluminum nitride layer. The first metal layer may include an electrode area configured for external electrical connection and one or more isolated areas configured to be electrically isolated from the electrode area and further configured to be electrically isolated from external electrical connection. Each pattern of the second metal layer may be arranged to at least partially overlap with one of the isolated area(s) of the first metal layer.

Abstract: A piezoelectric member including metal electrodes with improved adhesiveness to piezoelectric elements is to be provided. A piezoelectric member 102 includes a piezoelectric element 21, and a pair of electrodes 41, 42 respectively formed on a pair of opposing surfaces 21b, 21c of the piezoelectric element 21. The electrodes 41, 42 includes: a base film 41a that is formed on the opposing surfaces 21b, 21c of the piezoelectric element 21 and contains a thiol group; a metal adhesive film 41b formed on the base film 41a; and an electrode film 41c that is formed on the metal adhesive film 41b and is for applying voltage to the piezoelectric element 21. The metal adhesive film 41b is formed with a different material from the electrode film 41c, and has a thickness of 1 to 10 nm.

Abstract: A vibration device includes a semiconductor substrate having a first surface and a second surface in an obverse-reverse relationship, a vibration element disposed on the first surface, a lid bonded to the first surface, an integrated circuit disposed on the first surface, a terminal disposed on the second surface, a through electrode which penetrates the semiconductor substrate, and is configured to electrically couple the terminal and the integrated circuit to each other, and a first capacitor which is provided with a first recess provided to the semiconductor substrate and opening in the first surface, an insulating film disposed on an inside surface of the first recess, and an electrically-conductive material filling the first recess, and has a first capacitance between the electrically-conductive material and the semiconductor substrate, wherein the electrically-conductive material does not have contact with the terminal at the second surface side.

Abstract: A vibrating plate-bonded body includes a supporting substrate composed of silicon, a vibrating plate composed of a highly rigid ceramics and having a thickness of 100 ?m or smaller, and a bonding layer between the supporting substrate and vibrating plate, contacting a bonding surface of the vibrating plate and composed of ?-Si. The arithmetic average roughness Ra of the bonding surface of the vibrating plate is 0.01 nm or more and 10.0 nm or less, and the pit density of the bonding surface of the vibrating plate is 10 counts or more per 100 ?m2.

Abstract: An acoustic wave resonator includes: a piezoelectric substrate; and an interdigital transducer (IDT) located on the piezoelectric substrate, the IDT including a pair of comb-shaped electrodes having a plurality of electrode fingers and a bus bar to which the plurality of electrode fingers are coupled, the IDT having: a first region in which a pitch of electrode fingers is substantially constant; a second region in which a pitch of electrode fingers decreases at closer distances to an outer side; and a third region in which a pitch of electrode fingers increases at closer distances to an outer side, the second region being located outside the first region in an arrangement direction of the plurality of electrode fingers, and the third region being located outside the second region in the arrangement direction.

Abstract: A resonator device includes a quartz crystal substrate, a resonator element including a first excitation electrode arranged on a first surface of the quartz crystal substrate, a second excitation electrode arranged on a second surface of the quartz crystal substrate in opposition to the first excitation electrode, and first and second pad electrodes that are arranged on the first surface and are coupled to the first and second excitation electrodes, a base including a substrate and first and second interconnects arranged on the substrate, a first bonding member bonding the first pad electrode to the first interconnect, and a second bonding member bonding the second pad electrode to the second interconnect. The first and second bonding members are arranged such that a first imaginary line that passes through a centroid of the resonator element and is parallel to an X axis is interposed between the first and second bonding members.

Abstract: A RF antenna or sensor has a substrate, a resonator operable at UHF disposed on the substrate, the resonator preferably having a quartz bar or body with electrodes disposed on opposing major surfaces thereof and with a magnetostrictive material disposed on or covering at least one of the electrodes. A pair of trapezoidal, triangular or wing shaped high permeability pole pieces preferably supported by that substrate are disposed confronting the resonator, one of the pair being disposed one side of the resonator and the other one of the pair being disposed on an opposing side of said resonator, the pair of high permeability pole pieces being spaced apart by a gap G, the resonator being disposed within that gap G. The size of gap G is preferably less than 100 ?m.

Abstract: A high frequency ultrasound array having a number of transducer elements that are formed in sheet of piezoelectric material. A frame having a coefficient of thermal expansion similar to that of the piezoelectric material surrounds the piezoelectric material and is separated from the piezoelectric material by an epoxy material. Kerf cuts that define the individual elements in the sheet of piezoelectric material extend across a full width of the sheet. In some embodiments, sub-dice kerf cuts that divide a single transducer element into two or more sub-elements also extend all the way across the width of the sheet. A lens positioned in front of the transducer elements can have a radius machined therein to focus ultrasound signals. The frame, transducer elements and lens are bent or curved with the desired radius to focus ultrasound signals.